Thermal overload structure and thermal overload relay
By setting insulating parts in the thermal overload structure of the thermal overload relay to separate the conductive plate and the thermal deformation assembly, the conductive rod and the thermal deformation assembly, the burning, melting or gasification problems caused by high current overheating are solved, and good insulation is achieved Performance and anti-electric breakdown effect.
Patent Information
- Application Number
- CN202420238020.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-31
- Publication Date
- 2025-02-07
- Estimated Expiration
- 2034-01-31
AI Technical Summary
In the case of short circuit, existing thermal overload relays are prone to burn, melt or gasification due to overheating of high current, forming metal particles, reducing insulation performance and possibly leading to electrical breakdown.
A thermal overload structure is designed, by providing a first insulating member between the conductive plate and the thermal deformation assembly, a second insulating member between the conductive rod and the thermal deformation assembly, a conductive rod and Thermal deformation components ensure good insulation performance.
It effectively prevents electric breakdown, ensures the insulation performance of the thermal overload structure, and avoids damage caused by overheating of high currents.
Smart Images
Figure CN222440487U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of low-voltage electrical appliances, in particular to a thermal overload structure and a thermal overload relay. Background Art
[0002] Thermal overload relay is an overload relay that uses the principle of thermal effect of current and uses an electrical thermal bimetallic strip as a sensitive element. The so-called electrical thermal bimetallic strip is made by heating and rolling two alloys with large differences in linear expansion coefficients. When heated, the bimetallic strip bends from the high expansion layer to the low expansion layer. When the current is too large, the bimetallic strip moves due to "heat", so that its linked break contacts cut off the power supply of the controlled circuit and the protected equipment.
[0003] In the prior art, such as Figure 1 As shown, the thermal overload structure of the thermal overload relay generally includes a conductive rod 10, a thermal deformation component 20 and a conductive plate 30, wherein the conductive rod 10, the thermal deformation component 20 and the conductive plate 30 are electrically connected in series in the thermal overload structure; spatially, the distance between the conductive rod 10 and the thermal deformation component 20, as well as between the thermal deformation component 20 and the conductive plate 30, is relatively close, and only air medium is used for insulation. Under normal working conditions, the current flows through the conductive rod 10, the thermal deformation component 20 and the conductive plate 30 in sequence. However, under the working conditions of circuit faults, especially in the case of short circuits, the current is very large, and the thermal deformation component 20 will be overheated due to the large current and burn, melt, or even vaporize to form metal particles. The burnt and melted metal fragments are scattered inside the shell of the thermal overload relay and on the conductive plate 30. The vaporized metal particles are also distributed inside the shell of the thermal overload relay, reducing the insulation performance of the thermal overload structure, making it very easy for the conductors that were originally insulated by the air medium to conduct. The current may skip the thermal deformation component 20 and connect with the conductive plate 30, or the current only flows through part of the thermal deformation component 20 and flows to the conductive plate 30. In severe cases, it will cause electrical breakdown and damage. Utility Model Content
[0004] One purpose of the utility model is to provide a thermal overload structure with good insulation performance and effectively prevent electrical breakdown from occurring.
[0005] To achieve this purpose, the utility model adopts the following technical solutions:
[0006] A thermal overload structure is provided, comprising:
[0007] Thermal deformation components;
[0008] A conductive plate, disposed on a first side of the thermal deformation component along a first direction, wherein a first end of the conductive plate is electrically connected to the thermal deformation component;
[0009] A conductive rod, disposed on a second side of the thermal deformation component along the first direction, wherein a first end of the conductive rod is electrically connected to the thermal deformation component;
[0010] The insulating component comprises a first insulating member and a second insulating member, wherein the first insulating member is arranged between the conductive plate and the thermal deformation component, and the second insulating member is arranged between the conductive rod and the thermal deformation component.
[0011] Optionally, the conductive plate is provided with slots on both sides along the second direction, and the first insulating member is provided with buckles on both sides along the second direction, and the buckles are engaged with the slots on the corresponding sides.
