Heat dissipation device and light source module

Abstract

The utility model relates to the technical field of heat dissipation of photoelectric devices, and provides a heat dissipation device and a light source module. The heat dissipation device comprises an air guide module, a heat conduction piece, a fin heat dissipation module, a plurality of heat pipes and a fan module. The air guide module is provided with a heat dissipation cavity, an air inlet and an air outlet, the fan module is used for driving airflow to sequentially pass through the air inlet, the heat dissipation cavity and the air outlet; a plurality of first mounting grooves are formed in the surface of one side of the heat conduction piece, the first mounting grooves are distributed at intervals in the first direction, the fin heat dissipation module is mounted in the heat dissipation cavity, and the fin heat dissipation module is provided with a plurality of second mounting grooves; one end of the heat pipe is installed in the first installation groove, and the other end of the heat pipe is installed in the second installation groove. The interval between every two adjacent first installation grooves is smaller than the height of each first installation groove, so that more first installation grooves are formed in the same surface area, the number and density of the heat pipes are increased, the heat conduction capacity is improved, and the heat dissipation requirements of high power density and high power are met.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation of optoelectronic devices, in particular to a heat dissipation device and a light source module. Background Art

[0002] With the booming development of the electronics industry, electronic products require miniaturized design and high power density. Traditional radiators suitable for high power density and high power use water cooling, which has high costs, poor safety and complex structure. Utility Model Content

[0003] The utility model aims to provide a heat dissipation device and a light source module, aiming to solve the technical problems of poor safety and complex structure of the existing heat sink.

[0004] In a first aspect, the present application provides a heat dissipation device, the heat dissipation device comprising:

[0005] An air guide module, the air guide module having a heat dissipation cavity, and an air inlet and an air outlet communicated with the heat dissipation cavity;

[0006] A heat conducting member, the heat conducting member being installed on the air guiding module;

[0007] A fin heat dissipation module, wherein the fin heat dissipation module is installed in the heat dissipation cavity;

[0008] A plurality of heat pipes, one end of each heat pipe is mounted on the heat conducting member, in the end section of each heat pipe located on the heat conducting member, the width of each heat pipe is smaller than the height of each heat pipe, and the other end of each heat pipe is mounted on the fin heat dissipation module;

[0009] A fan module is installed on the air guide module, and is used to drive the air flow to pass through the air inlet, the heat dissipation cavity and the air outlet in sequence.

[0010] In one of the embodiments, a distance between two adjacent heat pipes on the heat conducting member is smaller than a distance between two adjacent heat pipes on the fin heat dissipation module.

[0011] In one embodiment, the heat conducting member has a plurality of first mounting grooves located in the heat dissipation cavity, the plurality of first mounting grooves are spaced apart along a first direction, and a spacing between two adjacent first mounting grooves is smaller than a height of the first mounting grooves.

[0012] In one embodiment, the width of the first installation groove is 20% to 50% of the height of the first installation groove.

[0013] In one of the embodiments, a partition plate is disposed on the surface of the heat conducting member to separate two adjacent first mounting grooves, and the thickness of the partition plate is 10% to 40% of the height of the first mounting groove.

[0014] In one of the embodiments, the width of the heat pipe in the first mounting groove is 90% to 110% of the width of the first mounting groove.

[0015] In one of the embodiments, the first mounting groove has an open side away from the surface of the heat conducting member, and the height of the heat pipe in the first mounting groove is 90% to 130% of the height of the first mounting groove.

[0016] In one embodiment, each of the first mounting grooves is installed with the heat pipe.

[0017] In one embodiment, the first mounting groove extends along a second direction, and the second direction is different from the first direction.

[0018] In one embodiment, the heat pipes are respectively installed at two ends of each of the first installation grooves in the second direction.

[0019] In one of the embodiments, a first installation interval is provided between two heat pipes located in the same first installation groove.

[0020] In one of the embodiments, the first mounting space is filled with a heat dissipating agent.

[0021] In one embodiment, the first installation interval is less than or equal to the height of the first installation groove.

[0022] In one embodiment, the first installation interval is greater than or equal to a width of the first installation groove.

[0023] In one embodiment, both ends of the first mounting groove in the second direction are open.

[0024] In one embodiment, the fin heat dissipation module has a plurality of second mounting grooves, and the heat pipes are installed in the second mounting grooves.

[0025] In one embodiment, each of the second mounting grooves is installed with the heat pipe.

[0026] In one embodiment, a distance between two adjacent second mounting grooves is greater than a height of the second mounting grooves.

[0027] In one embodiment, the interval between two adjacent second installation grooves is 2 to 6 times the interval between two adjacent first installation grooves.

[0028] In one embodiment, the width of the second mounting groove is 20% to 50% of the height of the second mounting groove.

[0029] In one embodiment, a plurality of the second mounting grooves are distributed at intervals along the first direction.

[0030] In one embodiment, the heat pipe includes a first straight segment, a second straight segment and a bent segment, the first straight segment is installed on the heat conductor, the second straight segment is installed on the fin heat dissipation module, and the two ends of the bent segment are respectively connected to the first straight segment and the second straight segment.

[0031] In one of the embodiments, in the length direction of the heat pipe, the width of the heat pipe is smaller than the height of the heat pipe.

[0032] In one of the embodiments, the heat conducting member, the fin heat dissipation module and the fan module are arranged in sequence along the third direction.

[0033] In one of the embodiments, the air inlet is located on a side of the air guide module away from the heat conductive member, and the air outlet is located on a side of the air guide module close to the heat conductive member.

[0034] In a second aspect, the present application provides a light source module, comprising a light source module and any one of the above-mentioned heat dissipation devices, wherein the light source module is installed on a side of the heat conductive member away from the heat pipe.

