Chip mounting mechanism for integrated circuit processing

Abstract

The utility model discloses a chip mounting mechanism for integrated circuit processing, which comprises a conveyor used for conveying a circuit board, an X-axis driving module arranged on one side of the conveyor and a vacuum adsorption assembly used for adsorbing elements and carrying out chip mounting operation, and the top of a moving body of the X-axis driving module is connected with a Y-axis driving module through a supporting bracket. A mounting bracket is mounted on one side of the Y-axis driving module moving body; the X-axis driving module and the Y-axis driving module can simultaneously drive the two vacuum adsorption assemblies to carry out surface mounting operation, the efficiency is high, and the driving assemblies cannot simultaneously control the two vacuum adsorption assemblies to move through cooperative use of the material pushing cylinder, the connecting seat and the movable bottom frame, so that the surface mounting efficiency is improved. Therefore, when the vacuum adsorption assembly controlled by the driving assembly continues to perform chip mounting operation, an operator can replace the vacuum suction nozzle of the other vacuum adsorption assembly, and the problem of time waste caused by replacement of the vacuum suction nozzle can be solved.

Description

Technical Field

[0001] The utility model relates to the technical field related to integrated circuit processing, in particular to a patch mechanism for integrated circuit processing. Background Art

[0002] During the processing of integrated circuits, it is necessary to perform chip placement operations on the integrated circuit board. When the existing integrated circuit chip placement mechanism performs the chip placement operation, the vacuum adsorption structure used to absorb the components generally absorbs the chips and then transports the chips to the circuit board for chip placement operations. However, different types of components require different vacuum suction nozzles, and the machine needs to be shut down when replacing the suction nozzle, which will cause a waste of time. Utility Model Content

[0003] In order to solve the defects in the prior art, the utility model provides a patch mechanism for integrated circuit processing.

[0004] In order to solve the above technical problems, the utility model provides the following technical solutions:

[0005] The utility model discloses a patch mechanism for integrated circuit processing, comprising a conveyor for conveying circuit boards, an X-axis driving module installed on one side of the conveyor, and a vacuum adsorption assembly for adsorbing components and performing patch operations, wherein the top of the X-axis driving module moving body is connected to the Y-axis driving module via a supporting bracket, a mounting bracket is installed on one side of the Y-axis driving module moving body, a linear regulator driven by the Y-axis driving module is provided on one side of the mounting bracket, the linear regulator is used to drive the vacuum adsorption assembly, and the linear regulator is composed of an adjustment shell and a driving assembly for driving the vacuum adsorption assembly.

[0006] As a preferred technical solution of the utility model, the adjusting shell includes a bearing base frame installed on one side of the mounting bracket and two movable base frames arranged on the outside of the bearing base frame, the top of the movable base frame is provided with an L-shaped cover plate fixedly connected to the bearing base frame, one side of the bottom plate of the movable base frame is provided with a slot, both ends of the top of the bottom plate of the movable base frame are provided with connecting seats, and both sides of the bottom plate of the bearing base frame are provided with insertion strips plugged into the slots, and two pushing cylinders arranged back to back are installed at both ends of the top of the bottom plate of the bearing base frame, and the piston rods of the pushing cylinders are fixedly connected to the corresponding connecting seats.

[0007] As a preferred technical solution of the utility model, the driving assembly includes a driving motor installed on the top of the L-shaped cover plate, and a driving gear keyed to the output shaft of the driving motor, the output shaft of the driving motor can pass through the through hole on the L-shaped cover plate, and a bearing is provided at the connection between the output shaft of the driving motor and the L-shaped cover plate, and adjustment racks are provided on both sides of the driving gear, and sliding bars are provided on the upper and lower ends of the adjusting racks, and guide rods fixedly connected to the movable base frame at both ends are provided in the through hole of the adjusting rack, and buffer springs are sleeved on the outer walls of the two ends of the guide rods, and guide rails are provided on the upper and lower sides of the guide rods, and the two guide rails are arranged face to face, and sliding grooves are opened on the guide rails, and sliding bars that slide with the sliding grooves are provided on the upper and lower sides of the adjusting racks.

[0008] As a preferred technical solution of the utility model, a sliding through hole is opened on the side plate of the movable chassis, and a sliding rod driven by an adjustment rack is slidably arranged in the sliding through hole. An adjustment plate is installed on one side of the sliding rod, and the other side is fixedly connected to the adjustment rack.

