Laser processing mechanism and laser processing device

Abstract

The utility model relates to the technical field of laser processing, in particular to a laser processing mechanism and a laser processing device. The laser machining mechanism comprises a rack, a workbench, a mounting plate, a first driving module and a laser machining assembly, the rack comprises a lathe bed and a cross beam, and the cross beam is erected on the lathe bed; the working table is arranged on the lathe bed, the laser machining assembly comprises a plurality of galvanometer scanning assemblies, and the galvanometer scanning assemblies are suitable for deflecting laser beams emitted by the laser device so as to machine workpieces to be machined on the working table; the plurality of galvanometer scanning assemblies are arranged on the mounting plate at intervals in the first direction, and the mounting plate is arranged on the cross beam, so that the plurality of galvanometer scanning assemblies are suspended above the workbench; the first driving module is connected with the mounting plate and used for driving the mounting plate to move in the first direction. According to the utility model, a plurality of processing procedures of the workpiece to be processed can be completed through one device, so that the defects and the efficiency loss caused by procedure circulation are reduced.

Description

Technical Field

[0001] The utility model belongs to the technical field of laser processing, in particular to a laser processing mechanism and a laser processing device. Background Art

[0002] Printed circuit boards (PCBs) are providers of electrical connections for electronic components. PCBs are mainly sandwich structures consisting of two types of materials: insulating substrates and conductors. Conductor materials usually use copper, and insulating materials include polypropylene (PP), polytetrafluoroethylene (PTFE), hydrocarbon resins, polyphenylene ether (PPO / PPE), resin materials (BT), Ajinomoto deposited film (ABF), ceramics, etc. With the development of circuit boards, the number of layers is increasing and the applications are becoming more and more extensive. For circuit boards for high-end applications, more and more traditional mechanical conversions are being made to laser drilling and cutting. Different material properties have different absorption rates for different laser wavelengths and pulse widths, that is, different processability. Different laser light sources will be used in the processing of such a circuit board.

[0003] In the prior art, when laser processing is performed on a circuit board, multiple processes of laser drilling or laser cutting are generally implemented by circulating on multiple devices, which is inefficient. Utility Model Content

[0004] The technical problem to be solved by the utility model is: in view of the problem of low efficiency in laser processing of a circuit board in the prior art, a laser processing mechanism and a laser processing device are provided.

[0005] In order to solve the above technical problems, on the one hand, the embodiment of the utility model provides a laser processing mechanism, including a frame, a workbench, a mounting plate, a first driving module and a laser processing assembly, wherein the frame includes a bed and a beam, and the beam is mounted on the bed;

[0006] The workbench is arranged on the bed, and the laser processing assembly includes a plurality of galvanometer scanning assemblies, and the galvanometer scanning assemblies are suitable for deflecting the laser beam emitted by the laser to process the workpiece to be processed on the workbench;

[0007] A plurality of the galvanometer scanning assemblies are arranged on the mounting plate at intervals along a first direction, and the mounting plate is arranged on the crossbeam, so that the plurality of the galvanometer scanning assemblies are suspended above the workbench;

[0008] The first driving module is connected to the mounting plate, and the first driving module is used to drive the mounting plate to move along a first direction.

[0009] Optionally, it further includes a second driving module, which is installed on the bed and connected to the workbench. The second driving module is used to drive the workbench to move along a second direction, and the second direction is perpendicular to the first direction.

[0010] Optionally, a third driving module is also included, which is installed on the mounting plate. Each galvanometer scanning assembly is connected to a third driving module, and the third driving module is used to drive the galvanometer scanning assembly to move along a third direction, which is perpendicular to the plane where the first direction and the second direction are located.

[0011] Optionally, it further comprises a plurality of lasers, wherein the lasers are arranged on the crossbeam, the wavelengths of laser beams emitted by the plurality of lasers are different from each other, and each of the galvanometer scanning assemblies is connected to one of the lasers.

[0012] Optionally, a focusing component is further included, and the focusing component is suitable for focusing the laser beam of the laser, and each of the galvanometer scanning assemblies is provided with one of the focusing components.

[0013] Optionally, it also includes a visual positioning component, which is used to position the workpiece to be processed on the workbench, and the visual positioning component is arranged on the mounting plate.

[0014] Optionally, the galvanometer scanning assembly includes a first galvanometer mechanism, a second galvanometer mechanism and a galvanometer mounting seat, and the first galvanometer mechanism and the second galvanometer mechanism are mounted on the galvanometer mounting seat.

