Multi-layer heat-conducting soft substrate

Abstract

The utility model discloses a multilayer heat-conducting soft substrate, which comprises a soft substrate body, a heat-conducting seat is arranged on the bottom surface of the soft substrate body, and a heat-conducting top plate is arranged on the top surface of the soft substrate; a plurality of vertical through holes are formed in the soft substrate body; the top face of the heat conduction base is provided with heat conduction protruding columns matched with the vertical through holes in position. Heat dissipation fins are integrally formed on the bottom surface of the heat conduction seat; the heat-conducting top plate is provided with heat dissipation groove holes, and a heat-conducting silica gel layer used for making contact with the soft substrate body is fixedly bonded to the bottom face of the heat-conducting top plate. The bottom face of the heat conduction top plate is provided with connecting column rods matched with the heat conduction protruding columns in position. Magnetic sheets are embedded in the end surfaces of the heat conduction convex column and the connecting column rod; and the heat-conducting convex column and the connecting column rod are magnetically attracted and positioned through the magnetic sheet. The LED lamp is reasonable in structural arrangement, connection can be rapidly achieved, the heat conduction and heat dissipation performance can be improved, the heat conduction protruding column and the connecting column rod are magnetically attracted and positioned through the magnetic sheets, disassembly, assembly and replacement operation is convenient, and the LED lamp is high in applicability and good in practicability.

Description

Technical Field

[0001] The utility model belongs to the technical field of flexible circuit boards, and in particular relates to a multi-layer heat-conducting soft substrate. Background Art

[0002] Flexible circuit boards are printed circuits made of flexible insulating substrates. They not only provide excellent electrical properties, but also meet the design requirements of smaller and higher density installations, and can be applied to installation requirements in different spatial ranges. However, in the prior art, there are more and more electronic parts on circuit boards. After long-term use, a large amount of heat is emitted, which will affect the use of the electronic parts on the circuit boards. Flexible circuit boards do not have good thermal conductivity and heat dissipation structures, so their thermal conductivity and heat dissipation performance is ineffective, so their applicability is limited. Utility Model Content

[0003] The utility model aims to provide a multi-layer heat-conducting soft substrate which has a reasonable structure and is conducive to improving the heat-conducting performance.

[0004] The technical solution to achieve the purpose of the utility model is a multi-layer heat-conducting soft substrate, comprising a soft substrate body, a heat-conducting seat is arranged on the bottom surface of the soft substrate body, and a heat-conducting top plate is arranged on the top surface of the soft substrate;

[0005] The soft substrate body is provided with a plurality of vertical through holes;

[0006] The top surface of the heat-conducting seat is provided with a heat-conducting protrusion matched with the position of the vertical through hole;

[0007] The bottom surface of the heat-conducting seat is integrally formed with heat-dissipating fins;

[0008] The heat-conducting top plate is provided with heat dissipation slots, and the bottom surface of the heat-conducting top plate is adhered with a heat-conducting silicone layer for contacting the soft substrate body;

[0009] The bottom surface of the heat-conducting top plate is provided with a connecting column rod matched with the position of the heat-conducting convex column;

[0010] The end surfaces of the heat-conducting protrusions and the connecting rods are both inlaid with magnetic sheets;

[0011] The heat-conducting protrusion and the connecting column rod are magnetically positioned by a magnetic sheet.

[0012] Further preferably, a protective frame edge is buckled at the edge of the soft substrate body;

[0013] The heat-conducting seat and the heat-conducting top plate are respectively attached to the bottom surface and the top surface of the protection frame edge.

[0014] It is further preferred that: a cooling fin is provided on the bottom surface of the heat conducting seat, and the inner cavity of the cooling fin is filled with a cooling liquid;

[0015] The cooling sheet is attached to the surface of the heat dissipation fin and fixed by screws.

[0016] It is further preferred that: the thermally conductive seat and the thermally conductive top plate are both metal material structures.

