Liquid cooling heat dissipation device and electronic product
By using a combination of phase change material barrier and liquid heat dissipation material in the liquid-cooled heat dissipation device, the chip overtemperature problem caused by the loss of liquid metal thermal paste is solved, and effective heat dissipation and loss prevention effects are achieved.
Patent Information
- Application Number
- CN202420097089.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-15
- Publication Date
- 2025-02-07
- Estimated Expiration
- 2034-01-15
AI Technical Summary
When liquid metal thermal paste is used on high-power chips, liquid metal may be lost due to physical vibration and other reasons, destroying the heat dissipation channel, resulting in the chip being over-tempered and reduced.
A liquid-cooled heat dissipation device is adopted, which includes a hollow annular phase change material enclosure, the liquid heat dissipation material is arranged in the hollow structure of the enclosure, and the heat dissipation module is superimposed on the fence structure and the liquid heat dissipation material surface, and the When the temperature rises, the phase change material changes from a solid state to a molten state, providing both a fence and heat dissipation.
Effectively prevent the loss of liquid heat dissipation materials, ensure the complete heat dissipation channel of the chip, avoid chip overtemperature, and improve the performance and reliability of the chip.
Smart Images
Figure CN222439919U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of heat dissipation of electronic products, in particular to a liquid cooling heat dissipation device and an electronic product. Background Art
[0002] As the cooling power consumption of gaming laptops increases year by year, ultra-high K value heat dissipation interface material pure liquid metal thermal paste (liquid gold) is applied to high-power chips. While high-performance liquid gold brings benefits, there are also problems. Because the heat dissipation interface material is liquid, some physical vibrations, swings, tilts or drops of the system may cause partial or complete loss of liquid gold on the chip surface. The loss of liquid gold will destroy the main heat dissipation channel of the chip, causing the chip to overheat and reduce the performance of the chip.
[0003] The main solution to the above problem is to use foam to enclose the liquid gold on the chip substrate. However, this method cannot effectively enclose a large amount of liquid gold, and can only rely entirely on the tension of the liquid gold itself to leave liquid gold on the chip, thereby reducing the thermal conductivity of the liquid gold, causing the chip to still overheat and reduce performance. Utility Model Content
[0004] In order to solve at least the above technical problems existing in the prior art, the utility model provides a liquid cooling device and an electronic product.
[0005] On the one hand, the utility model provides a liquid-cooled heat dissipation device, including an enclosure structure, a liquid heat dissipation material and a heat dissipation module; the enclosure structure includes a hollow and annular enclosure member, the material of the enclosure member is a phase change material, and when the phase change material reaches the phase change temperature range, it changes from a solid state to a molten state; the liquid heat dissipation material is arranged in the hollow structure of the enclosure member, and is used for heat exchange with a heating element; the heat dissipation module is superimposed on the enclosure structure and the surface of the liquid heat dissipation material, and contacts with the enclosure structure and the liquid heat dissipation material for heat exchange.
[0006] In some embodiments, it also includes a heat dissipation foam, which has a hollow hole in the middle; the enclosure structure and the liquid heat dissipation material are arranged in the hollow hole, and the heat dissipation foam, the enclosure structure and the liquid heat dissipation material are located in the same plane; the heat dissipation foam contacts the heat dissipation module for heat dissipation.
[0007] In some embodiments, the hollow hole of the heat dissipation foam has the same cross-sectional shape as the enclosure, and a gap is provided between the outer end surface of the enclosure and the inner wall of the hollow hole of the heat dissipation foam.
[0008] In some embodiments, a limiting structure is provided on the fitting surface of the heat dissipation module; the limiting structure protrudes from the fitting surface of the heat dissipation module, and the limiting structure extends into the gap, and the outer end surface of the enclosure is in contact with the limiting structure.
[0009] In some embodiments, the limiting structure is annular and is arranged around the periphery of the enclosure.
[0010] In some embodiments, the heat dissipation module includes a heat conductive block, a heat transfer metal sheet and an auxiliary heat dissipation component; the limiting structure is arranged on the heat conductive block, the heat conductive block and the auxiliary heat dissipation component are connected through the heat transfer metal sheet, the heat transfer metal sheet absorbs and transfers the heat on the heat conductive block, and the auxiliary heat dissipation component performs auxiliary heat dissipation on the heat transfer metal sheet.
[0011] In some embodiments, the phase change temperature of the phase change material ranges from 40 degrees Celsius to 50 degrees Celsius.
