Vibration temperature composite sensor and helicopter tail rotor operating lever bearing monitoring structure

Abstract

The utility model discloses a vibration and temperature composite sensor, which comprises a base, a vibration sensitive assembly and a temperature sensitive device, and is characterized in that the base comprises a base body, and a base upper part and a base lower part which are formed by vertically extending the base body, the vibration sensitive assembly is installed on the base upper part, and the base lower part is of a probe structure; an inner cavity is arranged in the base, the bottom of the inner cavity is close to the lower end of the lower portion of the base, and the temperature sensitive device is placed at the bottom of the inner cavity. The utility model further provides a helicopter tail rotor operating lever bearing monitoring structure, and the vibration and temperature composite sensor is arranged on a bearing seat of the tail rotor operating lever bearing and used for monitoring vibration and temperature signals of the bearing at the same time. Compared with the prior art, the vibration temperature composite sensor and the helicopter tail rotor operating lever bearing monitoring structure can monitor vibration and temperature signals at the same time, and are small in occupied space, convenient to install, simple in structure and convenient to assemble.

Description

Technical Field

[0001] The present application relates to the field of sensor technology, and in particular to a vibration-temperature composite sensor and a helicopter tail rotor joystick bearing monitoring structure. Background Art

[0002] The tail rotor lever is an important component for helicopter maneuvering control, and the operating status of its bearing is directly related to the aircraft's operating safety. However, due to the structural characteristics of the tail rotor lever bearing (the outer ring and guide rod rotate with the tail rotor shaft, and the inner ring does not move), it is difficult to monitor the operating status of the tail rotor lever bearing by installing a sensor on the tail rotor shaft.

[0003] How to simultaneously monitor vibration and temperature signals on such a small space and product is a technical problem that needs to be solved urgently by those skilled in the art. Utility Model Content

[0004] In order to solve the above technical problems, the purpose of the utility model is to provide a vibration-temperature composite sensor and a helicopter tail rotor joystick bearing monitoring structure that can simultaneously monitor vibration and temperature signals.

[0005] The technical solution provided by the utility model is as follows:

[0006] A vibration-temperature composite sensor comprises a base, a vibration-sensitive component, a temperature-sensitive device, a shell, and a connector. The base comprises a base body and a base upper portion and a base lower portion formed by the base body extending upward and downward respectively. The vibration-sensitive component is installed on the base upper portion, and the base lower portion is a probe structure. An inner cavity is provided inside the base, and the bottom of the inner cavity is close to the lower end of the base lower portion. The temperature-sensitive device is placed at the bottom of the inner cavity. The shell and the base body form a storage space for accommodating the vibration-sensitive component. The connector is fixed on the shell, and its pins are connected to the vibration-sensitive component and the temperature-sensitive device respectively through wires to lead out vibration and temperature signals.

[0007] Preferably, the shell includes an outer shell and a cover plate, the outer shell is provided with a base mating hole, a connector mating hole, and a cover plate mating hole, the base body, the connector, and the cover plate are respectively fixed to the hole walls of the base mating hole, the connector mating hole, and the cover plate mating hole to make the accommodating space sealed.

[0008] Preferably, the vibration sensitive component includes a first lead-in plate, a piezoelectric chip, a mass block, and a pre-tightening ring. The first lead-in plate is installed on the outer periphery of the upper part of the base and is insulated from the upper part of the base. The piezoelectric chip is installed on the outside of the first lead-in plate, the mass block is installed on the outside of the piezoelectric chip, and the pre-tightening ring is sleeved on the outer periphery of the mass block. The first lead-in plate, the piezoelectric chip, and the mass block are fixed to the upper part of the base. The first lead-in plate is connected to the pins of the connector through a wire to lead out the charge generated inside the piezoelectric chip.

[0009] Preferably, the upper part of the base is in the shape of a square column and is provided with four assembly surfaces. The first lead-in plate, piezoelectric chip and mass block are all installed along the assembly surfaces. There are four of the first lead-in plate, piezoelectric chip and mass block, and the shapes of the first lead-in plate, piezoelectric chip and mass block match the assembly surface of the upper part of the base.

