A2B audio transmission mode audio host with external power amplifier chip
By using the external amplifier chip audio host with A2B audio transmission method in the audio host, the problem that traditional audio hosts are difficult to meet the multi-speaker output in the car is solved, and the multi-speaker output effect with a simple structure and low cost is achieved.
Patent Information
- Application Number
- CN202421043663.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-14
- Publication Date
- 2025-02-07
- Estimated Expiration
- 2034-05-14
AI Technical Summary
Due to the high heat dissipation needs of the amplifier chip and the internal space limitations of traditional audio hosts, it is difficult to meet the needs of multi-speaker output in the car. At the same time, the circuit design of the external amplifier box is complex and costly.
The external amplifier chip audio host that adopts A2B audio transmission method controls the power supply unit and the amplifier unit through the main control unit, and uses the SOC+DSP chip and the A2B audio sending/receiving chip to realize the transmission of audio signals and the driving of the amplifier without adding MCU and DSP.
It realizes the need for multi-speaker output in the car, with a simpler structure and lower cost. At the same time, the digital signal decoded by the A2B audio reception chip can drive four amplifier chips at the same time, driving up to 16 speakers.
Smart Images
Figure CN222441827U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to an external power amplifier chip audio host in the technical field of vehicle-mounted audio hosts. Background Art
[0002] Traditional head units generally use built-in amplifier chips. One amplifier can only drive four 4-ohm speakers at most. Since the amplifier is a high-heat dissipation device, it is limited by the size and internal space of the head unit. At the same time, in order to meet the high-temperature working requirements of the head unit, it is necessary not only to install heat dissipation aluminum sheets, but also to use fans when necessary to meet the heat dissipation requirements. However, it still cannot meet the current vehicle sound effect requirements of too many speakers in the car. The solution for traditional head units to solve this problem is to add an external amplifier box and cancel the built-in amplifier chip. However, the circuit design of the external amplifier box is complex. In addition to the required amplifier, it is also necessary to add a control MCU, an audio DSP, and the power supply circuit of these two chips. The design is complex and costly. Utility Model Content
[0003] The utility model aims to provide an external power amplifier chip audio host in an A2B audio transmission mode, which does not require additional MCU and DSP, has a simpler structure and lower cost.
[0004] To achieve the above-mentioned purpose, the utility model provides an external power amplifier chip audio host with A2B audio transmission mode, including an audio host and an amplifier box, the audio host is provided with a main control unit, an audio control unit and an audio sending unit, the power amplifier box is provided with a power supply unit, an audio receiving unit and a power amplifier unit, the main control unit is connected to the power supply unit and the external power amplifier chip, the power supply unit is connected to the audio receiving unit, the audio control unit is connected to the audio sending unit, the audio sending unit is connected to the audio receiving unit, and the audio receiving unit is connected to the power amplifier unit.
[0005] Compared with the prior art, the beneficial effect of the utility model lies in that the main control unit controls the power supply of the power supply unit to the audio receiving unit, and the audio control unit sends digital audio and control signals to the audio sending unit, which then sends the digital audio and control signals to the audio receiving unit, and finally drives the power amplifier unit, thereby driving the corresponding speakers to work and meeting the needs of multiple speaker outputs in the car. There is no need to add MCU and DSP separately, the structure is simpler, and the cost is lower.
[0006] As a further improvement of the utility model, the audio control unit includes a SOC+DSP chip, the audio sending unit includes an A2B audio sending chip, the I2C pin, SCL pin, WS pin, TX0 pin and TX1 pin of the SOC+DSP chip are respectively connected to the I2C pin, SCL pin, WS pin, TX0 pin and TX1 pin of the A2B audio sending chip, the audio receiving unit includes an A2B audio receiving chip, and the BP pin and BN pin of the A2B audio receiving chip are respectively connected to the BP pin and BN pin of the A2B audio sending chip.
[0007] In this way, the SOC+DSP chip outputs the adjusted audio signal to the A2B audio transmitting chip, and then the A2B audio transmitting chip sends the audio signal to the A2B audio receiving chip, and then the A2B audio receiving chip sends it to the power amplifier unit to realize the transmission of the audio signal stream.
[0008] As a further improvement of the utility model, the power amplifier unit includes a first power amplifier module and a second power amplifier module, the first power amplifier module integrates external power amplifier chip one and external power amplifier chip two, the first power amplifier module integrates external power amplifier chip three and external power amplifier chip four, the I2C pin of the A2B audio receiving chip is respectively connected to the I2C pin of the first power amplifier module and the second power amplifier module, the SCK pin and WS pin of the A2B audio receiving chip are respectively connected to the SCK pin and WS pin of the first power amplifier module and the second power amplifier module, and the TX0 pin and TX1 pin of the A2B audio receiving chip are respectively connected to the TX0 pin and TX1 pin of the first power amplifier module and the second power amplifier module.