[0009] As a preferred technical solution of the utility model, the vacuum adsorption assembly includes a mounting support installed on one side of the adjustment plate and a pneumatic telescopic cylinder. The outer side of the pneumatic telescopic cylinder is provided with a support frame fixedly connected to the mounting support and used to support the pneumatic telescopic cylinder. The output shaft of the pneumatic telescopic cylinder is connected to a vacuum suction nozzle via a connecting piece.

[0010] As a preferred technical solution of the utility model, the vacuum adsorption assembly also includes a CCD camera, and the CCD camera is installed on one side of the adjustment plate.

[0011] The beneficial effects of the utility model are:

[0012] 1. In this patch mechanism for integrated circuit processing, the X-axis drive module and the Y-axis drive module can simultaneously drive two vacuum adsorption components to perform patch operations, which is highly efficient. Through the coordinated use of the push cylinder, the connecting seat, and the mobile chassis, the drive component cannot simultaneously control the movement of the two vacuum adsorption components. Therefore, while the vacuum adsorption component controlled by the drive component continues to perform the patch operation, the operator can replace the vacuum suction nozzle of the other vacuum adsorption component, which can solve the problem of time waste caused by replacing the vacuum suction nozzle.

[0013] 2. This patch mechanism for integrated circuit processing controls the driving gear and the adjusting rack to mesh and transmit through the driving motor, so that the moving directions of the two adjusting racks are opposite. The adjusting rack drives the vacuum adsorption component with the help of the sliding rod and the adjusting plate, so that the moving directions of the two vacuum adsorption components are opposite. The positions of the two vacuum adsorption components can be adjusted, and combined with the X-axis driving module and the Y-axis driving module, the patch operation can be made more flexible. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0015] Figure 1 This is a schematic diagram of the structure of a patch mechanism for integrated circuit processing of the utility model;

[0016] Figure 2 This is a schematic diagram of the structure of a linear regulator of a patch mechanism (omitting the L-shaped cover plate) for integrated circuit processing of the utility model;

[0017] Figure 3 This is an exploded diagram of a linear regulator of a patch mechanism for integrated circuit processing of the utility model;

[0018] Figure 4 The utility model is a schematic diagram of the structure of an adjusting rack, a guide rail and a guide rod of a patch mechanism for integrated circuit processing.

[0019] In the figure: 1. conveyor; 2. X-axis drive module; 3. adjustment shell; 31. L-shaped cover; 32. bearing base; 321. insert; 33. movable base; 331. sliding through hole; 332. slot; 34. adjustment plate; 35. sliding rod; 36. push cylinder; 37. connecting seat; 4. Y-axis drive module; 5. mounting bracket; 6. vacuum adsorption component; 61. mounting support; 62. pneumatic telescopic cylinder; 63. connecting piece; 64. vacuum suction nozzle; 65. support frame; 66. CCD camera; 7. drive component; 71. drive motor; 72. adjustment rack; 721. sliding bar; 73. drive gear; 74. guide rail; 741. sliding through groove; 75. buffer spring; 76. guide rod. DETAILED DESCRIPTION

[0020] The preferred embodiments of the present invention are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0021] Example: Figure 1 , Figure 2 , Figure 3 and Figure 4As shown, the utility model is a patch mechanism for integrated circuit processing, including a conveyor 1 for conveying circuit boards, an X-axis drive module 2 installed on one side of the conveyor 1, and a vacuum adsorption component 6 for adsorbing components and performing patch operations, the top of the X-axis drive module 2 moving body is connected to the Y-axis drive module 4 via a supporting bracket, a mounting bracket 5 is installed on one side of the Y-axis drive module 4 moving body, a linear regulator driven by the Y-axis drive module 4 is provided on one side of the mounting bracket 5, the linear regulator is used to drive the vacuum adsorption component 6, and the linear regulator is composed of an adjustment shell 3 and a driving component 7 for driving the vacuum adsorption component 6.

[0022] Among them, the adjustment shell 3 includes a bearing base frame 32 installed on one side of the mounting bracket 5 and two movable base frames 33 arranged on the outside of the bearing base frame 32, the top of the movable base frame 33 is provided with an L-shaped cover plate 31 fixedly connected to the bearing base frame 32, a slot 332 is opened on one side of the bottom plate of the movable base frame 33, both ends of the top of the bottom plate of the movable base frame 33 are provided with connecting seats 37, and both sides of the bottom plate of the bearing base frame 32 are provided with insertion strips 321 plugged into the slots 332, and two pushing cylinders 36 arranged back to back are installed at both ends of the top of the bottom plate of the bearing base frame 32, the piston rod of the pushing cylinder 36 is fixedly connected to the corresponding connecting seat 37, and the movable base frame 33 is positioned by plugging the insertion strip 321 into the slot 332.