[0010] Preferably, it further comprises four insulating sheets respectively attached to each assembly surface, wherein the insulating sheets are located between the upper assembly surface of the base and the first current lead sheet, and are used to insulate the first current lead sheet from the upper portion of the base.

[0011] Preferably, an insulating gap is provided between the upper surface of the base body and the first lead-in plate, the piezoelectric chip, the mass block and the pre-tightening ring.

[0012] Preferably, the first current lead-in plates are connected to each other via a connecting portion, wherein any of the first current lead-in plates further comprises a first lead-out portion for leading out the charge generated by the piezoelectric chip.

[0013] Preferably, a through hole is provided in the middle of each of the first current-conducting plates, and a through groove penetrating to the outside is provided below the through hole.

[0014] Preferably, the mass block and the pre-tightening ring are made of conductive materials, and a second lead-in plate is provided between at least one of the piezoelectric chips and the mass block. The second lead-in plate is connected to the pins of the connector through a wire to lead out the charge generated outside the piezoelectric chip.

[0015] Preferably, the inner surface of the mass block is a plane, and the outer surface is an arc surface; the preload ring is annular and is fixed to each mass block by an interference fit sleeve.

[0016] Preferably, the inner cavity inside the base is formed by a blind hole opened downward from the top of the upper part of the base, and a wire connected to the temperature sensitive device extends from the opening of the blind hole.

[0017] Preferably, the lower portion of the base includes an inserting portion located at the bottom thereof for penetrating into the bearing seat.

[0018] Preferably, the lower portion of the base is provided with an external thread above the insertion portion for mounting on the object to be measured.

[0019] A helicopter tail rotor joystick bearing monitoring structure, wherein the tail rotor joystick bearing seat is equipped with the above-mentioned vibration-temperature composite sensor for simultaneously monitoring the vibration and temperature signals of the bearing.

[0020] Compared with the prior art, the vibration-temperature composite sensor and helicopter tail rotor joystick bearing monitoring structure of the utility model, by setting a base, installing a vibration sensitive component on the upper part of the base to monitor the vibration signal, and placing a temperature sensitive device on the lower part of the base to monitor the temperature signal, can monitor the vibration and temperature signals at the same time, and occupies a small space, is easy to install, has a simple structure, and is easy to assemble. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 This is a three-dimensional exploded view of the vibration-temperature composite sensor according to an embodiment of the utility model;

[0023] Figure 2 for Figure 1 A combined cross-sectional view of the vibration-temperature composite sensor shown;

[0024] Figure 3 for Figure 1 A three-dimensional diagram of a base and a vibration sensitive component in the vibration-temperature composite sensor shown;

[0025] Figure 4 for Figure 1 A perspective view of the base in the vibration temperature composite sensor shown;

[0026] Figure 5 for Figure 1 A perspective view of the housing in the vibration-temperature composite sensor shown;

[0027] Figure 6 for Figure 5 A three-dimensional view of the housing from another angle;

[0028] Figure 7 for Figure 1 A three-dimensional diagram of the first lead-in sheet in the vibration-temperature composite sensor shown;

[0029] Figure 8 for Figure 7 A schematic diagram of the first current guide plate in an unfolded state;

[0030] Fig. 9for Figure 1 A three-dimensional diagram of the second lead-in piece in the vibration temperature composite sensor shown;

[0031] Fig.10 for Figure 1 A three-dimensional view of the mass piece in the vibration-temperature composite sensor shown. DETAILED DESCRIPTION

[0032] In order to enable those skilled in the art to better understand the technical solutions in this application, the technical solutions in the embodiments of this application will be clearly and completely described below. Obviously, the described embodiments are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0033] It should be noted that when an element is referred to as being "fixed on" or "set on" another element, it can be directly on the other element or indirectly set on the other element; when an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0034] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0035] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, "multiple" and "several" mean two or more, unless otherwise clearly and specifically defined.

[0036] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the conditions under which this application can be implemented. Therefore, they have no substantive technical significance. Any structural modification, change in proportional relationship or adjustment of size should still fall within the scope of the technical content disclosed in this application without affecting the effects and purposes that can be achieved by this application.

