LED packaging structure and light-emitting device
By using a combination of ceramic substrate, glass cover and glass anti-reflection sheet in the LED packaging structure, the problem of insufficient temperature tolerance of the sealant is solved, and the light output brightness and light extraction efficiency of the LED packaging structure are improved.
Patent Information
- Application Number
- CN202420265997.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-02
- Publication Date
- 2025-01-21
- Estimated Expiration
- 2034-02-02
AI Technical Summary
The sealant of the existing LED packaging structure is insufficient to withstand the temperature and cannot adapt to the higher temperature generated by the LED chip, which limits the increase in the light output brightness of the LED packaging structure.
An LED packaging structure including a ceramic substrate, a glass cover, an LED chip and a glass anti-reflection sheet is used. The glass anti-reflection sheet is arranged on a surface of the LED chip away from the ceramic substrate. The glass cover and the ceramic substrate form an air cavity. The LED chip and the glass anti-reflection sheet are The transparent sheet is arranged in the air cavity.
The light output brightness of the LED packaging structure is improved. The high temperature tolerance of the glass anti-reflection sheet and ceramic substrate adapts to the temperature generated by the greater luminous power of the LED chip. At the same time, the glass anti-reflection sheet improves the light extraction efficiency.
Smart Images
Figure CN222382054U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of LED packaging technology, and more specifically to an LED packaging structure and a light-emitting device. Background Art
[0002] The existing high-power LED packaging structure generally includes a ceramic substrate, an LED chip and a sealant. The LED chip is arranged on the ceramic substrate, and the sealant covers the surface of the LED chip exposed outside the ceramic substrate. The sealant is generally silicone, so the temperature tolerance of the existing LED packaging structure is limited by the sealant.
[0003] With the development of the industry, the consumer demand for the brightness of the LED packaging structure is getting higher and higher. The improvement of the brightness of the LED packaging structure needs to rely on the improvement of the luminous power of the LED chip and the improvement of the light extraction efficiency of the LED packaging structure. Among them, the increase in the luminous power of the LED chip is accompanied by the increase in the temperature generated by the LED chip. However, since the sealant in the LED packaging structure has insufficient temperature tolerance and cannot adapt to the higher temperature generated by the LED chip, the improvement of the brightness of the LED packaging structure is restricted.
[0004] Therefore, how to improve the light output brightness of the LED packaging structure is still a technical problem that technical personnel in this field need to solve urgently. Utility Model Content
[0005] In view of this, in order to solve the above technical problems, the present application provides an LED packaging structure and a light-emitting device.
[0006] In order to solve the above technical problems, one of the technical solutions adopted in the present application is to provide an LED packaging structure, which includes a ceramic substrate, a glass cover, an LED chip and a glass anti-reflection film;
[0007] The ceramic substrate includes a front side and a back side, and the LED chip is arranged on the front side of the ceramic substrate; a glass anti-reflection sheet is arranged corresponding to at least one LED chip, and the glass anti-reflection sheet is arranged on a surface of the corresponding LED chip away from the ceramic substrate; a glass cover is arranged on the ceramic substrate to enclose an air cavity with the front side of the ceramic substrate; the LED chip and the glass anti-reflection sheet are arranged in the air cavity.
[0008] Optionally, the glass cover is provided with a heat dissipation hole communicating with the air cavity, and the glass cover is plated with an AR antireflection film structure.
[0009] Optionally, the heat dissipation hole is arranged at one end of the glass cover close to the ceramic substrate.
[0010] Optionally, one end of the glass cover close to the ceramic substrate is glued to the ceramic substrate.
[0011] Optionally, at least one LED chip is provided with a fluorescent sheet corresponding thereto, and the fluorescent sheet is provided in the air cavity and on a surface of the LED chip facing away from the ceramic substrate.
[0012] Optionally, a plurality of LED chips are provided with fluorescent sheets, and the fluorescent sheets provided for at least two LED chips emit lights of different colors.
[0013] Optionally, a metal circuit layer is provided on the front side of the ceramic substrate, and a plurality of conductive pads are provided on the back side of the ceramic substrate; the ceramic substrate is provided with connecting through holes that pass through the front and back sides of the ceramic substrate, and the metal circuit layer and the conductive pads are connected via metal provided in the connecting through holes; the LED chip is provided on the metal circuit layer and is ohmically connected to the metal circuit layer.
[0014] Optionally, the LED chip is fixed to the metal circuit layer by nano silver glue or gold-tin alloy eutectic.
[0015] Optionally, a heat dissipation pad is disposed on the back side of the ceramic substrate, and the area of the heat dissipation pad is larger than the area of the conductive pad.
[0016] In order to solve the above technical problems, another technical solution adopted by the present application is to provide a light-emitting device, which includes any one of the above-mentioned LED packaging structures.
