Semiconductor cleaning equipment

Abstract

The utility model discloses semiconductor cleaning equipment, which relates to the technical field of semiconductor manufacturing and comprises a supporting seat, a rotary driving mechanism, a cleaning mechanism and a cleaning box, the cleaning box is arranged on one side of the supporting seat, and the rotary driving mechanism and the cleaning mechanism are both arranged in the cleaning box. The number of the rotary driving mechanisms and the number of the cleaning mechanisms are both two, the device further comprises a conveying mechanism and a bearing mechanism, the conveying mechanism comprises a rotary disc, a stepping motor is arranged in the supporting seat, the output end of the stepping motor is fixedly connected with the bottom of the rotary disc, and a plurality of linkage plates are fixedly connected to the rotary disc at equal intervals in a surrounding mode. A plurality of stations can be operated at the same time, so that the processing time is shortened, the implementation efficiency is improved, meanwhile, the rotary driving mechanism, the cleaning mechanism and the angle adjusting mechanism are arranged, and all the components are matched with one another to jointly guarantee the cleaning effect of the surface of a semiconductor wafer.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to semiconductor cleaning equipment. Background Art

[0002] Semiconductor manufacturing refers to the process of performing a series of processing and manufacturing processes on semiconductor materials to produce semiconductor devices. Semiconductor cleaning equipment is equipment used to clean and process wafers or other semiconductor devices during the semiconductor manufacturing process. The main function of semiconductor cleaning equipment is to remove impurities, organic matter, metal ions, oxides, etc. on the surface of the wafer to ensure the cleanliness and purity of the wafer surface, so as to ensure the smooth progress of subsequent process steps and the stability of device performance.

[0003] A Chinese patent with publication number CN114927441A discloses a semiconductor cleaning device. During the use of the device, a semiconductor wafer needs to be placed on a carrier, and then different types of cleaning liquids are sprayed in stages through a first nozzle and a second nozzle to clean the semiconductor wafer. The spray angles of the first cleaning arm and the second cleaning arm are adjusted through a driving mechanism. After the semiconductor wafer is cleaned, the semiconductor wafer is removed and another semiconductor wafer is placed, and the above cleaning operation is then repeated.

[0004] The shortcomings of the above-mentioned prior art solution are that: in each implementation process of the above-mentioned solution, two cleaning agents need to be used to clean it in stages, and the two cleaning agents correspond to two groups of nozzles respectively. When one group of nozzles is flushing, the other nozzle is idle and cannot continue to operate on the next workpiece, resulting in low cleaning efficiency. Utility Model Content

[0005] The utility model aims to provide a semiconductor cleaning device to solve the technical problem of low efficiency in the prior art.

[0006] The technical problem to be solved by the utility model can be achieved through the following technical solutions:

[0007] A semiconductor cleaning device comprises a support seat, a rotary drive mechanism, a cleaning mechanism and a cleaning box, wherein the cleaning box is arranged on one side of the support seat, and the rotary drive mechanism and the cleaning mechanism are both arranged inside the cleaning box, and two groups of the rotary drive mechanism and the cleaning mechanism are each provided. The device also comprises a conveying mechanism and a bearing mechanism, wherein the conveying mechanism comprises a turntable, and a progressive motor is arranged inside the support seat, and the output end of the progressive motor is fixedly connected to the bottom of the turntable, and a plurality of connecting plates are fixedly connected to the turntable at equal intervals; the bearing mechanism is provided with a plurality of groups, and is respectively connected to the turntable through connecting plates, and the bearing mechanism comprises a bearing ring plate fixedly connected to the connecting plate, and a bearing disk is rotatably connected inside the bearing ring plate, and a feeding port matched with the bearing disk is opened on the cleaning box, and the bearing disk matches with the cleaning mechanism and the rotary drive mechanism.

[0008] As a further solution of the utility model: two groups of mechanical arms are arranged on the side of the support base away from the cleaning box, and one side of each group of the mechanical arms is equipped with a group of semiconductor storage boxes.

[0009] As a further solution of the utility model: a positioning groove is provided on the upper surface of the carrying plate.

[0010] As a further solution of the utility model: the rotary drive mechanism includes a telescopic table, the telescopic table is fixedly connected to the bottom of the cleaning box, the upper end of the telescopic table is fixedly connected to a first servo motor, the output shaft of the first servo motor is fixedly connected to a transmission block, and the lower surface of each carrier plate is provided with a transmission groove that matches the transmission block.

