Wafer patch ring clamping device

Abstract

The utility model provides a wafer patch ring clamping device, comprising a main clamping jaw which is connected to a manipulator through a mounting part, and one side of the main clamping jaw far away from the mounting part is provided with a clamping step matched with the bottom surface for supporting a wafer patch ring; the main clamping jaw is fixedly connected with a first auxiliary clamping jaw and a second auxiliary clamping jaw on the two sides of the clamping step, the upper surfaces of the first auxiliary clamping jaw and the second auxiliary clamping jaw form a first bearing groove and a second bearing groove matched with the bottom surface of the wafer patch ring respectively, and the periphery of the wafer patch ring is attached to the side walls of the clamping step, the first bearing groove and the second bearing groove respectively; the wafer patch ring clamping device is used for solving the problems that the wafer patch ring is possibly deformed due to metal fatigue due to the fact that the contact area between an existing wafer patch ring clamping device and the wafer patch ring is small, and then a wafer is damaged when the wafer is fixed by the wafer patch ring subsequently.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor cleaning equipment, and more specifically to a wafer patch ring clamping device. Background Art

[0002] Since the production process of wafers is complex and their texture is fragile, in order to avoid damage to the wafers during transportation, wafer bonding rings are used to fix the wafers. The wafer handling device clamps the wafer bonding ring to move the wafer fixed at the center. In order to ensure the cleanliness of the wafer during transportation using the wafer bonding ring, that is, to avoid contaminants in the wafer bonding ring from contaminating the wafer during transportation, the wafer bonding ring needs to be cleaned before fixing the wafer, and the wafer bonding ring needs to be clamped during the cleaning process.

[0003] Existing wafer bonding rings are usually made of stainless steel, which has metal elasticity and a certain weight. Figure 1 As shown, it is a schematic diagram of the clamping claws of the wafer patch ring clamping device in the prior art, which supports and clamps one side of the wafer patch ring. The side of the wafer patch ring that is hollowed out in the middle and not clamped will produce a certain degree of inclination due to its own gravity (the inclination angle is generally 1°~4°). If the inclined state is maintained for a certain period of time, or the wafer patch ring is in the inclined state for many times, the wafer patch ring may be deformed due to metal fatigue, which may cause damage to the wafer when the wafer is subsequently fixed.

[0004] In view of this, it is necessary to improve the wafer bonding ring clamping device in the prior art to solve the above problems. Utility Model Content

[0005] The utility model aims to disclose a wafer patch ring clamping device, which is used to solve the problem that the wafer patch ring may be deformed due to metal fatigue due to the small contact area between the existing wafer patch ring clamping device and the wafer patch ring, thereby causing damage to the wafer when the wafer is subsequently fixed by the wafer patch ring.

[0006] To achieve the above-mentioned purpose, the utility model provides a wafer patch ring clamping device, comprising a main clamping jaw, wherein the main clamping jaw is connected to a manipulator through a mounting portion, and a clamping step adapted to the bottom surface of the wafer patch ring is formed on a side of the main clamping jaw away from the mounting portion;

[0007] The main clamp is fixedly connected with a first auxiliary clamp and a second auxiliary clamp on both sides of the clamping step, and the upper surfaces of the first auxiliary clamp and the second auxiliary clamp are respectively formed with a first supporting groove and a second supporting groove adapted to the bottom surface of the wafer patch ring, and the periphery of the wafer patch ring is respectively fitted with the side walls of the clamping step, the first supporting groove and the second supporting groove;

[0008] The main clamping jaw is connected to a clamping assembly, and the clamping assembly includes a driving assembly and a clamping head. The driving assembly drives the clamping head to loosen or clamp the top surface of the wafer supporting ring.

[0009] As a further improvement of the utility model, the main clamping jaw is located between the clamping step and the mounting portion to open a mounting opening, the chuck includes a connecting block, a clamping block and a clamping plate, the connecting block is connected to the mounting opening by a roller, and the clamping block is integrally formed at the top of the connecting block and extends from the top of the mounting opening;

[0010] The driving assembly comprises a driving cylinder and a top block, wherein the driving cylinder is fixedly connected to the upper surface of the mounting portion, the driving end of the driving cylinder is fixedly connected to the top block, and when the driving end of the driving cylinder is extended, the top block pushes the clamping block so that the clamping plate clamps the upper surface of the wafer bonding ring;

[0011] The main clamp is connected to a reset assembly, and when the driving end of the driving cylinder is retracted, the reset assembly pushes the clamp block to release the wafer bonding ring from the clamp.

