Projection exposure device

Abstract

The utility model belongs to the technical field of semiconductor manufacturing, and provides a projection exposure device which comprises a light source assembly, a working platform deck, a first bearing assembly, a second bearing assembly and an imaging projection assembly. The first bearing assembly is used for bearing a photomask and located between the light source assembly and the working platform deck, a first space defined by the working platform deck is formed in the first bearing assembly, the second bearing assembly is placed on the working platform deck and used for bearing an exposure test piece, and a first fluid working medium for immersing the exposure test piece is arranged in the first space; the exposure light beam sequentially passes through the photomask, the imaging projection assembly and the first fluid working medium to irradiate the exposure test piece, and through the first fluid working medium, the numerical aperture of the projection exposure device is effectively increased, the resolution is improved, and the feature size of the exposure test piece is reduced.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing technology, and in particular to a projection exposure device. Background Art

[0002] Semiconductor process technology is the core of the modern electronics industry, involving the integration of tiny electronic components on a silicon wafer to form complex circuits. With the development of semiconductor technology, the reduction of semiconductor feature size has become a key factor in promoting the performance of electronic devices. The reduction of electronic device size can not only improve the performance of integrated circuits, but also reduce power consumption and cost. In semiconductor process technology, photolithography is the key technology to achieve feature size reduction. The light source used in traditional photolithography technology has a longer wavelength, which limits the reduction of feature size. The development of extreme ultraviolet light sources has brought revolutionary changes to semiconductor process technology. The wavelength of extreme ultraviolet light sources is much smaller than that of traditional light sources, which can obtain smaller feature sizes, promoting the further reduction of semiconductor feature sizes.

[0003] With the development of light source technology, the resolution of the lithography system has become an important factor affecting the characteristic size of semiconductors. The minimum distance between two object points that can be distinguished by the lithography system is proportional to the wavelength of the light source and inversely proportional to the numerical aperture. The smaller the wavelength and the larger the numerical aperture, the smaller the distance between the two distinguishable object points, and the greater the resolution of the lithography system. In the prior art, the patterned exposure beam propagates in the atmosphere, and the numerical aperture of the lithography system will be limited to a value less than 1, which limits the further reduction of the characteristic size of semiconductor devices. Utility Model Content

[0004] The purpose of the present application is to provide a projection exposure device for improving resolution and reducing the characteristic size of an exposure specimen.

[0005] In order to achieve the above-mentioned object and other related objects, the present application provides a projection exposure device, comprising:

[0006] A light source assembly having a light emitting surface, and an exposure light beam generated by the light source assembly is emitted from the light emitting surface;

[0007] A working platform, located on the side where the light emitting surface of the light source assembly is located;

[0008] A first bearing component is located between the light source component and the working stage to bear the light mask, and the first bearing component has a first space enclosed by the working stage;

[0009] A second carrying assembly is located in the first space and placed on the work stage, the second carrying assembly is used to carry the exposure specimen, the first space has a first fluid working medium, and the first fluid working medium immerses the exposure specimen;

[0010] The imaging projection assembly is located in the first space, and the exposure light beam is sequentially irradiated to the exposure specimen through the light mask, the imaging projection assembly and the first fluid working medium.

[0011] Optionally, the light source assembly includes:

[0012] a light source unit, the light source unit radiating a first light;

[0013] The source light modulation unit is located between the light source unit and the first supporting component, and the source light modulation unit modulates the received first light into an exposure light beam.

[0014] Optionally, the first supporting assembly includes a top platform and a side support, the top platform is connected to one end of the side support close to the light source assembly to support the light cover, and the end of the side support away from the light source assembly is connected to the working platform to support the top platform.

[0015] Optionally, the second bearing assembly includes a bearing body, a first groove is formed on a side of the bearing body close to the light source assembly, and the exposure specimen is placed in the first groove.

[0016] Optionally, the first fluid medium is filled in the first groove, and a side of the imaging projection assembly close to the work stage is located in the first fluid medium.

[0017] Optionally, the second bearing assembly further includes a sealing portion, a plurality of first through holes are provided at the bottom of the first groove, and the sealing portion is connected to the bearing body and seals the first through holes.

[0018] Optionally, a second through hole is provided in the working platform, and when the second supporting assembly is placed on the working platform, the second through hole is coaxial with the first through hole.

