Circuit board assembly and electronic product

Abstract

A circuit board assembly comprises a first circuit substrate, heat-conducting glue, an electronic element and a second circuit substrate. The first circuit substrate comprises a first circuit layer, a heat conduction hole and a heat conduction block, and the heat conduction hole is connected with the heat conduction block and the first circuit layer; the first circuit layer is located on the first surface of the first circuit substrate; the heat-conducting glue is located on the second surface of the first circuit substrate, and the second surface and the first surface are two opposite surfaces of the first circuit substrate; an electronic element is connected with the heat conduction block through the heat conduction glue; the second circuit substrate is located on the surface, away from the first circuit substrate, of the electronic element and electrically connected with the electronic element, and the second circuit is connected with the first circuit substrate through a conduction part. The utility model further provides an electronic product.

Description

Technical Field

[0001] The present application relates to the technical field of circuit board heat dissipation, and in particular to a circuit board assembly and an electronic product. Background Art

[0002] As electronic products develop towards being lighter and thinner, electronic components are usually buried in circuit boards to reduce the installation thickness of the electronic components and circuit boards. When electronic components are buried in circuit boards, the heat generated by continuous operation is difficult to dissipate, which affects the performance of the electronic components. In related technologies, heat can be dissipated through a circuit substrate electrically connected to the electronic components, but the heat dissipation path is single and the heat dissipation effect is poor. Utility Model Content

[0003] In view of this, it is necessary to provide a circuit board assembly with good heat dissipation effect.

[0004] A circuit board assembly includes a first circuit substrate, a thermally conductive adhesive, an electronic component, and a second circuit substrate. The first circuit substrate includes a first circuit layer, a thermally conductive hole, and a thermally conductive block, wherein the thermally conductive hole connects the thermally conductive block and the first circuit layer; the first circuit layer is located on the first surface of the first circuit substrate; the thermally conductive adhesive is located on the second surface of the first circuit substrate, and the second surface and the first surface are two surfaces opposite to the first circuit substrate; the electronic component is connected to the thermally conductive block by the thermally conductive adhesive; the second circuit substrate is located on the surface of the electronic component away from the first circuit substrate and is electrically connected to the electronic component, and the second circuit is connected to the first circuit substrate through a conductive portion.

[0005] In some embodiments of the present application, the circuit board assembly further includes a packaging layer, wherein the packaging layer is located between the first circuit substrate and the second circuit substrate and surrounds the electronic component.

[0006] In some embodiments of the present application, the packaging layer is also located between the electronic component and the first circuit substrate and surrounds the thermal conductive adhesive.

[0007] In some embodiments of the present application, the conductive portion penetrates the packaging layer and electrically connects the first circuit substrate and the second circuit substrate.

[0008] In some embodiments of the present application, the first circuit substrate further includes a first dielectric layer, the first dielectric layer and the first circuit layer are stacked, a portion of the surface of the thermal conductive block is buried in the first dielectric layer, and the remaining portion of the surface is exposed to the first dielectric layer.

[0009] In some embodiments of the present application, a surface of the heat conductive block exposed to the first dielectric layer and a surface of the first dielectric layer facing the electronic component are on the same plane.

[0010] In some embodiments of the present application, the heat conductive block is made of copper.

[0011] In some embodiments of the present application, when the first circuit layer is multi-layered, the first circuit substrate further includes a first conductive hole, and the first conductive hole conducts electricity between two adjacent layers of the first circuit layer.

[0012] In some embodiments of the present application, the second circuit substrate includes a second dielectric layer and a second circuit layer, and the second circuit layer and the second dielectric layer are stacked; when the second circuit layer is multi-layer, the second circuit substrate also includes a second conductive hole, and the second conductive hole conducts two adjacent second circuit layers.

[0013] An electronic product comprises the circuit board assembly.

