Inspection jig matched with wafer holder
By designing a gripper for automatic movement and distance adjustment for wafer detection and combined with inspection fixtures, the difficulty of manually moving large-scale wafers in the prior art is solved, and efficient and convenient wafer detection is achieved.
Patent Information
- Application Number
- CN202421089931.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-20
- Publication Date
- 2025-02-07
- Estimated Expiration
- 2034-05-20
AI Technical Summary
In the prior art, the fixture used for wafer detection cannot automatically move large-scale wafers, resulting in artificially moving wafers, which are labor-intensive and inconvenient to use.
A wafer clamping device is designed to cooperate with inspection fixture, including a base plate, a visual detection camera, a sliding plate, a moving mechanism, a lifting mechanism and a clamping mechanism. Automatic movement and distance adjustment are achieved through the moving mechanism and a lifting mechanism to ensure visual inspection. The camera can evenly capture all parts of the wafer.
Automatic movement and uniform detection of large-scale wafers are realized, labor intensity is reduced, detection efficiency is improved, easy to use, and high practicality is high.
Smart Images

Figure CN222440541U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of wafer detection, in particular to a wafer clamper and an inspection jig. Background Art
[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits, which refers to a round wafer made of silicon raw materials. It has a wide range of applications in the field of semiconductors. After the wafer is produced, its appearance needs to be inspected. In the prior art, the utility model patent with patent application number 202221906627.X discloses a fixture for wafer inspection, which mainly includes a clamping mechanism and a camera. When it is used, the wafer is fixed by the clamping mechanism, and then the surface of the wafer is photographed by the camera. After that, the staff can inspect the appearance of the wafer by observing the picture taken by the camera; it is found during use that in order to record the picture of the wafer surface more clearly, the camera will be closer to the wafer. When inspecting some large-sized wafers, since the camera and the clamping mechanism in the above-mentioned prior art cannot be moved, it can only shoot part of the wafer, and the staff needs to move the wafer to enable the camera to capture the entire picture of the wafer. Relying on manual movement of the wafer is not only labor-intensive, but also inconvenient to use, so a kind of inspection fixture that can automatically move the wafer is needed. Utility Model Content
[0003] In order to solve the above technical problems, the utility model provides a wafer clamp and inspection fixture which can not only automatically move the wafer so that the visual inspection camera can evenly capture images of various parts of the wafer and transmit them to the controller, but also adjust the distance between the visual inspection camera and the wafer according to the specifications and thickness of the wafer, and is easy to use and highly practical.
[0004] The wafer clamp of the utility model cooperates with the inspection fixture, including a base plate and a visual inspection camera; it also includes a sliding plate, a moving mechanism, a lifting mechanism and a clamping mechanism, the sliding plate is mounted on the base plate through the moving mechanism, the moving mechanism is used to move the sliding plate, the clamping mechanism is mounted on the sliding plate, the clamping mechanism is used to fix the wafer, the visual inspection camera is mounted on the base plate through the lifting mechanism, and the lifting mechanism is used to lift the visual inspection camera; when inspecting the appearance of the wafer, firstly, the visual inspection camera is connected to an external controller, then the wafer is clamped and fixed by the clamping mechanism, then the visual inspection camera is adjusted in height by the lifting mechanism until the distance between the visual inspection camera and the wafer is a distance suitable for recording, then the visual inspection camera is The inspection camera takes pictures of the wafer and transmits the recorded images to an external controller. The staff can inspect the appearance of the wafer through the image on the controller. When inspecting some large-sized wafers, the sliding plate drives the clamping mechanism to move automatically through the moving mechanism, and the clamping mechanism drives the wafer to move. During the movement, the visual inspection camera evenly photographs the images of various parts of the wafer and transmits them to the controller. When inspecting large-sized wafers, it can automatically move the wafer so that it can evenly photograph the images of various parts of the wafer and transmit them to the controller. There is no need to manually move the wafer, which reduces labor intensity, improves efficiency, is easy to use, and has high practicality.
[0005] Preferably, the clamping mechanism includes a disc, a support tube, a rotary joint, a vacuum pump, a pressure relief pipe and a driving mechanism, the rotary joint is fixedly mounted on the sliding plate, the support tube is rotatably mounted on the rotary joint, the lower end of the support tube is connected to the rotary joint, the vacuum pump is fixedly mounted on the sliding plate, the input end of the vacuum pump is connected to the rotary joint, a chamber is arranged in the disc, a plurality of groups of suction holes communicating with the chamber are arranged on the disc, the upper end of the support tube is connected to the chamber of the disc, the pressure relief pipe is mounted on the support tube, the pressure relief pipe is connected to the support tube, and a valve is arranged on the pressure relief pipe The disc is coaxial with the support tube, and the driving mechanism is installed on the sliding plate. The driving mechanism is used to rotate the support tube. When fixing the wafer, first place the wafer on the upper end of the disc, and then turn on the vacuum pump. The vacuum pump makes the cavity of the disc a negative pressure state through the rotating joint and the support tube, so that the wafer is adsorbed and fixed on the disc. Then, the wafer is recorded by the visual inspection camera. When the recording is completed, turn off the vacuum pump, open the valve on the pressure relief pipe, break the negative pressure state in the disc, and then remove the wafer from the disc, which facilitates the fixation of the wafer.