[0012] Optionally, the thermal deformation components, the conductive plates and the conductive rods are arranged in multiple corresponding ways, and the insulating component includes multiple first insulating members and one second insulating member, the first insulating members are clamped on the conductive plates in a one-to-one manner, and the second insulating member is arranged between all the conductive rods and all the thermal deformation components.
[0013] Optionally, a plurality of accommodating grooves are provided at intervals along the second direction on a side of the second insulating member facing away from the thermal deformation component along the first direction, the accommodating grooves are arranged in one-to-one correspondence with the conductive rods, and at least a portion of the conductive rods is arranged in the corresponding accommodating grooves.
[0014] Optionally, the thermal deformation component includes:
[0015] A bimetallic strip, wherein a first end of the bimetallic strip is electrically connected to a first end of the conductive plate;
[0016] A sleeve is sleeved on the bimetallic strip, wherein the first end and the second end of the bimetallic strip both protrude from the sleeve;
[0017] a resistance belt, spirally wound on the sleeve, wherein a first end of the resistance belt is electrically connected to a second end of the bimetallic strip, and a second end of the resistance belt is electrically connected to a first end of the conductive rod; and
[0018] The insulating assembly further comprises a third insulating member, the third insulating member is provided with an insulating slot, and the first end of the bimetallic strip and the first end of the conductive plate are both inserted into the insulating slot.
[0019] Optionally, the sleeve extends into the insulation groove.
[0020] Optionally, at least a portion of the resistance band is disposed within the insulating slot.
[0021] Optionally, the insulating groove is stepped, including a first step groove portion and a second step groove portion, the width B1 of the first step groove portion is smaller than the width B2 of the second step groove portion, the first end of the bimetallic strip passes through the first step groove portion and the second step groove portion in sequence, and the first end of the conductive plate passes through the second step groove portion.
[0022] Another object of the present utility model is to provide a thermal overload relay, comprising a housing and any one of the thermal overload structures described above, wherein the thermal overload structure is arranged in the housing.
[0023] Optionally, a partition plate is provided in the shell, a first limiting groove is provided on the partition plate, a second limiting groove is provided on one side of the second insulating member along the first direction toward the thermal deformation component, the second insulating member is clamped with the first limiting groove, and the partition plate is clamped with the second limiting groove.
[0024] Beneficial effects:
[0025] In the thermal overload structure provided by the utility model, the first insulating member is arranged between the conductive plate and the thermal deformation component to separate the conductive plate and the thermal deformation component, so that the portion separated between the conductive plate and the thermal deformation component has good insulation performance; the second insulating member is arranged between the conductive rod and the thermal deformation component to separate the conductive rod and the thermal deformation component, so that the portion separated between the conductive rod and the thermal deformation component has good insulation performance, thereby making the entire thermal overload structure have good insulation performance, effectively preventing the occurrence of electrical breakdown.
[0026] The thermal overload relay provided by the utility model can effectively prevent the occurrence of electrical breakdown through the design of the thermal overload structure. BRIEF DESCRIPTION OF THE DRAWINGS
[0027] Figure 1 It is a structural schematic diagram of a thermal overload structure in the prior art;
[0028] Figure 2 This is a structural schematic diagram of a thermal overload structure provided by the utility model from one perspective;
[0029] Figure 3 This is a structural schematic diagram of the thermal overload structure provided by the utility model from another perspective;
[0030] Figure 4 It is a structural schematic diagram of the thermal overload relay provided by the utility model;
[0031] Figure 5 It is a structural schematic diagram of the thermal overload relay provided by the utility model at the conductive plate;
[0032] Figure 6 It is a partial structural exploded diagram of the thermal overload relay provided by the utility model;
[0033] Figure 7 It is a partial structural schematic diagram of the thermal overload relay provided by the utility model;
[0034] Figure 8 is a cross-sectional view of the thermal overload structure provided by the utility model;
[0035] Fig. 9 It is a structural schematic diagram of the third insulating member provided by the utility model.
