Calibration device and gluing equipment

Abstract

The utility model relates to the technical field of semiconductor device processing, and discloses a calibration device and gluing equipment. The calibration device comprises a bearing structure, a transmission structure and a striking assembly, the bearing structure comprises a body with a preset target position and an interception piece arranged on the body, and the interception piece is suitable for limiting a wafer to the preset target position; the transmission structure is arranged on the bearing structure and is suitable for conveying an external wafer to a preset target position; the beating assembly is arranged above the bearing structure and comprises a beating structure and a driving structure, and the beating structure is driven by the driving structure to rotate towards the wafer located at the preset target position so as to lock the wafer between the beating structure and the interception piece. The driving structure drives the striking structure to rotate anticlockwise, the striking structure pushes the wafer to move towards the interception piece by a certain distance in the conveying direction, the wafer is accurately fixed to the preset target position under left-right common clamping of the striking structure and the interception piece, follow-up processes are facilitated, and the wafer machining quality is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor device processing, in particular to a calibration device and a glue coating device. Background Art

[0002] The preparation of semiconductor devices includes multiple steps such as wafer processing, oxidation, photolithography, and etching. Among them, photolithography is to "print" the circuit pattern onto the wafer through light, that is, to draw the plane map required for semiconductor manufacturing on the surface of the wafer. The higher the precision of the circuit pattern, the higher the integration of the finished chip, which can only be achieved through advanced photolithography technology. Specifically, photolithography can be divided into three steps: coating photoresist, exposure, and development.

[0003] The glue coating and developing equipment in the related technology, such as the SVG86 equipment, usually uses belt transmission and circuit under pad (CUP) to carry out pattern lithography drawing. Specifically, the belt conveys the wafer to be processed to the CUP, and then glue coating, exposure and development are carried out on the wafer to form a pattern. Among them, after the wafer reaches the top of the CUP, the wafer is stopped on the CUP by setting an interception structure, but because the equipment controls the transmission based on the preset time and there is no position detection, the belt needs to continue to drive for a few seconds. The intercepted wafer on the belt will shake due to the relative friction with the belt below, and the wafer will be eccentric on the CUP, affecting the accuracy of subsequent processes and reducing the quality of the wafer. Utility Model Content

[0004] In view of this, the utility model provides a calibration device and a glue coating device to solve the problem that the existing glue coating equipment causes eccentricity of the wafer and affects the accuracy of subsequent processes.

[0005] In the first aspect, the utility model provides a calibration device, including a receiving structure, a transmission structure and a striking assembly, the receiving structure including a main body and a retaining piece, the main body having a preset target position, the retaining piece being arranged on the main body and suitable for limiting the wafer at the preset target position; the transmission structure is arranged on the receiving structure and suitable for conveying an external wafer to the preset target position; the striking assembly is arranged above the receiving structure, the striking assembly including a striking structure and a driving structure, driven by the driving structure, the striking structure is suitable for rotating toward the wafer located at the preset target position to lock the wafer between the striking structure and the retaining piece.

[0006] Beneficial effect: The driving structure of the striking assembly is turned on, the output end extends out and drives the striking structure to rotate in the counterclockwise direction, and the end of the striking structure away from the driving structure strikes the end of the wafer away from the retaining piece, pushing the wafer to move a certain distance along the conveying direction toward the retaining piece, and under the joint clamping of the striking structure and the retaining piece on the left and right, the wafer is accurately fixed at the preset target position, which is convenient for subsequent processes and improves the wafer processing quality.

[0007] In an optional embodiment, the driving structure is a linear driving member, the mounting end of the driving structure is fixed above the transmission structure, and the output end of the driving structure is hingedly connected to the striking structure.

[0008] In the utility model, the driving structure can be an electric push rod, an electric cylinder, a linear motor, a cylinder structure, or a hydraulic cylinder. The mounting end of the driving structure is fixed on a bracket such as one disposed on the side of the transmission structure, so that the driving structure is suspended above the body, and the output end of the driving structure extends from the bottom to the top to drive the striking structure above to rotate, with a simple structure and simple and fast driving.

