Integrated energy storage heat dissipation PCB

Abstract

The utility model belongs to the technical field of PCBs, and particularly relates to an integrated energy storage heat dissipation PCB which comprises a first substrate, a second substrate is adhered to the bottom of the first substrate, a plurality of mounting grooves are formed in the sides, close to each other, of the first substrate and the second substrate, mounting holes are formed in the inner walls of the mounting grooves in the top of the second substrate, and the mounting holes are communicated with the mounting grooves. Second heat dissipation plates are fixedly connected to the inner walls of the multiple mounting holes, third heat dissipation plates are fixedly connected to the bottoms of the multiple second heat dissipation plates, heat conduction pipes are fixedly connected to the tops of the multiple second heat dissipation plates, and the heat conduction pipes are fixedly connected with the inner walls of the mounting grooves in the first substrate and the second substrate. The plurality of heat conduction pipes are mounted between the first substrate and the second substrate, and the second heat dissipation plate and the third heat dissipation plate are mounted on the outer walls of the plurality of heat conduction pipes, so that heat in the PCB can be conveyed to the third heat dissipation plate through the heat conduction pipes and the second heat dissipation plate, and the heat dissipation effect of the PCB is improved through rapid heat dissipation of the third heat dissipation plate.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB, and more specifically to an integrated energy storage and heat dissipation PCB. Background Art

[0002] Integrated energy storage heat dissipation PCB is widely used in energy storage systems, photovoltaic products, charging pile products and other fields. In these fields, energy storage PCB board, as an important part of battery module, plays a key role in the performance and safety of the whole system. Good PCB layout design can greatly improve the heat dissipation performance.

[0003] Existing PCB boards generally adopt a multi-layer structure design, which is constructed by stacking and pressing layers. Since the PCB board adopts a multi-layer structure and is tightly pressed layer by layer, its internal space is relatively closed, which makes it difficult for heat to be effectively dissipated inside the board. To this end, we propose an integrated energy storage and heat dissipation PCB. Utility Model Content

[0004] Based on the above-mentioned technical problem that the existing PCB boards generally adopt a multi-layer structure design and are constructed by stacking and pressing layers, and because the PCB boards adopt a multi-layer structure and are tightly pressed layer by layer, their internal space is relatively closed, resulting in the difficulty in effectively dissipating heat inside the board, the utility model proposes an integrated energy storage and heat dissipation PCB.

[0005] The utility model proposes an integrated energy storage and heat dissipation PCB, comprising a first substrate, a second substrate bonded to the bottom of the first substrate, a plurality of mounting grooves on the sides of the first substrate and the second substrate close to each other, mounting holes on the inner walls of the plurality of mounting grooves located at the top of the second substrate, a second heat sink fixedly connected to the inner walls of the plurality of mounting holes, a third heat sink fixedly connected to the bottoms of the plurality of second heat sinks, a heat pipe fixedly connected to the tops of the plurality of second heat sinks, and the heat pipes fixedly connected to the inner walls of the mounting grooves on the first substrate and the second substrate, respectively.

[0006] Preferably, two first heat dissipation plates are further included, and both ends of the plurality of heat pipes respectively penetrate the first substrate and the second substrate and extend to the outside thereof, and relatively close sides of the two first heat dissipation plates are respectively fixedly connected to the heat pipes.

[0007] Preferably, a plurality of heat sinks are fixedly connected to the outer sides of the two first heat sinks, and supporting feet are fixedly connected to the bottoms of the two first heat sinks.

[0008] Preferably, a conductive layer is fixed on the top of the first substrate, an adhesive layer is fixedly connected to the top of the conductive layer, and a pad layer is fixedly connected to the top of the adhesive layer.

[0009] Preferably, the tops of the two first heat dissipation plates are fixedly connected to support plates, the ends of the two support plates are fixedly connected to rotating shafts, one end of the two rotating shafts is fixedly connected to screws, the ends of the screws are fixedly connected to limiting blocks, the outer wall of the screws is sleeved with rubber pads, the outer wall of the rubber pads is fixedly connected to the limiting blocks, the ends of the screws are threadedly connected to threaded sleeves, and the outer walls of the threaded sleeves are fixedly connected to two shifting blocks.

[0010] Preferably, two elastic plates are further included, wherein one of the elastic plates is rotatably connected to the rotating shaft via a bearing, and the other elastic plate is sleeved on the screw rod.

[0011] Preferably, the inner ends of the elastic plates are respectively in contact with the outer walls of the rubber pads.

[0012] Preferably, the ends of the two elastic plates are fixedly connected to connecting plates, a fixing frame is fixedly connected between the two connecting plates, a micro motor is fixedly connected to the inner wall of the fixing frame, and a fan blade is fixedly connected to the output end of the micro motor.

