Cooling fin and circuit board cooling device

Abstract

The utility model provides a heat dissipation fin and a circuit board heat dissipation device, and belongs to the technical field of plate type heat dissipation. The heat dissipation fins are of sheet structures which are sequentially stacked and covered, and each sheet structure comprises a substrate layer located in the center, a metal coating arranged on the outer surface of the substrate layer in a wrapping mode through electroplating forming, and a metal spraying layer arranged on the outer surface of the metal coating in a wrapping mode in a hot spraying mode. The circuit board heat dissipation device comprises a base, and a plurality of heat dissipation fins are arranged on the base. The radiating fin has high thermal conductivity and high stability, and the radiator assembled with the radiating fin is small in size and high in radiating efficiency.

Description

Technical Field

[0001] The utility model relates to a heat dissipation fin and a circuit board heat dissipation device, belonging to the technical field of plate heat dissipation. Background Art

[0002] With the progress of the times and the development of science and technology, circuit board heat sinks play a vital role in modern industrial production and daily life. For example, in smart grids, industrial robots, electric vehicle charging piles, computer servers, big data centers, solar panels and other products, as well as refrigerators, air conditioners, washing machines and other home appliance production fields, circuit board heat sinks must be used for heat dissipation and cooling. If the heat is not dissipated in time, the problems caused by this include not only the failure or malfunction of the electronic components themselves, but also the accumulation of heat generated by the heat source, causing the internal temperature of the electronic equipment to rise, thereby adversely affecting components other than the heat source, and even causing direct damage to the electrical appliances or fire if not handled with care.

[0003] Traditional circuit boards use aluminum parts and fan heat sinks. However, due to the increasing power of electronic components and the accumulation of heat flux density, and the need for electronic components to be small and portable, the volume of circuit board heat sinks needs to be reduced. Traditional heat sinks alone can no longer meet the heat dissipation requirements of circuit boards. Therefore, it is urgent to produce a heat sink or plate heat sink that can effectively dissipate heat in a limited and narrow space to meet the needs of various usage scenarios. Utility Model Content

[0004] The utility model aims to provide a heat dissipation fin and a heat dissipation device including the heat dissipation fin, so as to solve the problems of low heat dissipation efficiency and large volume in the prior art.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A heat dissipation fin is a sheet-like structure stacked in sequence, comprising a substrate layer located in the center, a metal coating layer coated on the outer surface of the substrate layer by electroplating, and a metal spray layer coated on the outer surface of the metal coating layer by thermal spraying.

[0007] The thickness of the substrate layer is 4-6 mm, and the material of the substrate layer is graphite, so that it has high thermal conductivity and improves heat dissipation efficiency.

[0008] The thickness of the metal coating is 10-30 μm, and the material of the metal coating is copper or silver. Thus, the metal coating prevents the graphite of the substrate from volatilizing, and the corrosion resistance of the metal coating prevents the substrate made of graphite from being oxidized and damaged, thereby extending the service life.

[0009] The thickness of the metal spray layer is 70-120 μm, and the material of the metal spray layer is aluminum or aluminum alloy, so that the heat dissipation fins prepared have corrosion resistance, wear resistance, high thermal conductivity, and good tensile strength.

[0010] The substrate layer has a shape of a flat plate, an arc plate or a special-shaped plate.

[0011] The heat dissipation fins are provided with ventilation holes through them. When multiple heat dissipation fins are arranged in parallel, the air flow between the heat dissipation fins is enhanced, which is conducive to rapid heat dissipation.

[0012] A connecting portion is arranged on one side of the sheet-like structure.

[0013] The cross section of the connecting portion is T-shaped or dovetail-shaped.

[0014] The utility model also provides a circuit board heat dissipation device, comprising a base, on which one or more heat dissipation fins are arranged.

[0015] The surface of the base is provided with a plurality of slots transversely, and the slots are matched with the connecting parts of the heat dissipation fins. Through the plugging of the slots and the connecting parts, the disassembly and assembly are convenient and the practicability is high.