[0011] As a further solution of the utility model: a limiting ring cooperating with the carrying plate is fixedly connected to the inner bottom of the carrying ring plate, a ball groove is provided on the upper side of the limiting ring, a plurality of balls are loaded inside the ball groove, the upper end of each ball is in contact with the bottom of the carrying plate, a protrusion is fixedly connected around the inner side of the carrying ring plate, and a groove cooperating with the protrusion is provided on the outer side of the carrying plate.

[0012] As a further solution of the utility model: the two groups of cleaning mechanisms include a water pump, which is fixedly connected to the bottom of the cleaning box. The water outlet of the water pump is rotatably connected to a delivery pipe, and the output end of the delivery pipe cooperates with the supporting plate.

[0013] As a further solution of the utility model: an angle adjustment mechanism is provided inside the cleaning box, and the angle adjustment mechanism includes a second servo motor, the second servo motor is fixedly connected to the bottom of the cleaning box, the output end of the second servo motor is fixedly connected to the second transmission wheel, the lower ends of the two groups of conveying pipes are coaxially fixedly connected with the first transmission wheels corresponding to the second transmission wheel, the second transmission wheels are equipped with two belts, and each of the first transmission wheels is connected to the second transmission wheel through a belt.

[0014] Beneficial effects of the utility model:

[0015] 1. The utility model is provided with two groups of cleaning mechanisms, and a plurality of semiconductor wafers are placed on corresponding carrier plates respectively. The carrier plates drive the semiconductor wafers to pass through the two groups of cleaning mechanisms in sequence. When the latter group of cleaning mechanisms performs secondary cleaning on the semiconductor wafer, the former group of cleaning mechanisms continues to clean another semiconductor wafer, so that the device can perform cleaning operations at different stages on two semiconductor wafers at the same time, thereby shortening the processing time and improving the implementation efficiency.

[0016] 2. The supporting mechanism of the utility model will pass through the output ends of the adjacent rotating drive mechanism and the cleaning mechanism in turn. The friction between the supporting ring plate and the supporting disk inside the supporting mechanism is relatively small, which facilitates the rotating drive mechanism to indirectly drive the semiconductor wafer to rotate, and the surface of the semiconductor wafer is flushed through the cleaning mechanism. The cleaning mechanism is adjusted through the angle adjustment mechanism, and the various components cooperate with each other to jointly ensure the cleaning effect of the surface of the semiconductor wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The utility model is further described below in conjunction with the accompanying drawings.

[0018] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0019] Figure 2 This is a schematic diagram of the internal structure of the cleaning box of the utility model;

[0020] Figure 3 This is a schematic diagram of the structure of the rotary drive mechanism of the utility model;

[0021] Figure 4 It is a structural schematic diagram of the bearing mechanism of the utility model.

[0022] In the figure: 1. support seat; 2. bearing mechanism; 201. bearing ring plate; 202. bearing plate; 203. positioning groove; 204. transmission groove; 205. limit ring; 206. ball groove; 207. ball; 3. transmission mechanism; 301. turntable; 302. connecting plate; 4. mechanical arm; 5. semiconductor storage box; 6. rotation drive mechanism; 601. telescopic table; 602. first servo motor; 603. transmission block; 7. cleaning mechanism; 701. water pump; 702. first transmission wheel; 703. conveying pipe; 8. angle adjustment mechanism; 801. second servo motor; 802. second transmission wheel; 9. cleaning box; 10. feeding port. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] like Figure 1-Figure 4 As shown, a semiconductor cleaning device includes a support seat 1, a rotating drive mechanism 6, a cleaning mechanism 7 and a cleaning box 9. The cleaning box 9 is arranged on one side of the support seat 1. The rotating drive mechanism 6 and the cleaning mechanism 7 are both arranged inside the cleaning box 9. The rotating drive mechanism 6 and the cleaning mechanism 7 are both provided with two groups, and the two are distributed correspondingly. The output end of the cleaning mechanism 7 is located directly above the rotating drive mechanism 6. The device also includes a conveying mechanism 3 and a bearing mechanism 2. The conveying mechanism 3 includes a turntable 301, and the turntable 301 is fixedly connected to the output end of the support seat 1. A progressive motor is fixedly arranged inside the support seat 1, and the output end of the progressive motor is fixedly connected to the bottom of the turntable 301. A plurality of groups of connecting plates 302 are equidistantly fixedly connected to the turntable 301, and the connecting plates 302 can rotate around the turntable 301 under the drive of the turntable 301; the number of the bearing mechanisms 2 corresponds to the number of the connecting plates 302, and each group of the bearing mechanisms 2 is arranged at a position corresponding to the connecting plates 302 away from the turntable 301 end, so that the connecting plate 302 can drive the supporting mechanism 2 to rotate around the turntable 301, the supporting mechanism 2 includes a supporting ring plate 201 fixedly connected to the connecting plate 302, and the supporting ring plate 201 is rotatably connected to the supporting disk 202, the supporting disk 202 can rotate on its own, and is limited inside the supporting ring plate 201, and a feeding port 10 matched with the supporting disk 202 is opened on the cleaning box 9, and the feeding port 10 itself The height of the feeding port 10 is adapted to the supporting mechanism 2, and the feeding port 10 facilitates the rotation of the supporting disk 202 into the cleaning box 9, the supporting disk 202 cooperates with the cleaning mechanism 7 and the rotating drive mechanism 6, and the supporting disk 202 can be rotated to between the output ends of the cleaning mechanism 7 and the output ends of the rotating drive mechanism 6; the transmission mechanism 3 is driven to rotate by the support seat 1, and the transportation of the supporting mechanism 2 is realized by the transmission mechanism 3, so that the two groups of cleaning mechanisms 7 and the rotating drive mechanism 6 can process the semiconductor wafers placed above the supporting mechanism 2 in turn.