[0019] Optionally, the projection exposure device further comprises a lifting assembly, wherein the lifting assembly comprises a driving part and a moving shaft, and the driving part drives the moving shaft to move so as to place the exposure specimen in the first groove.

[0020] Optionally, one end of the motion axis is located in the second through hole, and the other end is connected to the driving unit. The driving unit is located on a side of the work platform away from the light source assembly, and drives the motion axis to move along the central axis direction of the first through hole.

[0021] Optionally, the sealing portion is a movable sealing ring, and when the moving shaft passes through the movable sealing ring, the movable sealing ring abuts against the moving shaft to ensure water tightness between the moving shaft and the bearing body.

[0022] The projection exposure device provided in this application has at least the following beneficial effects:

[0023] The projection exposure device of the present application includes a light source component, a working stage, a first bearing component, a second bearing component and an imaging projection component. A first space is enclosed between the first bearing component and the working stage. A first fluid medium is provided in the first space to immerse the exposure specimen. The side of the imaging projection component close to the working stage is located in the first fluid medium, so that the first fluid medium becomes the medium between the imaging projection component and the exposure specimen, which effectively increases the numerical aperture of the projection exposure device, improves the resolution, and reduces the characteristic size of the exposure specimen. A first groove for containing the first fluid medium is provided in the second bearing component, which facilitates the use of the projection exposure device, and also facilitates the replacement of the first fluid medium, and the cleaning and maintenance of the projection exposure device. The projection exposure device also includes a lifting component, and a plurality of first through holes are provided at the bottom of the first groove, and a plurality of second through holes are provided in the working stage. The exposure specimen can be taken in and put out through the first through hole and the second through hole by using the upgrading component. The second bearing component also includes a sealing portion to seal the first through hole, which effectively ensures the watertightness of the first through hole. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0025] Figure 1 Shown is a schematic diagram of the structure of the projection exposure device provided in Example 1 of the present application.

[0026] Figure 2 Shown is a schematic diagram of the structure of the projection exposure device provided in Example 2 of the present application.

[0027] Figure 3 Display as Figure 2 A schematic structural diagram of the second supporting assembly in the projection exposure device is shown.

[0028] Reference numerals:

[0029] 1. Light source assembly; 11. Light source unit; 12. Source light modulation unit; 2. Working stage; 21. Second through hole; 3. First supporting assembly; 31. Top stage; 32. Side support; 33. First space; 4. Second supporting assembly; 41. Supporting body; 42. Sealing unit; 43. First through hole; 44. First groove; 5. Imaging projection assembly; 6. Lifting assembly; 61. Driving unit; 62. Moving axis; 71. Light mask; 72. Exposure specimen. DETAILED DESCRIPTION

[0030] In order to make the technical purpose, technical solution and technical effect of the present application clearer, the technical solution in the present application will be clearly and completely described in conjunction with the embodiments below. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0031] Therefore, the following detailed description of the embodiments of the present application is not intended to limit the scope of the present application for protection, but merely represents the selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work are within the scope of protection of the present application. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0032] In the description of the present application, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0033] In the description of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. In addition, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "example", "specific example" or "some examples" means that the specific features, structures, materials or characteristics described in combination with the implementation or example are included in at least one implementation or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same implementation or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more implementations or examples in a suitable scheme.

[0034] Embodiment 1

[0035] This embodiment provides a projection exposure device, referring to Figure 1 , including a light source assembly 1, a working stage 2, a first supporting assembly 3, a second supporting assembly 4 and an imaging projection assembly 5.

[0036] The light source assembly 1 has a light emitting surface, and the exposure light beam generated by the light source assembly 1 is emitted from the light emitting surface, and the exposure light beam can cause the exposure specimen 72 to be exposed; the working stage 2 is located on the side where the light emitting surface of the light source assembly 1 is located, and is used to support the first bearing assembly 3; the first bearing assembly 3 is located between the light source assembly 1 and the working stage 2, and is used to bear the mask 71, and the mask 71 can define at least one pattern to be transferred to the exposure specimen 72, and the first bearing assembly 3 has a first space 33, and the first space 33 is surrounded by the first bearing assembly 3 and the working stage 2; the second bearing assembly 4 is located in the first space 33 and is placed on the working stage 2, and is used to bear the exposure specimen 72, and the first space 33 has a first fluid medium, and the first fluid medium immerses the exposure specimen 72; the imaging projection assembly 5 is located in the first space 33, and the exposure light beam is sequentially irradiated to the exposure specimen 72 through the mask 71, the imaging projection assembly 5 and the first fluid medium. By setting the first fluid working medium in the transmission path of the exposure beam, the numerical aperture of the projection exposure device is increased, thereby improving the resolution of the projection exposure device, effectively reducing the characteristic size of the exposure specimen 72, and using the first fluid working medium as the transmission medium, which can reduce the generation of defects in the lithography process.

