Positioning and lifting mechanism used in cooperation with wafer film sticking machine

Abstract

A positioning and lifting mechanism used in cooperation with a wafer film sticking machine comprises a vacuum pump, an air compressor, an electric push rod, a film sticking table plate, a vacuum suction cup, a film sticking disc, a connecting plate, a lower fixing plate, a linear bearing, an upper fixing plate, an electromagnetic valve and a shell. Wherein the lower electric push rods are mounted on the lower fixing plate, and the lower upper fixing plate and the upper electric push rods are mounted together; the lower linear bearing is installed on the upper fixing plate, the lower film pasting disc is installed on the linear bearing, the film pasting disc is provided with a guide pipe, the lower vacuum suction cup and the other electric push rod are installed together, the shell side is connected with one end of the first electromagnetic valve, and the vacuum pump is connected with the other end of the first electromagnetic valve and one end of the second electromagnetic valve. The film pasting table plate and the connecting plate are mounted together; the side end communicating pipe of the vacuum chuck is connected with the other end of the second electromagnetic valve and one end of the third electromagnetic valve, and the other end of the third electromagnetic valve is connected with the air compressor. According to the utility model, convenience is brought to workers, and the working efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer production auxiliary equipment, in particular to a positioning and lifting mechanism used in conjunction with a wafer film mounting machine. Background Art

[0002] Wafer refers to the silicon chip used to make silicon semiconductor circuits. Its raw material is silicon. During the specific production, high-purity polysilicon is dissolved and doped with silicon crystal seeds, and then slowly pulled out to form a cylindrical single silicon crystal rod. After grinding, polishing, and slicing, the silicon crystal rod forms a silicon wafer, that is, a wafer. During the production of wafers, it is necessary to apply a photoresist film on its surface (the lower end is sticky). The photoresist on the lower side of the photoresist film (the upper side is a release film) (the lower end also has a release protective film, which is torn off in advance) is a compound composed of a soluble polymer and a photosensitive material. After the pressing is completed, in the subsequent production process and the wafer undergoing the photolithography process, the photoresist on the surface of the wafer can be used to create circuit patterns. It can also be used to form a barrier layer by electroplating metal wires in the subsequent electroplating process, etc., which meets the needs of the subsequent processing procedures of the wafer.

[0003] In the prior art, the film for wafer lamination is generally placed on the film lamination station manually or by mechanical clamps, and then the photoresist film is bonded to the wafer manually or mechanically (electric pressing equipment vertically distributed at the upper end of the film lamination station, when working, the cylinder or electric push rod pushes the pressure plate downward to press the film onto the wafer). Although the above method meets the film lamination needs of the wafer to a certain extent, it is limited by the structure and still has some problems. Specifically, since the wafer cannot be displaced during the film lamination, a concave limit ring will be set on the film lamination station (film lamination table). Although the displacement of the wafer is prevented when the wafer is placed in the limit ring for film lamination, the thickness of the wafer is relatively thin, and the distance between the outer side and the inner side of the limit ring is not large. After the film is lamination, it is relatively inconvenient for the staff to take out the wafer from the limit ring by hand, which is not conducive to improving the work efficiency of the film lamination. In summary, it is particularly necessary to provide a positioning and lifting mechanism that can be used in conjunction with a wafer lamination machine. Utility Model Content

[0004] In order to overcome the drawbacks as described in the background that the existing wafer laminating equipment has no suitable positioning and lifting equipment due to structural limitations, the utility model provides a positioning and lifting mechanism for use with a wafer laminating machine, which can automatically attract and position the wafer under the joint action of relevant mechanisms, and after laminating, can automatically lift the laminating wafer out of the laminating station for the convenience of manual removal by the staff, or clamp the wafer by mechanical claws, thereby bringing convenience to the staff and correspondingly improving the work efficiency.

