Inverted LED lamp bead

Abstract

The utility model relates to the technical field of surface mounting LED devices, in particular to an inverted LED lamp bead, which comprises a circuit layer and a chip set arranged on the circuit layer, and packaging glue is arranged on one side, close to the chip set, of the circuit layer and on the chip set. The circuit layer comprises a die bonding area, a first pin, a second pin, a third pin and a fourth pin, wherein the first pin, the second pin, the third pin and the fourth pin are electrically connected with the die bonding area. According to the flip LED lamp bead, due to the thickness of the carrier plate, the overall height of the lamp bead is reduced, the cost in the manufacturing process of the carrier plate is reduced, the cost of the carrier plate is reduced during packaging and supporting, the cost of the LED lamp bead in the manufacturing process is reduced, and due to the fact that the bottom of the LED lamp bead is the circuit layer formed by the copper foil, the whole LED lamp bead is a metal part, heat dissipation of the lamp bead is facilitated, and the service life of the LED lamp bead is prolonged. The service life of lamp beads is prolonged; meanwhile, the packaging is thinned while the substrate is thinned, so that the brightness of the lamp bead is higher, the angle is larger, and the effect of improving the performance of the LED lamp bead is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of surface mounted LED devices, in particular to a flip-chip LED lamp bead. Background Art

[0002] With the widespread application of display technology, the application of LED display devices, which are key components of display screens, has become more important. The requirements for LED lamp beads, one of the important components of display screens, are also getting higher and higher, especially in terms of LED lamp bead performance.

[0003] The existing flip-chip CHIPLED lamp bead structure uses a flat BT carrier as a bracket. The carrier is divided into a front circuit, a back circuit and a substrate. The front circuit is used to bind the light-emitting chip and realize electrical interconnection. The back circuit is used to weld with the LED display module PCB. The front and back circuits are connected and conducted through through holes. However, the existing lamp beads have high costs in the manufacturing process and poor luminous performance. Utility Model Content

[0004] Based on this, the purpose of the utility model is to provide a flip-chip LED lamp bead with low cost and good luminous performance.

[0005] A flip-chip LED lamp bead comprises a circuit layer and a chipset arranged on the circuit layer, packaging glue is arranged on a side of the circuit layer close to the chipset and on the chipset, the circuit layer comprises a solid crystal area and a first pin, a second pin, a third pin and a fourth pin electrically connected to the solid crystal area, a mark point for position identification is arranged on the second pin, the solid crystal area comprises a fourth connecting piece electrically connected to the first pin, a first connecting piece electrically connected to the second pin, a second connecting piece electrically connected to the third pin and a third connecting piece electrically connected to the fourth pin, the chipset comprises a red light chip arranged on the first connecting piece and the second connecting piece, a green light chip arranged on the first connecting piece and the third connecting piece, and a blue light chip arranged on the first connecting piece and the fourth connecting piece.

[0006] Furthermore, the packaging glue completely covers the red light chip, the green light chip, and the blue light chip.

[0007] Furthermore, the diameter of the mark point is 1 mm.

[0008] Furthermore, the red light chip is fixed to the first connecting piece and the second connecting piece by solder paste, the green light chip is fixed to the first connecting piece and the third connecting piece by solder paste, and the blue light chip is fixed to the first connecting piece and the fourth connecting piece by solder paste.

[0009] The flip-chip LED lamp bead of the utility model has a lower overall height due to the thickness of the carrier board itself, which reduces the cost in the carrier board manufacturing process and reduces the carrier board cost during the packaging support, thereby reducing the cost of the LED lamp bead in the manufacturing process. Moreover, since the bottom of the LED lamp bead is a circuit layer composed of copper foil, it is entirely metal, which is beneficial to the heat dissipation of the lamp bead and prolongs the life of the lamp bead. When the substrate is thinned, the package is also thinned, so that the lamp bead has higher brightness and a larger angle, thereby achieving the effect of improving the performance of the LED lamp bead. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 It is a schematic diagram of the structure of the flip-chip LED lamp bead after molding and packaging of the utility model.

[0011] Figure 2 It is a structural schematic diagram of the debonding of the inverted LED lamp bead of the utility model.

[0012] Figure 3 This is a schematic diagram of the structure of the front side of the inverted LED lamp bead of the utility model.

[0013] Figure 4 It is a structural schematic diagram of the back side of the inverted LED lamp bead of the utility model.

[0014] Figure 5 It is a structural schematic diagram of the circuit layer of the utility model.

[0015] Description of main component symbols:

[0016] 1-chipset, 11-red light chip, 12-green light chip, 13-blue light chip, 2-packaging glue, 3-circuit layer, 311-first pin, 312-second pin, 313-third pin, 314-fourth pin, 32-mark point, 33-solid crystal area, 331-first connecting piece, 332-second connecting piece, 333-third connecting piece, 334-fourth connecting piece, 4-colloid, 5-carrier.