[0036] In the figure:
[0037] 10. Conductive rod; 20. Thermal deformation component; 30. Conductive plate;
[0038] 100, housing; 110, first housing; 111, partition plate; 1111, first limiting groove; 112, mounting groove; 113, positioning groove; 120, second housing;
[0039] 200, thermal overload structure; 210, thermal deformation component; 211, bimetallic strip; 212, sleeve; 213, resistance belt; 220, conductive plate; 221, connecting portion; 222, supporting portion; 2221, slot; 223, wiring portion; 230, conductive rod; 240, insulating component; 241, first insulating member; 2411, buckle; 242, second insulating member; 2421, second limiting slot; 2422, accommodating slot; 243, third insulating member; 2431, insulating slot; 24311, first stepped slot portion; 24312, second stepped slot portion. DETAILED DESCRIPTION
[0040] The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only the parts related to the present invention, rather than all structures, are shown in the accompanying drawings.
[0041] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0042] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.
[0043] In the description of this embodiment, the terms "upper", "lower", "right", etc., directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplification of operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.
[0044] Reference Figures 2 to 4 As shown, this embodiment provides a thermal overload structure 200 , including a housing 100 and the thermal overload structure 200 , wherein the thermal overload structure 200 is disposed in the housing 100 .
[0045] Specifically, the thermal overload structure 200 includes a thermal deformation component 210, a conductive plate 220, a conductive rod 230 and an insulating component 240. The conductive plate 220 is arranged on the first side of the thermal deformation component 210 along the first direction, and the first end of the conductive plate 220 is electrically connected to the thermal deformation component 210; the conductive rod 230 is arranged on the second side of the thermal deformation component 210 along the first direction, and the first end of the conductive rod 230 is electrically connected to the thermal deformation component 210; the insulating component 240 includes a first insulating member 241 and a second insulating member 242, the first insulating member 241 is arranged between the conductive plate 220 and the thermal deformation component 210, and the second insulating member 242 is arranged between the conductive rod 230 and the thermal deformation component 210. The second end of the conductive plate 220 and the second end of the conductive rod 230 are both used to electrically connect to an external circuit. The a direction in the figure is the first direction.
[0046] In this embodiment, the thermal overload relay effectively prevents the occurrence of electrical breakdown through the design of the thermal overload structure 200. Specifically, the first insulating member 241 is disposed between the conductive plate 220 and the thermal deformation assembly 210 to separate the conductive plate 220 and the thermal deformation assembly 210, so that the portion separated between the conductive plate 220 and the thermal deformation assembly 210 has good insulation performance; the second insulating member 242 is disposed between the conductive rod 230 and the thermal deformation assembly 210 to separate the conductive rod 230 and the thermal deformation assembly 210, so that the portion separated between the conductive rod 230 and the thermal deformation assembly 210 has good insulation performance, thereby making the entire thermal overload structure 200 have good insulation performance, effectively preventing the occurrence of electrical breakdown.
[0047] Exemplarily, the first insulating member 241 and the second insulating member 242 are both plate-shaped.
[0048] In this embodiment, refer to Figure 2 , Figure 3 and Figure 5 As shown, the thermal deformation assembly 210, the conductive plate 220 and the conductive rod 230 are arranged in a one-to-one correspondence, and the insulating assembly 240 includes a plurality of first insulating members 241, and the first insulating members 241 are clamped on the conductive plate 220 in a one-to-one correspondence, so as to facilitate the assembly of the thermal overload structure 200. In this embodiment, the thermal deformation assembly 210, the conductive plate 220 and the conductive rod 230 are arranged in a plurality of intervals along the second direction. The direction b in the figure is the second direction.
[0049] Specifically, the conductive plate 220 is provided with a card slot 2221 on both sides along the second direction, and the first insulating member 241 is provided with a card buckle 2411 on both sides along the second direction. The card buckle 2411 is engaged with the card slot 2221 on the corresponding side to ensure that the card connection between the conductive plate 220 and the first insulating member 241 is stable, and facilitates the molding and manufacturing of the conductive plate 220 and the first insulating member 241. In this embodiment, the conductive plate 220 includes a connecting portion 221, a supporting portion 222 and a wiring portion 223 from the first end to the second end. The connecting portion 221 is electrically connected to the thermal deformation component 210, and the supporting portion 222 is provided with a card buckle 2411 on both sides along the second direction. The wiring portion 223 is used to electrically connect to an external circuit. Among them, the conductive plate 220 can be formed by bending, and the support part 222 and the wiring part 223 are L-shaped. The side of the support part 222 at one end away from the wiring part 223 is bent and extended to form a connecting part 221 to facilitate electrical contact between the connecting part 221 and the thermal deformation component 210.