[0012] Another aspect of the embodiment of the utility model further provides an electronic product, comprising the above-mentioned liquid cooling device.
[0013] In some embodiments, the cross-sectional shape of the hollow structure of the enclosure is the same as the cross-sectional shape of the electronic component to be cooled.
[0014] In some embodiments, the area of the enclosure is larger than the area of the electronic component to be cooled, and a portion of the enclosure overlaps with the electronic component to be cooled.
[0015] The utility model provides a liquid cooling device and electronic product, in which a phase change material is arranged around the periphery of the liquid cooling material, and has a blocking effect on the liquid cooling material to prevent it from flowing at will. When the phase change material has not reached the phase change temperature, the phase change material is solid. At this time, the electronic component may not be running or running at low power consumption. The phase change material mainly plays a blocking effect on the liquid cooling material. As the electronic component is running, its temperature gradually increases. After reaching the phase change temperature, the phase change material is in a molten state. At this time, the phase change material is used for heat dissipation and blocking effects.
[0016] In the technical solution of the utility model, liquid heat dissipation material is used to effectively dissipate heat from electronic components, and phase change material is used to enclose the liquid heat dissipation material. When the phase change material is solid, the electronic product is generally in a state of transportation or carrying, and the overall probability of tilting and shaking is high. Therefore, the solid phase change material has a better enclosure effect; and when the phase change material is molten, the electronic product is being used and is generally in a static state. Therefore, the molten phase change material can be enclosed and has a heat conductive effect. It can be seen that the combination of liquid heat dissipation material and phase change material can not only meet the effective heat dissipation of the heat-generating electronic components, but also avoid the loss of liquid heat dissipation material. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] By reading the detailed description below with reference to the accompanying drawings, the above and other objects, features and advantages of the exemplary embodiments of the present invention will become readily understood. In the accompanying drawings, several embodiments of the present invention are shown in an exemplary and non-limiting manner, wherein:
[0018] In the drawings, the same or corresponding reference numerals represent the same or corresponding parts.
[0019] Figure 1 A front view of a liquid cooling device is provided for an embodiment of the utility model;
[0020] Figure 2 A cross-sectional view of a liquid cooling device is provided for an embodiment of the utility model;
[0021] Figure 3 A schematic diagram of the structure of a heat dissipation module in a liquid cooling heat dissipation device is provided for an embodiment of the utility model;
[0022] Figure 4 A schematic structural diagram of a limiting structure of a heat dissipation module in a liquid cooling heat dissipation device is provided for an embodiment of the utility model.
[0023] In the figure:
[0024] 10: enclosure structure; 20: liquid heat dissipation material; 30: heat dissipation module; 40: heat dissipation foam; 50: heating element;
[0025] 11: enclosure; 31: heat-conducting block; 311: limiting structure; 32: heat-conducting metal sheet; 33: auxiliary heat dissipation component; 41: hollow hole. DETAILED DESCRIPTION
[0026] In order to make the purpose, features and advantages of the utility model more obvious and easy to understand, the technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of them. Based on the embodiments of the utility model, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the utility model.
[0027] The embodiment of the utility model provides a liquid-cooled heat dissipation device, including an enclosure structure, a liquid heat dissipation material and a heat dissipation module; the enclosure structure is used to enclose the liquid heat dissipation material, and a phase change will occur after the temperature rises, thereby effectively enclosing the liquid heat dissipation material; the liquid heat dissipation material has a higher thermal conductivity, which improves the heat dissipation efficiency of the heat dissipation device; the heat dissipation module effectively transfers the heat transferred by the liquid heat dissipation material, thereby achieving the purpose of heat dissipation.
[0028] The following is a detailed description of the various structures of a liquid cooling heat dissipation device provided by an embodiment of the utility model, as well as the positional relationship and connection relationship between the various structures, in conjunction with the accompanying drawings.
[0029] like Figures 1 to 4 As shown, in the embodiment of the utility model, a liquid heat dissipation material 20 is used to dissipate heat from a heating element 50. The liquid heat dissipation material 20 has an ultra-high K value. For example, the K value of the liquid heat dissipation material 20 is above 25W / mk. The cooling effect is better when the liquid heat dissipation material 20 is used. In order to prevent the liquid heat dissipation material 20 from flowing around and reducing the heat dissipation effect or affecting other electronic components, a retaining structure 10 is provided around the liquid heat dissipation material 20.