[0037] In this embodiment, the light source assembly 1 includes a light source unit 11 and a source light modulation unit 12. The light source unit 11 can radiate a first light. The source light modulation unit 12 is located between the light source unit 11 and the first supporting assembly 3. The source light modulation unit 12 receives the incident first light and emits an exposure light beam.

[0038] In an optional embodiment, the light source unit 11 can radiate a first light with a transmission direction toward the source light modulation unit 12. Optionally, the first light can be ultraviolet light, deep ultraviolet light, extreme ultraviolet light, or other light of acceptable wavelength. The source light modulation unit 12 includes a plurality of optical elements. Optionally, the source light modulation unit 12 can include a single lens or multiple lenses and / or other optical elements, such as a microlens array and other optical elements. The source light modulation unit 12 can modulate the received first light into an exposure beam suitable for exposure.

[0039] In this embodiment, the first carrying assembly 3 includes a top stage 31 and a side support 32, wherein the top stage 31 is connected to one end of the side support 32 close to the light source assembly 1 and is used to carry the light mask 71, and one end of the side support 32 away from the light source assembly 1 is connected to the working stage 2 and is used to support the top stage 31. Optionally, a first opening is provided in the top stage 31, and the first opening exposes the mask pattern in the light mask 71 so that the mask pattern can be transferred to the exposure specimen 72 through the exposure beam.

[0040] In an optional embodiment, the side support 32 is a box-shaped structure that is through from top to bottom, and one end of the box-shaped structure of the side support 32 with an opening is connected to the work stage 2, so that a first space 33 is enclosed between the box-shaped structure of the side support 32 and the work stage 2, and the first fluid working medium is filled in the first space 33 and immerses the exposure specimen 72. Optionally, a transmission pipe is also provided in the first space 33 for filling the first fluid working medium into the first space 33 or discharging the first fluid working medium out of the first space 33.

[0041] In an optional embodiment, the second bearing assembly 4 includes a bearing body 41, and a first groove 44 is formed on one side of the bearing body 41 close to the light source assembly 1, and the exposure specimen 72 is placed in the first groove 44. Optionally, the first fluid working medium is filled in the first groove 44 and immerses the exposure specimen 72. By providing the first groove 44 for containing the first fluid working medium in the second bearing assembly 4, the installation and use of the projection exposure device and the replacement of the first fluid working medium are greatly facilitated, and the cleaning and maintenance of the projection exposure device are also facilitated, thereby improving the convenience of use of the projection exposure device.

[0042] In this embodiment, the first fluid working medium is a transparent fluid material, and the refractive index of the first fluid working medium is greater than 1.0. By immersing the first fluid working medium in the exposure specimen 72, the numerical aperture of the projection exposure device breaks through the limit of 1.0, the value of the numerical aperture is increased, and the resolution of the projection exposure device is improved. Optionally, the first fluid working medium can be, for example, deionized water, the refractive index of which is 1.33, and can be used with the imaging projection component 5 to obtain a numerical aperture greater than 1.0, or the first fluid working medium can be bromonaphthalene, the refractive index of which is 1.66, and can be used with the imaging projection component 5 to obtain a numerical aperture greater than 1.4, or the first fluid working medium can also be other acceptable materials, and this embodiment is not limited thereto.

[0043] The imaging projection assembly 5 is located between the top stage 31 of the first bearing assembly 3 and the second bearing assembly 4. The imaging projection assembly 5 is used to modulate the exposure light beam after irradiating the mask 71 to transfer the mask pattern of the mask 71 to the exposure specimen 72. The imaging projection assembly 5 includes multiple optical elements. Optionally, the imaging projection assembly 5 may include, for example, a single lens element or an objective lens with multiple lens elements, and / or an optical element such as an illumination slit. Further, the imaging projection assembly 5 is located in the first fluid medium on the side close to the working stage 2, so that the exposure light beam emitted from the imaging projection assembly 5 is transmitted in the first fluid medium.