[0025] In some specific embodiments, in order to improve the efficiency of loading and unloading semiconductor chips, two groups of robotic arms 4 are arranged on the side of the support base 1 away from the cleaning box 9, and a clamping assembly is arranged at the front end of the robotic arm 4. Each group of robotic arms 4 is equipped with a group of semiconductor storage boxes 5 on one side, and the semiconductor storage boxes 5 are located inside the action range of the corresponding robotic arms 4. The two groups of robotic arms 4 are responsible for loading and unloading operations, respectively, thereby improving operational efficiency and saving waiting time. The positioning groove 203 is responsible for limiting the semiconductor chips to ensure stability during transportation.

[0026] In some specific embodiments, in order to prevent the semiconductor wafer from falling off the carrier plate 202 and improve the stability of the semiconductor wafer, a positioning groove 203 is opened on the upper surface of the carrier plate 202, and the size of the positioning groove 203 is the same as the size of the semiconductor wafer; when the carrier plate 202 drives the semiconductor wafer to be transported, the positioning groove 203 can limit the semiconductor wafer and ensure the stability of the semiconductor wafer during transportation or cleaning.

[0027] In some specific embodiments, in order to maintain the rotation state of the semiconductor wafer to ensure the washing effect, the rotation drive mechanism 6 is arranged directly below the rotation path of the carrier plate 202, and the rotation drive mechanism 6 includes a telescopic table 601, and the telescopic table 601 is fixedly connected to the bottom of the cleaning box 9. The upper end of the telescopic table 601 is fixedly connected to a first servo motor 602, and the output shaft of the first servo motor 602 is fixedly connected to a transmission block 603. The lower surface of each carrier plate 202 is provided with a transmission groove 204 that matches the transmission block 603, and the transmission block 603 can be connected to the transmission groove. 204 is engaged and connected, and the transmission block 603 and the transmission slot 204 can be reset each time the first servo motor 602 stops; the supporting mechanism 2 is transported to the inside of the cleaning box 9 under the action of the stepping motor, and is directly above the rotating drive mechanism 6. At this time, the telescopic table 601 pushes the first servo motor 602 to move upward, causing the transmission block 603 to be engaged and connected with the transmission slot 204, and the first servo motor 602 rotates, thereby driving the supporting plate 202 and the semiconductor wafer located above the supporting plate 202 to rotate synchronously, making it easier to clean the semiconductor wafer.

[0028] In some specific implementation schemes, in order to ensure that the carrier plate 202 is always limited in the carrier ring plate 201 and reduce the friction between the carrier plate 202 and the carrier ring plate 201 when the carrier plate 202 rotates, a limit ring 205 that matches the carrier plate 202 is fixedly connected to the bottom of the carrier ring plate 201. The limit ring 205 has a limit and support function for the carrier plate 202. A bead groove 206 is opened on the upper side of the limit ring 205. A plurality of balls 207 are filled in the bead groove 206. The plurality of balls 207 are limited in the bead groove 206. 06, the upper end of each ball 207 contacts the bottom of the carrying plate 202, a protrusion is fixedly connected around the inner side of the carrying ring plate 201, a groove matching the protrusion is opened on the outer side of the carrying plate 202, and the side of the carrying plate 202 is limited to the inside of the carrying ring plate 201 by the groove; when the carrying plate 202 rotates under the action of the first servo motor 602, the ball 207 can reduce the friction between the carrying plate 202 and the carrying ring plate 201, so that the implementation effect of the carrying plate 202 is more stable.