[0015] Optionally, the first galvanometer mechanism includes a first motor and a first galvanometer connected to the output shaft of the first motor; the second galvanometer mechanism includes a second motor and a second galvanometer connected to the output shaft of the second motor; a cavity is defined inside the galvanometer mounting seat, and the cavity is defined with a first mounting hole for mounting the first motor, a second mounting hole for mounting the second motor, a laser input hole for inputting laser, and a laser output hole for outputting laser; the first galvanometer extends from the first mounting hole into the cavity, and the second galvanometer extends from the second mounting hole into the cavity; the laser enters the cavity from the laser input hole, is refracted by the first galvanometer and the second galvanometer, and is output from the laser output hole.

[0016] Optionally, a fourth driving module is further included, the fourth driving module is installed on the bed, the fourth driving module is connected to a side of the second driving module away from the workbench, and is used to drive the second driving module to move along the first direction

[0017] According to the laser processing mechanism of this embodiment, a plurality of galvanometer scanning assemblies are arranged on the workbench, and each galvanometer scanning assembly processes the workpiece to be processed on the workbench by deflecting the laser beam emitted by the laser. When the workpiece to be processed requires multiple laser processing procedures, the present application makes each galvanometer scanning assembly deflect a laser beam of a wavelength, and different galvanometer scanning assemblies deflect laser beams of different wavelengths, so that different galvanometer scanning assemblies of the present application have different processing performances. At the same time, the multiple galvanometer scanning assemblies of the present application are installed on the same mounting plate, and the multiple galvanometer scanning assemblies are driven to move in the first direction by a driving device (first driving module), so that the same galvanometer scanning assembly can be at different positions on the workpiece to be processed, and different galvanometer scanning assemblies can be performed at the same position. At the same time, multiple galvanometer scanning assemblies are installed on the same mounting plate, and during the processing, the multiple galvanometer scanning assemblies are spaced from each other in the first direction, and the spacing distance remains unchanged, which can avoid interference between different galvanometer scanning assemblies. This embodiment can complete multiple processing procedures for the workpiece to be processed through one device, so that the processing mechanism of this embodiment integrates the functions of multiple devices, thereby reducing the defects and efficiency losses caused by the process flow.

[0018] On the other hand, an embodiment of the utility model provides a laser processing device, which is used for processing HDI boards, carrier-like boards and carrier boards, and includes the above-mentioned laser processing mechanism. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the overall structure of a laser processing mechanism provided by an embodiment of the utility model;

[0020] Figure 2 yes Figure 1 A magnified image of A.

[0021] The reference numerals in the specification are as follows:

[0022] 1. Frame; 2. Workbench; 3. Mounting plate; 4. Galvanometer scanning assembly; 5. First drive module; 6. Second drive module; 7. Third drive module; 8. Visual positioning assembly; 11. Bed; 12. Crossbeam. DETAILED DESCRIPTION

[0023] In order to make the technical problems, technical solutions and beneficial effects solved by the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0024] like Figure 1 and Figure 2As shown, an embodiment of the utility model provides a laser processing mechanism, including a frame 1, a workbench 2, a mounting plate 3, a first drive module 5 and a laser processing assembly, wherein the frame 1 includes a bed 11 and a crossbeam 12, and the crossbeam 12 is mounted on the bed 11;

[0025] The workbench 2 is arranged on the bed 11, and the laser processing assembly includes a plurality of galvanometer scanning assemblies 4, and the galvanometer scanning assemblies 4 are suitable for deflecting the laser beam emitted by the laser to process the workpiece to be processed on the workbench 2;

[0026] A plurality of galvanometer scanning assemblies 4 are arranged on the mounting plate 3 at intervals along the first direction. The mounting plate 3 may be a complete plate or a plurality of plates fixedly connected to form a mounting plate 3. The mounting plate 3 is arranged on the crossbeam 12, so that the plurality of galvanometer scanning assemblies 4 are suspended above the workbench 2, so that the plurality of galvanometers can be processed synchronously on the workbench;

[0027] The mounting plate 3 is connected to the crossbeam 12 via the first driving module 5, and the first driving module 5 is used to drive the mounting plate 3 to move along the first direction. In this embodiment, a plurality of galvanometer scanning assemblies 4 are arranged in a line along the first direction, and preferably, the first direction coincides with the X direction. In this embodiment, the first driving module 5 can drive the mounting plate 3 to move through structures such as a motor, a screw, and a guide rail, thereby driving the galvanometer scanning assembly 4 on the mounting plate to move synchronously in the first direction, thereby avoiding interference between different galvanometer scanning assemblies.