[0044] In the projection exposure device of the present embodiment, a first fluid medium for immersing the exposure specimen 72 is arranged in the first space 33, and the side of the imaging projection component 5 close to the work stage 2 is located in the first fluid medium, so that the first fluid medium serves as a medium between the exit lens of the imaging projection component 5 and the exposure specimen 72, thereby effectively increasing the numerical aperture of the projection exposure device, significantly improving the resolution of the projection exposure device during the lithography process, reducing the characteristic size of the exposure specimen 72, reducing the generation of defects during the lithography process, improving the integration of semiconductor components, and promoting the development and progress of semiconductor process technology.

[0045] Embodiment 2

[0046] This embodiment provides another projection exposure device, referring to Figure 2 , also includes a light source assembly 1, a work stage 2, a first bearing assembly 3, a second bearing assembly 4 and an imaging projection assembly 5, wherein the same points as those in the first embodiment are not repeated here, and the difference is that:

[0047] Reference Figure 2 and Figure 3 The second bearing assembly 4 includes a bearing body 41 and a sealing portion 42. A first groove 44 is formed on one side of the bearing body 41 close to the light source assembly 1. A plurality of first through holes 43 are arranged at the bottom of the first groove 44. The sealing portion 42 is connected to the bearing body 41 and seals the first through holes 43. Optionally, at least three first through holes 43 are arranged at the bottom of the first groove 44. The exposure specimen 72 is placed in the first groove 44. The first fluid working medium is filled in the first groove 44 and immerses the exposure specimen 72. The sealing portion 42 can ensure that the first through holes 43 at the bottom of the first groove 44 are watertight, and effectively prevent the first fluid working medium from leaking from the first through holes 43.

[0048] In this embodiment, the working stage 2 is provided with a second through hole 21 corresponding to the first through hole 43. When the second bearing assembly 4 is placed on the working stage 2, the second through hole 21 is coaxially arranged with the first through hole 43. Optionally, in a top view along the central axis direction of the second through hole 21, the first through hole 43 is completely located within the contour line of the second through hole 21. Further, both the first through hole 43 and the second through hole 21 are cylindrical structures. By controlling the sizes of the first through hole 43 and the second through hole 21, the second bearing assembly 4 is placed on the working stage 2 so that the first through hole 43 is aligned with the second through hole 21, thereby improving the convenience of use of the projection exposure device.

[0049] In this embodiment, the projection exposure device further includes a lifting assembly 6 , which includes a driving portion 61 and a moving shaft 62 . The driving portion 61 drives the moving shaft 62 to move so as to place the exposure specimen 72 in the first groove 44 .

[0050] In an optional embodiment, one end of the moving shaft 62 is located in the second through hole 21, and the other end is connected to the driving unit 61, which is located on the side of the work stage 2 away from the light source assembly 1 and drives the moving shaft 62 to move along the central axis direction of the first through hole 43. Optionally, the moving shaft 62 is a pin, and the end of the moving shaft 62 close to the light source assembly 1 can move to the top of the second bearing assembly 4, and move from the top of the second bearing assembly 4 to the first through hole 43, so as to place the exposure test piece 72 in the first groove 44 through the pin.

[0051] In an optional embodiment, the sealing portion 42 is a movable sealing ring. When the moving shaft 62 passes through the movable sealing ring, the movable sealing ring abuts against the moving shaft 62 to ensure water tightness between the moving shaft 62 and the supporting body 41. When the moving shaft 62 moves into the first through hole 43 near one end of the light source assembly 1, the movable sealing ring closes automatically to ensure the water tightness of the first through hole 43 and prevent the first fluid working medium from leaking from the first through hole 43.

[0052] In an optional embodiment, a limiting groove is further provided on the surface of the working platform 2 on the side close to the light source assembly 1, and the structural dimensions of the limiting groove correspond to the structural dimensions of the second supporting assembly 4, so as to facilitate placing the second supporting assembly 4 on the working platform 2 and aligning the first through hole 43 with the second through hole 21.

[0053] In this embodiment, the exposure specimen 72 can be a semiconductor element such as a wafer, or can be other elements that need to be exposed. Optionally, when the exposure specimen 72 is, for example, a wafer, when the projection exposure device is in use, a robotic arm is used to place the second carrier component 4 containing the first fluid working medium on the work platform 2, and the first through hole 43 is aligned with the second through hole 21, and the lifting component 6 is used to move the ejector pin in a direction close to the light source component 1, passing through the second through hole 21, the first through hole 43 and the sealing portion 42 in sequence, and moving to the top of the second carrier component 4, taking the wafer from the wafer box and placing it on the ejector pin, and controlling the ejector pin to move downward using the lifting component 6 to place the wafer in the first groove 44, and the ejector pin continues to move downward to the second through hole 21, and the projection exposure device is turned on to expose the wafer.