[0009] In an optional embodiment, the striking structure includes a first connecting portion, a second connecting portion and a third connecting portion, the angle between the first connecting portion and the second connecting portion is a first preset angle, and the angle between the second connecting portion and the third connecting portion is a second preset angle;

[0010] One end of the first connection part is hingedly connected to the output end of the driving structure, the other end of the first connection part is fixedly connected to the first end of the second connection part, the second end of the second connection part is fixedly connected to the fixed end of the third connection part, and the free end of the third connection part is suitable for abutting the wafer located at a preset target position.

[0011] In the utility model, the driving structure is extended upward by a multi-section striking structure, and the striking structure rotates downward in a counterclockwise direction to strike the upper wafer placed on the horizontal plane below the driving structure, so that the wafer moves to the right in the horizontal direction, thereby achieving left and right clamping and fixing of the wafer by the striking structure and the intercepting member.

[0012] In an optional implementation, the first preset angle is equal to the second preset angle, and the first connecting portion and the second connecting portion are arranged in parallel.

[0013] In an optional embodiment, the striking assembly further includes: a flexible member, which is arranged at an end of the striking structure away from the driving structure, and the flexible member is suitable for abutting against the wafer at a preset target position.

[0014] In the utility model, the flexible member is selected from materials such as various rubbers, foam tapes, etc., which have a certain elastic deformation ability and are not easily damaged by collision, and play a certain protective role; one end of the striking structure is hinged to the driving structure, and the other end in contact with the wafer is provided with a flexible member to avoid damage to the wafer.

[0015] In an optional embodiment, the calibration device further includes a positioning component, which is disposed above the receiving structure and between the striking structure and the wafer, so as to limit the angle between the striking structure and the wafer when the striking structure rotates toward the wafer.

[0016] In the utility model, the positioning component and the striking structure have a certain spacing range, which ensures that the striking structure can fully contact the wafer when rotating counterclockwise, realizes the striking calibration of the wafer, and at the same time ensures that the striking structure will not rotate infinitely and apply excessive force to the wafer to damage the wafer; the positioning component must also have a certain upper and lower spacing with the receiving structure to ensure the smooth transportation of the wafer below and the implementation of other necessary processes.

[0017] In an optional embodiment, the positioning component includes:

[0018] A first positioning rod is horizontally arranged above the wafer; a first long groove is formed on the first positioning rod along the length direction;

[0019] A second positioning rod is spaced apart from and arranged parallel to the first positioning rod, and the second positioning rod is provided with a second long groove along the length direction;

[0020] A connecting rod, wherein both ends of the connecting rod are respectively provided with a first protrusion and a second protrusion, the first protrusion is slidably arranged in the first long groove of the first positioning rod, and the second protrusion is slidably arranged in the second long groove of the second positioning rod;

[0021] The locking piece is suitable for passing through the second protrusion and the second long groove to limit the second positioning rod from sliding relative to the connecting rod.

[0022] In the utility model, the sliding of the connecting rod between the first positioning rod and the second positioning rod is achieved through the relative movement of the protrusion in the long groove or the long hole. The second positioning rod can slide left and right along the conveying direction of the wafer or the transmission structure, so as to limit and adjust the rotation angle of the striking structure. After reaching the determined position, the second positioning rod and the connecting rod are locked by the locking piece to avoid relative sliding, thereby ensuring that the multiple striking angles of the striking structure are consistent, avoiding repeated adjustments, saving time, and improving efficiency and accuracy.

[0023] In an optional embodiment, the transmission structure includes two conveyor belts arranged at intervals to carry the transport wafers; the intercepting members are arranged at intervals and are respectively located on the inner sides of the two conveyor belts, and the side of the intercepting members close to the wafer is arranged as an arc surface.

[0024] In an optional embodiment, the calibration device also includes: a control structure and a detection member, the control structure is electrically connected to the striking assembly and is suitable for controlling the start and stop of the striking assembly; the detection member is installed at one end of the interception member close to the wafer and is electrically connected to the control structure, the detection member is suitable for detecting the wafer at a preset target position and transmitting the detection information to the control structure.