[0050] Furthermore, the insulating assembly 240 includes a second insulating member 242 , which is disposed between all the conductive rods 230 and all the thermal deformation assemblies 210 , and facilitates fixing the second insulating member 242 in the housing 100 while separating all the conductive rods 230 and all the thermal deformation assemblies 210 .
[0051] In this embodiment, refer to Figure 3 , Figure 4 , Figure 6 and Figure 7 As shown, a partition plate 111 is provided in the housing 100, and a first limiting groove 1111 is provided on the partition plate 111, and a second limiting groove 2421 is provided on the side of the second insulating member 242 facing the thermal deformation component 210 along the first direction, and the second insulating member 242 is engaged with the first limiting groove 1111, and the partition plate 111 is engaged with the second limiting groove 2421. In this embodiment, the first limiting groove 1111 penetrates the partition plate 111 along the second direction, and the second insulating member 242 is engaged with the first limiting groove 1111 through the second insulating member 242, so as to realize the positioning of the second insulating member 242 along the third direction; the second limiting groove 2421 penetrates the partition plate 111 along the third direction, and the partition plate 111 is engaged with the second limiting groove 2421 through the second limiting groove 2421, so as to realize the positioning of the second insulating member 242 along the second direction. Wherein, the c direction in the figure is the third direction.
[0052] Furthermore, a partition plate 111 is respectively provided between adjacent conductive plates 220, and the partition plate 111 extends to the thermal deformation component 210, that is, the partition plate 111 can separate adjacent conductive plates 220 and adjacent thermal deformation components 210, effectively preventing the occurrence of phase-to-phase short circuit.
[0053] Further, the housing 100 includes a first shell 110 and a second shell 120 that are detachably connected, a partition plate 111 is arranged in the first shell 110, and the thermal deformation assembly 210, the conductive plate 220 and the first insulating member 241 are all arranged in the first shell 110. It can be understood that the partition plate 111 can separate the interior of the first shell 110 into a plurality of mounting grooves 112, and the thermal deformation assembly 210, the conductive plate 220 and the first insulating member 241 are respectively arranged in the corresponding mounting grooves 112. Further, the second insulating member 242 is arranged between the first shell 110 and the second shell 120, and the side of the second insulating member 242 facing away from the thermal deformation assembly 210 along the first direction abuts against the second shell 120 to achieve the positioning of the second insulating member 242 along the first direction. In this embodiment, the inner side surface of the first limiting groove 1111 away from the first end of the conductive plate 220 along the first direction can overlap with the inner side surface of the mounting groove 112.
[0054] In a feasible embodiment, the second insulating member 242 is provided with a plurality of accommodating grooves 2422 spaced apart along the second direction on one side facing away from the heat deformation component 210 along the first direction, and the accommodating grooves 2422 are arranged one-to-one corresponding to the conductive rods 230, and at least a portion of the conductive rods 230 is arranged in the corresponding accommodating grooves 2422 to position and fix the conductive rods 230 to prevent the conductive rods 230 from being deformed.
[0055] Furthermore, positioning grooves 113 corresponding to the conductive rods 230 are disposed in the first housing 110 , and the first ends of the conductive rods 230 extend into the corresponding positioning grooves 113 to position the conductive rods 230 .