[0014] The circuit board assembly provided in the embodiment of the present application includes a first circuit substrate, a second circuit substrate, a thermally conductive adhesive and an electronic component. The first circuit substrate includes a thermally conductive block and a thermally conductive hole, the thermally conductive adhesive bonds the thermally conductive block and the electronic component, the thermally conductive hole connects the thermally conductive block and the first circuit layer in the first circuit substrate, the second circuit substrate is located on the surface of the electronic component away from the first circuit substrate and is electrically connected to the electronic component, and the second circuit is connected to the first circuit substrate through a conductive portion. The electronic component can generate heat during operation, and the heat can be dissipated outward through the thermally conductive adhesive, the thermally conductive block, the thermally conductive hole and the first circuit layer in the first circuit substrate in sequence, and can also be dissipated outward through the second circuit substrate, that is, the circuit board assembly includes two heat dissipation paths, which is conducive to quickly dissipating the heat generated by the electronic component. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A schematic cross-sectional view of a circuit board assembly provided in an embodiment of the present application.

[0016] Figure 2 A schematic diagram of the structure of an electronic product provided in an embodiment of the present application.

[0017] Main component symbols

[0018] Circuit Board Assembly 100 First circuit substrate 10 First surface 111 Second surface 112 First circuit layer 11 The first dielectric layer 12 First solder mask 13 First via hole 14 Thermal vias 15 Thermal block 16 Thermally conductive adhesive 20 Electronic components 30 Main body 31 Conductive part 33 Second circuit substrate 40 Second circuit layer 41 Second dielectric layer 42 The second via 43 Second solder mask 44 Encapsulation layer 50 Conductive part 60 Electronics 200 First Direction L1 Heat dissipation direction A. B DETAILED DESCRIPTION

[0019] In order to more clearly understand the above-mentioned purposes, features and advantages of the present application, the present application is described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the absence of conflict, the embodiments of the present application and the features in the embodiments can be combined with each other. In the following description, many specific details are set forth to facilitate a full understanding of the present application, and the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments.

[0020] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of this article are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used herein includes all and any combination of one or more related listed items.

[0021] In the embodiments of the present application, for the convenience of description and not to limit the present application, the term "connection" used in the patent application specification and claims of the present application is not limited to physical or mechanical connection, whether direct or indirect. "Up", "down", "above", "below", "left", "right", etc. are only used to indicate relative position relationship. When the absolute position of the described object changes, the relative position relationship also changes accordingly.

[0022] See also Figure 1 The embodiment of the present application provides a circuit board assembly 100, and the circuit board assembly 100 may include a first circuit substrate 10, a second circuit substrate 40, a thermally conductive adhesive 20, and an electronic component 30. The thermally conductive adhesive 20 bonds the first circuit substrate 10 and the electronic component 30, and the second circuit substrate 40 is located on the surface of the electronic component 30 away from the first circuit substrate 10 and is electrically connected to the electronic component 30. The electronic component 30 may generate heat during operation, and the heat may be dissipated outwards through the thermally conductive adhesive 20 and the first circuit substrate 10 in sequence, and may also be dissipated outwards through the second circuit substrate 40, that is, the circuit board assembly 100 includes two heat dissipation paths, which is conducive to quickly dissipating the heat generated by the electronic component 30.

[0023] The first circuit substrate 10 may include a first circuit layer 11, a first dielectric layer 12, a first solder mask 13, a first via 14, a thermal via 15 and a thermal block 16. The first circuit layer 11 and the first dielectric layer 12 are stacked along a first direction L1, and the number of layers of the first circuit layer 11 may be one or more layers. When the number of layers of the first circuit layer 11 is multiple layers, two adjacent first circuit layers 11 are connected through the first via 14. The first dielectric layer 12 may be one or more layers.

[0024] The first solder resist layer 13 has two layers, one of which covers the first dielectric layer 12 located on the outside (away from the electronic component 30) and is located on the surface of the first dielectric layer 12 away from the second circuit substrate 40, and at least part of the first circuit layer 11 located on the outside is exposed to the first solder resist layer 13; the other first solder resist layer 13 covers part of the surface of the first dielectric layer 12 on the inside (close to the electronic component 30).