[0012] As a further improvement of the utility model, a force surface is formed between the bottom surface of one side of the clamping block connected to the clamping plate and the side wall of the connecting block, and the reset assembly includes a mounting plate and a spring, the mounting plate is bridged across the bottom opening of the mounting port, the bottom end of the spring is fixed to the mounting plate, and the top end of the spring abuts against the force surface of the clamping block, and when the top block does not contact the clamping block, the spring pushes the force surface of the clamping block to allow the clamping plate to relax the wafer mounting ring.

[0013] As a further improvement of the utility model, the upper surface of the mounting portion is provided with two connecting grooves symmetrically with the length direction as the axis, the main clamping jaw forms a mounting arm on the side away from the clamping step which is respectively embedded in the two connecting grooves, and the driving cylinder is arranged between the two connecting grooves.

[0014] As a further improvement of the utility model, an infrared sensor is respectively arranged on both sides of the mounting portion in the length direction of the driving cylinder, the driving end of the driving cylinder is fixedly connected to the mounting block away from the top block, and the two side walls of the mounting block perpendicular to the length direction are respectively fixedly connected to a baffle, and when the clamp clamps the wafer patch ring, the two baffles respectively block the sensing areas of the two infrared sensors.

[0015] As a further improvement of the utility model, two positioning notches are symmetrically distributed on the wafer bonding ring, and two positioning columns are vertically fixed on the bottom surface of the clamping step. When the clamping plate clamps the wafer bonding ring, the two positioning columns are respectively clamped in one positioning notch.

[0016] As a further improvement of the present invention, the main clamping jaw, the first auxiliary clamping jaw and the second auxiliary clamping jaw are respectively formed with a plurality of weight-reducing holes.

[0017] As a further improvement of the utility model, a positioning block is fixedly connected to both sides of the clamping block parallel to the moving direction of the driving end of the driving cylinder, and the positioning block overlaps the upper surface of the main clamping jaw when the clamping plate does not clamp the wafer patch ring.

[0018] As a further improvement of the utility model, the end of the top block away from the driving cylinder is set as a hemispherical surface.

[0019] As a further improvement of the present invention, a weight-reducing groove is formed on the upper surface of the mounting portion.

[0020] Compared with the prior art, the beneficial effects of the utility model are: first, through the main clamp and the first and second sub-jaws arranged on both sides of the clamping step of the main clamp, the first and second supporting grooves opened by the first and second sub-jaws, in cooperation with the clamping step, the wafer patch ring is supported at multiple points to support a larger area of ​​the bottom of the wafer patch ring, and then the wafer patch ring is clamped by the chuck of the clamping assembly, thereby avoiding the problem that the existing wafer patch ring clamping device may cause the wafer patch ring to deform due to metal fatigue due to the small contact area with the wafer patch ring, and then cause the wafer to be damaged when the wafer patch ring is subsequently fixed.

[0021] Secondly, the chuck consists of a connecting block, a clamping block and a clamping plate. The top block connected to the driving end of the driving cylinder pushes the clamping block to rotate with the roller connected to the connecting block as the axis until the chuck connected to the clamping block clamps the wafer. The clamping plate has a certain length and has a large contact area with the wafer bonding ring, thereby improving the stability of the wafer bonding ring.

[0022] Finally, several weight-reducing holes opened in the main clamp, the first auxiliary clamp and the second auxiliary clamp effectively reduce the overall weight of the main clamp, the first auxiliary clamp and the second auxiliary clamp, thereby effectively avoiding the load-bearing pressure of the mounting part, and further improving the stability of the overall structure of the wafer patch ring clamping device. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A schematic diagram of the clamping jaws of a wafer patch ring clamping device in the prior art;

[0024] Figure 2 It is a structural schematic diagram for reflecting the state of the wafer patch ring clamping device clamping the wafer patch ring in the present invention;