[0056] In this embodiment, refer to Figure 2 , Figure 3 , Figure 8 and Fig. 9 As shown, the thermal deformation component 210 includes a bimetallic strip 211, a sleeve 212 and a resistance strip 213. The first end of the bimetallic strip 211 is electrically connected to the first end of the conductive plate 220, that is, the first end of the bimetallic strip 211 is electrically connected to the connecting portion 221 of the conductive plate 220; the sleeve 212 is sleeved on the bimetallic strip 211, and the first end and the second end of the bimetallic strip 211 are both protruding from the sleeve 212; the resistance strip 213 is spirally wound on the sleeve 212, the first end of the resistance strip 213 is electrically connected to the second end of the bimetallic strip 211, and the second end of the resistance strip 213 is electrically connected to the first end of the conductive rod 230. In this embodiment, the sleeve 212 can separate the portion of the resistor belt 213 that is not electrically connected to the bimetallic strip 211, so that the current passes through the conductive rod 230, the resistor belt 213, the bimetallic strip 211 and the conductive plate 220 in sequence, and the first end and the second end of the bimetallic strip 211 are both protruding from the sleeve 212 to facilitate the connection between the bimetallic strip 211 and the resistor belt 213 and the conductive plate 220. The resistor belt 213 may burn, melt, or even vaporize to form metal particles when the current is too large. The first insulating member 241 is used to prevent the melted metal fragments and the vaporized metal particles from scattering on the conductive plate 220, and the second insulating member 242 is used to prevent the melted metal fragments and the vaporized metal particles from scattering on the conductive rod 230. The sleeve 212 is made of insulating material.
[0057] Furthermore, the insulating assembly 240 further includes a third insulating member 243, and the third insulating member 243 is provided with an insulating slot 2431. The first end of the bimetallic strip 211 and the first end of the conductive plate 220 are both inserted into the insulating slot 2431. The first end of the bimetallic strip 211 and the first end of the conductive plate 220 are separated from the second end of the resistor band 213 and the first end of the conductive rod 230 by the third insulating member 243, and in combination with the first insulating member 241 and the second insulating member 242, it is possible to prevent the current from flowing through the conductive rod 230 and only flowing through a part of the resistor band 213 or the bimetallic strip 211 and then flowing to the conductive plate 220, or to prevent the current from flowing through the conductive rod 230 and then skipping the resistor band 213 or the bimetallic strip 211 and directly flowing to the conductive plate 220. In addition, the third insulating member 243 forms a limit for the first end of the bimetallic strip 211 and the first end of the conductive plate 220 to ensure that the contact between the bimetallic strip 211 and the conductive plate 220 is stable and reliable.
[0058] In a feasible embodiment, the opening of the insulating groove 2431 extends from the side of the third insulating member 243 along the third direction toward the bimetallic strip 211 to the side of the third insulating member 243 along the first direction toward the conductive plate 220, so as to be suitable for the connecting portion 221 of the conductive plate 220 to be inserted into the insulating groove 2431.
[0059] In a feasible implementation, the sleeve 212 extends into the insulating slot 2431 to better separate the bimetallic strip 211 from the conductive plate 220 and the conductive rod 230 , thereby achieving a better insulation effect.
[0060] In a feasible implementation manner, at least a portion of the resistance belt 213 is disposed in the insulating slot 2431, and the resistance belt 213 can be limited by the third insulating member 243, so that the resistance belt 213 is stably wound around the sleeve 212. Exemplarily, the second end of the resistance belt 213 extends out of the insulating slot 2431 and is bent to be suitable for electrical contact and connection with the conductive rod 230.
[0061] In a feasible embodiment, the insulating groove 2431 is stepped, including a first stepped groove portion 24311 and a second stepped groove portion 24312, the width B1 of the first stepped groove portion 24311 is smaller than the width B2 of the second stepped groove portion 24312, the first end of the bimetallic strip 211 is sequentially penetrated by the first stepped groove portion 24311 and the second stepped groove portion 24312, and the first end of the conductive plate 220 is penetrated by the second stepped groove portion 24312 to better limit the conductive plate 220 and the bimetallic strip 211. The second stepped groove portion 24312 is located along the third direction on the side of the first stepped groove portion 24311 facing away from the bimetallic strip 211.
[0062] Obviously, the above embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention, and are not intended to limit the implementation methods of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the scope of protection of the present invention. It is not necessary and impossible to list all implementation methods here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention shall be included in the scope of protection of the claims of the present invention.
