Dispensing device for semiconductor packaging

Abstract

The utility model relates to the field of semiconductor processing equipment, and discloses a dispensing device for semiconductor packaging, which comprises a working table, and is characterized in that the front end and the rear end of the upper surface of the working table are respectively provided with a first sliding chute, and a sliding rod is fixedly connected in the first sliding chute at the front end of the upper surface of the working table; according to the dispensing device for semiconductor packaging, compared with most traditional dispensing devices for semiconductor packaging, the first protective shell is arranged on the connecting block, and the supporting block is arranged in the first sliding groove; a user can control the movement of a steel wire rope through a third electric telescopic rod so as to control the angle of a second protective shell relative to a first protective shell, so that the angle of a liquid outlet head arranged in the second protective shell is adjusted, and the trouble that some special positions cannot be aligned during vertical dispensing is reduced; and the device can accurately inject the glue solution to a required position, so that the dispensing efficiency of the device is improved.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor processing equipment, in particular to a glue dispensing device for semiconductor packaging. Background Art

[0002] The glue dispensing device for semiconductor packaging is a device used for glue dispensing in the process of semiconductor device packaging. The device is usually composed of glue dispensing machine, glue dispensing control system, glue dispensing head and glue dispensing mold. It is widely used in the packaging process of semiconductor devices, which can improve production efficiency, reduce production costs, and ensure the quality and reliability of devices.

[0003] However, most traditional semiconductor packaging dispensing devices are unable to accurately set the amount of glue injected each time according to processing requirements. Since the amount of glue cannot be accurately controlled during each dispensing, the viscosity of the glue between the semiconductor and the connected position may be inconsistent, affecting the packaging quality and reliability.

[0004] Therefore, those skilled in the art provide a dispensing device for semiconductor packaging to solve the problems raised in the above background technology. Utility Model Content

[0005] The purpose of the utility model is to solve the shortcomings existing in the prior art, and a semiconductor packaging dispensing device is proposed. Compared with most traditional semiconductor packaging dispensing devices, the semiconductor packaging dispensing device is provided with a liquid storage block. Through the retraction of the second electric telescopic rod, an appropriate amount of glue is sucked into the liquid storage block through the first delivery pipe, and then through the extension of the second electric telescopic rod, an appropriate amount of glue is delivered to the liquid outlet head through the second delivery pipe, and then coated on the required position. Through continuous cycle of operation, the device can more accurately control the injection amount of glue during each dispensing. The ability to more accurately control the injection amount of glue during each dispensing can ensure that the dispensing position is accurate and the glue is evenly applied, thereby improving the packaging quality and reliability, and the user can adjust the output glue by adjusting the extension length of the second electric telescopic rod, thereby improving the application range of the device.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] A dispensing device for semiconductor packaging comprises a workbench, wherein the front end and the rear end of the upper surface of the workbench are both provided with a first slide groove, a slide rod is fixedly connected in the first slide groove at the front end of the upper surface of the workbench, a support block is arranged inside the first slide groove, a first electric telescopic rod is fixedly connected at the center of the upper surface of the support block, a placement rack is fixedly connected to the upper surface of the first electric telescopic rod, a second slide groove is arranged in the middle of an outer wall of one side of the placement rack, a moving block is arranged inside the second slide groove, an outer wall of the moving block away from the placement rack is fixedly connected to a connecting block, an outer wall of the connecting block away from the moving block is fixedly connected to a first conveying pipe, and an end of the outer wall of the first conveying pipe close to the connecting block is fixedly connected A first one-way valve is provided, a liquid storage block is fixedly connected to the center of the upper surface of the connecting block, a second electric telescopic rod is fixedly connected to the center of the upper surface of the liquid storage block, a push plate is fixedly connected to the lower surface of the second electric telescopic rod, a second delivery pipe is fixedly connected to the center of the lower surface of the connecting block, a second one-way valve is fixedly connected to the upper end of the outer wall of the second delivery pipe, a liquid outlet head is fixedly connected to the end of the second delivery pipe away from the connecting block, a first protective shell is fixedly connected to the lower surface of the connecting block, the upper ends of both sides of the outer wall of the first protective shell are fixedly connected to the third electric telescopic rod, the lower surface of the first protective shell is hingedly connected to the second protective shell, and both sides of the upper surface of the second protective shell are fixedly connected to steel wire ropes.

[0008] Through the above technical solution, compared with most traditional semiconductor packaging dispensing devices, the semiconductor packaging dispensing device is provided with a first protective shell on the connecting block, and the user can control the movement of the wire rope through the third electric telescopic rod to control the angle of the second protective shell relative to the first protective shell, and then adjust the angle of the liquid outlet head provided in the second protective shell, thereby reducing the trouble of being unable to align with some special positions during vertical dispensing, so that the device can more accurately inject the glue into the required position, thereby improving the efficiency of the device during dispensing.