[0025] In a second aspect, the utility model provides a glue coating device, comprising: the above-mentioned calibration device and a glue coating device, wherein the glue coating device is suitable for coating a colloid onto the surface of a wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0027] Figure 1 It is a top view of the wafer of the embodiment of the utility model when it is not transferred to the preset target position;

[0028] Figure 2 It is a top view of a wafer in an embodiment of the utility model when it is transferred to a preset target position;

[0029] Figure 3 It is a front view of the wafer of the embodiment of the utility model when it is not transferred to the preset target position;

[0030] Figure 4 It is a front view of a wafer of an embodiment of the utility model when it is transferred to a preset target position;

[0031] Figure 5 is a front view of another structure of the striking structure of an embodiment of the utility model;

[0032] Figure 6 It is a schematic diagram of the control structure, detection component and driving structure of the calibration device of the embodiment of the utility model.

[0033] Description of reference numerals:

[0034] 100. Wafer;

[0035] 1. receiving structure; 11. main body; 110. preset target position; 12. interception piece;

[0036] 2. Transmission structure;

[0037] 3. striking assembly; 31. striking structure; 311. first connecting part; 312. second connecting part; 313. third connecting part; 32. driving structure; 321. mounting end; 322. output end; 33. flexible member;

[0038] 4. Positioning assembly; 41. first positioning rod; 411. first long groove; 42. second positioning rod; 421. second long groove; 43. connecting rod; 44. locking member;

[0039] 5. Detection parts; 6. Control structure; 7. Power supply; 8. Valve. DETAILED DESCRIPTION

[0040] The utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It is understandable that the specific embodiments described herein are only used to explain the utility model, rather than to limit the utility model. It should also be noted that, for the convenience of description, only some structures related to the utility model are shown in the accompanying drawings, not all structures. In the following description, the description of known structures and technologies is omitted to avoid unnecessary confusion of the concept of the utility model. Various structural schematic diagrams according to embodiments of the utility model are shown in the accompanying drawings. These figures are not drawn to scale, and some details are magnified for the purpose of clear expression, and some details may be omitted. The shapes of various regions and layers shown in the figures and the relative sizes and positional relationships between them are only exemplary, and may be deviated due to manufacturing tolerances or technical limitations in practice, and those skilled in the art may design regions / layers with different shapes, sizes, and relative positions according to actual needs. In the context of the utility model, when a layer / element is referred to as being "on" another layer / element, the layer / element may be directly on the other layer / element, or there may be an intermediate layer / element between them. In addition, if a layer / element is "on" another layer / element in one orientation, then when the orientation is reversed, the layer / element may be "below" the other layer / element.

[0041] The glue coating and developing equipment used in the preparation of semiconductor devices, such as the SVG86 equipment, usually uses belt transmission and circuit under pad (CUP) to carry out pattern lithography drawing. After the belt conveys the wafer to be processed to the CUP, the interception structure stops the wafer on the CUP. However, due to the nature of the SVG86 equipment itself, it controls the transmission based on the preset time and there is no detection of the end position, so it usually transmits for a few more seconds, that is, the belt will continue to transmit. Due to the interception structure blocking the wafer, the relative friction between the wafer on the belt and the belt will cause jitter, and then eccentricity will appear on the CUP, and the edge cannot be removed, which affects the accuracy of subsequent processes and reduces the quality of the wafer. Edge removal is a process that needs to be carried out in the CUP. Specifically, it refers to the action of removing the photoresist at the edge with propylene glycol methyl ether acetate to prevent contamination.

[0042] Therefore, if Figures 1 to 5 As shown, this embodiment provides a calibration device, including: a receiving structure 1, a transmission structure 2 and a striking assembly 3, wherein the receiving structure 1 includes a main body 11 and a retaining member 12, the main body 11 has a preset target position 110, and the retaining member 12 is arranged on the main body 11, suitable for limiting the wafer 100 at the preset target position 110; the transmission structure 2 is arranged on the receiving structure 1, suitable for conveying the external wafer 100 to the preset target position 110; the striking assembly 3 is arranged above the receiving structure 1, and the striking assembly 3 includes a striking structure 31 and a driving structure 32, and driven by the driving structure 32, the striking structure 31 is suitable for rotating toward the wafer 100 located at the preset target position 110 to lock the wafer 100 between the striking structure 31 and the retaining member 12.

