Wafer baking material box and wafer processing device

Abstract

The utility model provides a wafer baking material box and a wafer processing device, and relates to the technical field of semiconductor processing. The wafer baking material box comprises a base, a supporting rod arranged on the base and a plurality of wafer supports arranged on the supporting rod in a sleeving mode, the wafer supports are distributed at intervals in the extending direction of the supporting rod, wafer grooves are formed in the inner walls of the wafer supports, and the wafer grooves and the wafer supports are the same in extending path, are U-shaped and are used for containing wafers. According to the wafer baking material box, the plurality of wafer supports are arranged on the supporting rod at intervals, so that the whole wafer baking material box is hollow, the ventilation effect is good, and the weight is light. Moreover, the distance between two adjacent wafer supports can be adjusted, so that the ventilation effect can be further controlled.

Description

Technical Field

[0001] The present application relates to the field of semiconductor processing technology, and in particular to a wafer baking box and a wafer processing device. Background Art

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. Its raw material is silicon. During processing, the silicon crystal rod is ground, polished and sliced ​​to form a silicon wafer. In the process of producing wafers, it is often necessary to put the wafer into a baking device and use the appropriate temperature of the baking tray to perform physical or chemical transformations on it, such as thermal curing, to improve the product performance of the wafer.

[0003] Wafers are fragile items. In order to heat the wafers in a baking device, multiple wafers need to be loaded into a wafer baking box, and then the wafer baking box is placed in the baking device. However, the existing wafer baking box has poor ventilation and is heavy, which is not conducive to baking and transferring wafers. Utility Model Content

[0004] The purpose of the present application is to provide a wafer baking box and a wafer processing device, which have good ventilation effect and light weight, in view of the deficiencies in the above-mentioned prior art.

[0005] To achieve the above purpose, the technical solution adopted in the embodiment of the present application is as follows:

[0006] According to one aspect of an embodiment of the present application, a wafer baking box is provided, comprising: a base, a support rod arranged on the base, and a plurality of wafer holders mounted on the support rod, wherein the wafer holders are perpendicular to the support rod, and the plurality of wafer holders are spaced apart along an extension direction of the support rod, and a wafer groove is provided on an inner wall of the wafer holder, and the extension paths of the wafer groove and the wafer holder are the same and both are U-shaped wafer grooves for accommodating wafers.

[0007] Optionally, the number of support rods is two, and the wafer holder includes a wafer holder body and connecting bosses arranged on two opposite sides of the wafer holder body, and the connecting bosses are provided with connecting holes, and the two connecting holes are respectively matched with the two support rods.

[0008] Optionally, the connecting boss and the support rod are connected via a first connecting member, a first connecting hole is provided on the connecting boss, a second connecting hole corresponding to the first connecting hole is provided on the support rod, and the first connecting member passes through the first connecting hole and the second connecting hole respectively.

[0009] Optionally, the two support rods are symmetrically arranged on two opposite sides of the wafer support body.

[0010] Optionally, the base includes two substrates parallel to each other, and the two support rods are respectively fixed on the two substrates.

[0011] Optionally, the bottom of the wafer groove includes a first straight portion, an arc portion connected to the first straight portion in sequence, and a second straight portion, and the arc portion wraps around the side wall of the wafer.

[0012] Optionally, a limiting rod is also included, which is detachably connected to the base, and the limiting rod is located on the opening side of the wafer holder, and is used to limit the wafer in the wafer holder.

[0013] Optionally, a connecting rod is provided at the end of the limiting rod, the connecting rod is perpendicular to the limiting rod, the connecting rod and the base are connected by a second connecting piece, third connecting holes are respectively provided at both ends of the connecting rod, and a fourth connecting hole corresponding to the third connecting hole is provided on the base, and the second connecting piece passes through the third connecting hole and the fourth connecting hole respectively.

[0014] Optionally, a transport gripper is also provided on the base, and the transport gripper is used for a user or a robot to hold when transferring the wafer baking box.

[0015] Another aspect of an embodiment of the present application provides a wafer processing device, comprising a wafer baking box as described above.