[0037] like Figure 1 , Figure 2 , Figure 3 As shown, the embodiment of the utility model provides a vibration-temperature composite sensor, including a base 1, a vibration sensitive component 2, a temperature sensitive device 3, a housing 4, and a connector 5. The base 1 includes a base body 11 and a base upper portion 12 and a base lower portion 13 formed by the base body 11 extending upward and downward respectively. The vibration sensitive component 2 is installed on the base upper portion 12 to form a piezoelectric second-order system together. The base lower portion 13 is a probe structure. An inner cavity 14 is provided inside the base. The bottom of the inner cavity 14 is close to the lower end of the base lower portion 13. The temperature sensitive device 3 is placed at the bottom of the inner cavity 14.

[0038] like Figures 1 to 4 As shown, in this embodiment, the base body 11 is in the shape of a circular pancake, the upper part 12 of the base is in the shape of a square column, and is provided with four assembly surfaces. The lower part 13 of the base is in the shape of a cylinder, and the bottom is an insertion part 131 for penetrating into the bearing seat, and an external thread 132 for mounting on the object to be measured is provided above the insertion part 131.

[0039] The inner cavity 14 inside the base is formed by a blind hole opened downwardly from the top of the base upper portion 12, and the wire connected to the temperature sensitive device 3 extends out from the blind hole opening. Of course, in other embodiments, the inner cavity can also be set to other shapes and structures.

[0040] In this embodiment, the temperature sensitive device 3 is a PT100 platinum resistor, and its resistance value changes with the change of temperature. Of course, in other embodiments, the temperature sensitive device 3 can be other components.

[0041] like Figure 1 , Figure 2 , Figure 5 , Figure 6 As shown, in this embodiment, the shell 4 and the base body 11 form a storage space for accommodating the vibration sensitive component 2, and the shell 4 protects and seals the internal components. The shell 4 is provided with a base mating hole 41 and a connector mating hole 42, and the base body 11 and the connector 5 are respectively welded and fixed to the hole walls of the base mating hole 41 and the connector mating hole 42 to seal the storage space. Furthermore, in this embodiment, the shell 4 includes an outer shell 43 and a cover plate 44, and the base mating hole 41 and the connector mating hole 42 are located on the outer shell 43. The outer shell 43 is also provided with a cover plate mating hole 45 to cooperate with the cover plate 44, and the cover plate 44 and the outer shell 43 are sealed and fixed by welding (the welding positions of the outer shell and the base, the connector, and the cover plate are at Figure 2 The position indicated by A in the figure).

[0042] like Figure 1 , Figure 2 , Figure 3 as well as Figures 7 to 10As shown, in this embodiment, the vibration sensitive component 2 includes an insulating sheet 21, a first lead sheet 22, a piezoelectric chip 23, a mass block 24, a pre-tightening ring 25, and a second lead sheet 26. The first lead sheet 22 is mounted on the outer periphery of the upper part 12 of the base and is insulated from the upper part 12 of the base by the insulating sheet 21 (other insulation methods may also be used), the piezoelectric chip 23 is mounted on the outer side of the first lead sheet 22, the second lead sheet 26 is mounted on the outer side of the piezoelectric chip 23, the mass block 24 is mounted on the outer side of the piezoelectric chip 23 and the second lead sheet 26, and the pre-tightening ring 25 is sleeved on the outer periphery of the mass block 24 to fix the first lead sheet 22, the piezoelectric chip 23, the second lead sheet 26, and the mass block 24 on the upper part 12 of the base. In this embodiment, the upper part 12 of the base is in the shape of a square column and is provided with four assembly surfaces, and the insulating sheet 21, the first lead sheet 22, the piezoelectric chip 23, and the mass block 24 are all mounted along the assembly surfaces. There are four insulating sheets 21, first lead sheet 22, piezoelectric wafer 23, and mass block 24, and the shapes of the insulating sheets 21, first lead sheet 22, piezoelectric wafer 23, and mass block 24 match the assembly surface of the upper part 12 of the base. There is one second lead sheet 26, which is sandwiched between one of the piezoelectric wafers 23 and the mass block 24. The insulating sheet 21, piezoelectric wafer 23, and second lead sheet 26 are square sheets. In the longitudinal direction, there is an insulating gap between the upper surface of the base body and the first lead sheet 22, piezoelectric wafer 23, mass block 24, and preload ring 25.