[0025] The heat-conducting block 16 is located on the surface of the first dielectric layer 12 close to the second circuit substrate 40, and part of the surface of the heat-conducting block 16 is buried in the first dielectric layer 12. The heat-conducting hole 15 connects the heat-conducting block 16 and the first circuit layer 11; the remaining surface of the heat-conducting block 16 is exposed to the first dielectric layer 12, and the surface of the heat-conducting block 16 exposed to the first dielectric layer 12 is bonded to the heat-conducting adhesive 20, that is, the electronic component 30 and the heat-conducting block 16 are bonded to the two opposite surfaces of the heat-conducting adhesive 20 respectively, and the heat-conducting adhesive 20 can not only play a role of rapid heat conduction, but also play a buffering role between the electronic component 30 and the heat-conducting block 16.

[0026] The first circuit substrate 10 includes a first surface 111 and a second surface 112, and the first surface 111 and the second surface 112 are two opposite surfaces of the first circuit substrate 10. At least one first circuit layer 11 is located on the first surface 111, and the second circuit substrate 40, the thermally conductive adhesive 20 and the electronic components 30 are all located on the side where the second surface 112 is located. That is, the first surface 111 may include the surface of the first circuit layer 11 located on the outside and the surface of the first solder mask 13, and the second surface 112 may include the surface of the first dielectric layer 12 and the surface of the thermally conductive block 16. The thermally conductive adhesive 20 is located on the second surface 112 of the first circuit substrate 10. The material of the thermally conductive block 16 includes but is not limited to metal, metal alloy, etc. In this embodiment, the material of the thermally conductive block 16 is copper. In the step of manufacturing the first circuit layer 11 in the first circuit substrate 10, the thermally conductive block 16 made of copper can be formed simultaneously, which is conducive to reducing the manufacturing cost.

[0027] The heat conducting block 16 is exposed on the surface of the first dielectric layer 12 and is on the same plane as the surface of the first dielectric layer 12 facing the electronic component 30 , which is beneficial to the assembly of the circuit board assembly 100 .

[0028] The second circuit substrate 40 may include a second circuit layer 41, a second dielectric layer 42, a second via 43, and a second solder mask 44. The second circuit layer 41 and the second dielectric layer 42 are stacked along the first direction L1. The number of layers of the second circuit layer 41 may be one or more layers. When the number of layers of the second circuit layer 41 is multiple layers, two adjacent second circuit layers 41 are connected through the second via 43. The second dielectric layer 42 may be one or more layers.

[0029] The second solder resist layer 44 has one layer, covers the second dielectric layer 42 located on the outside, and is located on the surface of the second dielectric layer 42 facing away from the first circuit substrate 10 , and at least part of the second circuit layer 41 located on the outside is exposed to the second solder resist layer 44 .

[0030] The second circuit substrate 40 is electrically connected to the electronic component 30, and the electronic component 30 includes a main body 31 and a conductive portion 33 located on a surface of the main body 31. The thermally conductive adhesive 20 connects the main body 31 and the thermally conductive block 16, and the conductive portion 33 is located on a surface of the main body 31 away from the thermally conductive block 16, that is, the conductive portion 33 is arranged toward the second circuit substrate 40, and the conductive portion 33 is electrically connected to the second circuit layer 41.

[0031] When the electronic component 30 generates heat during operation, the heat can be dissipated through the thermal conductive adhesive 20, the thermal conductive block 16, the thermal conductive hole 15, the first circuit layer 11, the first via 14 and another first circuit layer 11 in sequence, that is, the heat dissipation direction A; the heat can also be dissipated through the conductive part 33, the second circuit layer 41, the second via 43 and another second circuit layer 41 in sequence, that is, the heat dissipation direction B.

[0032] The circuit board assembly 100 may further include a packaging layer 50, which is located between the first circuit substrate 10 and the second circuit substrate 40 and surrounds the electronic component 30. Specifically, the packaging layer 50 surrounds the electronic component 30 with the first direction L1 as the axis, and the packaging layer 50 also connects the first solder mask 13 and the second dielectric layer 42 close to the side where the electronic component 30 is located. The packaging layer 50 is also located between the electronic component 30 and the first circuit substrate 10 and surrounds the thermal conductive adhesive 20.

[0033] The circuit board assembly 100 further includes a conducting portion 60, which penetrates the packaging layer 50 along a first direction L1 and electrically connects the first circuit substrate 10 and the second circuit substrate 40. Specifically, the conducting portion 60 may be made of solder paste.