[0017] Beneficial effects: Different from the prior art, the present application improves the light output brightness of the LED packaging structure from at least two aspects. First, the glass anti-reflection sheet, the ceramic substrate and the glass cover have a high temperature tolerance and can withstand the temperature generated by the greater luminous power of the LED chip. Second, the glass anti-reflection sheet can improve the light extraction efficiency of the LED chip. Combining the above two aspects, the light output brightness of the LED packaging structure can be improved. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 is a schematic cross-sectional structure diagram of a first embodiment of the LED packaging structure of the present application;
[0019] Figure 2 is a schematic diagram of the structure of the first embodiment of the LED packaging structure of the present application from a top view;
[0020] Figure 3 is a schematic diagram of the structure of the first embodiment of the LED packaging structure of the present application from a bottom-up perspective;
[0021] Figure 4 is a schematic diagram of the structure of the second embodiment of the LED packaging structure of the present application from a top view;
[0022] Figure 5 It is a schematic diagram of the structure of the second embodiment of the LED packaging structure of the present application from a bottom-up perspective.
[0023] Description of reference numerals:
[0024] 100-LED packaging structure; 110-ceramic substrate; 120-glass cover; 130-LED chip; 140-glass anti-reflection film; 150-fluorescent film; 160-metal circuit layer; 171-conductive pad; 172-heat dissipation pad; 180-bonding wire; 111-connecting through hole; 101-air cavity; 122-heat dissipation hole. DETAILED DESCRIPTION
[0025] In order to enable those skilled in the art to better understand the technical solution of the present application, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. Obviously, the described implementation methods are only part of the implementation methods of the present application, rather than all the implementation methods. Based on the implementation methods in the present application, all other implementation methods obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.
[0026] Embodiment 1
[0027] See also Figure 1 and Figure 2 The LED package structure 100 of the first embodiment includes a ceramic substrate 110 , a glass cover 120 , an LED chip 130 and a glass anti-reflection film 140 .
[0028] The ceramic substrate 110 includes a front side and a back side, and the LED chip 130 is disposed on the front side of the ceramic substrate 110. A glass anti-reflection sheet 140 is disposed corresponding to at least one LED chip 130, and the glass anti-reflection sheet 140 is disposed on a surface of the corresponding LED chip 130 away from the ceramic substrate 110. The glass cover 120 is disposed on the ceramic substrate 110 to enclose an air cavity 101 with the front side of the ceramic substrate 110. The LED chip 130 and the glass anti-reflection sheet 140 are disposed in the air cavity 101.
[0029] Through the above method, the light output brightness of the LED package structure 100 is improved from at least two aspects. First, the glass anti-reflection sheet 140, the ceramic substrate 110 and the glass cover 120 have a relatively high temperature tolerance and can withstand the temperature generated by the greater light emitting power of the LED chip 130. Second, the glass anti-reflection sheet 140 can improve the light extraction efficiency of the LED chip 130. Combining the above two aspects, the light output brightness of the LED package structure 100 can be improved.
[0030] Optionally, the glass cover 120 is coated with an AR anti-reflection film structure (not shown). This can increase the transmittance of the glass cover 120 to the light emitted by the LED chip 130, thereby facilitating the improvement of the light output brightness of the LED package structure 100. Furthermore, the AR anti-reflection film structure is formed on the side of the glass cover 120 away from the ceramic substrate 110. This can improve the light output from the front of the glass cover 120.
[0031] Optionally, an air gap is formed between the glass cover 120 and the LED chip 130 , but is not limited thereto.
[0032] Exemplarily, when looking down at the LED package structure 100 from the side of the ceramic substrate 110 facing the LED chip 130 , the shape of the glass cover 120 is square, circular, triangular or other regular or irregular shapes.
[0033] Furthermore, combined with Figure 1-Figure 2 See also Figure 3 As shown, the glass cover 120 is provided with heat dissipation holes 122 communicating with the air cavity 101. The heat dissipation holes 122 can form heat convection between the air in the air cavity 101 and the outside air, thereby improving the heat dissipation efficiency of the LED chip 130, which is conducive to the LED chip 130 using high-power light emission.
[0034] For example but not limitation, the heat dissipation hole 122 is disposed at one end of the glass cover 120 close to the ceramic substrate 110. In this way, the influence of the heat dissipation hole 122 on the light uniformity of the side of the glass cover 120 facing away from the LED chip 130 can be reduced.
[0035] Optionally, one end of the glass cover 120 close to the ceramic substrate 110 is glued to the ceramic substrate 110. In this way, the sealing performance of the connection between the glass cover 120 and the ceramic substrate 110 except the heat dissipation hole 122 can be improved, and the amount of dust entering the air cavity 101 can be reduced.
