Pressure sensor MEMS chip calibration and test tool

Abstract

The utility model discloses a pressure sensor MEMS chip calibration and test tool, which comprises a chip tool module and a test circuit board corresponding to the chip tool module, and is characterized in that the chip tool module comprises a chip slot plate provided with a plurality of chip slots; wherein ventilation pipelines corresponding to the chip slots are arranged in the chip slot plate; wherein a probe is arranged between the test circuit board and each chip slot; the chip tool module can adjust the size of the positioning groove so as to be suitable for MEMS chips of different specifications. The integrated equipment integrating MEMS pressure sensor testing and high and low temperature calibration is developed by utilizing modular design in cooperation with an automatic testing and data processing technology, batch processing can be carried out, and great attraction is achieved for the industry needing a large amount of necessary standardization and repeated testing.

Description

Technical Field

[0001] The utility model relates to the technical field of chip testing, in particular to a pressure sensor MEMS chip calibration and testing tool. Background Art

[0002] MEMS pressure sensors are widely used in the automotive, aviation, medical and other industries, which have extremely high requirements for accuracy and stability. Testing and high and low temperature calibration of pressure sensor MEMS (micro-electromechanical system) chips are key processes to ensure the reliability and accuracy of these devices in various environments. Therefore, in the current production process of pressure sensor MEMS chips (hereinafter referred to as pressure chips), after the pressure chip is packaged, it needs to be calibrated at high and low temperatures and the pressure test output function needs to be applied. In this calibration and testing process, we need a test fixture that allows the calibration test system and the pressure chip to communicate and read and write data. At the same time, it is necessary to apply the corresponding range of pressure to the pressure chip and place it in a high and low temperature environment for high and low temperature calibration testing.

[0003] For example, patent application number CN202111127429.3 discloses a wafer-level test device and test method for a MEMS pressure sensor chip. The test device includes a test system, a pressure-regulating suction cup, a moving mechanism, and a pressure-regulating system. The upper surface of the pressure-regulating suction cup has an air suction hole for conducting different air pressures to the water-sensitive membrane of the MEMS pressure sensor chip to be tested; the wafer to be tested is fixed on the upper surface of the pressure-regulating suction cup and fixed and sealed with a fixing clamp, a pressure ring, and a sealing ring to ensure that there is no air leakage between the wafer to be tested and the pressure-regulating suction cup; the pressure-regulating system automatically adjusts and maintains the suction cup air pressure at the set value. The output signal of the MEMS pressure sensor chip is tested under different set air pressures, and the quality of the chip is judged based on the difference in the chip output value.

[0004] The above scheme is suitable for testing MEMS pressure sensor chips with a measuring range of 0.1 to 1 atmosphere, and can eliminate defective chips or screen out chips with different performance before packaging, thereby improving the yield of finished products after packaging. However, this scheme can only complete some electrical and mechanical tests, has limited functions, and requires additional equipment and processes for high and low temperature calibration, etc., and its overall performance needs to be improved. Summary of the invention

[0005] In response to the problem mentioned in the background technology that the pressure chip testing device in the prior art has limited functions, resulting in high workflow delays and low efficiency, the utility model provides a pressure sensor MEMS chip calibration and testing tooling, and utilizes modular design in conjunction with automated testing and data processing technology to develop an integrated device that integrates MEMS pressure sensor testing and high and low temperature calibration, which is capable of batch processing. This is very attractive to industries that require a large amount of necessary standardization and repeated testing.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0007] A pressure sensor MEMS chip calibration and testing tool, comprising a chip tooling module and a corresponding test circuit board, wherein the chip tooling module comprises a chip slot plate provided with a plurality of chip slots; wherein a ventilation pipeline is provided in the chip slot plate corresponding to each chip slot; wherein a probe is provided between the test circuit board and each chip slot; wherein the chip tooling module can adjust the size of the positioning slot to be suitable for MEMS chips of different specifications.