[0035] The heat dissipation device and light source module provided by the utility model have the following beneficial effects: the heat conducting member is used to absorb heat, the two ends of the heat pipe are respectively installed on the heat conducting member and the fin heat dissipation module, the heat pipe transfers the heat of the heat conducting member to the fin heat dissipation module, the fan module drives the external air flow to flow into the heat dissipation cavity of the air guiding module through the air inlet, and flows out of the heat dissipation cavity through the air outlet, taking away the heat of the fin heat dissipation module located in the heat dissipation cavity, thereby realizing the heat dissipation and cooling of the heat conducting member; the heat pipe is installed in the end section of the heat conducting member, the width of the heat pipe is smaller than the height of the heat pipe, and the height space of the heat conducting member is fully utilized, the number and density of the heat pipes are increased on the same surface area, and the thermal conductivity is improved, which is suitable for high power density and high power heat dissipation scenarios without the need for a complex water cooling system, thereby solving the technical problems of poor safety and complex structure of the existing radiator, thereby simplifying the structure of the heat dissipation device and improving the safety of the heat dissipation device. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0037] Figure 1 A schematic diagram of the structure of a heat dissipation device provided in an embodiment of the utility model;

[0038] Figure 2 for Figure 1 A cross-sectional view of the heat dissipation device along line A-A;

[0039] Figure 3 for Figure 2 A local enlarged view of point A in FIG.

[0040] Figure 4 A structural schematic diagram of a light source module provided in this application;

[0041] Figure 5 An exploded view of the heat dissipation device provided for this application;

[0042] Figure 6 A schematic diagram of the structure of multiple heat pipes of the heat dissipation device provided by the present application;

[0043] Figure 7 A schematic diagram of the structure of a single heat pipe of the heat dissipation device provided in this application;

[0044] Figure 8 This is another structural schematic diagram of the light source module provided in this application.

[0045] Among them, the reference numerals in the figure are:

[0046] X, first direction; Y, second direction; Z, third direction;

[0047] 10. Light source module; 20. Lampshade;

[0048] 100, air guide module; 101, heat dissipation cavity; 102, air inlet; 103, air outlet;

[0049] 200, heat conducting member; 201, first mounting groove; 202, partition;

[0050] 300, fin heat dissipation module; 301, second mounting slot;

[0051] 400, heat pipe; 410, first straight segment; 420, second straight segment; 430, bending segment;

[0052] 500. Fan module. DETAILED DESCRIPTION

[0053] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0054] Reference throughout the specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present application. Thus, when the phrases "in one embodiment" or "in some embodiments" appear in various places throughout the specification, not all references are to the same embodiment. Furthermore, in one or more embodiments, the particular features, structures, or characteristics may be combined in any suitable manner.

[0055] In the description of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0056] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features.

[0057] Embodiment 1

[0058] Combination Figures 1 to 3 The present application provides a heat dissipation device, including an air guide module 100, a heat conductive member 200, a fin heat dissipation module 300, a heat pipe 400 and a fan module 500. The air guide module 100 has a heat dissipation cavity 101, and an air inlet 102 and an air outlet 103 connected to the heat dissipation cavity 101. The heat conductive member 200 is installed on the air guide module 100. The fin heat dissipation module 300 is installed in the heat dissipation cavity 101. There are multiple heat pipes 400. One end of the heat pipe 400 is installed on the heat conductive member 200, and the other end of the heat pipe 400 is installed on the fin heat dissipation module 300. In combination Figure 7, in the end section of the heat pipe 400 located at the heat conductive element 200, the width i of the heat pipe 400 is less than the height j of the heat pipe 400. The end section of the heat pipe 400 refers to the cross section perpendicular to the length direction of the heat pipe 400. At this time, the height direction of the heat pipe 400 refers to the thickness direction of the heat conductive element 200, which can be referred to as the third direction Z in the figure, and the width direction of the heat pipe 400 can be referred to as the first direction X in the figure. The fan module 500 is installed on the air guide module 100, and the fan module 500 is used to drive the airflow to pass through the air inlet 102, the heat dissipation cavity 101 and the air outlet 103 in sequence.

[0059] Among them, the heat conductor 200 is used to absorb heat, and the two ends of the heat pipe 400 are respectively installed on the heat conductor 200 and the fin heat dissipation module 300. The heat pipe 400 is usually filled with a working medium under a certain pressure, and the working medium undergoes a corresponding phase change process as the temperature changes, thereby realizing the transfer of heat. The working medium absorbs heat at the heat conductor 200 and evaporates into a gaseous state, and then condenses into a liquid at the fin heat dissipation module 300 to release heat, and circulates continuously, thereby transferring heat from the heat conductor 200 to the fin heat dissipation module 300. The fan module 500 drives the external air flow to flow into the heat dissipation cavity 101 of the air guide module 100 through the air inlet 102, and flows out of the heat dissipation cavity 101 through the air outlet 103, preventing the air path from short-circuiting, taking away the heat of the fin heat dissipation module 300 located in the heat dissipation cavity 101, and realizing the heat dissipation and cooling of the heat conductor 200.

[0060] If the heat dissipation device adopts a combined heat dissipation method of heat conducting element 200, heat pipe 400 and fins, the width i of heat pipe 400 is equal to the height j of heat pipe 400, and the heat conduction capacity of the heat dissipation device is mainly limited by the surface area of ​​heat conducting element 200. For high-power products, such as products with a power greater than 1000W, heat conducting element 200 needs to be specially processed, and the price is high and the volume is large. If a water cooling solution is adopted, the heat dissipation device has a complex structure and low safety.