[0025] Figure 3 It is an exploded schematic diagram used to reflect the structure of each part in the present invention;

[0026] Figure 4 It is a partial schematic diagram for reflecting the specific structure of the wafer patch ring in the present invention;

[0027] Figure 5 for Figure 4 Schematic diagram of the cross section along FF direction;

[0028] Figure 6 for Figure 2 Enlarged view of part A in the middle;

[0029] Figure 7 for Figure 5 Enlarged view of part B in the middle. DETAILED DESCRIPTION

[0030] The present invention is described in detail below in conjunction with the various embodiments shown in the accompanying drawings, but it should be noted that these embodiments are not limitations of the present invention, and any equivalent transformations or substitutions in functions, methods, or structures made by ordinary technicians in the field based on these embodiments are all within the scope of protection of the present invention.

[0031] Ginseng Figures 2 to 7 As shown in the figure, a wafer patch ring clamping device designed by the utility model is mainly composed of a main clamping jaw 1, a first auxiliary clamping jaw 3 and a second auxiliary clamping jaw 4, wherein the main clamping jaw 1 is provided with a clamping step 11 adapted to the wafer patch ring 6, and the first auxiliary clamping jaw 3 and the second auxiliary clamping jaw 4 are respectively provided with a first supporting groove 31 and a second supporting groove 41 adapted to the wafer patch ring 6. Through the design of the clamping step 11, the first supporting groove 31 and the second supporting groove 41, when the wafer is mounted on the wafer, the wafer is mounted on the wafer. When the wafer ring 6 is clamped, the main clamp 1, the first auxiliary clamp 3 and the second auxiliary clamp 4 can support the wafer patch ring 6 at multiple points, with a larger contact area, and then clamp the wafer patch ring 6 through the clamp head 51 of the clamping assembly 5, thereby avoiding the problem that the existing wafer patch ring clamping device may cause the wafer patch ring 6 to sink and tilt due to gravity on the unsupported side due to the small contact area with the wafer patch ring 6, thereby causing metal fatigue and deformation, and then causing the wafer to be damaged when the wafer patch ring is subsequently fixed to the wafer.

[0032] Ginseng Figures 2 to 7As shown, a wafer patch ring clamping device (hereinafter referred to as the clamping device) provided in this embodiment includes a main clamping jaw 1, which is connected to a manipulator (not shown) through a mounting portion 2, and a clamping step 11 adapted to the bottom surface of the supported wafer patch ring 6 is formed on the side of the main clamping jaw 1 away from the mounting portion 2; the main clamping jaw 1 is fixedly connected to the first sub-jaw 3 and the second sub-jaw 4 on both sides of the clamping step 11, and the upper surfaces of the first sub-jaw 3 and the second sub-jaw 4 are respectively formed with a first supporting groove 31 and a second supporting groove 41 adapted to the bottom surface of the wafer patch ring 6, and the periphery of the wafer patch ring 6 is respectively fitted with the side walls of the clamping step 11, the first supporting groove 31 and the second supporting groove 41; the main clamping jaw 1 is connected to the clamping assembly 5, and the clamping assembly 5 includes a driving assembly 51 and a chuck 52, and the driving assembly 51 drives the chuck 52 to relax or clamp the top surface of the wafer supporting ring 6.

[0033] Ginseng Figures 2 to 7 As shown, the main clamping jaw 1 is located between the clamping step 11 and the mounting portion 2 to open a mounting opening 12, the chuck 52 includes a connecting block 521, a clamping block 522 and a clamping plate 523, the connecting block 521 is rotatably connected to the mounting opening 12 via a roller 5211, the clamping block 522 is integrally formed at the top of the connecting block 521 and extends out from the top of the mounting opening 12; the driving assembly 51 includes a driving cylinder 511 and a top block 512, the driving cylinder 511 is fixedly connected to the upper surface of the mounting portion 2, the driving end of the driving cylinder 511 is fixedly connected to the top block 512, and the end of the top block 512 away from the driving cylinder 511 is set as a hemispherical surface. When the driving end of the driving cylinder 511 is extended, the top block 512 pushes the clamping block 522 so that the clamping plate 523 clamps the upper surface of the wafer bonding ring 6; the main clamping jaw 1 is connected to the reset component 13, and when the driving end of the driving cylinder 511 is retracted, the reset component 13 pushes the clamping block 522 so that the clamping plate 523 releases the wafer bonding ring 6.