[0006] Preferably, the driving mechanism includes a bevel gear A, a bevel gear B, a motor and a support plate, the bevel gear A is fixedly mounted on the support tube, the bevel gear A is meshed with the bevel gear B, a rotating shaft is provided on the bevel gear B, the rotating shaft is rotatably mounted on the support plate, the input end of the rotating shaft is connected to the motor, and the motor is fixedly mounted on the support plate; when large-sized wafers are to be photographed, the motor is turned on, the motor drives the bevel gear B to drive the bevel gear A to rotate slowly through the rotating shaft, and the bevel gear A drives the wafer to rotate through the support tube. During the rotation of the wafer, the visual inspection camera can evenly record various parts of the wafer; the monitoring of the appearance of the wafer is convenient.
[0007] Preferably, the moving mechanism includes an electric slide rail, which is installed on the base plate, and the sliding plate is installed on the electric slide rail, and the electric slide rail is used to move the sliding plate left and right; when performing appearance inspection on the wafer, the support tube drives the disc to move in the left and right direction through the sliding plate, and the disc drives the wafer to move, so that the visual inspection camera can take pictures of the left and right parts of the wafer, thereby facilitating the appearance monitoring of the wafer.
[0008] Preferably, the lifting mechanism includes a support plate, a hydraulic cylinder and a push rod, a bracket is provided on the support plate, the support plate is fixedly mounted on the bottom plate through the bracket, the hydraulic cylinder is fixedly mounted on the upper end of the support plate, the push rod is slid up and down and mounted on the support plate, the upper end of the push rod is connected to the output end of the hydraulic cylinder, and the visual inspection camera is fixedly mounted on the lower end of the push rod; when recording the appearance of the wafer, the hydraulic cylinder is turned on, and the hydraulic cylinder can adjust the height of the visual inspection camera through the push rod until the distance between the visual inspection camera and the wafer is a distance suitable for recording; it can adjust the height of the visual inspection camera according to the thickness of the wafer, has low limitations, and is easy to use.
[0009] Preferably, a reducer is provided on the motor.
[0010] Preferably, a positioning groove is provided at the upper end of the disc, and a rubber pad is provided on the positioning groove; through the above arrangement, the wafer can be placed in the positioning groove of the disc, which facilitates positioning, and the rubber pad prevents the wafer from being scratched.
[0011] Compared with the prior art, the utility model has the following beneficial effects: not only can the wafer be moved automatically so that the visual inspection camera can evenly capture images of various parts of the wafer and transmit them to the controller, but the distance between the visual inspection camera and the wafer can be adjusted according to the specifications and thickness of the wafer. It is easy to use and highly practical. BRIEF DESCRIPTION OF THE DRAWINGS
[0012] Figure 1 It is a first axonometric structural schematic diagram of the utility model;
[0013] Figure 2It is a schematic diagram of the structure of the support tube, rotary joint and motor;
[0014] Figure 3 It is a second axonometric structural schematic diagram of the utility model;
[0015] Figure 4 It is a schematic diagram of the structure of the lifting mechanism and the visual inspection camera;
[0016] Figure 5 It is a main structural schematic diagram of the utility model.
[0017] Markings in the attached drawings: 1. Base plate; 2. Visual inspection camera; 3. Sliding plate; 4. Disc; 5. Support tube; 6. Rotary joint; 7. Vacuum pump; 8. Pressure relief pipe; 9. Bevel gear A; 10. Bevel gear B; 11. Motor; 12. Support plate; 13. Electric slide rail; 14. Support plate; 15. Hydraulic cylinder; 16. Push rod. DETAILED DESCRIPTION
[0018] In order to facilitate the understanding of the utility model, the utility model will be described more comprehensively below with reference to the relevant drawings. The utility model can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the utility model more thorough and comprehensive.