[0043] The first lead plates 22 are connected by arc-shaped connecting portions 27. Figure 7 The plate-shaped bending shown is formed as Figure 6 The polyhedral cylindrical structure with upper and lower openings is shown. A through hole 221 is provided in the middle of each first lead-in sheet 22, and a through groove 222 that penetrates to the outside is provided below the through hole 221. The through groove 222 can provide deformation to reduce the local stress during the assembly of the piezoelectric chip 23, prevent the piezoelectric chip 23 from being broken by uneven force, and can also facilitate sharing of the part with other products. Any of the first lead-in sheets 22 also includes a first lead-out portion 223 for leading out the charge generated inside the piezoelectric chip 23. Of course, in other embodiments, the first lead-in sheet can also adopt other structures.

[0044] In this embodiment, the mass block 24 and the pre-tightening ring 25 are made of conductive materials, the second lead-in plate 26 is provided with a second lead-out portion 261, the piezoelectric chip 23 is conductively connected to the corresponding mass block 24, and each mass block 24 is conductively connected to the pre-tightening ring 25, so one second lead-in plate 26 can be conductively connected to each piezoelectric chip 23 (of course, multiple second lead-in plates can also be provided), and the second lead-out portion 261 of the second lead-in plate 26 is then connected to the pin of the connector through the wire 6 to lead out the charge generated on the outside of the piezoelectric chip 23.

[0045] In this embodiment, the inner side of the piezoelectric chip 23 is the positive electrode, which is in contact with the first lead-in plate 22 to draw out the positive charge through the first lead-in plate 22; the outer side of the piezoelectric chip 23 is the negative electrode, which is connected to the second lead-in plate 26 to draw out the negative charge through the second lead-in plate 26 (of course, it can also be the opposite, and the drawing out of the positive and negative charges is determined by the placement position of the piezoelectric chip 23).

[0046] like Fig.10 As shown, in this embodiment, the mass block 24 is block-shaped, with a flat inner surface and an arc outer surface; the preload ring 25 is annular and is fixed to each mass block 24 by interference fit. After assembly, the center lines of the outer surfaces of all mass blocks 24 are on the same straight line, forming multiple arcs of a circle, which is concentric with the preload ring 25.

[0047] like Figure 1 , Figure 2 As shown, in this embodiment, the connector 5 is fixed to the housing 4, and the connector 5 is located on the outer wall of the housing 4. The pins 51 of the connector 5 are respectively connected to the vibration sensitive component 2 and the temperature sensitive device 3 through the wires 6 to lead out the vibration and temperature signals. In this embodiment, the connector 5 has four pins 51 (such as Figure 1 ), two of which are connected to the first lead sheet 22 and the second lead sheet in the vibration sensitive component 2, and the other two are connected to the temperature sensitive device 3 ( Figure 2 Only two pins connecting the first lead plate and the second lead plate are shown, and the two pins connecting the temperature sensitive device are not shown due to cross-sectional reasons).

[0048] This embodiment also provides a helicopter tail rotor joystick bearing monitoring structure, on which the vibration-temperature composite sensor as described above is installed for simultaneously monitoring the vibration and temperature signals of the bearing.

[0049] Compared with the prior art, the vibration-temperature composite sensor and helicopter tail rotor joystick bearing monitoring structure of this embodiment can monitor vibration and temperature signals at the same time by setting a base, installing a vibration sensitive component on the upper part of the base to monitor vibration signals, and placing a temperature sensitive device on the lower part of the base to monitor temperature signals. It has a compact structure and occupies a small space. When in use, the sensor can be directly inserted into the bearing seat (such as the inner ring or outer ring of the tail rotor joystick bearing), which is easy to install. The components are simple in structure and easy to assemble, especially the base is divided into upper and lower parts, with a simple shape and easy processing. After the vibration sensitive component and the temperature sensitive device are installed on the base, they are assembled with the housing and the connector. The assembly operation is very convenient and quick.