[0061] In this application, combined Figure 3 In the end section of the heat pipe 400 located at the heat conductive member 200, the width i of the heat pipe 400 is smaller than the height j of the heat pipe 400, which makes full use of the height space of the heat conductive member 200, increases the number and density of the heat pipes 400 on the same surface area, and improves the thermal conductivity. It is suitable for high power density and high power heat dissipation scenarios without the need for a complex water cooling system, and the heat conductive member 200 does not need to increase the surface area, which simplifies the structure of the heat dissipation device, improves the safety of the heat dissipation device, and is conducive to the miniaturization design of the heat dissipation device.

[0062] In some embodiments, in combination Figure 4, a heating module is installed on the side of the heat conductor 200 away from the heat pipe 400. The heating module can be a light source, a chip or a sensor, etc., which is not limited here. The heating module and the heat pipe 400 directly contact the opposite sides of the heat conductor 200 respectively, shortening the heat conduction distance, realizing rapid conduction and rapid dissipation of heat, and helping to improve the thermal conductivity efficiency. It can be understood that in other embodiments, the heat conductor 200 may not be in direct contact with the heating module. For example, the heat conductor 200 realizes heat transfer of the heating module through a heat conductive block or air, thereby realizing heat dissipation, which is not limited here.

[0063] In some embodiments, in combination Figure 2 and Figure 3 The heat conducting member 200 has a plurality of first mounting grooves 201 located in the heat dissipation cavity 101, and the plurality of first mounting grooves 201 are spaced apart along the first direction X, and the interval between two adjacent first mounting grooves 201 is less than the height of the first mounting groove 201. The interval a between two adjacent first mounting grooves 201 refers to the distance between the center positions of two adjacent first mounting grooves 201 in the first direction X. The interval a between two adjacent first mounting grooves 201 is less than the height b of the first mounting groove 201, that is, a<b. The aspect ratio of the first mounting groove 201 is adapted to the aspect ratio of the heat pipe 400, which is conducive to the stable installation of the heat pipe 400 on the heat conducting member 200, and the first mounting groove 201 makes full use of the height space, and increases the number and density of the first mounting grooves 201 on the same surface area of ​​the heat conducting member 200, which is conducive to increasing the number and density of the heat pipe 400 and improving the heat conduction power.

[0064] In some embodiments, in the projection along the height of the first mounting groove 201, the projection of the first mounting groove 201 overlaps with the projection of the heating module, which may be partially overlapped or completely overlapped, which is conducive to shortening the heat conduction path between the heating module and the heat pipe 400, and realizing rapid conduction and rapid dissipation of heat. It can be understood that in other embodiments, in the projection along the height of the first mounting groove 201, the projection of the first mounting groove 201 does not overlap with the projection of the heating module, and the heat of the heating module can still be conducted to the heat pipe 400 in contact therewith through the heat conductive member 200, and then the heat is transferred to the fin heat dissipation module 300.

[0065] Specifically, in the projection along the height of the first installation groove 201 , the projection of the first installation groove 201 covers the projection of the heating module, so that all the heating modules can conduct heat with the heat pipe 400 nearby, achieving rapid conduction and rapid dissipation of heat.

[0066] Optionally, the projection area of ​​the first mounting groove 201 is 100% to 150% of the projection area of ​​the heating module. On the one hand, it ensures that the first mounting groove 201 can cover the heating module to avoid that the uncovered heating module part is not heated in time and the temperature is locally high. On the other hand, it avoids that the setting area of ​​the first mounting groove 201 is too large, which leads to excessive processing of the first mounting groove 201 and excessive volume of the heat conducting component 200.

[0067] In some embodiments, in combination Figure 2 The heat conducting member 200 is a heat conducting substrate, and the first mounting groove 201 is disposed on one side of the heat conducting member 200 in the thickness direction, which is conducive to shortening the heat conducting path and realizing rapid heat conduction and rapid heat dissipation. Specifically, the heat conducting member 200 is a heat conducting copper plate, a heat conducting aluminum plate, a heat conducting steel plate, or a heat conducting graphite plate, which is not limited here.

[0068] In some embodiments, in combination Figure 2 A plurality of first mounting grooves 201 are located in the heat dissipation cavity 101. On the one hand, the external structure is prevented from interfering with the heat conduction of the first mounting grooves 201 and protecting the heat pipes 400 installed in the first mounting grooves 201. On the other hand, the fan module 500 drives the airflow to take away the heat in the heat dissipation cavity 101, which is beneficial to directly dissipate the heat of the first mounting grooves 201 and the heat pipes 400 located in the heat dissipation cavity 101.

[0069] In some embodiments, in combination Figure 3 , the width c of the first mounting groove 201 is 20% to 50% of the height b of the first mounting groove 201, that is, c = (20% to 50%) * b. Based on this, the width-to-height ratio of the first mounting groove 201 is between 20% and 50%, which prevents the first mounting groove 201 from being too narrow, which makes the processing of the first mounting groove 201 and the heat pipe 400 difficult, and also prevents the first mounting groove 201 from being too wide, which causes the number of the first mounting grooves 201 to increase insignificantly, thereby preventing the heat conduction capacity and heat dissipation capacity of the heat dissipation device from being improved insignificantly, and at the same time, the height space can be fully utilized to increase the heat conduction contact area to improve the heat conduction capacity.

[0070] Optionally, the width c of the first installation groove 201 is 20%, 30%, 35%, 40% or 50% of the height b of the first installation groove 201 .

[0071] In some embodiments, in combination Figure 3 The surface of the heat conductive member 200 is provided with a partition 202 separating two adjacent first mounting grooves 201. The partition 202 can support the heat pipe 400 to ensure the stability of the position of the heat pipe 400, while enhancing the heat exchange with the heat pipe 400 to quickly reduce the temperature of the heat conductive member 200.