[0016] The beneficial effects of this application include:

[0017] The present application provides a wafer baking material box, comprising: a base, a support rod arranged on the base, and a plurality of wafer holders sleeved on the support rod, the wafer holder is perpendicular to the support rod, the plurality of wafer holders are spaced apart along the extension direction of the support rod, the inner wall of the wafer holder is provided with a wafer groove, the extension paths of the wafer groove and the wafer holder are the same and both are U-shaped wafer grooves for accommodating wafers. In the wafer baking material box, a plurality of wafer holders are spaced apart on the support rod, so that the wafer baking material box is hollow as a whole, has good ventilation effect and is light in weight. Moreover, the spacing between two adjacent wafer holders is adjustable, which can further control the ventilation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 One of the structural schematic diagrams of the wafer baking box provided in the embodiment of the present application;

[0020] Figure 2 The second structural schematic diagram of the wafer baking box provided in the embodiment of the present application;

[0021] Figure 3 The third structural diagram of the wafer baking box provided in the embodiment of the present application;

[0022] Figure 4 This is the fourth structural schematic diagram of the wafer baking box provided in an embodiment of the present application.

[0023] Icons: 100-wafer baking box; 110-base; 111-substrate; 120-support rod; 130-wafer holder; 131-wafer slot; 1311-first straight portion; 1312-arc portion; 1313-second straight portion; 132-wafer holder body; 133-connecting boss; 140-limiting rod; 150-connecting rod; 151-third connecting hole; 160-handling gripper; 200-wafer; a-first direction; b-second direction. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0025] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for protection, but merely represents selected embodiments of the present application. It should be noted that, in the absence of conflict, the various features in the embodiments of the present application can be combined with each other, and the combined embodiments are still within the scope of protection of the present application.

[0026] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0027] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the product of the application is usually placed when in use. They are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0028] In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0029] In one aspect of the embodiment of the present application, please refer to Figure 1 and Figure 2 , a wafer baking material box 100 is provided, which is used to accommodate multiple wafers 200 at the same time. The wafer baking material box 100 includes: a base 110, a support rod 120 arranged on the base 110, and a plurality of wafer holders 130 sleeved on the support rod 120, the wafer holder 130 is perpendicular to the support rod 120, and the plurality of wafer holders 130 are distributed at intervals along the extension direction of the support rod 120, and the inner wall of the wafer holder 130 is provided with a wafer groove 131, and the wafer groove 131 and the wafer holder 130 have the same extension path and are both U-shaped wafer grooves 131 for accommodating wafers 200.

[0030] The wafer baking material box 100 includes a base 110, a support rod 120 and a plurality of wafer holders 130. The support rod 120 is fixed on the base 110, preferably fixed vertically on the base 110, that is, the extension direction (also known as the length direction) of the support rod 120 is perpendicular to the surface of the base 110. The plurality of wafer holders 130 are sequentially sleeved on the support rod 120, the wafer holders 130 are perpendicular to the support rod 120, and the plurality of wafer holders 130 are parallel to each other. The wafer holder 130 is used to accommodate the wafer 200, and is U-shaped as a whole, and a wafer groove 131 which is also U-shaped is provided on the inner surface. The wafer holder 130 has an opening for placing and taking out the wafer 200, and the opposite ends of the wafer groove 131 extend to the opening respectively, that is, the end of the wafer groove 131 is flush with the end of the wafer holder 130. When in use, the wafer 200 is inserted into the wafer slot 131 from the opening along the first direction a, and the sidewall of the wafer slot 131 supports the wafer 200. After baking, the wafer 200 is removed from the wafer slot 131 from the opening along the second direction b opposite to the first direction a. The first direction a and the second direction b are both perpendicular to the support rod 120. By adjusting the distance between two adjacent wafer supports 130, the distance between two adjacent wafers 200 during baking can be adjusted.

[0031] It is understood that the wafer holder 130 should be provided with a connection hole, and the wafer holder 130 is sleeved on the support rod 120 through the connection hole. As for how the wafer holder 130 is fixed to the support rod 120, this embodiment does not limit this, and it can be fixed by a connector, or the wafer holder 130 can be fixed by an interference fit between the connection hole and the support rod 120.

[0032] In the wafer baking box 100, a plurality of wafer holders 130 are arranged at intervals on the support rod 120, so that the wafer baking box 100 is hollow as a whole, has good ventilation effect and is light in weight, and the wafers are heated evenly. Moreover, the spacing between two adjacent wafer holders 130 can be adjusted, which can further control the ventilation effect.

[0033] In order to improve the installation stability of the wafer holder 130, optionally, the number of the support rods 120 is two, and the wafer holder 130 includes a wafer holder body 132 and connecting bosses 133 arranged on opposite sides of the wafer holder body 132, and the connecting bosses 133 are provided with connecting holes, and the two connecting holes are respectively matched with the two support rods 120.