[0005] The technical solution adopted by the utility model to solve its technical problems is:

[0006] A positioning and lifting mechanism for use with a wafer film bonding machine, comprising a vacuum pump, an air compressor, an electric push rod, a film bonding table, a vacuum suction cup, a film bonding disk, a connecting plate, a lower fixed plate, a linear bearing, an upper fixed plate, an electromagnetic valve, and a housing; characterized in that the electric push rods and linear bearings each have multiple sets, wherein the lower ends of the cylinders of the multiple sets of electric push rods are annularly mounted on the outer side of the upper end of the lower fixed plate, a plurality of axial holes are distributed in the middle of the upper end of the connecting plate, wherein the upper ends of the multiple sets of electric push cylinders are respectively mounted in the multiple axial holes, the lower end of the upper fixed plate is annularly distributed and the upper ends of the push columns of the multiple sets of electric push rods are respectively installed together; the lower ends of the bearing seats of the multiple sets of linear bearings are annularly distributed and installed on the outer side of the upper end of the upper fixed plate, the outer side of the lower end of the film bonding disk is annularly distributed and installed on the upper ends of the shafts of the multiple sets of linear bearings, and another set of electric The lower end of the cylinder of the push rod is installed on the upper part of the upper fixed plate, and a guide tube is distributed in an annular manner in the middle of the film sticking disk. The vacuum suction cup is located in the guide tube, and the air inlet pipe at the lower end of the vacuum suction cup is installed at the upper end of the shell. The upper end of the push column of another set of electric push rods is installed at the lower end of the shell. There is a branch pipe at the side end of the shell, and there are multiple solenoid valves. The outer end of the branch pipe is connected to one end of the first solenoid valve, and the air inlet pipe of the vacuum pump is connected to the other end of the first solenoid valve and one end of the second solenoid valve through a hose respectively; the film sticking table has a film sticking opening groove, and the two side ends of the film sticking table and the two side ends of the connecting plate are respectively installed together through the fixed plate; the side end of the vacuum suction cup is provided with a connecting pipe, and the other end of the connecting pipe is connected in parallel with the other end of the second solenoid valve and one end of the third solenoid valve, and the other end of the third solenoid valve is connected to the exhaust pipe of the air compressor through a hose A.

[0007] Furthermore, the inner diameter of the film sticking opening groove of the film sticking plate and the outer diameter of the film sticking plate are larger than the outer diameter of the wafer.

[0008] Furthermore, the outer diameter of the film sticking plate is smaller than the inner diameter of the film sticking opening groove of the film sticking table.

[0009] Furthermore, the surface of the film sticking plate has a plurality of air inlet and outlet holes.

[0010] Furthermore, the solenoid valve is a normally closed valve core solenoid valve.

[0011] Furthermore, the outer diameter of the vacuum suction cup is smaller than the inner diameter of the guide tube, and when the push column of the other set of electric push rods is at the upper dead point, the upper end height of the vacuum suction cup is higher than the height of the film sticking plate, and when the push column of the other set of electric push rods is at the lower dead point, the upper end height of the vacuum suction cup is lower than the height of the film sticking plate.

[0012] The beneficial effects of the utility model are as follows: (1) In the application of the utility model, the staff controls the height of the upper end of the vacuum suction cup, which can facilitate the staff to manually or mechanically place the wafer to be filmed on the suction cup, and can facilitate the staff to manually remove the wafer or mechanically clamp the film after filming; (2) During filming, the filming opening groove in the middle of the filming table can limit the wafer to be filmed, and the filming plate can not only support the wafer, but also adsorb the wafer, which can ensure that the wafer will not be displaced during filming and achieve a better filming effect. The utility model brings convenience to the staff and correspondingly improves work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0014] Figure 1 It is a schematic diagram of the structure of the utility model.