[0023] The pushing cylinder 36 pushes the movable base frame 33 with the help of the connecting seat 37, so that the corresponding movable base frame 33 is away from the supporting base frame 32, and the movable base frame 33 is used to drive the adjusting rack 72, so that one adjusting rack 72 is disengaged from the driving gear 73, and the driving component 7 will not be able to control the movement of the two vacuum adsorption components 6 at the same time. At this time, the vacuum adsorption component 6 controlled by the driving component 7 can continue to perform the patch operation, and the operator can replace the vacuum suction nozzle 64 of the other vacuum suction nozzle 6, which can solve the problem of time waste caused by replacing the vacuum suction nozzle 64.

[0024] The driving assembly 7 includes a driving motor 71 installed on the top of the L-shaped cover plate 31, a driving gear 73 keyed to the output shaft of the driving motor 71, the output shaft of the driving motor 71 can pass through the through hole on the L-shaped cover plate 31, a bearing is provided at the connection between the output shaft of the driving motor 71 and the L-shaped cover plate 31, and adjustment racks 72 are provided on both sides of the driving gear 73. Sliding bars 721 are provided at the upper and lower ends of the adjustment rack 72. A guide rod 76 is provided in the through hole of the adjustment rack 72, and both ends are fixedly connected to the movable base frame 33. Buffer springs are sleeved on the outer walls of both ends of the guide rod 76 75, guide rails 74 are provided on the upper and lower sides of the guide rod 76, and the two guide rails 74 are arranged face to face. A sliding groove 741 is opened on the guide rail 74, and a sliding bar 721 that slidably cooperates with the sliding groove 741 is provided on the upper and lower sides of the adjusting rack 72. The sliding cooperation between the sliding bar 721 and the sliding groove 741 is utilized to realize the sliding connection between the adjusting rack 72 and the guide rail 74. When the adjusting rack 72 moves, the guide rod 76 plays a guiding role, and the buffer spring 75 plays a buffering role. The three cooperate with each other, so that the stability of the adjusting rack 72 when moving is high, which is conducive to the stable operation of the mechanism.

[0025] The driving motor 71 controls the driving gear 73 to mesh with the adjusting rack 72, so that the moving directions of the two adjusting racks 72 are opposite. The adjusting rack 72 drives the vacuum adsorption assembly 6 with the help of the sliding rod 35 and the adjusting plate 34, so that the moving directions of the two vacuum adsorption assemblies 6 are opposite. The positions of the two vacuum adsorption assemblies 6 can be adjusted, and then cooperated with the X-axis driving module 2 and the Y-axis driving module 4, the patch operation is made more flexible.

[0026] Among them, a sliding through hole 331 is opened on the side plate of the movable base frame 33, and a sliding rod 35 driven by an adjusting rack 72 is slidably arranged in the sliding through hole 331. An adjusting plate 34 is installed on one side of the sliding rod 35, and the other side is fixedly connected to the adjusting rack 72. The sliding through hole 331 provides sufficient movement space for the sliding rod 35 and also serves as a limit for the sliding rod 35.

[0027] Among them, the vacuum adsorption component 6 includes a mounting support 61 and a pneumatic telescopic cylinder 62 installed on one side of the adjustment plate 34. The outer side of the pneumatic telescopic cylinder 62 is provided with a support frame 65 fixedly connected to the mounting support 61 and used to support the pneumatic telescopic cylinder 62. The output shaft of the pneumatic telescopic cylinder 62 is connected to the vacuum suction nozzle 64 via a connecting piece 63. The connecting piece 63 is driven by the pneumatic telescopic cylinder 62, and the connecting piece 63 drives the vacuum suction nozzle 64 to rise and fall, thereby realizing the absorption of components and patch operations.

[0028] The vacuum adsorption assembly 6 further includes a CCD camera 66 , which is installed on one side of the adjustment plate 34 . The CCD camera 66 is used to determine the patch position and can detect whether the component is pasted to the correct position.

[0029] During operation, the circuit board is transported by the conveyor 1, and the positions of the two vacuum adsorption components 6 are adjusted by the X-axis driving module 2 and the Y-axis driving module 4. The vacuum adsorption component 6 is used to perform the patch operation at the same time. When the vacuum suction nozzle 64 needs to be replaced (the vacuum adsorption component 6 is no longer driven by the Y-axis driving module 4), the pushing cylinder 36 pushes the movable chassis 33 with the help of the connecting seat 37, so that the corresponding movable chassis 33 is away from the bearing chassis 32, and the movable chassis 33 is used to drive the adjusting rack 72, so that one adjusting rack 72 is disengaged from the driving gear 73, and the driving component 7 will not be able to control the movement of the two vacuum adsorption components 6 at the same time. The driving motor 71 controls the driving gear 73 to engage with the adjusting rack 72 for transmission. The adjusting rack 72 drives the vacuum adsorption component 6 with the help of the sliding rod 35 and the adjusting plate 34, so that the position of the corresponding vacuum adsorption component 6 can be adjusted, and the patch operation can be continued. At this time, the operator can replace the vacuum suction nozzle 64 of the other vacuum adsorption component 6 to solve the problem of wasting time when replacing the vacuum suction nozzle 64.