[0072] In addition, the provision of the partition 202 avoids directly grooving on the surface of the heat conductive member 200. On the one hand, this can avoid reducing the structural strength of the heat conductive member 200. On the other hand, the heat conductive member 200 can be designed to be as thin as possible, and can be much smaller than the height b of the first mounting groove 201, which is beneficial to shortening the heat conduction distance and facilitating the lightweight and miniaturized design of the heat dissipation device.

[0073] Specifically, the thickness d of the partition 202 is 10% to 40% of the height b of the first mounting groove 201, that is, d = (10% to 40%) * b. Based on this, the thickness d of the partition 202 is controlled within a reasonable ratio range to avoid the thickness d being too thin relative to the height b and being easily deformed or broken, reducing the heat crosstalk between adjacent heat pipes 400, and also to avoid the thickness d being too thick relative to the height b and occupying too much surface area of ​​the heat conducting member 200, thereby causing the number of first mounting grooves 201 to increase insignificantly.

[0074] Optionally, the thickness d of the partition 202 is 10%, 20%, 25%, 30% or 40% of the height b of the first installation groove 201 , which is not specifically limited herein.

[0075] Among them, the interval a between two adjacent first mounting grooves 201 is equal to the sum of the width c of the first mounting groove 201 and the thickness d of the partition 202, that is, a=c+d. The heat dissipation device can achieve that the interval a between two adjacent first mounting grooves 201 is smaller than the height b of the first mounting groove 201 by reducing the width c of the first mounting groove 201 and / or the thickness d of the partition 202. In some embodiments, in order to ensure the processability of the groove processing and the processing of the heat pipe 400, the thickness d of the partition 202 is reduced to ensure that the width c of the first mounting groove 201 has a larger value. For example, the thickness d of the partition 202 is 10% to 30% of the height b of the first mounting groove 201, and the width c of the first mounting groove 201 is 40% to 60% of the height b of the first mounting groove 201. In other embodiments, in order to increase the number of the first mounting grooves 201 and the heat pipes 400 to improve the heat conduction power and ensure the structural strength of the partition 202, the width c of the first mounting groove 201 can be reduced, while ensuring that the thickness d of the partition 202 has a larger value. For example, the thickness d of the partition 202 is 20% to 40% of the height b of the first mounting groove 201, and the width c of the first mounting groove 201 is 20% to 30% of the height b of the first mounting groove 201.

[0076] In one embodiment, a heat conductive block is provided on one side surface of the heat conductive member 200, and a first mounting groove 201 is formed by slotting the heat conductive block, and a partition 202 is formed on the unslotted portion. In another embodiment, a plurality of partitions 202 arranged at intervals are integrally formed on one side surface of the heat conductive member 200, for example, the heat conductive member 200 and the partition 202 are integrally cast, 3D printed, or integrally stamped. The intervals between the partitions 202 form the first mounting groove 201. It is understood that in other embodiments, the partition 202 can also be manufactured separately from the heat conductive member 200, and then separately connected, for example, by snap-on, bonding, welding, fastener connection, etc., which is not specifically limited here.

[0077] In some embodiments, in combination Figure 5 , the first mounting groove 201 extends along the second direction Y, which is different from the first direction X. The first mounting groove 201 extends in the second direction Y, which is the length direction of the first mounting groove 201, to achieve multi-dimensional heat dissipation in the first direction X and the second direction Y, while increasing the length of the first mounting groove 201, thereby increasing the heat conduction area between the groove wall of the first mounting groove 201 and the end of the heat pipe 400, increasing the heat transfer efficiency, and facilitating more uniform absorption and transfer of heat, thereby avoiding local overheating.

[0078] Specifically, the angle between the first direction X and the second direction Y is 60° to 120°. Optionally, the angle between the first direction X and the second direction Y is 60°, 80°, 90°, 100° or 120°.

[0079] In some embodiments, in combination Figure 5 Each first mounting groove 201 is respectively installed with a heat pipe 400 at both ends in the second direction Y, thereby increasing the number of heat pipes 400, increasing the heat conduction area and heat conduction power, improving the efficiency of heat transfer, and accelerating the heat dissipation speed, which is beneficial for heat to be transferred and dissipated from the middle of the second direction Y with a high temperature to the two ends of the second direction Y with a low temperature at the same time, thereby achieving a more uniform heat distribution.

[0080] In one embodiment, in combination Figure 5 and Figure 6 There is a first installation interval m between the two heat pipes 400 located in the same first installation groove 201, which can effectively prevent heat crosstalk between the two heat pipes 400, reduce the possibility of vibration and interference, and is conducive to controlling and optimizing the heat conduction path to ensure uniformity of heat conduction.

[0081] In one embodiment, in combination Figure 5 and Figure 6The first installation interval m is filled with a heat sink. The heat sink has a higher thermal conductivity than air and can bear a higher power density, which is beneficial for accelerating the heat transfer in the first installation interval 401 to the outside and reducing the risk of local overheating.

[0082] In one embodiment, in combination Figure 3 and Figure 6 The first installation interval m is less than or equal to the height b of the first installation groove 201. On the one hand, it avoids the first installation interval m being too large to cause local overheating at the first installation interval m. On the other hand, the heat pipe 400 is fully installed in the first installation groove 201, reducing unnecessary space waste and increasing the heat conduction area between the heat pipe 400 and the first installation groove 201.