[0054] Compared with the first embodiment, the projection exposure device of the present embodiment also includes a light source assembly 1, a working stage 2, a first bearing assembly 3, a second bearing assembly 4 and an imaging projection assembly 5, and therefore, also has the beneficial effects of the first embodiment. In addition, in the projection exposure device of the present embodiment, the projection exposure device also includes a lifting assembly 6, the second bearing assembly 4 also includes a sealing portion 42, a first through hole 43 is provided at the bottom of the first groove 44, the sealing portion 42 seals the first through hole 43, and a second through hole 21 corresponding to the first through hole 43 is provided in the working stage 2. The lifting assembly 6 is used to realize the placement and taking of the exposure test piece 72 through the first through hole 43 and the second through hole 21, and the sealing portion 42 is used to effectively ensure the water tightness of the first through hole 43, thereby improving the convenience of use of the projection exposure device while ensuring high resolution.

[0055] The above embodiments are merely illustrative of the principles and effects of the present application and are not intended to limit the present application. Anyone familiar with the technology may modify, change or combine the above embodiments without violating the spirit and scope of the present application. Therefore, all equivalent modifications or changes made by a person of ordinary skill in the art without departing from the spirit and technical ideas disclosed in the present application shall still be covered by the claims of the present application.

Claims

1. A projection exposure device, characterized in that: include: A light source assembly having a light emitting surface, and an exposure light beam generated by the light source assembly is emitted from the light emitting surface; A working platform, located on the side where the light emitting surface of the light source assembly is located; A first bearing component is located between the light source component and the working stage to bear the light mask, and the first bearing component has a first space enclosed by the working stage; A second carrying assembly is located in the first space and placed on the work stage, the second carrying assembly is used to carry the exposure specimen, the first space has a first fluid working medium, and the first fluid working medium immerses the exposure specimen; The imaging projection assembly is located in the first space, and the exposure light beam is sequentially irradiated to the exposure specimen through the light mask, the imaging projection assembly and the first fluid working medium.

2. The projection exposure apparatus according to claim 1, characterized in that: The light source assembly comprises: a light source unit, the light source unit radiating a first light; The source light modulation unit is located between the light source unit and the first supporting component, and the source light modulation unit modulates the received first light into an exposure light beam.

3. The projection exposure apparatus according to claim 1, characterized in that: The first supporting assembly includes a top stage and a side support, wherein the top stage is connected to one end of the side support close to the light source assembly to support the light cover, and the end of the side support away from the light source assembly is connected to the working stage to support the top stage.

4. The projection exposure apparatus according to claim 1, characterized in that: The second bearing assembly includes a bearing body, a first groove is formed on a side of the bearing body close to the light source assembly, and the exposure specimen is placed in the first groove.

5. The projection exposure apparatus according to claim 4, characterized in that: The first fluid medium is filled in the first groove, and the imaging projection component is located in the first fluid medium on a side close to the working stage.

6. The projection exposure apparatus according to claim 4, characterized in that: The second bearing assembly further includes a sealing portion, a plurality of first through holes are provided at the bottom of the first groove, and the sealing portion is connected to the bearing body and seals the first through holes.

7. The projection exposure apparatus according to claim 6, characterized in that: A second through hole is provided in the working platform. When the second supporting component is placed on the working platform, the second through hole is coaxial with the first through hole.

8. The projection exposure apparatus according to claim 7, characterized in that: The projection exposure device further comprises a lifting assembly, wherein the lifting assembly comprises a driving part and a moving shaft, and the driving part drives the moving shaft to move so as to place the exposure specimen in the first groove.

9. The projection exposure apparatus according to claim 8, characterized in that: One end of the motion shaft is located in the second through hole, and the other end is connected to the driving part. The driving part is located on a side of the work platform away from the light source assembly and drives the motion shaft to move along the central axis direction of the first through hole.

10. The projection exposure apparatus according to claim 9, characterized in that: The sealing part is a movable sealing ring. When the moving shaft passes through the movable sealing ring, the movable sealing ring abuts against the moving shaft, so that the moving shaft and the bearing body are water-tight.

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