[0043] Specifically, the receiving structure 1 includes a main body 11 as a pressure welding block to place the circuit CUP and a retaining piece 12 arranged on the upper surface of the main body 11. The upper surface of the main body 11 has a preset target position 110. For example, when the upper surface of the CUP is a circular surface, the preset target position 110 can be a circular area with a certain diameter from the center of the circle to the outside. The retaining piece 12 is located outside the circular area of ​​the preset target position 110 and inside the transmission structure 2, and the wafer 100 coming along the conveying direction is stopped at the preset target position 110 on the main body 11 without affecting the continuous conveying of the transmission structure 2; the driving structure 32 is suspended and fixed above the main body 11, and does not affect the conveying of the wafer 100 below. The conveying direction of the wafer 100 is Figures 1 to 5 The direction is from left to right as indicated by the arrow in the figure.

[0044] Figure 3 is a schematic diagram of the process of the transmission structure 2 transporting the wafer 100, Figure 1The top view thereof corresponds to the above. Since the intercepting member 12 intercepts the wafer 100 at the preset target position 110, but the transmission structure 2 below is still continuing to transmit, there will be relative friction between the wafer 100 and the transmission structure 2, causing the wafer 100 located on the transmission structure 2 to shake near the preset target position 110, and then move a certain distance in the direction opposite to the transmission direction, and become eccentrically offset from the preset target position 110. At this time, the driving structure 32 of the striking assembly 3 is turned on, and the output end 322 is extended. The striking structure 31 rotates in a counterclockwise direction driven by the output end 322, and the end of the striking structure 31 away from the driving structure 32 strikes the end of the wafer 100 away from the intercepting member 12, pushing the wafer 100 to move a certain distance along the conveying direction toward the intercepting member 12, and being clamped by the striking structure 31 and the intercepting member 12 on the left and right, the wafer 100 is precisely fixed at the preset target position 110, which is convenient for subsequent processes and improves the processing quality of the wafer 100. Figure 4 As shown, when the wafer 100 is precisely located at the preset target position 110, the striking structure 31 is on the left, and the intercepting member 12 is on the right. The driving structure 32 applies a driving force to the striking structure 31 so that it exerts a pressing force from left to right on the wafer 100. Figure 2 is the corresponding top view.

[0045] In one embodiment, the driving structure 32 is a linear driving member, a mounting end 321 of the driving structure 32 is fixed above the transmission structure, and an output end 322 of the driving structure 32 is hingedly connected to the striking structure 31 .

[0046] Specifically, the driving structure 32 can be an electric push rod, an electric cylinder, a linear motor, a cylinder structure, or a hydraulic cylinder. In this embodiment, a cylinder structure is selected as the driving structure 32. The mounting end 321 of the cylinder structure is fixed above the transmission structure 2 through brackets arranged on both sides of the transmission structure 2. At the same time, the striking structure is kept stable by the fixture when it is not falling. The bracket and the fixture are Figures 1 to 6 It is not shown in the figure, and is only explained as a structure for installing and fixing the striking assembly 3, so that the cylinder structure is suspended above the main body 11, and the striking structure 31 is stabilized on the cylinder structure. The output end 322 of the cylinder structure extends from the bottom to the top to drive the striking structure 31 above to rotate. At this time, the fixture is withdrawn, and the striking structure 31 can rotate and fall. The structure is simple and the drive is simple and fast.

[0047] In one embodiment, Figure 3 and Figure 4 As shown, the striking structure 31 includes a first connecting portion 311, a second connecting portion 312 and a third connecting portion 313, wherein the angle between the first connecting portion 311 and the second connecting portion 312 is a first preset angle, and the angle between the second connecting portion 312 and the third connecting portion 313 is a second preset angle;

[0048] One end of the first connection part 311 is hingedly connected to the output end 322 of the driving structure 32, the other end of the first connection part 311 is fixedly connected to the first end of the second connection part 312, the second end of the second connection part 312 is fixedly connected to the fixed end of the third connection part 313, and the free end of the third connection part 313 is suitable for abutting the wafer 100 located at the preset target position 110.