[0083] In one embodiment, in combination Figure 3 and Figure 6 The first installation interval m is greater than or equal to the width c of the first installation groove 201, which reduces the heat crosstalk and mutual interference between the two heat pipes 400 located in the same first installation groove 201, reduces the thermal disturbance between the heat pipes 400, reduces the temperature gradient, and increases the stability and reliability of the system.

[0084] In some embodiments, in combination Figure 3 The first mounting groove 201 is open at both ends in the second direction Y, so that the heat pipe 400 can be installed in the first mounting groove 201 along the second direction Y, thereby increasing the length of the first mounting groove 201 and the heat conduction area between the first mounting groove 201 and the heat pipe 400, thereby improving the heat conduction capacity.

[0085] In one embodiment, in combination Figure 3 and Figure 7 , the width i of the heat pipe 400 located in the first mounting groove 201 is 90% to 110% of the width c of the first mounting groove 201, that is, i = (90% to 110%) * c. The width i of the heat pipe 400 is adapted to the width c of the first mounting groove 201, so that the heat pipe 400 is installed in the first mounting groove 201 with a clearance fit, a just fit, or an interference fit, which prevents the heat pipe 400 from loosening or swinging during operation, and makes the contact between the heat pipe 400 and the first mounting groove 201 tighter and the contact area larger, which is conducive to improving the heat transfer efficiency and stability.

[0086] In one embodiment, the first mounting groove 201 is open on one side of the surface away from the heat conducting member 200, which helps to reduce the difficulty of processing the first mounting groove 201 and facilitates the heat pipe 400 to be installed into the first mounting groove 201 from the open part. The open design can promote air circulation, increase ventilation, facilitate rapid heat dissipation, and improve heat dissipation efficiency.

[0087] Specifically, combined Figure 3 and Figure 7 , the height j of the heat pipe 400 located in the first mounting groove 201 is 90% to 130% of the height b of the first mounting groove 201, that is, j = (90% to 130%) * b. The height j of the heat pipe 400 is adapted to the height b of the first mounting groove 201, making full use of the height space, increasing the contact area between the heat pipe 400 and the first mounting groove 201, and improving the heat transfer efficiency and stability.

[0088] In some embodiments, each first mounting slot 201 is equipped with a heat pipe 400 to avoid the first mounting slot 201 being idle, increase the heat conduction area, and use the heat pipe 400 as much as possible, so that heat can be evenly transferred and dissipated from multiple first mounting slots 201, avoid local overheating or insufficient cooling, increase heat conduction power, and enhance heat dissipation effect. In addition, installing a heat pipe 400 in each first mounting slot 201 can increase the redundancy of the system. When a heat pipe 400 has a problem, other heat pipes 400 can still continue to work to ensure normal heat dissipation.

[0089] Optionally, one, two, or more than two heat pipes 400 may be installed in each first installation slot 201 , which is not limited here.

[0090] In some embodiments, in combination Figure 2 and Figure 3 The fin heat dissipation module 300 has a plurality of second mounting grooves 301, and the heat pipe 400 is mounted in the second mounting grooves 301. The provision of the second mounting grooves 301 is conducive to improving the installation stability of the heat pipe 400 on the fin heat dissipation module 300.

[0091] In some embodiments, in combination Figure 3 , the interval e between two adjacent second mounting grooves 301 is greater than the height f of the second mounting grooves 301, that is, e>f. Based on this, by increasing the interval e between two adjacent second mounting grooves 301, thermal crosstalk between the second mounting grooves 301 is avoided, and it is also beneficial to expand the dispersion of the heat pipe 400 in the second mounting groove 301. The large interval design helps to improve heat distribution and air circulation, enhance the overall heat dissipation effect, take away the heat of the fin heat dissipation module 300, and reduce the occurrence of problems such as heat accumulation and heat dissipation obstruction.

[0092] In some embodiments, in combination Figure 3 , the interval e between two adjacent second mounting grooves 301 is 2 to 6 times the interval a between two adjacent first mounting grooves 201, that is, e = (2 to 6) * a. On the one hand, the smaller the interval a, the more heat pipes 400 can be arranged on the same surface area of ​​the heat conducting member 200, thereby improving the heat conduction efficiency. On the other hand, by enlarging the interval e, the heat pipes 400 can be cooled quickly in the second mounting grooves 301, thereby improving the overall heat dissipation efficiency.

[0093] Optionally, the interval e between two adjacent second mounting grooves 301 is 2 times, 3 times, 4 times, 5 times or 6 times the interval a between two adjacent first mounting grooves 201. If the interval e is less than 2 times the interval a, the density distribution at both ends of the heat pipe 400 is roughly the same, and the heat pipe 400 can absorb heat with high power in the first mounting groove 201, but the air heat dissipation area in the second mounting groove 301 is not large, and the heat dissipation rate is not high, which is not conducive to the rapid cooling of the heat conductor 200. If the interval e is greater than 6 times the interval a, the temperature of the heat conductor 200 has been reduced to a reasonable temperature range. An excessively large interval e has little effect on the cooling of the heat conductor 200, and will cause the volume of the fin heat dissipation module 300 and the heat dissipation device to be too large, which is not conducive to the miniaturization design of the heat dissipation device.

[0094] In some embodiments, in combination Figure 3 , the shortest distance h between two adjacent second mounting grooves 301 is 1 to 5 times the height f of the second mounting groove 301. The shortest distance h has a larger value, thereby avoiding thermal crosstalk between the heat pipes 400 in the two adjacent second mounting grooves 301. At the same time, the air heat dissipation space corresponding to each second mounting groove 301 is large, and the density of the second mounting groove 301 is small, which is conducive to the rapid cooling of the fin heat dissipation module 300 by air. When the shortest distance h is less than the height f, the density of the second mounting groove 301 is large, which is not conducive to the rapid cooling of the fin heat dissipation module 300. When the shortest distance h is greater than 6 times the height f, the fin heat dissipation module 300 has been cooled rapidly. An excessively large shortest distance h does not significantly cool the fin heat dissipation module 300, and will cause the volume of the fin heat dissipation module 300 and the heat dissipation device to be too large.