[0030] The enclosure structure 10 includes a hollow and annular enclosure 11, and the liquid heat dissipation material 20 is arranged in the hollow structure of the enclosure 11 for heat exchange with the heating element 50; the material of the enclosure 11 is a phase change material, and when the phase change material reaches the phase change temperature range, it changes from a solid state to a molten state. According to the use scenario of electronic products, taking a laptop as an example, when the laptop is used, it is generally placed horizontally on the work surface, and the whole is in a static state, and the probability of tilting, shaking, etc. is low. When the laptop is not in use, it may be in a static state, and it may also be tilted or shaken due to transportation, carrying, etc. It can be seen that if a liquid heat dissipation material 20 is used, when the electronic product is not in use (including a low-power operation state), the electronic product is more likely to tilt, shake, etc. At this time, it is more necessary to effectively enclose the liquid heat dissipation material 20. In the use state, not only enclosure is required, but also more efficient heat dissipation is required. When the electronic product is in use, it is relatively static, so the requirements for enclosure will be reduced.
[0031] For example, the liquid heat dissipation material 20 is composed of a variety of heavy metals and a variety of heavy metal oxides, for example, the phase change material is composed of silicone grease. In the embodiment of the utility model, the materials of the liquid heat dissipation material 20 and the phase change material are not limited, as long as the thermal conductivity requirements are met and the two do not chemically react.
[0032] Based on this, in the embodiment of the utility model, the enclosure 11 can switch between the solid state and the molten state. For example, the phase change temperature range of the phase change material can be controlled at 40 degrees Celsius to 50 degrees Celsius. Take the operation of a laptop computer at 45 degrees Celsius as an example, and the heating element 50 is the chip of the laptop computer. At room temperature, and when the laptop computer is not running, the phase change material is in a solid state. At this time, the enclosure 11 is in a solid state for effective enclosure. When the laptop computer is running, the temperature of the chip begins to gradually exceed 45 degrees Celsius. Subsequently, the phase change material will be converted from a solid state to a molten state as the temperature rises. The molten phase change material meets the enclosure requirements when the laptop computer is stationary. At the same time, the molten phase change material can dissipate heat together with the liquid heat dissipation material 20. For example, the K value of the phase change material is above 8W / mk, and its heat exchange efficiency is lower than that of the liquid heat dissipation material 20, but it can also perform auxiliary heat dissipation operations.
[0033] In the embodiment of the utility model, the heat dissipation module 30 is superimposed on the enclosure structure 10 and the surface of the liquid heat dissipation material 20, and contacts and exchanges heat with the enclosure structure 10 and the liquid heat dissipation material 20. After the heat-generating element 50 is effectively exchanged with heat by the enclosure structure 10 and the liquid heat dissipation material 20, the absorbed heat can be dissipated by the heat dissipation module 30, thereby achieving continuous cooling of the heat-generating element 50. For example, the heat dissipation module 30 includes a heat-conducting block 31, a heat-conducting metal sheet 32 and an auxiliary heat dissipation component 33; the edge of the heat-conducting block 31 is fitted with the top of the phase change material, and the liquid heat dissipation material 20 can be sealed in the space surrounded by the heat-conducting block 31, the phase change material and the surface of the heat-generating element 50. The heat-conducting block 31 transfers the heat to the heat-conducting metal sheet 32, and the heat-conducting metal sheet 32 conducts the heat in a directional manner, that is, transfers the heat to the auxiliary heat dissipation component 33, and the heat on the heat-conducting metal sheet 32 is discharged through the auxiliary heat dissipation component 33. For example, the auxiliary heat dissipation component 33 is a heat dissipation fan, and the heat is discharged by the airflow generated by the heat dissipation fan.
[0034] In the embodiment of the utility model, the liquid cooling heat dissipation device further includes a heat dissipation foam 40, and a hollow hole 41 is provided in the middle of the heat dissipation foam 40; the enclosure structure 10 and the liquid heat dissipation material 20 are arranged in the hollow hole 41, and the heat dissipation foam 40, the enclosure structure 10 and the liquid heat dissipation material 20 are located in the same plane; the heat dissipation foam 40 is in contact with the heat dissipation module 30 for heat dissipation. The heat dissipation foam 40 is arranged around the periphery of the enclosure structure 10 (phase change material), which can further block the liquid heat dissipation material 20, thereby reducing the probability of the liquid heat dissipation material 20 flowing out of the liquid cooling heat dissipation device.