[0028] In one embodiment, a second driving module 6 is further included, the second driving module 6 is mounted on the bed 11, the second driving module 6 is connected to the workbench 2, and the second driving module 6 is used to drive the workbench 2 to move along the second direction. In this embodiment, the second driving module 6 can drive the workbench 2 to move through a motor, a screw and other structures, and the second direction is perpendicular to the first direction. In this embodiment, the second direction is preferably the Y direction.

[0029] In one embodiment, a third driving module 7 is further included, and the third driving module 7 is mounted on the mounting plate 3. Each galvanometer scanning assembly 4 is connected to a third driving module 7, and the third driving module 7 is used to drive the galvanometer scanning assembly 4 to move along a third direction. In this embodiment, the third driving module 7 can drive the galvanometer scanning assembly 4 to move through a motor, a screw and other structures, and the third direction is perpendicular to the plane where the first direction and the second direction are located. The third direction is preferably the Z direction.

[0030] In one embodiment, it also includes multiple lasers, which are arranged on the beam 12. The wavelengths of the laser beams emitted by the multiple lasers are different. Each galvanometer scanning assembly 4 is connected to a laser. By setting different lasers, more than two processes can be completed on one machine at the same time, reducing the problem of increased alignment errors caused by using different equipment for multiple processes.

[0031] In one embodiment, a focusing assembly is further included, and the focusing assembly is suitable for focusing the laser beam of the laser, and a focusing assembly is provided on each galvanometer scanning assembly 4. In this embodiment, the focusing assembly includes a focusing mirror, and the function of the focusing mirror is to focus the laser on the entire workpiece marking plane. In this embodiment, the number of workbenches 2 is preferably one, and the number of galvanometer scanning assemblies 4 on the workbench 2 is preferably two.

[0032] In one embodiment, a visual positioning component 8 is further included, and the visual positioning component 8 is used to locate the workpiece to be processed on the workbench 2, and the visual positioning component 8 is arranged on the mounting plate 3. In this embodiment, the visual positioning component 8 includes a CCD camera, and the workpiece to be processed on the workbench 2 can be located, identified, and detected by the CCD camera. In this embodiment, the first direction is the X direction, and the second direction is the Y direction. One device in this embodiment shares an XY coordinate system, and by sharing a CCD camera, the overlap of multiple laser processing systems (lasers) is high, which can reduce the alignment error caused by multiple alignments of multiple devices.

[0033] In one embodiment, the galvanometer scanning assembly 4 includes a first galvanometer mechanism, a second galvanometer mechanism and a galvanometer mounting seat, and the first galvanometer mechanism and the second galvanometer mechanism are mounted on the galvanometer mounting seat.

[0034] In one embodiment, the first galvanometer mechanism includes a first motor and a first galvanometer connected to the output shaft of the first motor; the second galvanometer mechanism includes a second motor and a second galvanometer connected to the output shaft of the second motor; a cavity is defined inside the galvanometer mounting seat, and the cavity is defined with a first mounting hole for mounting the first motor, a second mounting hole for mounting the second motor, a laser input hole for inputting laser, and a laser output hole for outputting laser; the first galvanometer extends from the first mounting hole into the cavity, and the second galvanometer extends from the second mounting hole into the cavity; the laser enters the cavity from the laser input hole, is refracted by the first galvanometer and the second galvanometer, and is output from the laser output hole.

[0035] In one embodiment, a fourth driving module is further included. The fourth driving module is installed on the bed 11. The fourth driving module is connected to the side of the second driving module 6 away from the workbench 2, and is used to drive the second driving module 6 to move along the first direction. By setting the fourth driving module, the flexibility of laser processing of the workpiece is further enhanced.