[0034] Ginseng Figures 2 to 7 As shown, a force-bearing surface 5221 is formed between the bottom surface of one side of the clamping block 522 connected to the clamping plate 523 and the side wall of the connecting block 521. The reset assembly 13 includes a mounting plate 131 and a spring 132. The mounting plate 131 is connected across the bottom opening of the mounting port 12. The bottom end of the spring 132 is fixed to the mounting plate 131. The top end of the spring 131 abuts against the force-bearing surface 5221 of the clamping block 522. When the top block 512 does not contact the clamping block 522, the spring 132 pushes the force-bearing surface of the clamping block 522 to make the clamping plate 523 loosen the wafer patch ring 6. The wafer patch ring 6 has two symmetrically distributed positioning notches 61. The bottom surface of the clamping step 11 vertically fixes two positioning columns 111. When the clamping plate 523 clamps the wafer patch ring 6, the two positioning columns 111 are respectively clamped in one positioning notch 61.

[0035] When the wafer patch ring 6 is placed on the clamping step 11 by the transfer robot (not shown), the two positioning notches 61 formed on the wafer patch ring 6 respectively clamp a positioning column 111, thereby positioning the wafer patch ring 6. At this time, the center of the edge of the wafer patch ring 6 is embedded in the clamping step 11, and the edges of the wafer patch ring 6 are located on both sides of the first supporting groove 31 and the second supporting groove 41 respectively. At this time, the wafer patch ring 6 is placed in place, and the positioning column 111 cooperates with the positioning notch 61 to achieve the purpose of effectively positioning the wafer patch ring 6. The edges of the wafer patch ring 6 are respectively fitted with the side walls of the clamping step 11, the first supporting groove 31 and the second supporting groove 41. Since the clamping assembly 5 does not clamp the wafer patch ring 6 at this time, the transfer robot (not shown) is still in a state of supporting the side of the wafer patch ring 6 away from the clamping step 11. Based on the structure of the driving cylinder 511, the driving end of the driving cylinder 511 is a piston rod, and the top block 512 is fixedly connected to the end of the piston rod away from the main body of the driving cylinder 511. When the clamp 523 is in a state where the wafer bonding ring 6 is not clamped, the piston rod of the driving cylinder 511 is in a retracted state, and there is no contact between the top block 512 and the clamp 522. At this time, the force-bearing surface 5221 of the clamp 522 is lifted upward by the elastic force from the spring 132, so that the chuck 52 as a whole rotates relative to the main clamp 1 with the roller 5211 as the axis, and the clamp 523 is lifted together with the clamp 522, so that a space for the wafer bonding ring 6 to be placed is formed between the clamp 523 and the clamping step 11.

[0036] After the transfer robot (not shown) places the wafer patch ring 6 in the clamping step 11, the piston rod of the driving cylinder 511 is extended, and the top block 512 fixed to the end of the piston rod applies a thrust to the side of the clamping block 522 away from the clamping plate 523, so that the clamping head 52 as a whole rotates again with the roller 5211 as the axis, and the spring 132 is compressed by the pressure from the force-bearing surface 5221, and the clamping plate 523 is pressed down to the upper surface of the wafer patch ring 6, and then the transfer robot (not shown) is withdrawn to complete the clamping step of the wafer patch ring 6. Since the end surface of the top block 512 in contact with the clamping block 522 is set as a hemispherical surface, when the top block 512 applies a thrust to the clamping block 522, it can effectively reduce the pressure exerted on the clamping block 522, thereby preventing the clamping block 522 from deforming. In this embodiment, the wafer bonding ring 6 is supported by the first supporting groove 31 and the second supporting groove 41 opened by the first auxiliary clamping jaw 3 and the second auxiliary clamping jaw 4. Figure 1 The clamping jaws shown in the figure effectively increase the supporting points and supporting area of ​​the wafer patch ring 6, so as to cover the range of 100° to 120° between the wafer patch ring 6 and the center of the circle, and then cooperate with the extended clamping plate 523 to clamp the upper surface of the wafer patch ring 6, while increasing the supporting area and clamping area of ​​the wafer patch ring 6, thereby effectively avoiding Figure 1The prior art shown has a problem that the wafer bonding ring 6 has a small supporting area with the wafer bonding ring 6, so that the side of the wafer bonding ring 6 away from the chuck sinks due to gravity, resulting in deformation due to metal fatigue.