[0008] The chip slot plate is used to fix the MEMS chip to be tested, the ventilation line is used to provide the necessary pressure environment for the MEMS chip, and the probe is used to transmit the test signal from the test circuit board to the MEMS chip. Through the adjustable chip slot, the tooling can adapt to chips of different sizes and specifications, which improves the versatility and flexibility of the tooling. The present invention can test a variety of MEMS chips on a single tool, reducing the equipment replacement time and improving the test efficiency. In addition, the integrated ventilation line and test circuit simplify the operating steps, reduce the possibility of operating errors, and improve the accuracy and reliability of the test. Compared with traditional test tools, the present invention provides better adaptability and flexibility through the design of adjustable chip slots. This integrated design reduces unnecessary connection and configuration requirements, significantly improving the efficiency of the test process and the accuracy of chip processing.

[0009] Preferably, a probe fixing plate group is provided between the test circuit board and the chip slot plate, and the probe fixing plate group includes an upper plate and a lower plate for fixing the upper end and the lower end of the probe respectively, and the probe passes through the probe fixing plate group and then presses the MEMS chip placed in the chip slot. The probe fixing plate group provides a way of mechanical fixing and electrical connection to ensure the precise docking of the probe and the chip, so that the test signal can be accurately transmitted to the chip. Through physical crimping, the probe maintains stable contact with the chip PAD to ensure the reliability of data transmission. Ensure that the probe and the chip can maintain a stable physical and electrical connection during the entire test process, even in high and low temperature environments. The presence of the probe fixing plate group greatly enhances the structural stability and durability of the test device. Compared with conventional tooling, the present invention realizes a more accurate and reliable probe positioning and crimping mechanism through a specially designed probe fixing plate group. This design is particularly important for ensuring high-precision testing, especially when performing high-performance testing on MEMS chips. Further, a mechanism for automatically adjusting the probe pressure can be designed to dynamically adjust the crimping force according to the specific needs of the chip to further improve the adaptability and accuracy of the test.

[0010] Furthermore, a middle sealing ring is provided between the upper plate and the test circuit board, and a lower sealing ring is provided between the lower plate and the chip slot plate; the middle sealing ring and the lower sealing ring maintain a sealed state between the chip slot plate and the probe fixing plate group. The provision of the sealing ring prevents possible gas leakage or external environmental influences during the test process, and ensures the stability and controllability of the test environment. This sealing design is essential for maintaining the consistency of pressure and environmental parameters, especially when testing MEMS chips that are sensitive to air pressure or environment. The sealing ring not only enhances the reliability of the test, but also improves the accuracy of the test data, because the impact of external environmental changes on the test results is effectively isolated. This sealing design also helps to maintain the long-term stability and durability of the equipment, and reduces equipment failures caused by environmental factors. The present invention provides an effective environmental isolation and protection measure by introducing a sealing ring, which is particularly important in MEMS chip testing that requires precise control of test environment parameters. In addition, a system for automatically detecting and reporting the sealing state can be further developed to monitor and maintain the integrity of the test environment in real time.

[0011] Preferably, the chip fixture module includes a cover plate arranged on the top of the test circuit board, and an upper sealing ring is arranged between the cover plate and the test circuit board; a first locking screw group is arranged from the lower plate to the cover plate, and a second locking screw group is arranged from the cover plate to the chip slot plate. By arranging the upper sealing ring between the cover plate and the test circuit board, the sealing performance of the device is further enhanced, and the external environment is effectively isolated, especially when high and low temperature tests are performed. The use of the locking screw group not only fixes the various components of the device, but also ensures stability and durability during long-term operation. The addition of the cover plate and the design of its sealing ring significantly improve the resistance of the device to environmental factors, especially in high-precision tests involving temperature and humidity control. In addition, by fixing the device with a locking screw group, the reliability of the device under high-frequency vibration or other mechanical stress is greatly improved. The present invention provides a high level of environmental protection and mechanical stability through structural sealing and fixing enhancement, so that it can be applied to more demanding test conditions and a wider range of application scenarios. In addition, the materials of the cover plate and the sealing ring are further optimized, and high temperature or low temperature resistant materials are used to adapt to extreme environmental conditions.