[0095] In some embodiments, in combination Figure 3 , the width g of the second mounting groove 301 is 20% to 50% of the height f of the second mounting groove 301, that is, g = (20% to 50%) * f. Based on this, the width-to-height ratio of the second mounting groove 301 is between 20% and 50%, which prevents the second mounting groove 301 from being too narrow, which makes the second mounting groove 301 and the end of the heat pipe 400 difficult to process, and also prevents the second mounting groove 301 from being too wide, which occupies too much surface area of ​​the fin heat dissipation module 300, and prevents the width difference between the two ends of the heat pipe 400 from being too large, which leads to a large amount of processing. At the same time, the height space can be fully utilized to increase the heat conduction contact area to improve the heat dissipation capacity.

[0096] Optionally, the width g of the second mounting groove 301 is 20%, 30%, 35%, 40% or 50% of the height f of the second mounting groove 301 .

[0097] In some embodiments, in combination Figure 5, the plurality of second mounting grooves 301 are spaced apart along the first direction X, so that the heat pipes 400 can be evenly distributed on the fin heat dissipation module 300 to avoid hot spot concentration. At the same time, the plurality of first mounting grooves 201 and the plurality of second mounting grooves 301 are spaced apart along the first direction X, that is, both ends of the plurality of heat pipes 400 are spaced apart along the first direction X, which is conducive to the neat arrangement of the heat conducting member 200, the fin heat dissipation module 300 and the plurality of heat pipes 400, saving space and realizing the miniaturized design of the heat dissipation device.

[0098] In some embodiments, in combination Figure 5 Each second installation groove 301 is respectively installed with a heat pipe 400 at both ends in the second direction Y, thereby increasing the number of installed heat pipes 400, increasing the heat conduction area, improving the efficiency of heat transfer, and accelerating the heat dissipation speed.

[0099] In one embodiment, in combination Figure 5 and Figure 6 There is a second installation interval n between the two heat pipes 400 located in the same second installation groove 301, which can effectively prevent structural interference and heat crosstalk between the two heat pipes 400, reduce the possibility of vibration and interference, and is conducive to controlling and optimizing the heat conduction path to ensure uniformity of thermal conductivity.

[0100] In one embodiment, in combination Figure 5 and Figure 6 , the second installation interval n is filled with a heat sink. The heat sink has a higher thermal conductivity than air and can bear a higher power density, which is beneficial to accelerate the heat transfer outward in the second installation interval n and reduce the risk of local overheating. It can be understood that in other embodiments, the second installation interval n is not filled with a heat sink. Since the temperature of the heat pipe 400 gradually decreases from the end of the second installation groove 301 to the middle of the second installation groove 301, the temperature of the second installation interval n is not high, and the use of the heat sink can be saved.

[0101] In one embodiment, in combination Figure 3 and Figure 6 The second installation interval n is less than or equal to the height f of the second installation groove 301 , so that the heat pipe 400 is fully installed in the second installation groove 301 , reducing unnecessary space waste and increasing the heat conduction area between the heat pipe 400 and the second installation groove 301 .

[0102] In one embodiment, in combination Figure 3 and Figure 6 The second installation interval n is greater than or equal to the width g of the second installation groove 301, which reduces the heat crosstalk and mutual interference between the two heat pipes 400 located in the same second installation groove 301, reduces the thermal disturbance between the heat pipes 400, reduces the temperature gradient, and increases the stability and reliability of the system.

[0103] In one embodiment, in combination Figure 3 and Figure 7 , the width i of the heat pipe 400 located in the second mounting groove 301 is 90% to 110% of the width g of the second mounting groove 301, that is, i = (90% to 110%) * g. The width i of the heat pipe 400 is adapted to the width g of the second mounting groove 301, so that the heat pipe 400 is installed in the second mounting groove 301 with a clearance fit, a just fit, or an interference fit, which prevents the heat pipe 400 from loosening or swinging during operation, and makes the contact between the heat pipe 400 and the second mounting groove 301 tighter and the contact area larger, which is conducive to improving the heat transfer efficiency and stability.

[0104] In one of the embodiments, the second mounting groove 301 is closed at both ends in the height direction, so as to facilitate the position stability of the heat pipe 400 in height, especially to maintain the position stability under fast airflow.

[0105] Specifically, combined Figure 3 and Figure 7 , the height j of the heat pipe 400 located in the second mounting groove 301 is 90% to 110% of the height f of the second mounting groove 301, that is, j = (90% to 110%) * f. The height j of the heat pipe 400 is adapted to the height f of the second mounting groove 301, making full use of the height space, increasing the contact area between the heat pipe 400 and the second mounting groove 301, and improving the heat transfer efficiency and stability.

[0106] In one embodiment, each second mounting slot 301 is installed with a heat pipe 400 to avoid the second mounting slot 301 being idle, increase the heat conduction area, and thereby use the heat pipe 400 as much as possible, increase the heat conduction power, improve the uniformity of heat conduction, and enhance the heat dissipation effect.

[0107] Optionally, one, two or more than two heat pipes 400 may be installed in each second installation slot 301 , which is not limited here.