[0013] The beneficial effects of the present invention are:

[0014] 1. In the utility model, by installing a plurality of heat pipes between the first substrate and the second substrate, and installing a second heat sink and a third heat sink on the outer walls of the plurality of heat pipes, the internal heat of the PCB board can be transported to the third heat sink through the heat pipes and the second heat sink, and the heat is quickly dissipated through the third heat sink, thereby improving the heat dissipation effect of the PCB board.

[0015] 2. In the present invention, by installing a first heat sink on both sides of the PCB board and installing a plurality of heat sinks on the first heat sink, the heat dissipation effect of the PCB board can be further improved.

[0016] 3. In the utility model, by installing support feet at the bottom of the two first heat sinks, when installing the PCB board, the PCB board is supported by the support feet to ensure that a gap is maintained between the PCB board and the mounting member to facilitate heat dissipation by the third heat sink.

[0017] 4. In the utility model, the fan blades are driven to rotate by a micro motor, so that the electronic components installed on the PCB board can be cooled. By rotating the shift block, the threaded sleeve is separated from the extrusion of the elastic plate, and the elastic plate is separated from the extrusion of the rubber pad. At this time, the blowing angle of the fan blades is adjusted by rotating the connecting plate, and the threaded sleeve is rotated to squeeze the elastic plate, so that the elastic plate squeezes the rubber pad, and the micro motor can be fixed under the friction between the elastic plate and the rubber pad. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0019] Figure 2 This is a schematic structural diagram of the first substrate of the utility model;

[0020] Figure 3 This is a schematic diagram of the installation structure of the first heat sink of the utility model;

[0021] Figure 4 For this utility model Figure 1 The enlarged view of point A in the middle;

[0022] Figure 5 This is a schematic diagram of the installation structure of the fan blade of the utility model;

[0023] Figure 6 This is a schematic diagram of the installation structure of the rubber pad of the utility model.

[0024] In the figure: 1. first substrate; 2. second substrate; 3. mounting groove; 4. mounting hole; 5. heat pipe; 6. first heat sink; 7. second heat sink; 8. third heat sink; 9. heat sink; 10. support foot; 11. conductive layer; 12. adhesive layer; 13. pad layer; 14. screw; 15. support plate; 16. rotating shaft; 17. elastic plate; 18. connecting plate; 19. fixing frame; 20. micro motor; 21. fan blade; 22. limit block; 23. rubber pad; 24. threaded sleeve; 25. shift block. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0026] like Figure 1 , Figure 2 and 4As shown, an integrated energy storage and heat dissipation PCB comprises a first substrate 1, a second substrate 2 is bonded to the bottom of the first substrate 1, a conductive layer 11 is fixed on the top of the first substrate 1, an adhesive layer 12 is fixedly connected to the top of the conductive layer 11, a pad layer 13 is fixedly connected to the top of the adhesive layer 12, a plurality of mounting grooves 3 are provided on the side of the first substrate 1 and the second substrate 2 close to each other, mounting holes 4 are provided on the inner walls of the plurality of mounting grooves 3 located on the top of the second substrate 2, a second heat dissipation plate 7 is fixedly connected to the inner walls of the plurality of mounting holes 4, a third heat dissipation plate 8 is fixedly connected to the bottom of the plurality of second heat dissipation plates 7, a heat pipe 5 is fixedly connected to the top of the plurality of second heat dissipation plates 7, the heat pipe 5 is fixedly connected to the inner walls of the mounting grooves 3 on the first substrate 1 and the second substrate 2, respectively, by installing a plurality of heat pipes 5 between the first substrate 1 and the second substrate 2, and installing the second heat dissipation plate 7 and the third heat dissipation plate 8 on the outer walls of the plurality of heat pipes 5, the internal heat of the PCB board can be transported to the third heat dissipation plate 8 through the heat pipes 5 and the second heat dissipation plate 7, the heat is quickly dissipated through the third heat dissipation plate 8, and the heat dissipation effect of the PCB board is improved.

[0027] like Figure 1 and 3 As shown, two first heat sinks 6 are also included, and both ends of the plurality of heat pipes 5 respectively penetrate the first substrate 1 and the second substrate 2 and extend to the outside thereof. The relatively close sides of the two first heat sinks 6 are respectively fixedly connected to the heat pipes 5, and the outer sides of the two first heat sinks 6 are fixedly connected to a plurality of heat sinks 9, and the bottoms of the two first heat sinks 6 are fixedly connected to support feet 10. By installing the first heat sinks 6 on both sides of the PCB board and installing a plurality of heat sinks 9 on the first heat sinks 6, the heat dissipation effect of the PCB board can be further improved. By installing the support feet 10 at the bottom of the two first heat sinks 6, the PCB board is supported by the support feet 10 when the PCB board is installed, ensuring that a gap is maintained between the PCB board and the mounting member, so as to facilitate the third heat sink 8 to dissipate heat.