[0037] Ginseng Figures 2 to 5 As shown, the upper surface of the mounting portion 2 is provided with two connection grooves 21 symmetrically with the length direction as the axis, and the main clamping jaw 1 forms a mounting arm 14 respectively embedded in the two connection grooves 21 on the side away from the clamping step 11, and the driving cylinder 511 is arranged between the two connection grooves 21. The mounting portion 2 is provided with an infrared sensor 22 on both sides of the driving cylinder 511 in the length direction, and the driving end of the driving cylinder 511 is fixedly connected to the mounting block 5111 away from the top block 512. The two side walls of the mounting block 511 perpendicular to the length direction are respectively fixedly connected with a baffle 5112. When the clamping plate 523 clamps the wafer patch ring 6, the two baffles 5112 respectively block the sensing areas of the two infrared sensors 22.

[0038] When the piston rod of the driving cylinder 511 drives the top block 512 to push the clamping block 522 so that the clamping plate 523 clamps the wafer bonding ring 6, the mounting block 5111 fixed to the piston rod moves toward the direction close to the clamping block 522, and the two blocking plates 5112 vertically fixed on both sides of the mounting block 5111 move from a position away from the infrared sensor 22 to a position blocking the sensing area of ​​the infrared sensor 22, so that the piston rod of the driving cylinder 511 stops moving. At this time, the clamping plate 523 is in a state of stably clamping the upper surface of the wafer bonding ring 6. When the wafer bonding ring 6 needs to be loosened, the transfer robot (not shown) receives the wafer bonding ring 6 away from the clamping step 11, and drives the piston rod of the cylinder 511 to retract so that the top block 512 moves from the position in contact with the clamping block 522 to the position away from the clamping block 522. At the same time, the baffle 5112 moves out of the sensing area of ​​the infrared sensor 22, and the spring 132 applies elastic force to the force-bearing surface 5221 to lift the clamping plate 523 and loosen the wafer bonding ring. Figure 6 As shown, the clamp block 522 is fixed with a positioning block 5222 on both sides parallel to the moving direction of the driving end of the driving cylinder 511. When the clamp plate 523 does not clamp the wafer bonding ring 6, the positioning block 5222 overlaps the upper surface of the main clamping jaw 1. When the spring 132 applies elastic force to the force-bearing surface 5221 to rotate the clamp block 522 and lift the clamp plate 523, when the spring 132 returns to the length of the unstressed state, the positioning block 5222 overlaps the upper surface of the main clamping jaw 1 to achieve a positioning effect, and when the chuck 52 is assembled as a whole, the positioning block 5222 can prevent the clamp block 522 from falling out of the mounting opening 12.

[0039] Ginseng Figures 2 to 5As shown, the main jaw 1, the first auxiliary jaw 3 and the second auxiliary jaw 4 are respectively formed with a plurality of weight-reducing holes 42. In order to improve the stability of the overall structure of the clamping device, it is necessary to control the overall weight of the main jaw 1, the first auxiliary jaw 3 and the second auxiliary jaw 4 within 300g. By opening a plurality of weight-reducing holes 42, the overall weight of the main jaw 1, the first auxiliary jaw 3 and the second auxiliary jaw 4 is effectively controlled, thereby effectively reducing the bearing pressure of the mounting portion 2, thereby achieving the purpose of improving the stability of the overall structure of the clamping device. A weight-reducing groove 23 is formed on the upper surface of the mounting portion 2. The weight of the mounting portion 2 is effectively reduced by the design of the weight-reducing groove 23, thereby reducing the bearing pressure of the manipulator (not shown) connected to the mounting portion 2.

[0040] The series of detailed descriptions listed above are only specific descriptions of feasible implementation methods of the utility model. They are not intended to limit the protection scope of the utility model. Any equivalent implementation methods or changes that do not deviate from the technical spirit of the utility model should be included in the protection scope of the utility model.