[0019] Example 1
[0020] like Figures 1 to 5The wafer clamper of the utility model cooperates with the inspection fixture and comprises a base plate 1, a visual inspection camera 2, a sliding plate 3, a moving mechanism, a lifting mechanism and a clamping mechanism. The sliding plate 3 is installed on the base plate 1 through the moving mechanism. The moving mechanism is used to move the sliding plate 3. The clamping mechanism is installed on the sliding plate 3. The clamping mechanism is used to fix the wafer. The visual inspection camera 2 is installed on the base plate 1 through the lifting mechanism. The lifting mechanism is used to lift the visual inspection camera 2. When inspecting the appearance of the wafer, the visual inspection camera 2 is first connected to an external controller, and then the wafer is clamped and fixed by the clamping mechanism. Then, the visual inspection camera 2 is adjusted in height by the lifting mechanism until the distance between the visual inspection camera 2 and the wafer is a distance suitable for recording. The rear visual inspection camera 2 takes a picture of the wafer and transmits the recorded image to an external controller. The staff can inspect the appearance of the wafer through the image on the controller. When inspecting some large-sized wafers, the sliding plate 3 drives the clamping mechanism to move automatically through the moving mechanism, and the clamping mechanism drives the wafer to move. During the movement, the visual inspection camera 2 evenly photographs the images of various parts of the wafer and transmits them to the controller. When inspecting large-sized wafers, it can automatically move the wafer so that it can evenly photograph the images of various parts of the wafer and transmit them to the controller. There is no need to manually move the wafer, which reduces labor intensity, improves efficiency, is easy to use, and has high practicality.
[0021] like Figure 1 and Figure 2 The clamping mechanism includes a disc 4, a support tube 5, a rotary joint 6, a vacuum pump 7, a pressure relief pipe 8 and a driving mechanism. The rotary joint 6 is fixedly mounted on the sliding plate 3, the support tube 5 is rotatably mounted on the rotary joint 6, the lower end of the support tube 5 is connected to the rotary joint 6, the vacuum pump 7 is fixedly mounted on the sliding plate 3, the input end of the vacuum pump 7 is connected to the rotary joint 6, a chamber is arranged in the disc 4, a plurality of suction holes communicating with the chamber are arranged on the disc 4, the upper end of the support tube 5 is connected to the chamber of the disc 4, the pressure relief pipe 8 is mounted on the support tube 5, the pressure relief pipe 8 is connected to the support tube 5, and the pressure relief pipe 8 is provided with Valve, disc 4 is coaxial with support tube 5, and the driving mechanism is installed on sliding plate 3, and the driving mechanism is used to rotate support tube 5; when fixing the wafer, first place the wafer on the upper end of disc 4, and then turn on vacuum pump 7, vacuum pump 7 makes the cavity of disc 4 into negative pressure state through rotary joint 6 and support tube 5, so that the wafer is adsorbed and fixed on disc 4, and then the wafer is filmed by visual inspection camera 2, and when the filming is completed, turn off vacuum pump 7, open the valve on pressure relief pipe 8, break the negative pressure state in disc 4, and then remove the wafer from disc 4, which is convenient for fixing the wafer.
[0022] Continue to refer to Figure 2The driving mechanism includes a bevel gear A9, a bevel gear B10, a motor 11 and a support plate 12. The bevel gear A9 is fixedly mounted on the support tube 5. The bevel gear A9 is meshed with the bevel gear B10. A rotating shaft is arranged on the bevel gear B10. The rotating shaft is rotatably mounted on the support plate 12. The input end of the rotating shaft is connected to the motor 11. The motor 11 is fixedly mounted on the support plate 12. When recording large-sized wafers, the motor 11 is turned on. The motor 11 drives the bevel gear A9 to rotate slowly through the rotating shaft by the bevel gear B10. The bevel gear A9 drives the disc 4 to rotate through the support tube 5. During the rotation of the wafer, the visual inspection camera 2 can evenly record various parts of the wafer. This facilitates the monitoring of the appearance of the wafer.
[0023] like Figure 1 The moving mechanism includes an electric slide rail 13, the electric slide rail 13 is installed on the base plate 1, the sliding plate 3 is installed on the electric slide rail 13, and the electric slide rail 13 is used to move the sliding plate 3 left and right; when the appearance of the wafer is inspected, the support tube 5 drives the disc 4 to move in the left and right directions through the sliding plate 3, and the disc 4 drives the wafer to move, so that the visual inspection camera 2 can shoot the left and right parts of the wafer, which is convenient for the appearance monitoring of the wafer.
[0024] like Figure 4 The lifting mechanism includes a support plate 14, a hydraulic cylinder 15 and a push rod 16. A bracket is provided on the support plate 14. The support plate 14 is fixedly mounted on the base plate 1 through the bracket. The hydraulic cylinder 15 is fixedly mounted on the upper end of the support plate 14. The push rod 16 is slidably mounted on the support plate 14 up and down. The upper end of the push rod 16 is connected to the output end of the hydraulic cylinder 15, and the visual inspection camera 2 is fixedly mounted on the lower end of the push rod 16. When recording the appearance of the wafer, the hydraulic cylinder 15 is turned on, and the hydraulic cylinder 15 can adjust the height of the visual inspection camera 2 through the push rod 16 until the distance between the visual inspection camera 2 and the wafer is a distance suitable for recording. The height of the visual inspection camera 2 can be adjusted according to the thickness of the wafer, with low limitations and easy use.