[0034] See also Figure 2The embodiment of the present application further provides an electronic product 200, and the electronic product 200 includes the circuit board assembly 100. The electronic product 200 may be a mobile phone, a camera, a webcam, a drone, a smart watch, etc. In this embodiment, the electronic product 200 is a mobile phone.

[0035] The circuit board assembly 100 provided in the embodiment of the present application includes a first circuit substrate 10, a second circuit substrate 40, a heat-conducting adhesive 20 and an electronic component 30. The first circuit substrate 10 includes a heat-conducting block 16 and a heat-conducting hole 15, the heat-conducting adhesive 20 bonds the heat-conducting block 16 and the electronic component 30, the heat-conducting hole 15 connects the heat-conducting block 16 and the first circuit layer 11 in the first circuit substrate 10, and the second circuit substrate 40 is located on the surface of the electronic component 30 away from the first circuit substrate 10 and is electrically connected to the electronic component 30. The electronic component 30 can generate heat during operation, and the heat can be dissipated outward through the heat-conducting adhesive 20, the heat-conducting block 16, the heat-conducting hole 15 and the first circuit layer 11 in the first circuit substrate 10 in sequence, and can also be dissipated outward through the conductive part 33 and the second circuit layer 41 in the second circuit substrate 40, that is, the circuit board assembly 100 includes two heat dissipation paths, which is conducive to quickly dissipating the heat generated by the electronic component 30.

[0036] The above implementation modes are only used to illustrate the technical solutions of the present application and are not intended to limit the present application. Although the present application has been described in detail with reference to the above preferred implementation modes, a person skilled in the art should understand that the technical solutions of the present application may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present application.

Claims

1. A circuit board assembly, characterized in that: include: A first circuit substrate, comprising a first circuit layer, a heat-conducting hole and a heat-conducting block, wherein the heat-conducting hole connects the heat-conducting block and the first circuit layer, and the first circuit layer is located on a first surface of the first circuit substrate; Thermally conductive adhesive, located on a second surface of the first circuit substrate, the second surface and the first surface being two surfaces opposite to the first circuit substrate; An electronic component, wherein the electronic component is connected to the heat conductive block by the heat conductive adhesive; as well as The second circuit substrate is located on the surface of the electronic component away from the first circuit substrate and is electrically connected to the electronic component; the second circuit is connected to the first circuit substrate through a conducting portion.

2. The circuit board assembly according to claim 1, characterized in that: The circuit board assembly further includes a packaging layer, which is located between the first circuit substrate and the second circuit substrate and surrounds the electronic component.

3. The circuit board assembly according to claim 2, characterized in that: The packaging layer is also located between the electronic component and the first circuit substrate and surrounds the thermal conductive adhesive.

4. The circuit board assembly according to claim 2, characterized in that: The conductive portion penetrates the packaging layer and electrically connects the first circuit substrate and the second circuit substrate.

5. The circuit board assembly according to claim 1, characterized in that: The first circuit substrate further includes a first dielectric layer, which is stacked with the first circuit layer. Part of the surface of the heat conductive block is buried in the first dielectric layer, and the remaining part of the surface is exposed to the first dielectric layer.

6. The circuit board assembly according to claim 5, characterized in that: The surface of the heat conducting block exposed to the first dielectric layer is on the same plane as the surface of the first dielectric layer facing the electronic component.

7. The circuit board assembly according to claim 1, characterized in that: The material of the heat conducting block is copper.

8. The circuit board assembly according to claim 1, wherein: When the first circuit layer is multi-layered, the first circuit substrate further includes a first conducting hole, and the first conducting hole conducts electricity between two adjacent first circuit layers.

9. The circuit board assembly according to claim 1, characterized in that: The second circuit substrate includes a second dielectric layer and a second circuit layer, and the second circuit layer and the second dielectric layer are stacked. When the second circuit layer is multi-layer, the second circuit substrate also includes a second conductive hole, and the second conductive hole conducts two adjacent second circuit layers.

10. An electronic product, characterized in that: A circuit board assembly comprising any one of claims 1-9.

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