[0012] Preferably, the ventilation line includes ventilation holes corresponding to each chip slot, and the ventilation line includes an air nozzle arranged on the side of the chip slot plate, and the air nozzle is connected to a pressure gas source. By designing the ventilation holes corresponding to each chip slot and the centralized air nozzle connection, uniform pressure supply to each chip is achieved. This design allows precise control of the pressure environment of each chip slot, which is suitable for situations where multiple chips need to be tested simultaneously. This centralized air supply design simplifies the complexity of traditional multi-point connection, reduces the leakage points of the air circuit, and improves the overall sealing and reliability of the system. At the same time, this design makes the pressure supply more uniform and ensures the consistency of the test results. The present invention not only optimizes the pipeline layout through the application of integrated ventilation lines and centralized air nozzles, but also improves the test efficiency and accuracy. In addition, the centralized pressure gas source connection design provides convenience for subsequent upgrades, such as introducing an intelligent pressure regulation system to achieve more sophisticated pressure control. The materials of the air nozzle and ventilation line are also further optimized, using more corrosion-resistant or higher-strength materials to adapt to different test environments and requirements.

[0013] Further, the test circuit board is provided with a connector, and an external pressure calibration test system is connected to the connector. Through the connector on the test circuit board, the device can be connected to the external pressure calibration test system to achieve data transmission and command reception. This connection ensures the real-time transmission and analysis of test data, while allowing the test parameters to be adjusted from the external system. The design simplifies the configuration and operation of the system, allowing users to easily switch different test modes and parameters, while ensuring the high efficiency and safety of data transmission. In addition, through standardized connectors, the tooling can be compatible with a variety of different test systems, increasing its versatility and flexibility. The present invention provides a more concise and efficient external connection solution through an integrated connection design, reduces the complexity of the interface, improves the convenience of operation and the reliability of the system. Furthermore, the introduction of wireless connection technology, such as using Bluetooth or Wi-Fi for data transmission, further simplifies the physical connection requirements and enhances the flexibility and scalability of the system. In addition, the design of the connector can also consider higher data transmission rates and stronger anti-interference capabilities to meet more complex or higher-speed test requirements.

[0014] Furthermore, the lower sealing ring is a multi-specification detachable component, the thickness of the lower sealing ring is adapted to the thickness of the MEMS chip, and the initial pressure of the probe for crimping MEMS chips of different specifications is the same. The contact pressure between the probe and the chip is adjusted by the replaceable lower sealing ring to maintain its consistency when testing chips of different specifications. This design allows for quick adaptation of the gap between the lower part of the chip slot plate and chips of different thicknesses, thereby maintaining sealing and test accuracy. The present design provides a flexible solution to accommodate MEMS chips of various thicknesses, which is very useful in a diverse production environment. In addition, this approach simplifies test preparation and reduces the time and labor required to replace chips. Compared with the traditional fixed design, the adjustable sealing ring provided by the present invention increases the scope of application and flexibility of the test fixture, enabling it to quickly adapt to the testing requirements of different products. This design not only improves production efficiency, but also ensures high precision and reliability during the test process.

[0015] Preferably, the chip tooling module is a modular structure, and the probe can be adapted and replaced according to the type of MEMS chip to be tested. The modular probe design allows the user to choose the appropriate probe type according to different test requirements, and these probes can be quickly replaced to adapt to the physical and electrical characteristics of various chips. This flexible design enables the same test tooling to handle a variety of different chips without replacing the entire system. The modular design greatly improves the applicability and economic benefits of the tooling and reduces the equipment cost in diversified production. At the same time, the ability to quickly replace the probe also significantly shortens the adjustment time of the equipment and improves production efficiency. The modular and replaceable probe design of the present invention provides higher flexibility and scalability compared to the traditional fixed probe system. This design is suitable for the rapidly developing and technologically updated electronics industry, and can quickly adapt to market changes. In addition, the combination of the probe and the machine vision system can be considered to achieve precise control and automatic adjustment of the probe position.