[0030] Finally, it should be noted that the above description is only a preferred embodiment of the utility model and is not intended to limit the utility model. Although the utility model is described in detail with reference to the above embodiments, those skilled in the art can still modify the technical solutions recorded in the above embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A chip placement mechanism for integrated circuit processing, comprising a conveyor (1) for conveying circuit boards, an X-axis drive module (2) installed on one side of the conveyor (1), and a vacuum adsorption component (6) for adsorbing components and performing chip placement operations, characterized in that: The top of the X-axis driving module (2) moving body is connected to the Y-axis driving module (4) via a supporting bracket, a mounting bracket (5) is installed on one side of the Y-axis driving module (4) moving body, and a linear regulator driven by the Y-axis driving module (4) is provided on one side of the mounting bracket (5), the linear regulator is used to drive the vacuum adsorption component (6), and the linear regulator is composed of an adjustment shell (3) and a driving component (7) used to drive the vacuum adsorption component (6).

2. The chip placement mechanism for integrated circuit processing according to claim 1, characterized in that: The adjusting housing (3) comprises a bearing base (32) mounted on one side of the mounting bracket (5) and two movable bases (33) arranged on the outside of the bearing base (32); an L-shaped cover plate (31) fixedly connected to the bearing base (32) is arranged on the top of the movable base (33); a slot (332) is opened on one side of the bottom plate of the movable base (33); connecting seats (37) are arranged at both ends of the top of the bottom plate of the movable base (33); and inserting strips (321) plugged into the slots (332) are arranged on both sides of the bottom plate of the bearing base (32); two pushing cylinders (36) arranged back to back are installed at both ends of the top of the bottom plate of the bearing base (32); piston rods of the pushing cylinders (36) are fixedly connected to corresponding connecting seats (37).

3. The chip placement mechanism for integrated circuit processing according to claim 2, characterized in that: The driving assembly (7) comprises a driving motor (71) mounted on the top of the L-shaped cover plate (31), and a driving gear (73) key-connected to the output shaft of the driving motor (71); the output shaft of the driving motor (71) can pass through a through hole on the L-shaped cover plate (31); a bearing is provided at the connection between the output shaft of the driving motor (71) and the L-shaped cover plate (31); both sides of the driving gear (73) are provided with adjustment racks (72); and the upper and lower ends of the adjustment racks (72) are provided with sliding bars (721). A guide rod (76) having two ends fixedly connected to the movable base frame (33) is arranged in the through hole of the adjusting rack (72), and buffer springs (75) are sleeved on the outer walls of both ends of the guide rod (76). Guide rails (74) are arranged on the upper and lower sides of the guide rod (76), and the two guide rails (74) are arranged face to face. A sliding groove (741) is formed on the guide rail (74), and a sliding bar (721) slidably matched with the sliding groove (741) is provided on the upper and lower sides of the adjusting rack (72).

4. The chip placement mechanism for integrated circuit processing according to claim 3, characterized in that: A sliding through hole (331) is provided on the side plate of the movable chassis (33), a sliding rod (35) driven by an adjusting rack (72) is slidably provided in the sliding through hole (331), an adjusting plate (34) is installed on one side of the sliding rod (35), and the other side is fixedly connected to the adjusting rack (72).

5. The chip placement mechanism for integrated circuit processing according to claim 4, characterized in that: The vacuum adsorption assembly (6) comprises a mounting support (61) mounted on one side of the adjustment plate (34) and a pneumatic telescopic cylinder (62); a support frame (65) fixedly connected to the mounting support (61) and used to support the pneumatic telescopic cylinder (62) is provided on the outer side of the pneumatic telescopic cylinder (62); an output shaft of the pneumatic telescopic cylinder (62) is connected to a vacuum suction nozzle (64) via a connecting piece (63).

6. The chip placement mechanism for integrated circuit processing according to claim 4, characterized in that: The vacuum adsorption component (6) also includes a CCD camera (66), and the CCD camera (66) is installed on one side of the adjustment plate (34).

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