[0108] In some embodiments, in combination Figure 6 and Figure 7 , the interval between two adjacent heat pipes 400 on the heat conducting member 200 is smaller than the interval between two adjacent heat pipes 400 on the fin heat dissipation module 300. In this way, the heat pipe 400 occupies a small area on the heat conducting member 200 and has a large distribution density, which can adapt to the size of the heating module and improve the heat conduction capacity of the heating module corresponding to the high temperature area. The heat pipe 400 occupies a large area on the fin heat dissipation module 300 and has a small distribution density, which is conducive to expanding the heat dissipation surface area and using a wider size of heat dissipation fins, thereby reducing the height of the heat dissipation fins while meeting the same heat dissipation volume, which is conducive to the thinning design of the fin heat dissipation module 300 and the heat dissipation device, and achieving a better heat dissipation effect.

[0109] In some embodiments, in combination Figure 6 and Figure 7 The heat pipe 400 includes a first straight segment 410, a second straight segment 420 and a bent segment 430. The first straight segment 410 is installed on the heat conductor 200, the second straight segment 420 is installed on the fin heat dissipation module 300, and the two ends of the bent segment 430 are connected to the first straight segment 410 and the second straight segment 420 respectively. Based on this, the design of the straight groove and the straight segment can reduce the processing technology, and the straight segment can facilitate the plane fitting contact, achieve a large contact area, high heat conduction efficiency and uniform heat conduction, which is conducive to improving the heat conduction efficiency. The bent segment 430 has a certain elastic bending through bending, and can flexibly adapt to the installation position of the first straight segment 410 and the second straight segment 420, reducing the processing accuracy requirements and assembly accuracy requirements of the heat conductor 200 and the fin heat dissipation module 300.

[0110] Specifically, the first installation groove 201 and the second installation groove 301 are both straight grooves, the first straight segment 410 is installed in the first installation groove 201, and the second straight segment 420 is installed in the second installation groove 301, which helps to reduce the processing difficulty of the first installation groove 201 and the second installation groove 301.

[0111] In some embodiments, the heat pipe 400 is integrally formed to avoid poor heat conduction caused by connection gaps in the heat pipe 400. Specifically, the first straight section 410, the second straight section 420 and the bent section 430 are integrally formed by bending, which is conducive to improving the assembly consistency and position accuracy of the three, and the heat pipe 400 has good continuity and stable and smooth heat transfer.

[0112] In some embodiments, in combination Figure 5 The heat conducting member 200, the fin heat dissipation module 300 and the fan module 500 are sequentially arranged along the third direction Z, effectively utilizing the space in the third direction Z, thereby making the entire heat dissipation device more compact and reducing the volume of the heat dissipation device. In addition, the heat is transferred along the third direction Z, which is conducive to forming a reasonable temperature gradient, making the air flow smoother, improving the heat conduction efficiency, and enhancing the heat dissipation effect.

[0113] In some embodiments, in combination Figure 1 and Figure 2The air inlet 102 is located on the side of the air guide module 100 away from the heat conductor 200, and the air outlet 103 is located on the side of the air guide module 100 close to the heat conductor 200. The air inlet 102 is located on the side away from the heat conductor 200, so that relatively low-temperature air can be introduced to improve the cooling effect; while the air outlet 103 is located on the side close to the heat conductor 200, so that the heat can be taken out along the direction of the heat pipe 400 to achieve more effective heat dissipation. The arrangement of the positions of the air inlet 102 and the air outlet 103 allows the cooling air to flow through the heat conductor 200 more directly, reducing the internal air flow path and the heat conduction path, reducing the thermal resistance, and improving the heat dissipation efficiency.

[0114] In some embodiments, in combination Figure 2 The plurality of first mounting grooves 201 are located in the heat dissipation cavity 101 , which is beneficial to protecting the first mounting grooves 201 and also beneficial to stable and reliable heat conduction between the first mounting grooves 201 and the heat pipe 400 in the heat dissipation cavity 101 .

[0115] In some embodiments, in combination Figure 1 The air guide module 100 is cylindrical, one end of the air guide module 100 is covered by the heat conductive member 200, the heat conductive member 200 extends to the outside of the air guide module 100, a plurality of first mounting grooves 201 of the heat conductive member 200 are located inside the air guide module 100, and the side of the heat conductive member 200 away from the first mounting groove 201 is located outside the air guide module 100 for mounting the heating module. The end of the air guide module 100 away from the heat conductive member 200 has an air inlet 102, and the air outlet 103 is located on the side of the fin heat dissipation module 300 close to the first mounting groove 201. In this way, the heat dissipation device realizes top air intake and side air outlet, and after the airflow enters the heat dissipation cavity 101 from the air inlet 102, it passes through the fin heat dissipation module 300, takes away the heat, and does not leave the heat dissipation cavity 101 immediately, but continues to flow to the heat pipe 400 and the first mounting groove 201, further reducing the stability of the heat pipe 400 and the first mounting groove 201, and then leaves the heat dissipation cavity 101 from the air outlet 103, thereby achieving a better heat dissipation effect.

[0116] In some embodiments, the fin heat dissipation module 300 includes a plurality of fins, and the plurality of fins are sequentially spaced and distributed. Optionally, each fin has a plurality of second mounting slots 301, so that the heat pipe 400 is passed through and fixed in the second mounting slots 301 of the plurality of fins.