[0034] The wafer holder body 132 is used to accommodate the wafer 200. The wafer holder body 132 is U-shaped, and the wafer groove 131 is arranged on the wafer holder body 132. The connecting boss 133 is located outside the wafer holder body 132. The wafer holder 130 is sleeved on the support rod 120 through the connecting hole on the connecting boss 133. The wafer holder body 132 is located between the two support rods 120. The two support rods 120 are used to support the wafer holder 130 respectively, which can effectively improve the stability of the installation of the wafer holder 130.

[0035] Optionally, two support rods 120 are symmetrically arranged on two opposite sides of the wafer support body 132 .

[0036] Correspondingly, the two connection holes on the two connection bosses 133 are also symmetrically arranged on opposite sides of the wafer support body 132, so as to correspond to the positions of the two support rods 120. Furthermore, the two connection bosses 133 are also symmetrically arranged on opposite sides of the wafer support body 132, so that the wafer baking material box 100 has a symmetrical structure as a whole, and the force of the wafer support 130 is more reasonable.

[0037] Optionally, the base 110 includes two substrates 111 parallel to each other, and the two support rods 120 are fixed on the two substrates 111 respectively.

[0038] Two mutually parallel substrates 111 are used to support the support rod 120 instead of an integral structure. On the one hand, the weight of the wafer baking box 100 can be reduced. On the other hand, the bottom of the wafer holder 130 can be exposed. After the bottom wafer 200 is installed, its bottom will not be blocked by the substrate 111, thereby ensuring that the bottom wafer 200 is well ventilated.

[0039] Preferably, the support rod 120 is vertically disposed in the middle of the base plate 111 .

[0040] Optionally, the connecting boss 133 is connected to the support rod 120 via a first connecting member, a first connecting hole is provided on the connecting boss 133, a second connecting hole corresponding to the first connecting hole is provided on the support rod 120, and the first connecting member passes through the first connecting hole and the second connecting hole respectively.

[0041] For example, the first connecting member is a screw, the first connecting hole is a through hole, and the second connecting hole is a threaded hole. The screw passes through the first connecting hole and is threadedly connected to the second connecting hole, thereby fixing the wafer holder 130 on the support rod 120. The screw connection can not only ensure the stable connection between the wafer holder 130 and the support rod 120, but also make the wafer holder 130 and the support rod 120 detachable, so as to adjust the position of the wafer holder 130 and adjust the distance between two adjacent wafers 200 during baking.

[0042] The wafer 200 is circular and moves along a straight line relative to the wafer support 130. In order to facilitate the placement of the wafer 200 and better limit the position of the wafer 200, optionally, please refer to Figure 1 and Figure 3 The bottom of the wafer groove 131 includes a first straight portion 1311 , an arc portion 1312 sequentially connected to the first straight portion 1311 , and a second straight portion 1313 , and the arc portion 1312 wraps around the side wall of the wafer 200 .

[0043] The first straight portion 1311 and the second straight portion 1313 are parallel to each other, and the two ends of the arc portion 1312 are connected to the ends of the first straight portion 1311 and the second straight portion 1313 respectively. The first straight portion 1311 and the second straight portion 1313 extend along the first direction a (or the second direction b), and the distance between the two is equal to or slightly greater than the diameter of the wafer 200. The first straight portion 1311 and the second straight portion 1313 guide the movement of the wafer 200 during the insertion and removal of the wafer 200. The radius of the arc portion 1312 is equal to or slightly greater than the radius of the wafer 200. After the wafer 200 is installed, the wafer 200 is clamped between the first straight portion 1311 and the second straight portion 1313, and is wrapped and limited by the arc portion 1312. At the same time, the area of ​​the wafer groove 131 corresponding to the arc portion 1312 has a larger support area for the wafer 200, which can better protect the wafer 200.

[0044] After the wafer 200 is installed, if the wafer baking box 100 is deflected, the wafer 200 may slide out of the opening of the wafer support 130. In order to prevent the wafer 200 from falling after installation, optionally, please refer to Figure 1 and Figure 4 The wafer baking material box 100 also includes a limiting rod 140 , which is detachably connected to the base 110 . The limiting rod 140 is located on the opening side of the wafer holder 130 , and is used to limit the wafer 200 in the wafer holder 130 .

[0045] When the wafer 200 is inserted and removed, the limiting rod 140 is disassembled so that the wafer 200 can smoothly enter and exit the wafer support 130. After the wafer 200 is installed, the limiting rod 140 is fixed to the base 110 to limit the wafer 200 on the sliding path of the wafer 200, thereby preventing the wafer 200 from accidentally falling after installation.