Claims
1. A thermal overload structure, characterized in that: include: Thermal deformation component (210); A conductive plate (220) is arranged on a first side of the thermal deformation component (210) along a first direction, and a first end of the conductive plate (220) is electrically connected to the thermal deformation component (210); A conductive rod (230) is arranged on a second side of the thermal deformation component (210) along the first direction, and a first end of the conductive rod (230) is electrically connected to the thermal deformation component (210); The insulating component (240) comprises a first insulating component (241) and a second insulating component (242), wherein the first insulating component (241) is arranged between the conductive plate (220) and the thermal deformation component (210), and the second insulating component (242) is arranged between the conductive rod (230) and the thermal deformation component (210).
2. The thermal overload structure according to claim 1, characterized in that: The conductive plate (220) is provided with a clamping groove (2221) on both sides along the second direction, and the first insulating member (241) is provided with a clamping buckle (2411) on both sides along the second direction, and the clamping buckle (2411) is clamped with the clamping groove (2221) on the corresponding side.
3. The thermal overload structure according to claim 1, characterized in that: The thermal deformation components (210), the conductive plates (220) and the conductive rods (230) are arranged in a plurality in a one-to-one correspondence, the insulating component (240) comprises a plurality of the first insulating members (241) and one second insulating member (242), the first insulating members (241) are clamped on the conductive plates (220) in a one-to-one correspondence, and the second insulating member (242) is arranged between all the conductive rods (230) and all the thermal deformation components (210).
4. The thermal overload structure according to claim 3, characterized in that: A plurality of accommodating grooves (2422) are provided at intervals along a second direction on a side of the second insulating member (242) facing away from the thermal deformation component (210) along the first direction, and the accommodating grooves (2422) are arranged in a one-to-one correspondence with the conductive rods (230), and at least a portion of the conductive rods (230) is arranged in the corresponding accommodating grooves (2422).
5. The thermal overload structure according to claim 1, characterized in that: The thermal deformation component (210) comprises: A bimetallic strip (211), wherein a first end of the bimetallic strip (211) is electrically connected to a first end of the conductive plate (220); A sleeve (212) is sleeved on the bimetallic strip (211), and a first end and a second end of the bimetallic strip (211) are both protruding from the sleeve (212); a resistance belt (213) spirally wound on the sleeve (212), wherein a first end of the resistance belt (213) is electrically connected to a second end of the bimetallic strip (211), and a second end of the resistance belt (213) is electrically connected to a first end of the conductive rod (230); and The insulating component (240) further comprises a third insulating member (243), wherein the third insulating member (243) is provided with an insulating slot (2431), and the first end of the bimetallic strip (211) and the first end of the conductive plate (220) are both inserted into the insulating slot (2431).
6. The thermal overload structure according to claim 5, characterized in that: The sleeve (212) extends into the insulation groove (2431).
7. The thermal overload structure according to claim 5, characterized in that: At least a portion of the resistance band (213) is disposed in the insulating groove (2431).
8. The thermal overload structure according to claim 5, characterized in that: The insulating groove (2431) is stepped, including a first stepped groove portion (24311) and a second stepped groove portion (24312), wherein a width B1 of the first stepped groove portion (24311) is smaller than a width B2 of the second stepped groove portion (24312), and a first end of the bimetallic strip (211) passes through the first stepped groove portion (24311) and the second stepped groove portion (24312) in sequence, and a first end of the conductive plate (220) passes through the second stepped groove portion (24312).
9. A thermal overload relay, characterized in that: It comprises a housing (100) and a thermal overload structure (200) according to any one of claims 1 to 8, wherein the thermal overload structure (200) is arranged in the housing (100).
10. The thermal overload relay according to claim 9, characterized in that: A partition plate (111) is provided inside the housing (100), a first limiting groove (1111) is provided on the partition plate (111), a second limiting groove (2421) is provided on the second insulating member (242) along the first direction toward a side of the thermal deformation component (210), the second insulating member (242) is clamped with the first limiting groove (1111), and the partition plate (111) is clamped with the second limiting groove (2421).