[0016] Therefore, the utility model has the following beneficial effects:

[0017] (1) The adjustable sealing ring and modular probe design of the present invention significantly improve the applicability and flexibility of the tooling, and can quickly adapt and test MEMS chips of different specifications and types, effectively improving production efficiency and equipment economy;

[0018] (2) The integrated ventilation circuit design simplifies the test configuration and reduces the need for external equipment, while ensuring the stability of the test environment and high accuracy of the test data over a wide temperature range;

[0019] (3) The seals and structural fixing elements (such as screw groups) in the design provide excellent environmental isolation and mechanical stability, which is particularly suitable for operation under harsh test conditions, ensuring long-term equipment stability and durability. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is an axonometric drawing of the utility model.

[0021] Figure 2 It is an exploded view of the utility model.

[0022] Figure 3 yes Figure 1 Cross-section of the middle chip slot board.

[0023] Figure 4 It is a top view of the utility model.

[0024] Figure 5 yes Figure 4 Isometric section view at center AA.

[0025] Figure 6 yes Figure 4 Plane section view at BB in the middle.

[0026] Figure 7 yes Figure 6 A partial enlarged view of point C in the middle.

[0027] Chip tooling module 100, MEMS chip 200, chip slot plate 1, air nozzle 11, cover plate 12, ventilation pipe 13, ventilation hole 14, hexagon socket flat end set screw 15, chip slot 16, lower sealing ring 2, middle sealing ring 3, upper sealing ring 4, first locking screw group 5, second locking screw group 6, lower plate 7, probe 71, upper plate 8, probe hole 81, test circuit board 9, connector 10. DETAILED DESCRIPTION

[0028] The present invention will be further described below in conjunction with the accompanying drawings and specific implementation methods.

[0029] Example 1

[0030] like Figure 1 , 2As shown, a pressure sensor MEMS chip calibration and testing tooling includes a chip tooling module 100 and a corresponding test circuit board 9, wherein the chip tooling module 100 includes a chip slot plate 1 provided with a plurality of chip slots 16; wherein a ventilation pipe 13 is provided in the chip slot plate 1 corresponding to each chip slot 16; wherein a probe 71 is provided between the test circuit board 9 and each chip slot 16; wherein the chip tooling module 100 can adjust the size of the positioning slot to be suitable for MEMS chips 200 of different specifications. A probe fixing plate group is provided between the test circuit board 9 and the chip slot plate 1, wherein the probe fixing plate group includes an upper plate 8 and a lower plate 7 for fixing the upper end and the lower end of the probe 71 respectively, and the probe 71 penetrates the probe fixing plate group and then presses the MEMS chip 200 placed in the chip slot 16. The chip tooling module 100 is a modular structure, and the probe 71 can be adapted and replaced according to the type of the MEMS chip 200 to be tested.