[0029] In some specific embodiments, in order to improve the cleaning efficiency, the two groups of cleaning mechanisms 7 include a water pump 701, which is fixedly connected to the bottom of the cleaning box 9. The water outlet end of the water pump 701 is rotatably connected to a delivery pipe 703, and the output end of the delivery pipe 703 points to the upper surface of the carrier plate 202. The input pipes of the two groups of water pumps 701 are externally connected to cleaning liquid containers, and different types of cleaning liquids are delivered respectively, which are cleaning agents and ultrapure water respectively; the carrier plate 202 delivers the semiconductor wafers to the bottom of the output ends of the two groups of cleaning mechanisms 7 in turn, and rotates under the action of the rotating drive mechanism 6, and then the corresponding cleaning mechanisms 7 use different cleaning agents to clean the semiconductor wafers respectively, so that multiple semiconductor wafers can be processed at the same time, thereby improving the implementation efficiency.

[0030] In some specific embodiments, in order to ensure the flushing effect of the cleaning mechanism 7, an angle adjustment mechanism 8 is provided inside the cleaning box 9, and the angle adjustment mechanism 8 includes a second servo motor 801, and the second servo motor 801 is fixedly connected to the bottom of the cleaning box 9, and the second servo motor 801 is located between the two cleaning mechanisms 7. The output end of the second servo motor 801 is fixedly connected to a second transmission wheel 802, and two groups of belt grooves are opened on the second transmission wheel 802. The lower ends of the two groups of conveying pipes 703 are coaxially fixedly connected to the first transmission wheels 702 corresponding to the second transmission wheel 802, and the second transmission wheel 802 is equipped with two belts, and each of the first transmission wheels 702 is connected to the second transmission wheel 802 through a belt. The transmission wheel 802 is connected in cooperation, and relies on the motor controller to control the reciprocating rotation of the second servo motor 801, so as to facilitate driving the corresponding delivery pipe 703 to reciprocate within a certain angle range, ensuring that the spraying range of the delivery pipe 703 is only within the range of a carrier plate 202; when the cleaning mechanism 7 starts to clean the semiconductor wafer, the second servo motor 801 relies on the motor controller to control the operation, driving the second transmission wheel 802 to rotate, and the second transmission wheel 802 drives the first transmission wheel 702 to rotate through the belt, and the first transmission wheel 702 drives the delivery pipe 703 to reciprocate above the carrier plate 202, so that the surface of the semiconductor wafer is evenly rinsed to avoid omissions and ensure the rinsing effect.

[0031] In order to facilitate the understanding of the embodiments of the present invention by those skilled in the art, the working principle of the embodiments of the present invention is now described in combination with specific application scenarios:

[0032] The two groups of mechanical arms 4 are responsible for the loading and unloading operations respectively, thereby improving the operation efficiency and saving waiting time. The positioning groove 203 is responsible for limiting the semiconductor wafer to ensure stability during transportation. The bearing mechanism 2 is transported to the inside of the cleaning box 9 and directly above the rotating drive mechanism 6 under the action of the support seat 1. At this time, the telescopic table 601 pushes the first servo motor 602 to move up, causing the transmission block 603 to be engaged with the transmission groove 204, and the first servo motor 602 rotates, thereby driving the carrier plate 202 and the semiconductor wafer located above the carrier plate 202 to rotate synchronously, making the semiconductor wafer easier to clean. When the carrier plate 202 rotates under the action of the first servo motor 602, it will drive the ball 207 inside the ball groove 206 to rotate, thereby reducing the friction between the carrier plate 202 and the carrier ring plate 201;

[0033] The carrier plate 202 delivers the semiconductor wafers to the bottom of the output ends of the two cleaning mechanisms 7 in turn, and rotates under the action of the rotating drive mechanism 6. The corresponding cleaning mechanisms 7 then use different cleaning agents to clean the semiconductor wafers respectively, and multiple semiconductor wafers can be processed at the same time, thereby improving the implementation efficiency. When the cleaning mechanism 7 starts to clean the semiconductor wafers, the second servo motor 801 is controlled by the motor controller to rotate back and forth, driving the second transmission wheel 802 to rotate. The second transmission wheel 802 drives the first transmission wheel 702 to rotate through a belt, and the first transmission wheel 702 drives the conveying tube 703 to rotate back and forth above the carrier plate 202, so that the surface of the semiconductor wafer is evenly rinsed to avoid omissions and ensure the rinsing effect.