[0117] Embodiment 2

[0118] Combination Figure 4The present application provides a light source module, including a light source module 10 and any heat dissipation device in the first embodiment, wherein the light source module 10 is installed on the side of the heat conductive member 200 away from the heat pipe 400. The light source module 10 generates heat when it is working, and the heat is directly transferred to the heat conductive member 200 connected thereto. The two ends of the heat pipe 400 are respectively installed on the heat conductive member 200 and the fin heat dissipation module 300, so as to transfer the heat from the heat conductive member 200 to the fin heat dissipation module 300. The fan module 500 drives the external air flow to flow into the heat dissipation cavity 101 of the air guide module 100 through the air inlet 102, and flows out of the heat dissipation cavity 101 through the air outlet 103, taking away the heat of the fin heat dissipation module 300 located in the heat dissipation cavity 101, so as to achieve heat dissipation and cooling of the light source module 10. The light source module 10 and the heat pipe 400 are respectively in direct contact with the opposite sides of the heat conductive member 200, so that the heat conduction distance is short, so as to achieve rapid conduction and rapid dissipation of heat, which is conducive to improving the heat conduction efficiency.

[0119] In some embodiments, in combination Figure 8 The light source module further includes a lampshade 20. The lampshade 20 and the light source module 10 are mounted on the same side of the heat conducting member 200. The lampshade 20 surrounds the light source module 10 to reduce the impact of the external environment on the light source module and improve the stability and life of the light source module. The lampshade 20 focuses the light emitted by the light source module 10, reduces the scattering of light, and improves the brightness and uniformity of the lighting.

[0120] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A heat dissipation device, characterized in that: The heat dissipation device comprises: An air guide module (100), the air guide module (100) comprising a heat dissipation cavity (101), and an air inlet (102) and an air outlet (103) communicated with the heat dissipation cavity (101); A heat conducting member (200), the heat conducting member (200) being mounted on the air guiding module (100); A fin heat dissipation module (300), the fin heat dissipation module (300) being installed in the heat dissipation cavity (101); a plurality of heat pipes (400), one end of each heat pipe (400) being mounted on the heat conducting member (200), a width of each heat pipe (400) being smaller than a height of each heat pipe (400) in an end section of each heat conducting member (200), and the other end of each heat pipe (400) being mounted on the fin heat dissipation module (300); A fan module (500), wherein the fan module (500) is installed on the air guide module (100), and the fan module (500) is used to drive the air flow to pass through the air inlet (102), the heat dissipation cavity (101) and the air outlet (103) in sequence.

2. The heat dissipation device according to claim 1, characterized in that: The interval between two adjacent heat pipes (400) on the heat conducting member (200) is smaller than the interval between two adjacent heat pipes (400) on the fin heat dissipation module (300).

3. The heat dissipation device according to claim 1, characterized in that: The heat conducting member (200) has a plurality of first mounting grooves (201) located in the heat dissipation cavity (101), the plurality of first mounting grooves (201) being distributed at intervals along a first direction (X), and the interval between two adjacent first mounting grooves (201) being smaller than the height of the first mounting grooves (201).

4. The heat dissipation device according to claim 3, characterized in that: The heat dissipation device further comprises at least one of the following: The width of the first installation groove (201) is 20% to 50% of the height of the first installation groove (201); A partition (202) is provided on the surface of the heat conducting member (200) for separating two adjacent first mounting grooves (201), and the thickness of the partition (202) is 10% to 40% of the height of the first mounting groove (201); The width of the heat pipe (400) located in the first installation groove (201) is 90% to 110% of the width of the first installation groove (201); The first installation groove (201) is open on one side of the surface away from the heat conducting member (200), and the height of the heat pipe (400) located in the first installation groove (201) is 90% to 130% of the height of the first installation groove (201); Each of the first installation grooves (201) is installed with the heat pipe (400).

5. The heat dissipation device according to claim 3, characterized in that: The first installation groove (201) extends along a second direction (Y), and the second direction (Y) is different from the first direction (X); and the heat pipe (400) is respectively installed at both ends of each first installation groove (201) in the second direction (Y).

6. The heat dissipation device according to claim 5, characterized in that: A first installation interval is provided between two heat pipes (400) located in the same first installation groove (201); The first mounting space is filled with a heat dissipating agent; The first installation interval is less than or equal to the height of the first installation groove (201); The first installation interval is greater than or equal to the width of the first installation groove (201); The first installation groove (201) is open at both ends in the second direction (Y).

7. The heat dissipation device according to claim 1, characterized in that: The fin heat dissipation module (300) has a plurality of second installation slots (301), and the heat pipes (400) are installed in the second installation slots (301).

8. The heat dissipation device according to claim 7, characterized in that: The heat dissipation device further comprises at least one of the following: The interval between two adjacent second mounting grooves (301) is greater than the height of the second mounting groove (301); The width of the second installation groove (301) is 20% to 50% of the height of the second installation groove (301); A plurality of the second installation grooves (301) are distributed at intervals along the first direction (X); Each of the second installation grooves (301) is installed with the heat pipe (400).

9. The heat dissipation device according to claim 1, characterized in that: The heat pipe (400) comprises a first straight segment (410), a second straight segment (420) and a bent segment (430); the first straight segment (410) is installed on the heat conducting member (200), the second straight segment (420) is installed on the fin heat dissipation module (300), and two ends of the bent segment (430) are respectively connected to the first straight segment (410) and the second straight segment (420); And / or, in the length direction of the heat pipe (400), the width of the heat pipe (400) is smaller than the height of the heat pipe (400).

10. The heat dissipation device according to any one of claims 1 to 9, characterized in that: The heat conducting member (200), the fin heat dissipation module (300) and the fan module (500) are arranged in sequence along a third direction (Z); And / or, the air inlet (102) is located on a side of the air guide module (100) away from the heat conductive element (200), and the air outlet (103) is located on a side of the air guide module (100) close to the heat conductive element (200).

11. A light source module, characterized in that: The heat dissipation device comprises a light source module (10) and any one of claims 1 to 10, wherein the light source module (10) is mounted on a side of the heat conducting member (200) facing away from the heat pipe (400).

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