[0031] The chip slot plate 1 is used to fix the MEMS chip 200 to be tested, the ventilation line 13 is used to provide the necessary pressure environment for the MEMS chip, and the probe is used to transmit the test signal from the test circuit board 9 to the MEMS chip. Through the adjustable chip slot, the tooling can adapt to chips of different sizes and specifications, thereby improving the versatility and flexibility of the tooling. The present invention can test a variety of MEMS chips on a single tooling, reducing the equipment replacement time and improving the test efficiency. In addition, the integrated ventilation line 13 and the test circuit simplify the operation steps, reduce the possibility of operating errors, and improve the accuracy and reliability of the test. Compared with the traditional test tooling, the present invention provides better adaptability and flexibility through the design of the adjustable chip slot. This integrated design reduces the unnecessary connection and configuration requirements, significantly improving the efficiency of the test process and the accuracy of chip processing. The probe fixing plate group provides a mechanical fixation and electrical connection method to ensure the precise docking of the probe with the chip, so that the test signal can be accurately transmitted to the chip. Through physical crimping, the probe maintains stable contact with the chip PAD to ensure the reliability of data transmission. Ensure that the probe and the chip can maintain a stable physical and electrical connection during the entire test process, even in high and low temperature environments. The presence of the probe fixing plate group greatly enhances the structural stability and durability of the test device. Compared with conventional tooling, the specially designed probe fixing plate group in the present invention realizes a more accurate and reliable probe positioning and crimping mechanism. This design is particularly important for ensuring high-precision testing, especially when performing high-performance testing on MEMS chips. Furthermore, a mechanism for automatically adjusting the probe pressure can be designed to dynamically adjust the crimping force according to the specific needs of the chip, further improving the adaptability and accuracy of the test. The modular probe design allows users to choose the appropriate probe type according to different test requirements. These probes can be quickly replaced to adapt to the physical and electrical characteristics of various chips.

[0032] Among them, a middle sealing ring 3 is arranged between the upper plate 8 and the test circuit board 9, and a lower sealing ring 2 is arranged between the lower plate 7 and the chip slot plate 1; the middle sealing ring 3 and the lower sealing ring 2 keep the chip slot plate 1 and the probe fixing plate group in a sealed state. The upper plate and the lower plate are correspondingly provided with probe holes 81 for passing and limiting the probe. The lower sealing ring 2 is a multi-specification detachable component, and the thickness of the lower sealing ring 2 is adapted to the thickness of the MEMS chip, and the initial pressure of the probe for crimping MEMS chips of different specifications is the same.

[0033] The setting of the sealing ring prevents possible gas leakage or external environmental influence during the test process, ensuring the stability and controllability of the test environment. This sealing design is crucial to maintaining the consistency of pressure and environmental parameters, especially when testing MEMS chips that are sensitive to air pressure or environment. The sealing ring not only enhances the reliability of the test, but also improves the accuracy of the test data, because the influence of external environmental changes on the test results is effectively isolated. This sealing design also helps to maintain the long-term stability and durability of the equipment and reduce equipment failures caused by environmental factors. The present invention provides an effective environmental isolation and protection measure by introducing a sealing ring, which is particularly important in MEMS chip testing that requires precise control of test environment parameters. In addition, a system for automatically detecting and reporting the sealing state can be further developed to monitor and maintain the integrity of the test environment in real time. The contact pressure between the probe and the chip is adjusted by a replaceable lower sealing ring 2 to maintain its consistency when testing chips of different specifications. This design allows the gap between the lower part of the chip slot plate 1 and chips of different thicknesses to be quickly adapted, thereby maintaining sealing and test accuracy. The present design provides a flexible solution to adapt to MEMS chips of various thicknesses, which is very useful in a diverse production environment. In addition, this approach simplifies test preparation and reduces the time and labor required to replace chips.

[0034] like Figure 5 , 6 As shown, the chip fixture module 100 includes a cover plate 12 disposed on the top of the test circuit board 9, and an upper sealing ring 4 is disposed between the cover plate 12 and the test circuit board 9; a first locking screw group 5 is disposed from the lower plate 7 to the cover plate 12, and a second locking screw group is disposed from the cover plate 12 to the chip slot plate 1. Figure 7 As shown, the ventilation pipeline 13 includes ventilation holes 14 arranged corresponding to each chip slot, and the ventilation pipeline 13 includes an air nozzle 11 arranged on the side of the chip slot plate 1, and the air nozzle 11 is connected to a pressure air source.