[0046] It is understandable that the end of the limiting rod 140 away from the base 110 should be higher than the topmost wafer holder 130 , so that one limiting rod 140 can limit the wafers 200 in multiple wafer holders 130 at the same time.

[0047] Preferably, the distance between the limiting rod 140 and the first straight portion 1311 is equal to the distance between the limiting rod 140 and the second straight portion 1313 .

[0048] Optionally, a connecting rod 150 is provided at the end of the limiting rod 140, and the connecting rod 150 is perpendicular to the limiting rod 140. The connecting rod 150 is connected to the base 110 through a second connecting member. Third connecting holes 151 are respectively provided at both ends of the connecting rod 150, and a fourth connecting hole corresponding to the third connecting hole 151 is provided on the base 110. The second connecting member passes through the third connecting hole 151 and the fourth connecting hole respectively.

[0049] For example, the second connecting member is a pin, the third connecting hole 151 is a through hole, and the fourth connecting hole is a through hole or a blind hole. After the pin passes through the third connecting hole 151, it is interference fit with the fourth connecting hole, thereby fixing the limiting rod 140 on the base 110 through the connecting rod 150.

[0050] Furthermore, the base 110 includes two mutually parallel base plates 111 , the two support rods 120 are respectively fixed on the two base plates 111 , and both ends of the connecting rod 150 are respectively connected to the two base plates 111 .

[0051] Optionally, a transport gripper 160 is further provided on the base 110 , and the transport gripper 160 is used for being held by a user or a robot when transferring the wafer baking material box 100 .

[0052] For example, the transport gripper 160 is cylindrical, and the axis of the cylinder is perpendicular to the surface of the base 110 .

[0053] For example, please refer to Figure 2 There are two transport grippers 160 , and the two transport grippers 160 are symmetrically arranged at the rear side of the wafer support 130 .

[0054] The present embodiment further provides a wafer 200 processing device, comprising any one of the above wafer baking boxes 100 .

[0055] The wafer 200 processing device includes the same structure and benefits as the wafer baking box 100 in the previous embodiment. The structure and benefits of the wafer baking box 100 have been described in detail in the previous embodiment and will not be repeated here.

[0056] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A wafer baking box, characterized in that: include: A base, a support rod arranged on the base, and a plurality of wafer holders mounted on the support rod, the wafer holders are perpendicular to the support rod, the plurality of wafer holders are spaced apart along the extension direction of the support rod, the inner wall of the wafer holder is provided with a wafer groove, the extension paths of the wafer groove and the wafer holder are the same and both are U-shaped, and the wafer groove is used to accommodate wafers.

2. The wafer baking box according to claim 1, characterized in that: The number of the support rods is two, and the wafer holder comprises a wafer holder body and connecting bosses arranged on two opposite sides of the wafer holder body, and the connecting bosses are provided with connecting holes, and the two connecting holes are respectively matched with the two support rods.

3. The wafer baking box according to claim 2, characterized in that: The connecting boss is connected to the supporting rod via a first connecting member, a first connecting hole is provided on the connecting boss, a second connecting hole corresponding to the first connecting hole is provided on the supporting rod, and the first connecting member passes through the first connecting hole and the second connecting hole respectively.

4. The wafer baking box according to claim 2, characterized in that: The two support rods are symmetrically arranged on two opposite sides of the wafer support body.

5. The wafer baking box according to claim 2, characterized in that: The base comprises two mutually parallel base plates, and the two support rods are respectively fixed on the two base plates.

6. The wafer baking box according to claim 1, characterized in that: The bottom of the wafer groove includes a first straight portion, an arc portion sequentially connected to the first straight portion, and a second straight portion, and the arc portion wraps around the side wall of the wafer.

7. The wafer baking box according to claim 1, characterized in that: Also included is a limiting rod, which is detachably connected to the base, and is located on the opening side of the wafer holder, and is used to limit the wafer in the wafer holder.

8. The wafer baking box according to claim 7, characterized in that: A connecting rod is provided at the end of the limiting rod, and the connecting rod is perpendicular to the limiting rod. The connecting rod is connected to the base through a second connecting piece. Third connecting holes are respectively provided at both ends of the connecting rod. A fourth connecting hole corresponding to the third connecting hole is provided on the base, and the second connecting piece passes through the third connecting hole and the fourth connecting hole respectively.

9. The wafer baking box according to claim 1, characterized in that: The base is also provided with a transport gripper, which is used for being held by a user or a robot when transferring the wafer baking material box.

10. A wafer processing device, characterized in that: It comprises a wafer baking box as described in any one of claims 1 to 9.

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