[0041] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A wafer patch ring clamping device, characterized in that: include: A main clamping jaw, wherein the main clamping jaw is connected to the manipulator through a mounting portion, and a clamping step is formed on a side of the main clamping jaw away from the mounting portion to match the bottom surface of the wafer patch ring; The main clamp is fixedly connected with a first auxiliary clamp and a second auxiliary clamp on both sides of the clamping step, and the upper surfaces of the first auxiliary clamp and the second auxiliary clamp are respectively formed with a first supporting groove and a second supporting groove adapted to the bottom surface of the wafer patch ring, and the periphery of the wafer patch ring is respectively fitted with the side walls of the clamping step, the first supporting groove and the second supporting groove; The main clamping jaw is connected to a clamping assembly, and the clamping assembly includes a driving assembly and a clamping head. The driving assembly drives the clamping head to loosen or clamp the top surface of the wafer supporting ring.

2. The wafer bonding ring clamping device according to claim 1, characterized in that: The main clamping jaw is located between the clamping step and the mounting portion to form a mounting opening, the clamping head comprises a connecting block, a clamping block and a clamping plate, the connecting block is connected to the mounting opening by a roller, the clamping block is integrally formed at the top of the connecting block and extends out from the top of the mounting opening; The driving assembly comprises a driving cylinder and a top block, wherein the driving cylinder is fixedly connected to the upper surface of the mounting portion, the driving end of the driving cylinder is fixedly connected to the top block, and when the driving end of the driving cylinder is extended, the top block pushes the clamping block so that the clamping plate clamps the upper surface of the wafer bonding ring; The main clamp is connected to a reset assembly, and when the driving end of the driving cylinder is retracted, the reset assembly pushes the clamp block to release the wafer bonding ring from the clamp.

3. The wafer bonding ring clamping device according to claim 2, characterized in that: A force-bearing surface is formed between the bottom surface of one side of the clamping block connected to the clamping plate and the side wall of the connecting block. The reset assembly includes a mounting plate and a spring. The mounting plate is connected across the bottom opening of the mounting port. The bottom end of the spring is fixed to the mounting plate. The top end of the spring abuts against the force-bearing surface of the clamping block. When the top block does not contact the clamping block, the spring pushes the force-bearing surface of the clamping block to allow the clamping plate to relax the wafer mounting ring.

4. The wafer bonding ring clamping device according to claim 3, characterized in that: The upper surface of the mounting portion is provided with two connecting grooves symmetrically with the length direction as the axis, the main clamping jaw forms a mounting arm which is respectively embedded in the two connecting grooves on one side away from the clamping step, and the driving cylinder is arranged between the two connecting grooves.

5. The wafer bonding ring clamping device according to claim 4, characterized in that: The mounting portion is located on both sides of the driving cylinder in the length direction, and an infrared sensor is respectively arranged thereon. The driving end of the driving cylinder is fixedly connected to a mounting block away from the top block. The two side walls of the mounting block perpendicular to the length direction are respectively fixedly connected to a baffle. When the clamping plate clamps the wafer patch ring, the two baffles respectively block the sensing areas of the two infrared sensors.

6. The wafer bonding ring clamping device according to claim 3, characterized in that: The wafer patch ring has two symmetrically distributed positioning notches, the bottom surface of the clamping step vertically fixes two positioning columns, and when the clamping plate clamps the wafer patch ring, the two positioning columns are respectively clamped in one positioning notch.

7. The wafer bonding ring clamping device according to claim 3, characterized in that: The main clamping jaw, the first auxiliary clamping jaw and the second auxiliary clamping jaw are respectively formed with a plurality of weight-reducing holes.

8. The wafer bonding ring clamping device according to claim 2, characterized in that: The clamp block is fixed with a positioning block on both sides parallel to the moving direction of the driving end of the driving cylinder. When the clamp plate does not clamp the wafer patch ring, the positioning block overlaps the upper surface of the main clamping jaw.

9. The wafer bonding ring clamping device according to claim 8, characterized in that: One end of the top block away from the driving cylinder is arranged as a hemispherical surface.

10. The wafer bonding ring clamping device according to claim 7, characterized in that: A weight-reducing groove is formed on the upper surface of the mounting portion.

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