[0035] By setting the upper sealing ring 4 between the cover plate 12 and the test circuit board 9, the sealing performance of the device is further enhanced, and the external environment is effectively isolated, especially when high and low temperature tests are performed. The use of the locking screw group not only fixes the various components of the device, but also ensures stability and durability during long-term operation. The addition of the cover plate 12 and the design of its sealing ring significantly improve the resistance of the device to environmental factors, especially in high-precision tests involving temperature and humidity control. In addition, by using the locking screw group to fix the device, the reliability of the device under high-frequency vibration or other mechanical stress is greatly improved. By designing the vent holes 14 corresponding to each chip slot and connecting with the centralized air nozzle 11, uniform pressure supply to each chip is achieved. This design allows precise control of the pressure environment of each chip slot and is suitable for situations where multiple chips need to be tested simultaneously. This centralized air supply design simplifies the complexity of traditional multi-point connections, reduces the leakage points of the air circuit, and improves the overall sealing and reliability of the system. At the same time, this design makes the pressure supply more uniform and ensures the consistency of the test results. The present invention not only optimizes the pipeline layout through the application of the integrated ventilation pipeline 13 and the centralized air nozzle 11, but also improves the test efficiency and accuracy. In addition, the centralized pressure gas source connection design provides convenience for subsequent upgrades, such as the introduction of an intelligent pressure regulation system to achieve more precise pressure control. The materials of the gas nozzle 11 and the ventilation pipeline 13 are also further optimized, using more corrosion-resistant or higher-strength materials to adapt to different test environments and requirements.

[0036] The test circuit board 9 is provided with a connector 10, and an external pressure calibration test system is connected to the connector 10. Through the connector 10 on the test circuit board 9, the device can be connected to the external pressure calibration test system to realize data transmission and command reception. This connection ensures the real-time transmission and analysis of test data, and allows the test parameters to be adjusted from the external system. This design simplifies the configuration and operation of the system, allowing users to easily switch between different test modes and parameters, while ensuring high efficiency and security of data transmission. In addition, through the standardized connector 10, the tooling can be compatible with a variety of different test systems, increasing its versatility and flexibility. The present invention provides a simpler and more efficient external connection solution through an integrated connection design, reduces the complexity of the interface, and improves the convenience of operation and the reliability of the system.

[0037] This embodiment relates to a tooling device for testing a pressure sensor MEMS chip, which is intended to provide an efficient, stable and reliable testing environment to evaluate the performance of the chip during or after its manufacturing process. The tooling device integrates a variety of precision components to form a sealed high-pressure environment and ensure accurate transmission of test signals.

[0038] like Figure 3 ,4 As shown, in this embodiment, the core part of the device is the chip slot plate 1, which is made of aluminum alloy or stainless steel to ensure the strength and stability of the structure. The design of the chip slot plate 1 takes into account the overall dimensions of the chip, and multiple chip slots are processed to adapt to the pressure sensor MEMS chip being tested. The bottom of each chip slot is designed with a vent 14, which corresponds to the pressurized hole on the pressure chip, ensuring that the air pressure can act directly on the chip. In addition, these vents 14 are connected through 8 pipes inside the chip slot plate 1, and finally converge to a pagoda straight metal micro air nozzle 11, which is further connected to an external pressure calibration test system to provide the required pressure for the pressure chip. This design not only achieves accurate pressure delivery, but also prevents air pressure leakage through a closed pipeline system, thereby providing a stable test environment. The use of hexagonal flat-end set screws 15 further ensures the sealing of the ventilation pipe. These screws are installed at the ends of the 8 ventilation pipes inside the bottom of the chip slot plate 1, and are used with sealing glue to ensure the airtightness of the pipe cavity and prevent air pressure leakage. The advantage of this design is that it can maintain good air tightness and ensure test accuracy even under long-term use or different environmental conditions. The pagoda-through metal micro-air nozzle 11 is a key component connecting the internal pipeline with the external pressure control system. It is compact in design and can withstand high pressure, ensuring that the gas passes through the entire system smoothly and is finally delivered to the pressure chip. The use of this metal micro-air nozzle 11 also reflects the advantages of the tooling in miniaturized design, making the overall device more compact and efficient.