[0050] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A vibration temperature composite sensor, characterized in that: The invention comprises a base, a vibration sensitive component, a temperature sensitive device, a shell and a connector. The base comprises a base body and a base upper part and a base lower part formed by the base body extending upward and downward respectively. The vibration sensitive component is installed on the base upper part, the base lower part is a probe structure, an inner cavity is arranged inside the base, the bottom of the inner cavity is close to the lower end of the base lower part, the temperature sensitive device is placed on the bottom of the inner cavity, the shell and the base body form a storage space for accommodating the vibration sensitive component, the connector is fixed on the shell, and its pins are connected to the vibration sensitive component and the temperature sensitive device respectively through wires to lead out vibration and temperature signals.

2. The vibration temperature composite sensor according to claim 1, characterized in that: The shell includes an outer shell and a cover plate. The outer shell is provided with a base mating hole, a connector mating hole, and a cover plate mating hole. The base body, the connector, and the cover plate are respectively fixed to the hole walls of the base mating hole, the connector mating hole, and the cover plate mating hole to seal the accommodating space.

3. The vibration temperature composite sensor according to claim 1, characterized in that: The vibration sensitive component includes a first lead-in plate, a piezoelectric chip, a mass block, and a pre-tightening ring. The first lead-in plate is installed on the outer periphery of the upper part of the base and is insulated from the upper part of the base. The piezoelectric chip is installed on the outer side of the first lead-in plate, and the mass block is installed on the outer side of the piezoelectric chip. The pre-tightening ring is sleeved on the outer periphery of the mass block. The first lead-in plate, the piezoelectric chip, and the mass block are fixed on the upper part of the base. The first lead-in plate is connected to the pins of the connector through a wire to lead out the charge generated inside the piezoelectric chip.

4. The vibration temperature composite sensor according to claim 3, characterized in that: The upper part of the base is in the shape of a square column and is provided with four assembly surfaces. The first lead-in plate, piezoelectric chip, and mass block are all installed along the assembly surfaces. There are four of the first lead-in plate, piezoelectric chip, and mass block in total, and the shapes of the first lead-in plate, piezoelectric chip, and mass block match the assembly surface of the upper part of the base.

5. The vibration temperature composite sensor according to claim 3, characterized in that: It also includes four insulating sheets, which are respectively attached to each assembly surface. The insulating sheets are located between the upper assembly surface of the base and the first current lead sheet, and are used to insulate the first current lead sheet from the upper part of the base.

6. The vibration temperature composite sensor according to claim 3, characterized in that: An insulating gap is provided between the upper surface of the base body and the first lead-in sheet, the piezoelectric wafer, the mass block and the pre-tightening ring.

7. The vibration temperature composite sensor according to claim 3, characterized in that: The first current-leading plates are connected to each other via a connecting portion, and any of the first current-leading plates further includes a first lead-out portion for leading out the charge generated by the piezoelectric chip.

8. The vibration temperature composite sensor according to claim 3, characterized in that: A through hole is provided in the middle of each of the first current-leading plates, and a through groove penetrating to the outside is provided below the through hole.

9. The vibration temperature composite sensor according to claim 3, characterized in that: The mass block and the pre-tightening ring are made of conductive materials. A second lead-in plate is provided between at least one of the piezoelectric chips and the mass block. The second lead-in plate is connected to the pins of the connector through a wire to lead out the charge generated outside the piezoelectric chip.

10. The vibration temperature composite sensor according to claim 3, characterized in that: The inner surface of the mass block is a plane, and the outer surface is an arc surface; the preload ring is annular and is fixed on each mass block by interference fit.

11. The vibration temperature composite sensor according to any one of claims 1 to 10, characterized in that: The inner cavity inside the base is formed by a blind hole opened downward from the top of the upper part of the base, and a wire connected to the temperature sensitive device is extended from the opening of the blind hole.

12. The vibration temperature composite sensor according to any one of claims 1 to 10, characterized in that: The base lower portion includes an inserting portion located at the bottom thereof and used for penetrating into the bearing seat.

13. The vibration temperature composite sensor according to claim 12, characterized in that: The lower part of the base is provided with an external thread above the inserting part for being installed on the object to be measured.

14. A helicopter tail rotor control rod bearing monitoring structure, characterized in that: The tail rotor joystick bearing seat is mounted with a vibration-temperature composite sensor as described in any one of claims 1 to 13, for simultaneously monitoring the vibration and temperature signals of the bearing.

Images