[0036] It should be noted that, in other examples, the glass cover 120 can be connected to the ceramic substrate 110 by using one or more common connection methods such as snap connection, threaded connection, and plug-in connection.
[0037] Furthermore, if Figure 1-Figure 3 As shown, at least one LED chip 130 is provided with a fluorescent sheet 150 correspondingly, and the fluorescent sheet 150 is provided in the air cavity 101 and is provided on a surface of the LED chip 130 away from the ceramic substrate 110. The light emitted by the LED chip 130 is used to excite the fluorescent sheet 150. In this way, the fluorescent sheet 150 provided on the LED chip 130 can excite corresponding light. For example, when the fluorescent sheet 150 is a red fluorescent sheet, red light can be excited. For example, when the fluorescent sheet 150 is a green fluorescent sheet, green light can be excited.
[0038] Optionally, one or more layers of fluorescent sheets 150 may be disposed on the same LED chip 130 , wherein the multiple layers of fluorescent sheets 150 may be fluorescent sheets 150 for stimulating light of the same color or fluorescent sheets 150 for stimulating light of different colors.
[0039] Optionally, there may be a plurality of LED chips 130 corresponding to the fluorescent sheets 150, and the fluorescent sheets 150 provided on at least two LED chips 130 may emit light of different colors. In this way, the light output by the LED package structure 100 may present different colors through different combinations of light of different colors, so that the LED package structure 100 may emit light of different colors in different time periods.
[0040] Further, see Figure 1-Figure 3 A metal circuit layer 160 is provided on the front side of the ceramic substrate 110, and a plurality of conductive pads 171 are provided on the back side of the ceramic substrate 110; the ceramic substrate 110 is provided with a connecting through hole 111 which passes through the front and back sides of the ceramic substrate 110, and the metal circuit layer 160 and the conductive pads 171 are connected by metal provided in the connecting through hole 111; the LED chip 130 is provided on the metal circuit layer 160 and is ohmically connected to the metal circuit layer 160.
[0041] In this way, the metal circuit layer 160 can conduct the heat of the LED chip 130 to the conductive pad 171, so as to diffuse the heat to the outside of the LED package structure 100 through the conductive pad 171, thereby improving the heat diffusion efficiency of the LED chip 130. This is conducive to high-power light emission of the LED chip 130.
[0042] Optionally, the LED chip 130 is fixed to the metal circuit layer 160 by nano silver glue or gold-tin alloy eutectic. In this way, the efficiency of heat conduction from the LED chip 130 to the metal circuit layer 160 is improved.
[0043] Optionally, a heat dissipation pad 172 is provided on the back of the ceramic substrate 110, and the area of the heat dissipation pad 172 is larger than the area of the conductive pad 171. This can further increase the total area of all pads on the back of the ceramic substrate 110 and improve the heat dissipation performance of the LED packaging structure 100.
[0044] In one example, the heat dissipation pad 172 can be connected to one of the conductive pads 171 to form an integrally formed enlarged pad, and the area of the enlarged pad is larger than the area of the other conductive pads 171 .
[0045] In another example, the heat dissipation pad 172 can be spaced apart from the conductive pad 171, and the area of the heat dissipation pad 172 is larger than the area of the conductive pad 171. Preferably, the LED chip 130 is disposed on the ceramic substrate 110 in the area corresponding to the heat dissipation pad 172. That is, the horizontal projection of the LED chip 130 is located within the horizontal projection of the heat dissipation pad 172. It should be understood that the horizontal projection in the present application refers to the projection of the corresponding structure in the LED packaging structure 100 on the horizontal plane when the LED packaging structure 100 is placed on the horizontal plane with the side of the ceramic substrate 110 facing away from the LED chip 130 facing the horizontal plane.
[0046] By means of the above method, the distance for heat transfer between the LED chip 130 and the heat dissipation pad 172 through the ceramic substrate 110 can be reduced, thereby increasing the heat dissipation efficiency of the LED chip 130 .
[0047] Optionally, the LED chip 130 and the metal circuit layer 160 are connected in an ohmic manner via a bonding wire 180, but the present invention is not limited thereto. The bonding wire 180 includes but is not limited to a gold wire or other conductive wire.
[0048] In other examples, the LED chip 130 is a flip chip, which is ohmically connected to the metal circuit layer 160 through a side close to the metal circuit layer 160 .
[0049] Optionally, the material of the ceramic substrate 110 includes but is not limited to AlN, and the material of the metal circuit layer 160 includes but is not limited to one or more of Cu, Ni, Pd, Au and Ag.
[0050] Alternatively, if Figure 1-Figure 3 As shown, the LED package structure 100 is provided with four LED chips 130 , and the four LED chips 130 are respectively distributed at the four vertices of a rectangle.