[0039] In the test device, the setting of the lower sealing ring 2 is crucial. The annular silicone sealing ring is installed in the annular groove around each chip slot of the chip slot plate 1. When the probe plate is squeezed, it can effectively form a sealing structure around each pressure chip to ensure that the pressure only acts on the pressure chip and will not leak. This sealing method not only improves the accuracy of the test, but also protects the chip from interference from the external environment. In the construction of the test system, the design of the probe and the probe fixing lower plate 7 is indispensable. The overall design of the probe is exquisite, and its size and shape must match the pressure chip being tested and the Pad of the test circuit board 9 to ensure the accurate transmission of the signal. The combined use of the probe fixing lower plate 7 and the cover plate 12 not only ensures the fixation of the probe but also facilitates the disassembly and maintenance of the overall device. In addition, the combined use of the upper plate 8 and the upper sealing ring 4 further improves the sealing of the entire test environment and prevents the leakage of pressure during the test process, which is crucial to ensure the accuracy of the test results. The design of the test circuit board 9 allows the signal on the chip to be transmitted to the external test system through the probe, which is the key to the entire device to achieve its function. Through the well-designed connector 10 and connecting wires, the test circuit board 9 can be reliably connected to the external test system, thereby realizing signal reading and analysis.

[0040] In this embodiment, a fixture device for testing a pressure sensor MEMS chip is provided, which is specially designed to meet the testing requirements of the small size and electrical interface of the pressure chip. The fixture device is intended to achieve batch calibration and testing of pressure chips to adapt them to the mass production process. The entire fixture device is exquisitely designed, allowing multiple chips to be tested at the same time, providing each chip with the necessary pressure and electrical connection, and ensuring the efficiency and accuracy of the test.

[0041] In terms of the operation process, the first thing to do is to prepare the tooling device. The staff selects a suitable chip slot plate 1 according to the test requirements. The slot plate is customized according to the outer dimensions of the pressure chip of 331.5mm, and each slot is equipped with a vent 14 corresponding to the vent 14 on the pressure chip. The operator places the MEMS pressure chip on the chip slot plate 1, ensuring that the vent 14 of each chip is aligned with the vent 14 of the slot plate.

[0042] Afterwards, the operator needs to install the sealing ring and the probe plate. The annular silicone sealing ring is placed in the annular groove around the chip slot plate 1. Its function is to seal the chip in the subsequent steps to prevent pressure leakage. The probes on the probe plate correspond to the tiny electrical interface pad on the pressure chip. The probe plate is fixed in the appropriate position to ensure the precise docking of the probe and the chip pad.

[0043] Next, connect the pagoda through the metal micro air nozzle 11. Through the internal pipeline, the air nozzle 11 is connected to the vent 14 of the chip slot plate 1, and the air pressure of the external pressure control system is guided to the vent 14 of each chip. During the pipeline connection process, it is necessary to ensure the sealing of the hexagon socket flat end set screw 15, and use sealing glue to prevent air pressure leakage when necessary.

[0044] After that, the test circuit board 9 is connected to the probe card, and the connector 10 on the circuit board is ensured to match the connection line of the external test system. The operator must check each connection point to ensure the reliability of signal transmission.

[0045] In the actual test process, the external pressure control system is first started and adjusted to the required 100KPA in this example, and the pressure is evenly distributed to each chip through the pagoda direct metal micro air nozzle 11 and the internal pipeline system. During this process, the operator needs to monitor the stability of the pressure to avoid pressure fluctuations affecting the accuracy of the test results.

[0046] With the pressure being supplied steadily, the operator starts the external test system to collect and record the electrical response of the pressure chip under the specified pressure through the signal line connected to the test circuit board 9. The test system will analyze this data, perform the calibration of the chip, and evaluate its performance.