[0016] The beneficial effects of the utility model are:

[0017] The heat dissipation fin of the utility model can quickly conduct away the heat generated by the electronic components when they are working by adopting a three-layer stacked sheet structure, and has an excellent heat dissipation effect, thereby ensuring the normal use of the electronic components and improving the reliability and service life of the components.

[0018] The heat dissipation device of the utility model arranges a plurality of heat dissipation fins separately on the base, which effectively reduces the thermal stress between the heat dissipation fins and improves the heat dissipation performance of the device; prolongs the service life of each power device on the circuit board and ensures the service life of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 : A schematic diagram of the structure of the circuit board heat dissipation device in the utility model;

[0020] Figure 2 : A schematic diagram of the structure of the heat dissipation fins in the utility model;

[0021] Figure 3 : Cross-sectional view of the heat sink fin;

[0022] Figure 4 : Schematic diagram of the structure of the base;

[0023] Figure 5 : Schematic diagram of the second structure of the heat sink;

[0024] Figure 6 : Schematic diagram of the third structure of the heat sink;

[0025] Figure 7 : Another structural schematic diagram of the connection part of the heat sink fin.

[0026] Description of Reference Numerals

[0027] 1. heat dissipation fins; 11. substrate layer; 12. metal plating layer; 13. metal spray layer; 14. connection part; 15. vent hole;

[0028] 2. Base; 21. Slot. DETAILED DESCRIPTION

[0029] The following is a clear and complete description of the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings of the present invention. In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention can also be implemented in other ways different from those described herein, and those skilled in the art can make similar generalizations without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0030] Embodiment 1

[0031] The utility model provides a circuit board heat dissipation device, such as Figure 1 As shown, it includes a heat dissipation fin 1 and a base 2. The heat dissipation fin 1 is arranged on the base 2. According to the heat dissipation requirements, one or more heat dissipation fins 1 are used.

[0032] The structure of the base 2 is as follows Figure 4 As shown, a plurality of slots 21 are horizontally provided on the upper surface of the base 2, and the slots 21 are used to plug the heat sink fins 1. In this embodiment, the cross section of the slot 21 is dovetail-shaped to increase the firmness of the connection. Of course, the cross section of the slot 21 can also be designed to be T-shaped, or a standard geometric shape such as a rectangle or a square. In addition, a connector (not shown in the figure) can be inserted between adjacent heat sink fins to stabilize the position. The connector can be a thin straight round rod, or a straight rod with stepped shafts at both ends.

[0033] The structure of the heat sink 1 is as follows Figure 2 and Figure 3 As shown in FIG. 1 , a sheet structure is stacked in sequence, and a connecting portion 14 is provided on one side of the sheet structure. The connecting portion 14 is matched with the slot 21, and is easy to assemble and disassemble. The cross-sectional shape of the connecting portion 14 corresponds to the slot 21 of the base 2. In this embodiment, a dovetail type is selected, and a T-type can also be selected, such as Figure 7 As shown; it can also be a standard geometric shape such as a rectangle, square, etc.

[0034] The sheet structure of the heat dissipation fin 1 preferably includes three layers, which are a substrate layer 11, a metal coating layer 12 and a metal spray layer 13 from the inside to the outside. The substrate layer 11 is located in the center; the metal coating layer 12 is coated on the outer surface of the substrate layer 11; and the metal spray layer 13 is coated on the outer surface of the metal coating layer 12.

[0035] The thickness of the substrate layer 11 is 4-6 mm, and the material of the substrate layer 11 is graphite. In this embodiment, the material is commercially available high-purity graphite of 99.99% (4N) or more, which is processed into a thin plate with a thickness of 5 mm.

[0036] The thickness of the metal plating layer 12 is 10-30 μm, and the material of the metal plating layer 12 is copper or silver. In this embodiment, the material is preferably copper metal, and a general electroplating method is adopted. Specifically, the processed graphite sheet is used as the inner core, and the graphite sheet is placed in the electrolyte of the electroplating tank for copper electroplating. The thickness of the copper plating layer is 15 μm. After plating, it should be rinsed with clean water. After electroplating with copper metal, the heat sink fins have good corrosion resistance, which prevents the heat sink made of only a single layer of graphite from being damaged by oxidation, thereby extending the service life of the heat sink fins; in addition, it can also prevent graphite from volatilizing and causing local environmental pollution.