[0017] It is further preferred that: the diameters of the heat-conducting protrusions and the connecting column rods are matched with the inner diameter of the vertical through hole.

[0018] The utility model has positive effects: the structure of the utility model is reasonable, and the heat-conducting top plate and the heat-conducting seat are provided, and the heat-conducting convex column and the connecting column rod are matched, which can not only quickly realize the connection, but also improve the heat-conducting and heat-dissipating performance, and the heat-conducting convex column and the connecting column rod are magnetically positioned by the magnetic sheet, which is also convenient for disassembly, assembly and replacement operation, and has strong applicability and good practicality;

[0019] At the same time, it is provided with a protective frame edge, which will not cause damage to the soft substrate body and the electronic components thereon when the thermal seat and the thermal top plate are connected. At the same time, the cooling plate filled with coolant can improve the thermal conductivity and heat dissipation performance of the thermal seat, which is conducive to improving the stability and reliability of use. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to make the content of the utility model easier to understand, the utility model is further described in detail below based on specific embodiments and in conjunction with the accompanying drawings, wherein:

[0021] Figure 1 It is a schematic diagram of the structure of the utility model;

[0022] Figure 2 It is a schematic diagram of the specific structure of the heat conducting seat in the utility model;

[0023] Figure 3 It is a schematic diagram of the specific structure of the heat-conducting top plate in the utility model.

[0024] Figure numerals: soft substrate body 1, heat-conducting seat 2, heat-conducting top plate 3, vertical through hole 4, heat-conducting protrusion 5, heat dissipation fin 6, heat dissipation slot 7, heat-conducting silicone layer 8, connecting column rod 9, magnetic sheet 10, protective frame edge 11, cooling sheet 12. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0026] Example

[0027] See Figures 1 to 3 As shown, a multi-layer thermally conductive soft substrate includes a soft substrate body 1. In this embodiment, the soft substrate body is a conventional structure of the prior art, and some electronic components are arranged on it. When installed, a thermally conductive seat 2 is arranged on the bottom surface of the soft substrate body, and a thermally conductive top plate 3 is arranged on the top surface of the soft substrate. In actual application, the thermally conductive seat and the thermally conductive top plate are both metal material structures. In addition, a plurality of vertical through holes 4 are arranged on the soft substrate body. In order to improve the thermal conductivity and the convenience of installation, a thermally conductive protruding column 5 matching the position of the vertical through hole is arranged on the top surface of the thermally conductive seat. A heat dissipation fin 6 is integrally formed on the bottom surface of the thermally conductive seat. The thermally conductive and heat dissipation performance can be improved by matching the heat dissipation fin with the thermally conductive protruding column.

[0028] Moreover, in this embodiment, the heat-conducting top plate is provided with heat dissipation slots 7, and the bottom surface of the heat-conducting top plate is adhered with a heat-conducting silicone layer 8 for contacting the soft substrate body; the heat-conducting silicone layer can protect the electronic components, and at the same time, effective thermal conductivity can be guaranteed, and in order to facilitate disassembly and connection, the bottom surface of the heat-conducting top plate is provided with a connecting column 9 that matches the position of the heat-conducting boss; the end surfaces of the heat-conducting boss and the connecting column are inlaid with magnetic sheets 10; the heat-conducting boss and the connecting column are magnetically positioned by the magnetic sheet. During the installation process, the heat-conducting boss and the connecting column are both in the vertical through hole, and then magnetically positioned by the magnetic sheet. In this embodiment, the diameters of the heat-conducting boss and the connecting column match the inner diameter of the vertical through hole. The convenience of connection can be improved, and the thermal conductivity can also be effectively achieved.