[0049] In this embodiment, the striking structure 31 includes a first connection part 311, a second connection part 312 and a third connection part 313 connected in sequence from the end connected to the driving structure 32 to the end away from the driving structure 32, and the first connection part 311, the second connection part 312 and the third connection part 313 are all fixedly connected, the first connection part 311 is hinged to the output end 322 of the driving structure 32, and the third connection part 313 is suitable for abutting against the wafer 100. Through the multi-stage striking structure 31, the driving structure 32 is extended upward, and the striking structure 31 rotates downward in the counterclockwise direction to strike the upper wafer 100 placed on the horizontal plane below the driving structure 32, so that the wafer 100 moves to the right in the horizontal direction, and the striking structure 31 and the intercepting member 12 clamp and fix the wafer 100 to the left and right.

[0050] Further, the first preset angle is equal to the second preset angle, and the first connection portion 311 and the second connection portion 312 are arranged in parallel.

[0051] The first preset angle and the second preset angle can be acute angles, right angles or obtuse angles. The first preset angle and the second preset angle are the inner angles located on both sides of the connecting member between the straight line where the first connecting portion 311 and the straight line where the second connecting portion 312 are located. In this embodiment, the first preset angle and the second preset angle are set to right angles, which have high support.

[0052] As another optional implementation, Figure 5 As shown, the striking structure 31 can be set as an integrated arc structure rather than a multi-segment straight line structure. One end of the arc structure is hinged to the output end 322 of the driving structure 32, and the other end is suitable for abutting against the wafer 100. The structure is evenly stressed at all locations and can rotate more flexibly.

[0053] In one embodiment, the striking structure 31 further includes a flexible member 33 disposed at one end of the striking structure 31 away from the driving structure 32 , and the flexible member 33 is suitable for abutting against the wafer 100 at a preset target position 110 .

[0054] The flexible part 33 can be a material such as various rubbers, foam tapes, etc., which has a certain elastic deformation ability and is not easily damaged by collision, and plays a certain protective role; one end of the striking structure 31 is hinged to the driving structure 32, and the other end in contact with the wafer 100 is provided with a flexible part 33 to avoid damage to the wafer 100.

[0055] In one embodiment, the calibration device further includes a positioning assembly 4 disposed above the receiving structure 1, and the positioning assembly 4 is disposed between the striking structure 31 and the wafer 100, so as to limit the angle between the striking structure 31 and the wafer 100 when the striking structure 31 rotates toward the wafer 100. Similarly, the positioning assembly 4 is fixed above the receiving structure 1 by the above-mentioned bracket, fixture, etc.

[0056] Specifically, Figure 3 and Figure 4 As shown, the positioning assembly 4 includes: a first positioning rod 41, a second positioning rod 42, a connecting rod 43 and a locking piece 44. The first positioning rod 41 is horizontally arranged above the wafer 100, and a first long groove 411 is opened on the first positioning rod 41 along the length direction; the second positioning rod 42 is spaced apart from the first positioning rod 41 and arranged parallel to each other, and a second long groove 421 is opened on the second positioning rod 42 along the length direction; a first protrusion and a second protrusion are respectively arranged at both ends of the connecting rod 43, the first protrusion can be slidably arranged in the first long groove 411 of the first positioning rod 41, and the second protrusion can be slidably arranged in the second long groove 421 of the second positioning rod 42; the locking piece 44 is suitable for passing through the second protrusion and the second long groove 421 to limit the second positioning rod 42 from sliding relative to the connecting rod 43.

[0057] The positioning component 4 is fixed to the bracket through the first positioning rod 41 to ensure the relative relationship between the positioning component 4 and the striking structure 31 and the supporting structure 1. On the one hand, the positioning component 4 is suspended above the supporting structure 1 and has a certain upper and lower spacing with the supporting structure 1 to ensure the smooth transportation of the wafer 100 below and the implementation of other necessary processes; on the other hand, the second positioning rod 42 is hingedly connected to the first positioning rod 41 through the connecting rod 43 to ensure the relative relationship between the positioning component 4 and the striking structure 31, that is, the positioning component 4 and the striking structure 31 have a certain spacing range to ensure that the striking structure 31 can fully contact the wafer 100 when rotating counterclockwise, so as to realize the striking calibration of the wafer 100, and at the same time, it is also necessary to ensure that the striking structure 31 will not rotate infinitely and exert excessive force on the wafer 100 to damage the wafer 100. The first positioning rod 41 and the second positioning rod 42 are both provided with a long groove. Of course, it can also be a long hole in the thickness direction of the first positioning rod 41 or the second positioning rod 42. It can be designed according to actual needs without specific limitation. The connecting rod 43 can slide between the first positioning rod 41 and the second positioning rod 42 through the relative movement of the protrusion in the long groove or the long hole, that is, the second positioning rod 42 can slide left and right along the conveying direction of the wafer 100 or the transmission structure 2 to limit and adjust the rotation angle of the striking structure 31. After reaching the determined position, the second positioning rod 42 and the connecting rod 43 are locked by the locking member 44 to avoid relative sliding, thereby ensuring that the multiple striking angles of the striking structure 31 are consistent, avoiding repeated adjustments, saving time, and improving efficiency and accuracy.