[0037] The thickness of the metal spray layer 13 is 70-120μm, and the material of the metal spray layer 13 is aluminum or aluminum alloy. In this embodiment, the material is 60 series aluminum alloy, and a general thermal spraying method is adopted. Specifically, before thermal spraying aluminum, sandblasting is performed on the electroplated copper to make its surface rough, so that the thermal sprayed aluminum and copper are very densely bonded and very firmly adhered. After sandblasting, it is cleaned and dried, and then aluminum is sprayed. The thickness of the aluminum alloy spray layer is 100μm. The metal spray layer is made of aluminum alloy material, and the heat sink fins have corrosion resistance, wear resistance, high thermal conductivity, and also increase the tensile strength of the heat sink fins.

[0038] The heat dissipation fin 1 of the utility model is first electroplated with copper and then thermally sprayed with aluminum on the surface of the graphite sheet, which enhances the thermal conductivity, improves the thermal stability, enhances the mechanical strength and the aesthetics, thereby improving the performance and quality of the heat dissipation fin as a whole; and further improves the performance of the heat dissipation device of the utility model.

[0039] The heat dissipation fin 1 is also provided with a vent hole 15, which may be one or more. When the heat dissipation device of the utility model uses a plurality of heat dissipation fins arranged in parallel, the vent hole 15 can enhance the air circulation between the heat dissipation fins 1, prevent local overheating at the center of the plate surface of the heat dissipation fin 1, improve the heat dissipation efficiency, and extend the service life.

[0040] Embodiment 2

[0041] In this embodiment, the structure is basically the same as that of the first embodiment, and the difference from the first embodiment is: Figure 5As shown, the sheet structure of the heat dissipation fin 1 is an arc-shaped plate.

[0042] Similarly, the cross-section of the connecting portion 14 of the heat dissipating fin 1 may be a dovetail shape, a T shape, or a standard geometric shape such as a rectangle or a square.

[0043] Embodiment 3

[0044] In this embodiment, the structure is basically the same as that of the first embodiment, and the difference from the first embodiment is: Figure 6 As shown, the sheet structure of the heat dissipation fin 1 is a special-shaped plate.

[0045] Similarly, the cross-section of the connecting portion 14 of the heat dissipating fin 1 may be a dovetail shape, a T shape, or a standard geometric shape such as a rectangle or a square.

[0046] The above descriptions are only several preferred embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of them. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

Claims

1. A heat dissipation fin, characterized in that: The heat dissipation fin is a sheet structure stacked in sequence, comprising a substrate layer located in the center, a metal coating formed by electroplating and coated on the outer surface of the substrate layer, and a metal spray layer coated on the outer surface of the metal coating layer by thermal spraying.

2. The heat dissipation fin according to claim 1, characterized in that: The thickness of the substrate layer is 4-6 mm, and the material of the substrate layer is graphite.

3. The heat dissipation fin according to claim 1, characterized in that: The thickness of the metal plating layer is 10-30 μm, and the material of the metal plating layer is copper or silver.

4. The heat dissipation fin according to claim 1, characterized in that: The thickness of the metal spray layer is 70-120 μm, and the material of the metal spray layer is aluminum or aluminum alloy.

5. The heat dissipation fin according to claim 1, characterized in that: The substrate layer has a shape of a flat plate, an arc-shaped plate or a special-shaped plate.

6. The heat dissipation fin according to claim 1, characterized in that: The heat dissipation fins are provided with ventilation holes.

7. The heat dissipation fin according to claim 1, characterized in that: A connecting portion is arranged on one side of the sheet-like structure.

8. The heat dissipation fin according to claim 7, characterized in that: The cross section of the connecting portion is T-shaped or dovetail-shaped.

9. A circuit board heat dissipation device, characterized in that: It comprises a base, on which one or more heat dissipation fins according to any one of claims 1 to 8 are arranged.

10. The circuit board heat dissipation device according to claim 9, characterized in that: A plurality of slots are arranged transversely on the surface of the base, and the slots are matched with the connecting parts of the heat dissipation fins.

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