[0009] In this way, the A2B audio receiving chip still uses digital signals after decoding, and can drive four power amplifier chips at the same time, driving up to 16 speakers, fully meeting the actual needs of multi-speaker output in the car at this stage.
[0010] As a further improvement of the present invention, the power supply unit includes an A2B power supply chip, and the A2B power supply chip is connected to the vehicle battery and the A2B audio receiving chip.
[0011] In this way, the A2B power supply chip converts the battery voltage into the voltage required by the A2B audio receiving chip through the vehicle battery to provide power for its normal operation.
[0012] As a further improvement of the present invention, the main control unit includes an MCU, the MCU is connected to the A2B power supply chip, and the MCU is also connected to external power amplifier chip one, external power amplifier chip two, external power amplifier chip three and external power amplifier chip four.
[0013] In this way, the MCU controls the power supply enable of the A2B power supply chip and the operation enable of four external power amplifier chips, thereby meeting the low power consumption requirements during sleep.
[0014] As a further improvement of the utility model, a built-in power amplifier chip is provided in the audio host, and the MCU and the SOC+DSP chip are connected to the built-in power amplifier chip.
[0015] In this way, when the external amplifier box fails, you can switch to the built-in amplifier chip at any time to ensure the basic needs of sound output. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 This is a circuit diagram of the prior art.
[0017] Figure 2 This is a circuit block diagram of the utility model.
[0018] Figure 3 This is a main circuit signal connection diagram between the audio host and the power amplifier box of the utility model. DETAILED DESCRIPTION
[0019] The utility model is further described below in conjunction with the accompanying drawings:
[0020] like Figure 2-3 An external power amplifier chip audio host with an A2B audio transmission method shown in the figure includes an audio host and an amplifier box. The audio host is provided with a main control unit, an audio control unit and an audio sending unit. The power amplifier box is provided with a power supply unit, an audio receiving unit and an amplifier unit. The main control unit is connected to the power supply unit and the external power amplifier chip, the power supply unit is connected to the audio receiving unit, the audio control unit is connected to the audio sending unit, the audio sending unit is connected to the audio receiving unit, and the audio receiving unit is connected to the power amplifier unit.
[0021] The audio control unit includes a SOC+DSP chip, the audio sending unit includes an A2B audio sending chip, the I2C pin, SCL pin, WS pin, TX0 pin and TX1 pin of the SOC+DSP chip are respectively connected to the I2C pin, SCL pin, WS pin, TX0 pin and TX1 pin of the A2B audio sending chip, the audio receiving unit includes an A2B audio receiving chip, and the BP pin and BN pin of the A2B audio receiving chip are respectively connected to the BP pin and BN pin of the A2B audio sending chip.
[0022] The power amplifier unit includes a first power amplifier module and a second power amplifier module. The first power amplifier module integrates external power amplifier chip one and external power amplifier chip two, the second power amplifier module integrates external power amplifier chip three and external power amplifier chip four, the I2C pin of the A2B audio receiving chip is respectively connected to the I2C pin of the first power amplifier module and the second power amplifier module, the SCK pin and WS pin of the A2B audio receiving chip are respectively connected to the SCK pin and WS pin of the first power amplifier module and the second power amplifier module, and the TX0 pin and TX1 pin of the A2B audio receiving chip are respectively connected to the TX0 pin and TX1 pin of the first power amplifier module and the second power amplifier module.
[0023] The power supply unit includes an A2B power supply chip, which is connected to the vehicle battery and the A2B audio receiving chip. The main control unit includes an MCU, which is connected to the A2B power supply chip. The MCU is also connected to external power amplifier chip 1, external power amplifier chip 2, external power amplifier chip 3, and external power amplifier chip 4. A built-in power amplifier chip is set in the head unit, and the MCU and SOC+DSP chip are connected to the built-in power amplifier chip.
[0024] In the utility model, the A2B chip is composed of an A2B transmitting chip, an A2B receiving chip and an A2B power supply chip. The A2B transmitting chip receives the audio signal output by the SOC+DSP chip and adjusts the audio signal to the power amplifier box. After receiving the audio signal, the A2B receiving chip of the power amplifier box distributes the audio signal to each power amplifier to realize the transmission of the audio signal stream. In addition to transmitting the audio data stream, the A2B chip can also transmit the I2C signal of the SOC+DSP chip to control the power amplifier. The SOC+DSP chip configures the amplification factor of the power amplifier through I2C and obtains the working status of the power amplifier chip through I2C.