[0051] Embodiment 2
[0052] Combination Figure 1 Comparison Figure 2 and Figure 3 See also Figure 4 and Figure 5 The same parts of the second embodiment as those of the first embodiment are not described in detail. The difference between the second embodiment and the first embodiment is that the LED packaging structure 100 is provided with five LED chips 130, and the five LED chips 130 are respectively distributed at the four vertices and the center of the rectangle.
[0053] It should be understood that in other examples, the LED package structure 100 may be provided with only one LED chip 130, or with two, three, or other numbers of LED chips 130. In other examples, if multiple LED chips 130 are provided, the multiple LED chips 130 may be distributed in regular or irregular shapes.
[0054] Embodiment 3
[0055] Combination Figure 1 See also Figure 2 Or see Figure 4 The same parts of the third embodiment as those of the first embodiment are not described in detail. What needs to be explained in particular relative to the first embodiment is that, when looking down at the LED package structure 100 from the side of the ceramic substrate 110 toward the LED chip 130, the glass cover 120 is a predetermined pattern, which is a pattern that can be closely arranged with other patterns that are congruent to itself to form a mosaic pattern. The following is a detailed description.
[0056] It should be understood that a mosaic figure is an arrangement of closed figures without any overlap or gaps, and details can be found in the definition of mosaic figures in mathematics. Thus, the predetermined figure can be one of a rectangle, a triangle and a regular hexagon, but is not limited thereto.
[0057] In the above manner, since the glass cover 120 and the LED chip 130 in the glass cover constitute a light-emitting unit, and the glass cover 120 is a predetermined pattern, and the predetermined pattern is a pattern that can be closely arranged with other patterns that are congruent to itself to form a mosaic pattern. In this way, multiple light-emitting units can be closely arranged with the same glass cover 120 to form a mosaic pattern to provide a larger light-emitting surface.
[0058] The light-emitting device of the present application includes any of the above-mentioned LED packaging structures 100, which will not be described in detail here. In one example, the light-emitting device can be a device for lighting, such as commercial lighting, indoor lighting, and home lighting. In another example, the light-emitting device can be a device for backlighting or outdoor display.
[0059] The above are only implementation methods of the present application, and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.
Claims
1. An LED packaging structure, characterized in that: The LED packaging structure includes a ceramic substrate, a glass cover, an LED chip and a glass anti-reflection film; The ceramic substrate includes a front side and a back side, and the LED chip is arranged on the front side of the ceramic substrate; at least one of the LED chips is correspondingly provided with the glass anti-reflection sheet, and the glass anti-reflection sheet is arranged on a surface of the corresponding LED chip away from the ceramic substrate; the glass cover is arranged on the ceramic substrate to enclose an air cavity with the front side of the ceramic substrate; the LED chip and the glass anti-reflection sheet are arranged in the air cavity.
2. The LED packaging structure according to claim 1, characterized in that: The glass cover is provided with a heat dissipation hole communicated with the air cavity, and the glass cover is plated with an AR anti-reflection film structure.
3. The LED packaging structure according to claim 2, characterized in that: The heat dissipation hole is arranged at one end of the glass cover close to the ceramic substrate.
4. The LED packaging structure according to claim 1, characterized in that: One end of the glass cover close to the ceramic substrate is glued to the ceramic substrate.
5. The LED packaging structure according to claim 1, characterized in that: At least one of the LED chips is provided with a fluorescent sheet corresponding thereto. The fluorescent sheet is provided in the air cavity and on a surface of the LED chip away from the ceramic substrate.
6. The LED packaging structure according to claim 5, characterized in that: The plurality of LED chips are provided with the fluorescent sheet, and the fluorescent sheets provided on at least two of the LED chips emit lights of different colors.
7. The LED packaging structure according to claim 1, characterized in that: A metal circuit layer is arranged on the front side of the ceramic substrate, and a plurality of conductive pads are arranged on the back side of the ceramic substrate; the ceramic substrate is provided with connecting through holes which pass through the front side and the back side of the ceramic substrate, and the metal circuit layer and the conductive pads are connected via metal arranged in the connecting through holes; the LED chip is arranged on the metal circuit layer and is ohmically connected to the metal circuit layer.
8. The LED packaging structure according to claim 7, characterized in that: The LED chip is fixed to the metal circuit layer through nano silver glue or gold-tin alloy eutectic.
9. The LED packaging structure according to claim 7, characterized in that: A heat dissipation pad is disposed on the back of the ceramic substrate, and the area of the heat dissipation pad is larger than the area of the conductive pad.
10. A light emitting device, characterized in that: The light-emitting device comprises the LED packaging structure according to any one of claims 1 to 9.