[0029] In actual application, a protective frame 11 is snapped onto the edge of the soft substrate body; the thermally conductive seat and the thermally conductive top plate are respectively attached to the bottom and top surfaces of the protective frame. In this embodiment, the protective frame can be a silicone frame, an insulating rubber frame, or a frame made of other insulating materials, which is mainly used to protect the soft substrate body to prevent the thermally conductive seat and the thermally conductive top plate from damaging the soft substrate body or electronic components during installation.

[0030] In order to improve the heat dissipation performance, a cooling fin 12 is provided on the bottom surface of the heat-conducting seat, and the inner cavity of the cooling fin is filled with coolant; the cooling fin is attached to the surface of the heat dissipation fin and fixed by screws, so that the heat of the heat-conducting seat can be quickly dissipated to improve the heat dissipation effect.

[0031] The utility model has positive effects: the structure of the utility model is reasonable, and the heat-conducting top plate and the heat-conducting seat are provided, and the heat-conducting convex column and the connecting column rod are matched, which can not only quickly realize the connection, but also improve the heat-conducting and heat-dissipating performance, and the heat-conducting convex column and the connecting column rod are magnetically positioned by the magnetic sheet, which is also convenient for disassembly, assembly and replacement operation, and has strong applicability and good practicality;

[0032] At the same time, it is provided with a protective frame edge, which will not cause damage to the soft substrate body and the electronic components thereon when the thermal seat and the thermal top plate are connected. At the same time, the cooling plate filled with coolant can improve the thermal conductivity and heat dissipation performance of the thermal seat, which is conducive to improving the stability and reliability of use.

[0033] The standard parts used in this embodiment can be purchased directly from the market, and the non-standard structural components recorded in the specification can also be directly processed according to existing technical common sense. At the same time, the connection method of each component adopts the mature conventional means in the prior art, and the machinery, parts and equipment all adopt the conventional models in the prior art, so no specific description will be given here.

[0034] Obviously, the above embodiments of the present invention are merely examples for clearly explaining the present invention, and are not intended to limit the implementation methods of the present invention. For ordinary technicians in the relevant field, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. However, these obvious changes or modifications derived from the essential spirit of the present invention still belong to the protection scope of the present invention.

Claims

1. A multi-layer thermally conductive soft substrate, comprising a soft substrate body, characterized in that: The bottom surface of the soft substrate body is provided with a heat-conducting seat, and the top surface of the soft substrate is provided with a heat-conducting top plate; The soft substrate body is provided with a plurality of vertical through holes; The top surface of the heat-conducting seat is provided with a heat-conducting protrusion matched with the position of the vertical through hole; The bottom surface of the heat-conducting seat is integrally formed with heat-dissipating fins; The heat-conducting top plate is provided with heat dissipation slots, and the bottom surface of the heat-conducting top plate is adhered with a heat-conducting silicone layer for contacting the soft substrate body; The bottom surface of the heat-conducting top plate is provided with a connecting column rod matched with the position of the heat-conducting convex column; The end surfaces of the heat-conducting protrusions and the connecting rods are both inlaid with magnetic sheets; The heat-conducting protrusion and the connecting column rod are magnetically positioned by a magnetic sheet.

2. The multi-layer thermally conductive soft substrate according to claim 1, characterized in that: A protective frame edge is buckled at the edge of the soft substrate body; The heat-conducting seat and the heat-conducting top plate are respectively attached to the bottom surface and the top surface of the protection frame edge.

3. The multi-layer thermally conductive soft substrate according to claim 2, characterized in that: The bottom surface of the heat-conducting seat is provided with a cooling fin, and the inner cavity of the cooling fin is filled with a coolant; The cooling sheet is attached to the surface of the heat dissipation fin and fixed by screws.

4. The multi-layer thermally conductive soft substrate according to claim 3, characterized in that: The heat-conducting seat and the heat-conducting top plate are both metal material structures.

5. The multi-layer thermally conductive soft substrate according to claim 1, characterized in that: The diameters of the heat-conducting protrusions and the connecting column rods are matched with the inner diameter of the vertical through hole.

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