[0015] Figure 2 It is a partial structural schematic diagram of the utility model. DETAILED DESCRIPTION

[0016] Figure 1 , 2As shown, a positioning and lifting mechanism for use with a wafer film bonding machine includes a vacuum pump 11 (existing mature technology, and the present application does not elaborate on the working principle), an air compressor 12 (existing mature technology, and the present application does not elaborate on the working principle), an electric push rod (existing mature technology, and the present application does not elaborate on the working principle), a film bonding table 1, a vacuum suction cup 2 (existing mature technology, and the present application does not elaborate on the working principle), a film bonding plate 3, a connecting plate 4, a lower fixed plate 5, a linear bearing 6, an upper fixed plate 7, and a solenoid valve. The electric push rod and the linear bearing each have multiple sets, and the lower end rings of the cylinders of three sets of electric push rods 81 are respectively installed on the outer side of the upper end of the lower fixed plate 5 by bolts, and connected Three shaft holes 41 are distributed in an annular manner in the middle of the upper end of the plate 4, and the outer sides of the upper ends of the cylinders of the three sets of electric push rods 81 are respectively installed in the three shaft holes 41 by bolts, and the outer sides of the lower end of the upper fixed plate 7 are distributed in an annular manner and the upper ends of the push columns of the three sets of electric push rods 81 are respectively installed together by bolts; the lower ends of the bearing seats of the three sets of linear bearings 6 are distributed in an annular manner and are respectively installed on the outer sides of the upper end of the upper fixed plate 7 by bolts, and the outer sides of the lower end of the film-sticking disk 3 are respectively installed on the upper ends of the shafts of the three sets of linear bearings 6 by bolts; the lower ends of the cylinders of the fourth set of electric push rods 82 are installed in the upper middle part of the upper fixed plate 7 by bolts, and three guide tubes 31 (and the film-sticking disk 3) are welded in an annular manner and penetrate up and down. The membrane disc is sealed and isolated), the lower end air intake pipe of the vacuum suction cup 2 is respectively welded to the outer side of the upper end of an annular hollow shell 21, and the lower end of the air intake pipe is interconnected with the shell 21, and the three vacuum suction cups are respectively movably located in the three guide tubes 31; the upper end of the push column of the fourth set of electric push rods 82 is bolted to the outer side of the middle part of the lower end of the shell 21, and a branch pipe 23 that is interconnected in the shell is welded to the right end of the shell 21. There are three solenoid valves, and the outer end of the branch pipe 23 is connected to one end of the first solenoid valve 221 through a thread, and the air intake pipe of the vacuum pump 11 is threadedly connected to the first end of the first three-way pipe 91 through a thread, and the second end and the third end of the first three-way pipe 91 are respectively connected to the first solenoid valve 221. The other end and one end of the second solenoid valve 222 are sealed and connected via a hose 101 with a length margin; there is a film sticking opening groove 11 in the middle of the film sticking table, and the left and right side ends of the film sticking table and the left and right side ends of the connecting plate 4 are respectively welded together via a fixing plate 102; a connecting pipe that is interconnected with the interior is welded to the right side of the lower end of the vacuum suction cup 2, and the other end of the connecting pipe is threadedly connected to the first end of the second three-way pipe 92, and the second end and the third end of the second three-way pipe 92 are threadedly connected to the other end of the second solenoid valve 222 and one end of the third solenoid valve 223, and the other end of the third solenoid valve 223 is sealed and connected to the exhaust pipe of the air compressor via the second hose 102 with a length margin.

[0017] Figure 1 , 2As shown in , the inner diameter of the film sticking opening groove 11 in the middle of the film sticking plate and the outer diameter of the film sticking plate 3 are larger than the outer diameter of the wafer (not shown in the figure). The outer diameter of the film sticking plate 3 is smaller than the inner diameter of the film sticking opening groove 11 in the middle of the film sticking plate. The surface of the film sticking plate 3 is provided with a plurality of air inlet and outlet holes 32 (to extract the air in the hollow film sticking plate or blow the air upward). The solenoid valves 221, 222, and 223 are normally closed valve core solenoid valves. The outer diameter of the vacuum suction cup 2 is smaller than the inner diameter of the guide tube 31. When the push column of the fourth set of electric push rods 82 is at the upper dead point, the upper end height of the vacuum suction cup 2 is higher than the height of the film sticking plate 3. When the push column of the fourth set of electric push rods 82 is at the lower dead point, the upper end height of the vacuum suction cup 2 is lower than the height of the film sticking plate 3.