[0035] Specifically, when the liquid cooling device is assembled, the heat dissipation foam 40 is directly attached to the base of the heating element 50 at the factory end, and the liquid heat dissipation material 20 is sprayed onto the heating element 50 at high speed by the voltage valve of the dispensing machine. The surface of the liquid heat dissipation material 20 is slightly smaller than the surface area of the heating element 50. The enclosure structure 10 is directly attached to the heat conductive block 31 of the heat dissipation module 30. When the liquid cooling device is assembled, the heat dissipation foam 40, the enclosure structure 10 (phase change material) and the liquid heat dissipation material 20 will be squeezed by the heat conductive block 31, among which some of the liquid heat dissipation material 20 will pass over the enclosure structure 10 and cover the outside of the chip, and the remaining liquid heat dissipation material 20 on the chip surface is surrounded by the phase change material and used for heat exchange.
[0036] For example, the hollow hole 41 of the heat dissipation foam 40 has the same cross-sectional shape as the enclosure 11, and a gap is provided between the outer end surface of the enclosure 11 and the inner wall of the hollow hole 41 of the heat dissipation foam 40. The space of the gap is used to accommodate the liquid heat dissipation material 20 flowing out of the phase change material when the liquid cooling heat dissipation device is assembled.
[0037] In the embodiment of the utility model, a limiting structure 311 is provided on the fitting surface of the heat dissipation module 30; the limiting structure 311 protrudes from the fitting surface of the heat dissipation module 30, and the limiting structure 311 extends into the gap, and the outer end surface of the enclosure 11 abuts against the limiting structure 311. When the enclosure 11 changes from a solid state to a molten state, the gap between the heat dissipation block and the surface of the heating element 50 will be filled when the liquid cooling heat dissipation device is assembled, and the limiting structure 311 (such as the limiting structure 311 is about 0.1 mm high) is used to surround the molten phase change material. When the heating element 50 stops running, the phase change material changes from a molten state to a solid state again. At this time, the solid phase change material forms a stable and solid enclosure, thereby effectively sealing the liquid heat dissipation material 20. In this state, when the electronic product is transported or carried, the liquid heat dissipation material 20 will not be lost or the probability of loss is low. When the phase change material is in a molten state, it does not flow due to its strong viscosity, so it can also play a role in enclosing the liquid heat dissipation material 20 to a certain extent. The electronic product is less likely to be moved during use, so the possibility of the liquid heat dissipation material 20 being lost is also smaller.
[0038] For example, the limiting structure 311 is annular, and the limiting structure 311 is disposed around the periphery of the enclosure 11. The shape of the limiting structure 311 matches the shape of the enclosure 11, and any position around the enclosure 11 can be effectively enclosed.
[0039] The embodiment of the utility model also provides an electronic product, including the above-mentioned liquid cooling and heat dissipation device. The motherboard of the electronic product includes a plurality of types of heating elements 50 that generate heat, and a liquid cooling and heat dissipation device is configured on the heating element 50 to perform effective heat dissipation. For example, the heating element 50 is a laptop computer. On the motherboard of the laptop computer, the chip is a high-heating heating element 50, and the above-mentioned liquid cooling and heat dissipation device is arranged on the surface of the chip, thereby achieving efficient cooling and heat dissipation of the chip.
[0040] For example, the cross-sectional shape of the hollow structure of the enclosure 11 is the same as the cross-sectional shape of the heat-generating element 50 to be dissipated. Taking the chip of a laptop computer as an example, if the interface shape of the chip is rectangular, the cross-sectional shape of the hollow structure of the corresponding enclosure 11 is also set to be rectangular. The same cross-sectional shape makes the contact area between the heat dissipation material and the chip more uniform, thereby facilitating uniform heat dissipation of the chip.
[0041] In the embodiment of the utility model, the area of the enclosure 11 is larger than the area of the heating element 50 to be radiated, and part of the enclosure 11 overlaps with the heating element 50 to be radiated. This structural setting can ensure that the liquid heat dissipation material 20 is surrounded on the surface of the heating element 50, and the phase change material can be structured with the heating element 50 to absorb the heat generated by the heating element 50 in time and undergo phase change.