[0047] After the pressure test is completed, it can be further placed in a high and low temperature temperature box. The metal micro-air nozzle below the pagoda is connected to a dedicated pressure air pipe, and then to an external pressure calibration test system; the connector on the test circuit board is connected to the corresponding connecting wire, and then connected to the pressure calibration test system. The tooling in this example can load 32 pressure chips at a time. In addition, the pressure controller can connect multiple such tooling fixtures at a time (according to the test capacity of the pressure calibration test system) through branch pipes, and the pressure calibration test system can connect multiple such tooling fixtures at a time through branch connecting wires to perform high and low temperature calibration and functional testing of multiple pressure chips.

[0048] After the entire test is completed, it is necessary to disconnect one by one, release the pressure, and remove the tested chip from the chip slot plate 1. At this time, the operator needs to carefully check each part of the tooling device to ensure that there is no damage or wear so that the next round of testing can proceed smoothly.

[0049] During the implementation of the present invention, the operator needs to pay attention to the following issues: ensuring air tightness, avoiding pressure leakage, ensuring accurate docking of the probe and the chip pad, and monitoring the stability of the test system. The preferred solution may include using more advanced materials to manufacture the chip slot plate 1 to enhance its durability and stability; or using more advanced probe technology to improve the transmission efficiency and accuracy of the signal.

[0050] The creativity of this solution lies in that it provides an integrated solution that integrates air pressure supply and electrical signal testing, which greatly improves the test efficiency while maintaining the test accuracy.

Claims

1. A pressure sensor MEMS chip calibration and testing tool, characterized in that: It includes a chip tooling module and a corresponding test circuit board, wherein the chip tooling module includes a chip slot board provided with a plurality of chip slots; Wherein, a ventilation pipeline is provided in the chip slot plate corresponding to each chip slot; Wherein, a probe is arranged between the test circuit board and each chip slot; The chip tooling module can adjust the size of the positioning groove to be suitable for MEMS chips of different specifications.

2. The pressure sensor MEMS chip calibration and testing tool according to claim 1, characterized in that: A probe fixing plate group is arranged between the test circuit board and the chip slot plate. The probe fixing plate group includes an upper plate and a lower plate for fixing the upper end and the lower end of the probe respectively. The probe passes through the probe fixing plate group and then is crimped to the MEMS chip placed in the chip slot.

3. The pressure sensor MEMS chip calibration and testing tool according to claim 2, characterized in that: A middle sealing ring is arranged between the upper plate and the test circuit board, and a lower sealing ring is arranged between the lower plate and the chip slot plate; the middle sealing ring and the lower sealing ring keep the chip slot plate and the probe fixing plate group in a sealed state.

4. The pressure sensor MEMS chip calibration and testing tool according to claim 3, characterized in that: The chip tooling module includes a cover plate arranged on the top of the test circuit board, an upper sealing ring is arranged between the cover plate and the test circuit board; a first locking screw group is arranged from the lower plate to the cover plate, and a second locking screw group is arranged from the cover plate to the chip slot plate.

5. The pressure sensor MEMS chip calibration and testing tool according to any one of claims 1 to 4, characterized in that: The ventilation pipeline includes ventilation holes arranged corresponding to each chip slot, and the ventilation pipeline includes an air nozzle arranged on the side of the chip slot plate, and the air nozzle is connected to a pressure air source.

6. The pressure sensor MEMS chip calibration and testing tool according to any one of claims 1 to 4, characterized in that: The test circuit board is provided with a connector, and the connector is connected with an external pressure calibration test system.

7. The pressure sensor MEMS chip calibration and testing tool according to claim 3, characterized in that: The lower sealing ring is a detachable component with multiple specifications. The thickness of the lower sealing ring is adapted to the thickness of the MEMS chip. The initial pressure of the probe for crimping MEMS chips of different specifications is the same.

8. The pressure sensor MEMS chip calibration and testing tool according to claim 2, characterized in that: The chip tooling module is a modular structure, and the probe can be adapted and replaced according to the type of MEMS chip to be tested.

Images