[0025] The MCU of the audio host controls the power supply enable of the A2B power supply chip and the operation enable of four external power amplifier chips through the hard-line AMP ON, thereby meeting the low power consumption requirements during sleep.
[0026] The built-in DSP of the utility model adopts analog + digital audio output, while retaining the built-in amplifier, which can be used as a backup amplifier for high-end models or a built-in amplifier for low-end models, so as to achieve free adaptation of high and low-end models. In addition, when the external amplifier box of the high-end model fails, it can be switched to the built-in amplifier at any time to ensure the basic needs of sound output.
[0027] The circuit design of the power amplifier box is simple. There is no need to add an MCU to control the power amplifier, nor is there a need to add a DSP sound chip. It only needs to be connected to the vehicle's BATT power supply. The MCU provides an AMP ON signal to turn on the power amplifier, and the power amplifier solves the control problem through the IIC signal transmitted by A2B.
[0028] The audio signal transmission uses A2B transmitter chip and A2B receiver chip to achieve lossless transmission of sound effects. The A2B transmitter chip is used on the head unit end, and the A2B receiver chip is used on the external amplifier box end. The A2B receiver chip still uses digital signals after decoding, which can drive four amplifier chips at the same time and drive up to 16 speakers, fully meeting the actual needs of multi-speaker output in the car at this stage.
[0029] The audio A2B transmission technology adopted by the utility model saves the cost of MCU+DSP+power supply system, has the advantages of simple overall structure and low cost, and also meets the actual demand for multiple speaker outputs in the car at this stage.
[0030] The present utility model is not limited to the above-mentioned embodiments. On the basis of the technical solution disclosed herein, technicians in this field can make some substitutions and deformations to some technical features therein according to the disclosed technical content without creative labor, and these substitutions and deformations are all within the protection scope of the present utility model.
Claims
1. An external power amplifier chip audio host with A2B audio transmission mode, characterized by: It includes an audio host and an amplifier box. The audio host is provided with a main control unit, an audio control unit and an audio sending unit. The power amplifier box is provided with a power supply unit, an audio receiving unit and a power amplifier unit. The main control unit is connected to the power supply unit and an external power amplifier chip, the power supply unit is connected to the audio receiving unit, the audio control unit is connected to the audio sending unit, the audio sending unit is connected to the audio receiving unit, and the audio receiving unit is connected to the power amplifier unit.
2. According to the A2B audio transmission mode of the external power amplifier chip audio host of claim 1, it is characterized by: The audio control unit includes a SOC+DSP chip, the audio sending unit includes an A2B audio sending chip, the I2C pin, SCL pin, WS pin, TX0 pin and TX1 pin of the SOC+DSP chip are respectively connected to the I2C pin, SCL pin, WS pin, TX0 pin and TX1 pin of the A2B audio sending chip, the audio receiving unit includes an A2B audio receiving chip, and the BP pin and BN pin of the A2B audio receiving chip are respectively connected to the BP pin and BN pin of the A2B audio sending chip.
3. According to claim 2, an external power amplifier chip audio host with A2B audio transmission mode, characterized in that: The power amplifier unit includes a first power amplifier module and a second power amplifier module. The first power amplifier module integrates external power amplifier chip one and external power amplifier chip two, the second power amplifier module integrates external power amplifier chip three and external power amplifier chip four, the I2C pin of the A2B audio receiving chip is respectively connected to the I2C pin of the first power amplifier module and the second power amplifier module, the SCK pin and WS pin of the A2B audio receiving chip are respectively connected to the SCK pin and WS pin of the first power amplifier module and the second power amplifier module, and the TX0 pin and TX1 pin of the A2B audio receiving chip are respectively connected to the TX0 pin and TX1 pin of the first power amplifier module and the second power amplifier module.
4. According to the A2B audio transmission mode of the external power amplifier chip audio host of claim 3, it is characterized in that: The power supply unit includes an A2B power supply chip, and the A2B power supply chip is connected to the vehicle battery and the A2B audio receiving chip.
5. According to the A2B audio transmission mode external power amplifier chip audio host according to claim 4, it is characterized in that: The main control unit includes an MCU, the MCU is connected to the A2B power supply chip, and the MCU is also connected to an external power amplifier chip 1, an external power amplifier chip 2, an external power amplifier chip 3, and an external power amplifier chip 4.
6. The external power amplifier chip audio host of the A2B audio transmission method according to claim 5, characterized in that: A built-in power amplifier chip is provided in the audio host, and the MCU and the SOC+DSP chip are connected to the built-in power amplifier chip.