[0058] As an achievable manner, there is a spacing component in the height direction and a spacing component in the width direction between the first positioning rod 41 and the second positioning rod 42. The height direction is Figure 3 Vertical direction in front view, Figure 3 The horizontal direction in the above can be understood as the length direction, and the width direction is the direction perpendicular to the longitudinal direction and the horizontal direction. That is to say, the first positioning rod 41 and the second positioning rod 42 are not completely opposite to each other in the vertical direction or the width direction, but are staggered. The first positioning rod 41 and the second positioning rod 42 have different height positions and width positions. The staggered interval between the first positioning rod 41 and the second positioning rod 42 facilitates the arrangement of the striking assembly 3, especially facilitates the striking structure 31 and the second positioning rod 42 to correspond in the width direction, so as to realize the rotation limit of the striking structure 31 by the second positioning rod 42.

[0059] Of course, based on specific installation needs, the arrangement positions of the various structures of the positioning assembly 4 can also be flexibly adjusted, as long as the rotation limit of the striking structure 31 by the positioning assembly 4 can be achieved.

[0060] In one embodiment, the transmission structure 2 includes two conveyor belts arranged at intervals to carry the wafer 100; the interception members 12 are arranged at intervals and are respectively located on the inner side of the two conveyor belts, and the side of the interception member 12 close to the wafer 100 is arranged as an arc surface, which is convenient for cooperating with the circular wafer 100 to abut against the wafer 100 and avoid damaging the wafer 100. Of course, the interception member 12 can also be arranged as a continuous arc structure to abut against the wafer 100 more fully.

[0061] In one embodiment, the calibration device further includes: a control structure 6 and a detection member 5, wherein the control structure 6 is electrically connected to the striking assembly 3 and is suitable for controlling the start and stop of the striking assembly 3; the detection member 5 is installed at one end of the interception member 12 close to the wafer 100 and is electrically connected to the control structure 6, and the detection member 5 is suitable for detecting whether the wafer 100 reaches the preset target position 110 and transmitting the detected information to the control structure 6. Figure 6 As shown, the control structure 6 can be a PLC (programmable logic controller) circuit, which receives the signal transmitted by the detection component 5 and controls the drive structure 32 of the striking component 3 to start or pause. The detection component 5 can be a photoelectric sensor. The control structure 6 is connected to a 24V power supply 7. The control structure 6 is electrically connected to the drive structure 32, and a valve 8 is set to control whether compressed air is introduced, that is, to control the opening and closing of the drive structure 32. The valve 8 can be a solenoid valve.

[0062] The wafer 100 has not reached the preset target position 110, and the detection member 5 is not blocked. At this time, there is a passage between the detection member 5 and the control structure 6. The logic setting is that at this time, there is an open circuit between the control structure 6 and the driving structure 32 of the striking assembly 3. The solenoid valve is closed, and the compressed air does not pass through the solenoid valve. The output end 322 of the driving structure 32 is in a retracted state. When the detection member 5 detects that it is blocked, that is, the wafer 100 has reached the preset target position 110, there is an open circuit between the detection member 5 and the control structure 6. The logic setting is that at this time, there is a passage between the control structure 6 and the driving structure 32 of the striking assembly 3, the solenoid valve is opened, and the compressed air can pass through the solenoid valve. The output end 322 of the driving structure 32 is in an extended state, driving the striking structure 31 to rotate counterclockwise, striking and calibrating the position of the wafer 100 and fixing the wafer 100.