[0036] According to the laser processing mechanism of this embodiment, a plurality of galvanometer scanning assemblies 4 are arranged on the workbench 2, and each galvanometer scanning assembly processes the workpiece to be processed on the workbench 2 by deflecting the laser beam emitted by the laser. When the workpiece to be processed requires multiple laser processing procedures, the present application enables each galvanometer scanning assembly to deflect a laser beam of a wavelength, and different galvanometer scanning assemblies deflect laser beams of different wavelengths, so that different galvanometer scanning assemblies 4 of the present application have different processing performances. At the same time, the plurality of galvanometer scanning assemblies 4 of the present application are installed on the same mounting plate 3, and the plurality of galvanometer scanning assemblies 4 are driven to move in the first direction by a driving device (first driving module 5), so that the same galvanometer scanning assembly 4 can be at different positions on the workpiece to be processed, and different galvanometer scanning assemblies 4 can be at the same position. At the same time, the plurality of galvanometer scanning assemblies 4 are installed on the same mounting plate 3, and during the processing, the plurality of galvanometer scanning assemblies 4 are spaced apart from each other in the first direction, and the spacing distance remains unchanged, so that interference between different galvanometer scanning assemblies 4 can be avoided. In this embodiment, a plurality of processing steps of the workpiece to be processed can be completed by one device, so that the processing mechanism of this embodiment integrates the functions of multiple devices, thereby reducing the defects and efficiency loss caused by the process flow. The workpiece to be processed in this embodiment can be a PCB board or other workpieces.

[0037] In addition, an embodiment of the present invention provides a laser processing device, which is used to process HDI boards, carrier-like boards and carrier boards, and includes the laser processing mechanism of the above embodiment.

[0038] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A laser processing mechanism, characterized in that: It includes a frame, a workbench, a mounting plate, a first driving module and a laser processing assembly, wherein the frame includes a bed and a crossbeam, and the crossbeam is mounted on the bed; The workbench is arranged on the bed, and the laser processing assembly includes a plurality of galvanometer scanning assemblies, and the galvanometer scanning assemblies are suitable for deflecting the laser beam emitted by the laser to process the workpiece to be processed on the workbench; A plurality of the galvanometer scanning assemblies are arranged on the mounting plate at intervals along a first direction, and the mounting plate is arranged on the crossbeam, so that the plurality of the galvanometer scanning assemblies are suspended above the workbench; The first driving module is connected to the mounting plate and is used for driving the mounting plate to move along a first direction.

2. The laser processing mechanism according to claim 1, characterized in that: It also includes a second driving module, which is mounted on the bed and connected to the workbench, and is used to drive the workbench to move along a second direction, and the second direction is perpendicular to the first direction.

3. The laser processing mechanism according to claim 2, characterized in that: It also includes a third driving module, which is installed on the mounting plate. Each galvanometer scanning assembly is connected to a third driving module, and the third driving module is used to drive the galvanometer scanning assembly to move along a third direction, which is perpendicular to the plane where the first direction and the second direction are located.

4. The laser processing mechanism according to claim 1, characterized in that: It also includes a plurality of lasers, which are arranged on the crossbeam, the wavelengths of laser beams emitted by the plurality of lasers are different from each other, and each of the galvanometer scanning components is connected to one of the lasers.

5. The laser processing mechanism according to claim 1, characterized in that: It also includes a focusing component, which is suitable for focusing the laser beam of the laser, and each of the galvanometer scanning components is provided with a focusing component.

6. The laser processing mechanism according to claim 1, characterized in that: It also includes a visual positioning component, which is used to position the workpiece to be processed on the workbench and is arranged on the mounting plate.

7. The laser processing mechanism according to claim 1, characterized in that: The galvanometer scanning assembly comprises a first galvanometer mechanism, a second galvanometer mechanism and a galvanometer mounting seat, and the first galvanometer mechanism and the second galvanometer mechanism are mounted on the galvanometer mounting seat.

8. The laser processing mechanism according to claim 7, characterized in that: The first galvanometer mechanism includes a first motor and a first galvanometer connected to the output shaft of the first motor; the second galvanometer mechanism includes a second motor and a second galvanometer connected to the output shaft of the second motor; A cavity is provided inside the galvanometer mounting seat, and the cavity is provided with a first mounting hole for mounting the first motor, a second mounting hole for mounting the second motor, a laser input hole for inputting laser light, and a laser output hole for outputting laser light; The first galvanometer extends from the first mounting hole into the cavity, and the second galvanometer extends from the second mounting hole into the cavity; the laser enters the cavity from the laser input hole, is refracted by the first galvanometer and the second galvanometer, and is output from the laser output hole.

9. The laser processing mechanism according to claim 2, characterized in that: It also includes a fourth driving module, which is mounted on the bed and connected to a side of the second driving module away from the workbench, and is used to drive the second driving module to move along the first direction.

10. A laser processing device, used for processing HDI boards, carrier-like boards and carrier boards, characterized in that: A laser processing mechanism comprising any one of claims 1-9.

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