[0018] Figure 1 , 2As shown in , when the present invention is used, the staff controls the push column of the fourth set of electric push rods 82 to raise the height of the three sets of vacuum suction cups 2, and the height of the three sets of vacuum suction cups 2 becomes higher (the height is higher than the height of the film sticking table 1), so that the staff can manually or mechanically place the wafers that need to be filmed on the vacuum suction cups 2, and can also facilitate the staff to manually remove the film or clamp the film with mechanical clamps after subsequent film sticking (the staff turns on the power switches of the vacuum pump and the solenoid valve 221, the vacuum pump is energized to generate negative pressure suction, and the solenoid valve 221 is energized to open the valve core, so that the three sets of vacuum suction cups 2 generate negative pressure suction to effectively stabilize the wafer). The staff controls the push column of the fourth set of electric push rods 82 to drive the three sets of vacuum suction cups 2 to descend, and the height of the three sets of vacuum suction cups 2 becomes lower (the height is lower than the height of the film-mounting plate 1; at this moment, the power switch of the solenoid valve 221 is turned off, and the vacuum suction cups no longer generate adsorption force), and the upper end of the wafer is slightly higher than the height of the film-mounting plate 1 (the upper end height of the three sets of vacuum suction cups 2 is lower than the height of the film-mounting plate 3, and the lower end of the wafer is in contact with the upper end of the film-mounting plate 3). The staff turns on the power switch of the solenoid valve 222, and the electric valve core of the solenoid valve 222 is opened, and the vacuum pump extracts the air in the film-mounting plate 3. The film-mounting plate 3 generates negative pressure suction through the air inlet and exhaust pipes, and the wafer is effectively adsorbed on the film-mounting plate 3. In this way, during film-mounting, the film-mounting opening groove in the middle of the film-mounting plate can limit the wafer to be film-mounted, and the film-mounting plate can not only support the wafer, but also adsorb the wafer, which can ensure that the wafer will not be displaced during film-mounting and achieve a better film-mounting effect. The staff adheres the photoresist film to the wafer manually or mechanically (the electric pressing device vertically distributed at the upper end of the film sticking station, when working, the cylinder or electric push rod pushes the pressing plate downward to press and stick the film on the wafer). After sticking the film (turn off the power switch of the vacuum pump and the solenoid valve 222), the staff controls the push column of the three sets of electric push rods 41 to push the film sticking plate 3 upward along the film sticking opening groove 11 in the middle of the film sticking plate, and then turns on the power switch of the air compressor and the solenoid valve 223. The compressed air output by the air compressor enters the film sticking plate 3, and the air blows the film upward along the air inlet and outlet holes 32 (to prevent the lower end of the wafer from sticking to the film sticking plate and being inconvenient to remove), and the film is no longer stuck to the film sticking plate. Then the staff controls the push column of the fourth set of electric push rods 82 again to drive the three sets of vacuum suction cups 2 to rise, and the height of the three sets of vacuum suction cups 2 becomes higher (the height is higher than the height of the film-mounting table 1), which makes it convenient for the staff to manually remove the film or mechanical clamps to remove the film after the subsequent film-mounting; finally, the staff controls the push column of the three sets of electric push rods 81 to drive the film-mounting plate 3 to descend, and controls the vacuum suction cups to descend to the initial state, so as to prepare for the next wafer film-mounting. This new type brings convenience to the staff and correspondingly improves the work efficiency.