[0034] The above is a detailed description of an embodiment of the utility model, but the content is only a preferred embodiment of the utility model and cannot be considered to limit the scope of implementation of the utility model. All equivalent changes and improvements made within the scope of application of the utility model should still fall within the scope of the patent coverage of the utility model.

Claims

1. A semiconductor cleaning device, comprising a support base (1), a rotary drive mechanism (6), a cleaning mechanism (7) and a cleaning box (9), wherein the cleaning box (9) is arranged on one side of the support base (1), the rotary drive mechanism (6) and the cleaning mechanism (7) are both arranged inside the cleaning box (9), and the rotary drive mechanism (6) and the cleaning mechanism (7) are both arranged in two groups, characterized in that , also includes: A conveying mechanism (3), the conveying mechanism (3) comprising a turntable (301), a progressive motor being arranged inside the support seat (1), an output end of the progressive motor being fixedly connected to the bottom of the turntable (301), and a plurality of groups of connecting plates (302) being fixedly connected to the turntable (301) at equal intervals; The carrier mechanism (2) is provided with a plurality of groups, and each of the groups is connected to a rotating disk (301) via a connecting plate (302). The carrier mechanism (2) comprises a carrier ring plate (201) fixedly connected to the connecting plate (302). The carrier disk (202) is rotatably connected inside the carrier ring plate (201). The cleaning box (9) is provided with a feeding port (10) matched with the carrier disk (202). The carrier disk (202) is matched with a cleaning mechanism (7) and a rotating drive mechanism (6).

2. A semiconductor cleaning device according to claim 1, characterized in that: Two groups of mechanical arms (4) are arranged on the side of the support base (1) away from the cleaning box (9), and one side of each group of the mechanical arms (4) is equipped with a group of semiconductor storage boxes (5).

3. A semiconductor cleaning device according to claim 1, characterized in that: A positioning groove (203) is provided on the upper surface of the carrying plate (202).

4. A semiconductor cleaning device according to claim 1, characterized in that: The rotary drive mechanism (6) comprises a telescopic platform (601), the telescopic platform (601) is fixedly connected to the bottom of the cleaning box (9), the upper end of the telescopic platform (601) is fixedly connected to a first servo motor (602), the output shaft of the first servo motor (602) is fixedly connected to a transmission block (603), and the lower surface of each of the carrier plates (202) is provided with a transmission groove (204) that matches the transmission block (603).

5. The semiconductor cleaning equipment according to claim 1, characterized in that: A limiting ring (205) matching with the supporting plate (202) is fixedly connected to the bottom of the inner side of the supporting ring plate (201); a ball groove (206) is provided on the upper side of the limiting ring (205); a plurality of balls (207) are loaded inside the ball groove (206); the upper end of each ball (207) is in contact with the bottom of the supporting plate (202); a protrusion is fixedly connected around the inner side of the supporting ring plate (201); and a groove matching with the protrusion is provided on the outer side of the supporting plate (202).

6. The semiconductor cleaning equipment according to claim 1, characterized in that: Both groups of cleaning mechanisms (7) include a water pump (701), which is fixedly connected to the bottom of the cleaning box (9). The water outlet end of the water pump (701) is rotatably connected to a delivery pipe (703), and the output end of the delivery pipe (703) cooperates with the carrier plate (202).

7. A semiconductor cleaning device according to claim 6, characterized in that: An angle adjustment mechanism (8) is provided inside the cleaning box (9), and the angle adjustment mechanism (8) comprises a second servo motor (801), the second servo motor (801) is fixedly connected to the bottom of the cleaning box (9), the output end of the second servo motor (801) is fixedly connected to a second transmission wheel (802), the lower ends of the two groups of conveying pipes (703) are coaxially fixedly connected to first transmission wheels (702) corresponding to the second transmission wheels (802), the second transmission wheels (802) are provided with two belts, and each of the first transmission wheels (702) is respectively connected to the second transmission wheel (802) by a belt.

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