[0025] Example 2
[0026] like Figure 1 On the basis of Example 1, a positioning groove is provided at the upper end of the disk 4, and a rubber pad is provided on the positioning groove; through the above arrangement, the wafer can be placed in the positioning groove of the disk 4, which facilitates positioning, and the rubber pad prevents scratches on the wafer.
[0027] The wafer clamp of the utility model cooperates with the visual inspection camera 2, the rotary joint 6, the vacuum pump 7, the pressure relief pipe 8, the electric slide rail 13 and the hydraulic cylinder 15 of the inspection fixture, which are all purchased on the market. The technicians in this industry only need to install and operate them according to the accompanying instruction manual, without the need for the technicians in this field to make creative labor.
[0028] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principle of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention.
Claims
1. A wafer holder inspection jig, comprising a base plate (1) and a visual inspection camera (2); characterized in that: It also includes a sliding plate (3), a moving mechanism, a lifting mechanism and a clamping mechanism, wherein the sliding plate (3) is mounted on the base plate (1) via the moving mechanism, the moving mechanism is used to move the sliding plate (3), the clamping mechanism is mounted on the sliding plate (3), the clamping mechanism is used to fix the wafer, and the visual inspection camera (2) is mounted on the base plate (1) via the lifting mechanism, and the lifting mechanism is used to lift the visual inspection camera (2).
2. A wafer holder matching inspection jig as claimed in claim 1, characterized in that: The clamping mechanism comprises a disc (4), a support tube (5), a rotary joint (6), a vacuum pump (7), a pressure relief pipe (8) and a driving mechanism. The rotary joint (6) is fixedly mounted on the sliding plate (3). The support tube (5) is rotatably mounted on the rotary joint (6). The lower end of the support tube (5) is connected to the rotary joint (6). The vacuum pump (7) is fixedly mounted on the sliding plate (3). The input end of the vacuum pump (7) is connected to the rotary joint (6). A chamber is arranged inside the disc (4). The disc (4) is provided with a plurality of groups of suction holes communicating with the chamber. The upper end of the support tube (5) is connected to the chamber of the disc (4). The pressure relief pipe (8) is mounted on the support tube (5). The pressure relief pipe (8) is connected to the support tube (5). A valve is arranged on the pressure relief pipe (8). The disc (4) and the support tube (5) are coaxial. The driving mechanism is mounted on the sliding plate (3). The driving mechanism is used to rotate the support tube (5).
3. A wafer holder matching inspection jig as claimed in claim 2, characterized in that: The driving mechanism comprises a bevel gear A (9), a bevel gear B (10), a motor (11) and a support plate (12); the bevel gear A (9) is fixedly sleeved on the support tube (5); the bevel gear A (9) is meshed with the bevel gear B (10); a rotating shaft is arranged on the bevel gear B (10); the rotating shaft is rotatably mounted on the support plate (12); an input end of the rotating shaft is connected to the motor (11); and the motor (11) is fixedly mounted on the support plate (12).
4. A wafer holder matching inspection jig as claimed in claim 1, characterized in that: The moving mechanism comprises an electric slide rail (13), the electric slide rail (13) is mounted on the base plate (1), the sliding plate (3) is mounted on the electric slide rail (13), and the electric slide rail (13) is used to move the sliding plate (3) left and right.
5. The wafer holder matching inspection jig as claimed in claim 1, characterized in that: The lifting mechanism comprises a support plate (14), a hydraulic cylinder (15) and a push rod (16); a bracket is provided on the support plate (14); the support plate (14) is fixedly mounted on the base plate (1) through the bracket; the hydraulic cylinder (15) is fixedly mounted on the upper end of the support plate (14); the push rod (16) is mounted on the support plate (14) in an up-and-down sliding manner; the upper end of the push rod (16) is connected to the output end of the hydraulic cylinder (15); and the visual inspection camera (2) is fixedly mounted on the lower end of the push rod (16).
6. A wafer holder matching inspection jig as claimed in claim 3, characterized in that: The motor (11) is provided with a reducer.
7. A wafer holder matching inspection jig as claimed in claim 2, characterized in that: The upper end of the disc (4) is provided with a positioning groove, and a rubber pad is provided on the positioning groove.
Citation Information
Patent Citations
Jig for wafer inspection
CN217931441U