[0028] like Figure 4 , Figure 5 and 6As shown, the tops of the two first heat dissipation plates 6 are fixedly connected with support plates 15, the ends of the two support plates 15 are fixedly connected with rotating shafts 16, one end of the two rotating shafts 16 is fixedly connected with screws 14, the ends of the screws 14 are fixedly connected with limiting blocks 22, the outer walls of the screws 14 are sleeved with rubber pads 23, the outer walls of the rubber pads 23 are fixedly connected to the limiting blocks 22, the ends of the screws 14 are threadedly connected with threaded sleeves 24, the outer walls of the threaded sleeves 24 are fixedly connected with two shifting blocks 25, and also include two elastic plates 17, one of which is rotatably connected to the rotating shaft 16 through a bearing, and the other elastic plate 17 is sleeved on the screws 14, the inner ends of the elastic plates 17 are respectively abutted against the outer walls of the rubber pads 23, the ends of the two elastic plates 17 are fixedly connected with connecting plates 18, a fixing frame 19 is fixedly connected between the two connecting plates 18, a micro motor 20 is fixedly connected to the inner wall of the fixing frame 19, and a fan blade 21 is fixedly connected to the output end of the micro motor 20.

[0029] Working principle: The fan blades 21 are driven to rotate by the micro motor 20, so that the electronic components installed on the PCB board can be cooled. By rotating the dial block 25, the threaded sleeve 24 is separated from the extrusion of the elastic plate 17, and the elastic plate 17 is separated from the extrusion of the rubber pad 23. At this time, the blowing angle of the fan blades 21 is adjusted by rotating the connecting plate 18. The threaded sleeve 24 is rotated to squeeze the elastic plate 17, so that the elastic plate 17 squeezes the rubber pad 23. The micro motor 20 can be fixed under the friction between the elastic plate 17 and the rubber pad 23.

[0030] It should be noted that the terms "comprises", "includes" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or apparatus that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or apparatus.

[0031] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An integrated energy storage and heat dissipation PCB, comprising a first substrate (1), characterized in that: A second substrate (2) is bonded to the bottom of the first substrate (1); a plurality of mounting grooves (3) are provided on the sides of the first substrate (1) and the second substrate (2) that are close to each other; mounting holes (4) are provided on the inner walls of the plurality of mounting grooves (3) located at the top of the second substrate (2); a second heat sink (7) is fixedly connected to the inner walls of the plurality of mounting holes (4); a third heat sink (8) is fixedly connected to the bottoms of the plurality of second heat sinks (7); a heat pipe (5) is fixedly connected to the tops of the plurality of second heat sinks (7); the heat pipe (5) is fixedly connected to the inner walls of the mounting grooves (3) on the first substrate (1) and the second substrate (2), respectively.

2. The integrated energy storage and heat dissipation PCB according to claim 1, characterized in that: It also comprises two first heat dissipation plates (6), the two ends of the plurality of heat conduction pipes (5) respectively penetrate the first substrate (1) and the second substrate (2) and extend to the outside thereof, and the relatively close sides of the two first heat dissipation plates (6) are respectively fixedly connected to the heat conduction pipes (5).

3. The integrated energy storage and heat dissipation PCB according to claim 2, characterized in that: A plurality of heat sinks (9) are fixedly connected to the outer side of the two first heat sinks (6), and a support foot (10) is fixedly connected to the bottom of the two first heat sinks (6).

4. The integrated energy storage and heat dissipation PCB according to claim 3, characterized in that: A conductive layer (11) is fixed on the top of the first substrate (1), an adhesive layer (12) is fixedly connected to the top of the conductive layer (11), and a pad layer (13) is fixedly connected to the top of the adhesive layer (12).

5. The integrated energy storage and heat dissipation PCB according to claim 4, characterized in that: The tops of the two first heat dissipation plates (6) are fixedly connected to support plates (15), the ends of the two support plates (15) are fixedly connected to rotating shafts (16), one end of the two rotating shafts (16) is fixedly connected to screw rods (14), the ends of the screw rods (14) are fixedly connected to limiting blocks (22), the outer wall of the screw rods (14) is sleeved with rubber pads (23), the outer wall of the rubber pads (23) is fixedly connected to the limiting blocks (22), the ends of the screw rods (14) are threadedly connected to thread sleeves (24), and the outer wall of the thread sleeves (24) are fixedly connected to two shifting blocks (25).

6. The integrated energy storage and heat dissipation PCB according to claim 5, characterized in that: It also includes two elastic plates (17), one of which is rotatably connected to the rotating shaft (16) via a bearing, and the other elastic plate (17) is sleeved on the screw rod (14).

7. The integrated energy storage and heat dissipation PCB according to claim 6, characterized in that: The inner ends of the elastic plates (17) are respectively in contact with the outer walls of the rubber pads (23).

8. The integrated energy storage and heat dissipation PCB according to claim 7, characterized in that: The ends of the two elastic plates (17) are fixedly connected to a connecting plate (18), a fixing frame (19) is fixedly connected between the two connecting plates (18), a micro motor (20) is fixedly connected to the inner wall of the fixing frame (19), and a fan blade (21) is fixedly connected to the output end of the micro motor (20).

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