[0019] The above shows and describes the basic principles and main features of the utility model and the advantages of the utility model. For those skilled in the art, it is obvious that the utility model is limited to the details of the above exemplary embodiments, and the utility model can be implemented in other specific forms without departing from the spirit or basic features of the utility model. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the utility model is defined by the attached claims rather than the above description, and it is intended that all changes that fall within the meaning and scope of the equivalent elements of the claims are included in the utility model.

[0020] In addition, it should be understood that although the present specification is described according to the implementation mode, the implementation mode does not only include an independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in the embodiments can also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A positioning and lifting mechanism used in conjunction with a wafer film mounting machine, comprising a vacuum pump, an air compressor, an electric push rod, a film mounting plate, a vacuum suction cup, a film mounting plate, a connecting plate, a lower fixing plate, a linear bearing, an upper fixing plate, a solenoid valve, and a housing; characterized in that: The electric push rods and linear bearings are each in multiple sets, wherein the lower ends of the cylinders of the multiple sets of electric push rods are annularly installed on the outer side of the upper end of the lower fixed plate, and a plurality of axial holes are distributed in the middle of the upper end of the connecting plate, wherein the upper ends of the multiple sets of electric push cylinders are respectively installed in the plurality of axial holes, and the lower end of the upper fixed plate is annularly distributed and the upper ends of the push columns of the multiple sets of electric push rods are respectively installed together; the lower ends of the bearing seats of the multiple sets of linear bearings are annularly distributed and installed on the outer side of the upper end of the upper fixed plate, and the outer side of the lower end of the film sticking disk is annularly installed on the upper ends of the shafts of the multiple sets of linear bearings, and the lower end of the cylinder of another set of electric push rods is installed on the upper part of the upper fixed plate, and a guide tube is annularly distributed in the middle of the film sticking disk, and the vacuum suction cup is located on the guide tube. Into the tube, the air intake pipe at the lower end of the vacuum suction cup is installed on the upper end of the shell, the upper end of the push column of another set of electric push rods is installed at the lower end of the shell, the side end of the shell is provided with a branch pipe, there are multiple solenoid valves, the outer end of the branch pipe is connected to one end of the first solenoid valve, the air intake pipe of the vacuum pump is connected to the other end of the first solenoid valve and one end of the second solenoid valve through a hose respectively; the film pasting table has a film pasting opening groove, and the two side ends of the film pasting table and the two side ends of the connecting plate are respectively installed together through a fixed plate; the side end of the vacuum suction cup is provided with a connecting pipe, the other end of the connecting pipe is connected in parallel with the other end of the second solenoid valve and one end of the third solenoid valve, and the other end of the third solenoid valve is connected to the exhaust pipe of the air compressor through a hose A.

2. The positioning and lifting mechanism used in conjunction with a wafer mounting machine according to claim 1, characterized in that: The inner diameter of the film sticking opening groove of the film sticking plate and the outer diameter of the film sticking plate are larger than the outer diameter of the wafer.

3. The positioning and lifting mechanism used in conjunction with a wafer mounting machine according to claim 1, characterized in that: The outer diameter of the film sticking plate is smaller than the inner diameter of the film sticking opening groove of the film sticking table.

4. The positioning and lifting mechanism used in conjunction with a wafer mounting machine according to claim 1, characterized in that: The surface of the film-sticking plate is provided with a plurality of air inlet and outlet holes.

5. The positioning and lifting mechanism used in conjunction with a wafer mounting machine according to claim 1, characterized in that: The solenoid valve is a normally closed spool solenoid valve.

6. The positioning and lifting mechanism used in conjunction with a wafer mounting machine according to claim 1, characterized in that: The outer diameter of the vacuum suction cup is smaller than the inner diameter of the guide tube. When the push column of the other set of electric push rods is at the upper dead center, the upper end height of the vacuum suction cup is higher than the height of the film sticking plate. When the push column of the other set of electric push rods is at the lower dead center, the upper end height of the vacuum suction cup is lower than the height of the film sticking plate.

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