[0063] This embodiment further provides a glue coating device, including: the above-mentioned calibration device and a glue coating device, and the glue coating device is suitable for coating colloid on the surface of the wafer 100.

[0064] In the above description, the technical details of the patterning and etching of each layer are not described in detail. However, those skilled in the art should understand that various technical means can be used to form layers, regions, etc. of desired shapes. In addition, in order to form the same structure, those skilled in the art can also design methods that are not completely the same as the methods described above. In addition, although the various embodiments are described above separately, this does not mean that the measures in the various embodiments cannot be used in combination to advantage.

[0065] Although the embodiments of the present invention are described in conjunction with the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations are all within the scope defined by the appended claims.

Claims

1. A calibration device, characterized in that: include: A receiving structure, the receiving structure comprising a main body and a retaining member, the main body having a preset target position, the retaining member being arranged on the main body and being suitable for limiting the wafer to the preset target position; A transmission structure, which is arranged on the receiving structure and is suitable for transporting the external wafer to the preset target position; A striking assembly is arranged above the receiving structure; The striking assembly includes a striking structure and a driving structure. Driven by the driving structure, the striking structure is adapted to rotate toward the wafer located at the preset target position to lock the wafer between the striking structure and the retaining member.

2. The calibration device according to claim 1, characterized in that: The driving structure is a linear driving member, the mounting end of the driving structure is fixed above the transmission structure, and the output end of the driving structure is hingedly connected to the striking structure.

3. The calibration device according to claim 2, characterized in that: The striking structure comprises a first connecting portion, a second connecting portion and a third connecting portion, wherein the angle between the first connecting portion and the second connecting portion is a first preset angle, and the angle between the second connecting portion and the third connecting portion is a second preset angle; One end of the first connection part is hingedly connected to the output end of the driving structure, the other end of the first connection part is fixedly connected to the first end of the second connection part, the second end of the second connection part is fixedly connected to the fixed end of the third connection part, and the free end of the third connection part is suitable for abutting the wafer located at the preset target position.

4. The calibration device according to claim 3, characterized in that: The first preset angle is equal to the second preset angle, and the first connecting portion and the second connecting portion are arranged in parallel.

5. The calibration device according to claim 4, characterized in that: The striking assembly also includes: A flexible member is arranged at an end of the striking structure away from the driving structure, and the flexible member is suitable for abutting against the wafer at the preset target position.

6. The calibration device according to claim 1, characterized in that: Also includes: A positioning component is arranged above the receiving structure and between the striking structure and the wafer, so as to limit the angle between the striking structure and the wafer when the striking structure rotates toward the wafer.

7. The calibration device according to claim 6, characterized in that: The positioning component comprises: A first positioning rod is horizontally arranged above the wafer; a first long groove is formed on the first positioning rod along the length direction; A second positioning rod, spaced apart from and parallel to the first positioning rod, the second positioning rod being provided with a second long groove along the length direction; A connecting rod, wherein two ends of the connecting rod are respectively provided with a first protrusion and a second protrusion, the first protrusion is slidably disposed in the first long groove of the first positioning rod, and the second protrusion is slidably disposed in the second long groove of the second positioning rod; A locking member, wherein the locking member is adapted to pass through the second protrusion and the second long groove to limit the second positioning rod from sliding relative to the connecting rod.

8. The calibration device according to any one of claims 1 to 7, characterized in that: The transmission structure includes two conveyor belts arranged at intervals to carry the transmission wafers; the intercepting members are arranged in two intervals and are respectively located on the inner sides of the two conveyor belts, and the side of the intercepting member close to the wafer is arranged as an arc surface.

9. The calibration device according to claim 8, characterized in that: Also includes: A control structure, the control structure is electrically connected to the striking assembly and is suitable for controlling the start and stop of the striking assembly; A detection member is installed at one end of the retaining member close to the wafer and is electrically connected to the control structure. The detection member is suitable for detecting the wafer at a preset target position and transmitting the detection information to the control structure.

10. A glue coating device, characterized in that: include: A calibration device as claimed in any one of claims 1 to 9, and a glue coating device, wherein the glue coating device is suitable for coating glue onto the surface of the wafer.

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