[0042] The utility model provides a liquid cooling device and electronic product, in which a phase change material is arranged around the periphery of a liquid heat dissipation material 20, and has a containment effect on the liquid heat dissipation material 20 to prevent it from flowing at will. When the phase change material has not reached the phase change temperature, the phase change material is in a solid state. At this time, the heating element 50 may not be running or running at low power consumption. The phase change material mainly plays a containment effect on the liquid heat dissipation material 20. As the heating element 50 runs, its temperature gradually increases. After reaching the phase change temperature, the phase change material is in a molten state. At this time, the phase change material is used for heat dissipation and containment.
[0043] In the technical solution of the utility model, liquid heat dissipation material 20 is used to effectively dissipate heat from the heating element 50, and phase change material is used to enclose the liquid heat dissipation material 20. When the phase change material is solid, the electronic product is generally in a state of transportation or carrying, and the overall probability of tilting and shaking is high. Therefore, the solid phase change material has a better enclosure effect; and when the phase change material is molten, the electronic product is being used and is generally in a static state. Therefore, the molten phase change material can be enclosed and has a heat conductive effect. It can be seen that the combination of liquid heat dissipation material 20 and phase change material can not only meet the effective heat dissipation of the heating element 50, but also avoid the loss of liquid heat dissipation material 20.
[0044] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine different embodiments or examples described in this specification and the features of different embodiments or examples, unless they are contradictory.
[0045] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.
[0046] The above are only specific implementations of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.
Claims
1. A liquid cooling device, characterized in that: It comprises an enclosure structure (10), a liquid heat dissipation material (20) and a heat dissipation module (30); The enclosure structure (10) comprises a hollow and annular enclosure member (11), the material of the enclosure member (11) is a phase change material, and when the phase change material reaches a phase change temperature range, it changes from a solid state to a molten state; The liquid heat dissipation material (20) is arranged in the hollow structure of the enclosure (11) and is used for exchanging heat with the heating element (50); The heat dissipation module (30) is superimposed on the surface of the enclosure structure (10) and the liquid heat dissipation material (20), and is in contact with the enclosure structure (10) and the liquid heat dissipation material (20) for heat exchange.
2. The liquid cooling device according to claim 1, characterized in that: It also includes a heat dissipation foam (40), wherein a hollow hole (41) is provided in the middle of the heat dissipation foam (40); The enclosure structure (10) and the liquid heat dissipation material (20) are arranged in the hollow hole (41), and the heat dissipation foam (40), the enclosure structure (10) and the liquid heat dissipation material (20) are located in the same plane; The heat dissipation foam (40) contacts the heat dissipation module (30) to dissipate heat.
3. The liquid cooling device according to claim 2, characterized in that: The hollow hole (41) of the heat dissipation foam (40) has the same cross-sectional shape as the enclosure (11), and a gap is provided between the outer end surface of the enclosure (11) and the inner wall of the hollow hole (41) of the heat dissipation foam (40).
4. The liquid cooling device according to claim 3, characterized in that: A limiting structure (311) is provided on the fitting surface of the heat dissipation module (30); The limiting structure (311) protrudes from the fitting surface of the heat dissipation module (30), and the limiting structure (311) extends into the interval, and the outer end surface of the enclosure (11) abuts against the limiting structure (311).
5. The liquid cooling device according to claim 4, characterized in that: The limiting structure (311) is annular in shape and is arranged around the periphery of the enclosure (11).
6. The liquid cooling device according to claim 4, characterized in that: The heat dissipation module (30) comprises a heat conduction block (31), a heat transfer metal sheet (32) and an auxiliary heat dissipation component (33); The limiting structure (311) is arranged on the heat-conducting block (31); the heat-conducting block (31) and the auxiliary heat-dissipating component (33) are connected via the heat-conducting metal sheet (32); the heat-conducting metal sheet (32) absorbs and transfers the heat on the heat-conducting block (31); and the auxiliary heat-dissipating component (33) performs auxiliary heat dissipation on the heat-conducting metal sheet (32).
7. The liquid cooling device according to claim 6, characterized in that: The phase change temperature range of the phase change material is 40 degrees Celsius to 50 degrees Celsius.
8. An electronic product, characterized in that: It comprises the liquid cooling heat dissipation device as claimed in any one of claims 1 to 7.
9. The electronic product according to claim 8, characterized in that: The cross-sectional shape of the hollow structure of the enclosure (11) is the same as the cross-sectional shape of the heating element (50) to be cooled.
10. The electronic product according to claim 9, characterized in that: The area of the enclosure (11) is larger than the area of the heating element (50) to be cooled, and a portion of the enclosure (11) overlaps with the heating element (50).