[0017] The following specific implementation manner will further illustrate the present utility model in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0018] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. Several embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0019] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0020] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0021] A flip-chip LED lamp bead, such as Figure 1-Figure 5 As shown, it includes a circuit layer 3 and a chipset 1 arranged on the circuit layer 3, and a packaging glue 2 is arranged on the side of the circuit layer 3 close to the chipset 1 and on the chipset 1, the circuit layer 3 includes a solid crystal area 33 and a first pin 311, a second pin 312, a third pin 313 and a fourth pin 314 electrically connected to the solid crystal area 33, and a mark point 32 for position identification is arranged on the second pin 312, the solid crystal area 33 includes a fourth connecting piece 334 electrically connected to the first pin 311, a first connecting piece 331 electrically connected to the second pin 312, a second connecting piece 332 electrically connected to the third pin 313 and a third connecting piece 333 electrically connected to the fourth pin 314, and the chipset 1 includes The red light chip 11 is arranged on the first connecting piece 331 and the second connecting piece 332, the green light chip 12 is arranged on the first connecting piece 331 and the third connecting piece 333, and the blue light chip 13 is arranged on the first connecting piece 331 and the fourth connecting piece 334. The packaging glue 2 completely covers the red light chip 11, the green light chip 12, and the blue light chip 13. The diameter of the mark point 32 is 1 mm. The red light chip 11 is fixed on the first connecting piece 331 and the second connecting piece 332 by solder paste, the green light chip 12 is fixed on the first connecting piece 331 and the third connecting piece 333 by solder paste, and the blue light chip 13 is fixed on the first connecting piece 331 and the fourth connecting piece 334 by solder paste.

[0022] Among them, a solid crystal area 33 is arranged on the circuit layer 3, and a chipset 1 is arranged on the solid crystal area 33, so that the circuit layer 3 is electrically connected to the chipset 1, and the packaging glue 2 covers the red light chip 11, the green light chip 12 and the blue light chip 13, so that the light emitted by the red light chip 11, the green light chip 12 and the blue light chip 13 can pass through the packaging glue 2 to make the light-emitting angle wider and the brightness greater, and the packaging glue 2 completely covers the red light chip 11, the green light chip 12 and the blue light chip 13, which can prevent water vapor from entering and causing the above-mentioned chip failure or reduction in luminous performance, and effectively protect the above-mentioned chips. The mark point 32 is used for position identification on the automatic placement machine.

[0023] The red light chip 11 emits red light, the green light chip 12 emits green light, and the blue light chip 13 emits blue light.

[0024] Described in further detail, the manufacturing process of the flip-chip LED lamp bead is as follows:

[0025] like Figure 1 As shown:

[0026] S1: providing a carrier board 5, and evenly applying a layer of colloid 4 on the carrier board 5, wherein the colloid 4 is UV glue.

[0027] S2: Lay a layer of copper foil on the colloid 4.

[0028] S3: Etching is performed on the copper foil to form the required circuits, thereby forming a circuit layer 3.

[0029] S4: Die bonding: Brush tin on the circuit layer 3 and place the chipset 1 on the solder paste, thereby fixing the chipset 1 on the circuit layer 3.

[0030] S5: performing molding and sealing on the circuit layer 3 and the chipset 1, and then cutting and removing the excess glue, thereby forming a packaging glue 2 on the circuit layer 3 and the chipset 1.

[0031] like Figure 2 As shown:

[0032] S6: The colloid 4 is debonded by UV irradiation, and then the carrier board 5 and the colloid 4 are separated from the circuit layer 3, and then the material is blanked to make the finished lamp beads.

[0033] In summary, the LED lamp bead reduces the thickness of the carrier board 5 itself, so that the overall height of the lamp bead is reduced, the cost in the manufacturing process of the carrier board 5 is reduced, and the cost of the carrier board 5 is reduced during the packaging support, thereby reducing the cost of the LED lamp bead in the manufacturing process. In addition, since the bottom of the LED lamp bead is a circuit layer 3 composed of copper foil, it is entirely metal, which is beneficial to the heat dissipation of the lamp bead and extends the life of the lamp bead. At the same time as the substrate is thinned, the package is also thinned, so that the lamp bead is brighter and the angle is larger, thereby achieving the effect of improving the performance of the LED lamp bead.

[0034] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0035] The above-mentioned embodiments only express several implementation methods of the utility model, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent of the utility model. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the utility model, and these all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A flip-chip LED lamp bead, characterized in that: It includes a circuit layer and a chipset arranged on the circuit layer, packaging glue is arranged on the side of the circuit layer close to the chipset and on the chipset, the circuit layer includes a solid crystal area and a first pin, a second pin, a third pin and a fourth pin electrically connected to the solid crystal area, the second pin is provided with a mark point for position identification, the solid crystal area includes a fourth connecting piece electrically connected to the first pin, a first connecting piece electrically connected to the second pin, a second connecting piece electrically connected to the third pin and a third connecting piece electrically connected to the fourth pin, the chipset includes a red light chip arranged on the first connecting piece and the second connecting piece, a green light chip arranged on the first connecting piece and the third connecting piece, and a blue light chip arranged on the first connecting piece and the fourth connecting piece.

2. The flip-chip LED lamp bead according to claim 1, characterized in that: The packaging glue completely covers the red light chip, the green light chip, and the blue light chip.

3. The flip-chip LED lamp bead according to claim 1, characterized in that: The diameter of the mark point is 1 mm.

4. The flip-chip LED lamp bead according to claim 1, characterized in that: The red light chip is fixed to the first connecting piece and the second connecting piece by solder paste, the green light chip is fixed to the first connecting piece and the third connecting piece by solder paste, and the blue light chip is fixed to the first connecting piece and the fourth connecting piece by solder paste.

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