[0009] Furthermore, the four corners of the lower surface of the workbench are fixedly connected with legs, and the middle part of the front end outer wall of the workbench is fixedly connected with a controller;

[0010] Through the above technical solution, the working table can be placed in a desired position more stably by providing the supporting legs, and the user can operate the device by providing the controller.

[0011] Furthermore, a first servo motor is fixedly connected to the rear end of the outer wall of one side of the workbench, and a first threaded rod is fixedly connected to the output end of the first servo motor;

[0012] Through the above technical solution, the first servo motor can control the liquid discharge head to move leftward or rightward through the first threaded rod.

[0013] Furthermore, a second servo motor is fixedly connected to the center of the rear end outer wall of the placement rack, and a second threaded rod is fixedly connected to the output end of the second servo motor;

[0014] Through the above technical solution, the second servo motor can control the liquid discharge head to move forward or backward through the second threaded rod.

[0015] Furthermore, a fixing groove is provided at the center of the outer wall of the moving block away from the placement rack;

[0016] Through the above technical solution, the fixing groove is provided so that the connecting block can be fixedly connected to the moving block.

[0017] Furthermore, a display window is fixedly connected to the center of the front end of the outer wall of the liquid storage block;

[0018] Through the above technical solution, the display window is provided so that the user can observe the glue inside the liquid storage block.

[0019] Furthermore, a sealing gasket is fixedly connected to the lower end of the outer wall of the push plate;

[0020] Through the above technical solution, the sealing performance between the push plate and the liquid storage block is improved by providing a sealing gasket.

[0021] Furthermore, the lower ends of both sides of the outer wall of the first protective shell are fixedly connected to limit rings;

[0022] Through the above technical solution, a limiting ring is provided to limit the position of the steel wire rope moving on the first protective shell.

[0023] The utility model has the following beneficial effects:

[0024] 1. The utility model discloses a semiconductor packaging dispensing device. Compared with most traditional semiconductor packaging dispensing devices, the semiconductor packaging dispensing device is provided with a liquid storage block. An appropriate amount of glue liquid is sucked into the liquid storage block through the first delivery pipe by the retraction of the second electric telescopic rod, and then an appropriate amount of glue liquid is delivered to the liquid outlet head through the second delivery pipe by the extension of the second electric telescopic rod, and then coated on the required position. Through continuous cycle operation, the device can more accurately control the injection amount of glue liquid during each dispensing. The ability to more accurately control the injection amount of glue liquid during each dispensing can ensure that the dispensing position is accurate and the glue is evenly applied, thereby improving the packaging quality and reliability. In addition, the user can adjust the output glue liquid by adjusting the extension length of the second electric telescopic rod, thereby improving the application range of the device.

[0025] 2. The utility model proposes a semiconductor packaging dispensing device. Compared with most traditional semiconductor packaging dispensing devices, the semiconductor packaging dispensing device is provided with a first protective shell on the connecting block. The user can control the movement of the steel wire rope through the third electric telescopic rod to control the angle of the second protective shell relative to the first protective shell, and then adjust the angle of the liquid outlet head arranged in the second protective shell, thereby reducing the trouble of being unable to align with some special positions during vertical dispensing, so that the device can more accurately inject the glue into the required position, thereby improving the efficiency of the device during dispensing. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is a schematic diagram of the workbench structure of a semiconductor packaging dispensing device proposed by the utility model;

[0027] Figure 2 This is a schematic diagram of the structure of a placement frame for a semiconductor packaging dispensing device proposed by the utility model;

[0028] Figure 3 This is a schematic diagram of the structure of a liquid storage block of a semiconductor packaging dispensing device proposed by the utility model;

[0029] Figure 4 This is a schematic diagram of the structure of a second delivery pipe of a semiconductor packaging dispensing device proposed by the utility model;

[0030] Figure 5 This is a schematic diagram of the first protective shell structure of a glue dispensing device for semiconductor packaging proposed by the utility model.

[0031] Legend:

[0032] 1. Workbench; 2. Outriggers; 3. Controller; 4. First servo motor; 5. First threaded rod; 6. First slide; 7. Support block; 8. First electric telescopic rod; 9. Placement rack; 10. Second servo motor; 11. Second threaded rod; 12. Second slide; 13. Moving block; 14. Fixed slot; 15. Connecting block; 16. First delivery pipe; 17. First one-way valve; 18. Liquid storage block; 19. Display window; 20. Second electric telescopic rod; 21. Push plate; 22. Sealing pad; 23. Second delivery pipe; 24. Second one-way valve; 25. Liquid outlet; 26. First protective shell; 27. Third electric telescopic rod; 28. Limiting ring; 29. ​​Second protective shell; 30. Wire rope; 31. Slide. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0034] Reference Figure 1-5 , an embodiment provided by the utility model:

[0035] A dispensing device for semiconductor packaging comprises a workbench 1, four corners of the lower surface of the workbench 1 are fixedly connected with legs 2, a middle part of the outer wall at the front end of the workbench 1 is fixedly connected with a controller 3, the legs 2 are provided so that the workbench 1 can be placed in a desired position more stably, the controller 3 is provided so that a user can operate the device, a first slide groove 6 is provided at the front and rear ends of the upper surface of the workbench 1, a slide rod 31 is fixedly connected in the first slide groove 6 at the front end of the upper surface of the workbench 1, a support block 7 is provided inside the first slide groove 6, a first electric telescopic rod 8 is fixedly connected at the center of the upper surface of the support block 7, a placement rack 9 is fixedly connected to the upper surface of the first electric telescopic rod 8, a second slide groove 12 is provided in the middle part of the outer wall on one side of the placement rack 9, a moving block 13 is provided inside the second slide groove 12, the outer wall of the moving block 13 away from the placement rack 9 is fixedly connected with a connecting block 15, and the outer wall of the connecting block 15 away from the moving block 13 is fixedly connected with a first conveying pipe 16.

[0036] A first one-way valve 17 is fixedly connected to one end of the outer wall of the first delivery pipe 16 close to the connecting block 15, a liquid storage block 18 is fixedly connected to the center of the upper surface of the connecting block 15, a second electric telescopic rod 20 is fixedly connected to the center of the upper surface of the liquid storage block 18, a push plate 21 is fixedly connected to the lower surface of the second electric telescopic rod 20, a second delivery pipe 23 is fixedly connected to the center of the lower surface of the connecting block 15, a second one-way valve 24 is fixedly connected to the upper end of the outer wall of the second delivery pipe 23, a liquid outlet head 25 is fixedly connected to one end of the second delivery pipe 23 away from the connecting block 15, a first protective shell 26 is fixedly connected to the lower surface of the connecting block 15, third electric telescopic rods 27 are fixedly connected to the upper ends of both sides of the outer wall of the first protective shell 26, a second protective shell 29 is hingedly connected to the lower surface of the first protective shell 26, and steel wire ropes 30 are fixedly connected to both sides of the upper surface of the second protective shell 29.

[0037] Compared with most traditional semiconductor packaging dispensing devices, the semiconductor packaging dispensing device is provided with a liquid storage block 18. By retracting the second electric telescopic rod 20, an appropriate amount of glue is sucked into the liquid storage block 18 through the first delivery pipe 16, and then by extending the second electric telescopic rod 20, an appropriate amount of glue is delivered to the liquid outlet head 25 through the second delivery pipe 23, and then coated on the required position. Through continuous cycle operation, the device can more accurately control the injection amount of glue during each dispensing. The ability to more accurately control the injection amount of glue during each dispensing can ensure that the dispensing position is accurate and the glue is evenly applied, thereby improving the packaging quality and reliability, and the user can adjust the output glue by adjusting the extension length of the second electric telescopic rod 20, thereby improving the application range of the device.

[0038] A first servo motor 4 is fixedly connected to the rear end of the outer wall of one side of the workbench 1, and a first threaded rod 5 is fixedly connected to the output end of the first servo motor 4, so that the first servo motor 4 can control the liquid discharge head 25 to move left or right through the first threaded rod 5. A second servo motor 10 is fixedly connected to the center of the rear end outer wall of the placement rack 9, and a second threaded rod 11 is fixedly connected to the output end of the second servo motor 10, so that the second servo motor 10 can control the liquid discharge head 25 to move forward or backward through the second threaded rod 11. A fixed groove 14 is opened at the center of the outer wall of one side of the moving block 13 away from the placement rack 9. By setting a fixing groove 14, the connecting block 15 can be fixedly connected to the moving block 13. A display window 19 is fixedly connected to the center of the front end of the outer wall of the liquid storage block 18. By setting the display window 19, the user can observe the glue inside the liquid storage block 18. A sealing gasket 22 is fixedly connected to the lower end of the outer wall of the push plate 21. The sealing gasket 22 is provided to improve the sealing between the push plate 21 and the liquid storage block 18. The lower ends of both sides of the outer wall of the first protective shell 26 are fixedly connected with limiting rings 28. The limiting rings 28 are provided to limit the position of the wire rope 30 moving on the first protective shell 26.

[0039] Working principle: When the device is needed, first connect the first delivery pipe 16 to the glue barrel, then control the first servo motor 4, the second servo motor 10 and the first electric telescopic rod 8 through the controller 3, so as to move the liquid outlet head 25 to the desired position, and then the second electric telescopic rod 20 is retracted to suck a proper amount of glue into the liquid storage block 18 through the first delivery pipe 16, and then the second electric telescopic rod 20 is extended to deliver a proper amount of glue to the liquid outlet head 25 through the second delivery pipe 23, and then apply it to the desired position. Through continuous cycle of operation, the device can The amount of glue injected each time the glue is dispensed can be controlled more accurately, and the user can control the movement of the wire rope 30 through the third electric telescopic rod 27 to control the angle of the second protective shell 29 relative to the first protective shell 26. When the third electric telescopic rod 27 on one side is extended, the third electric telescopic rod 27 on the other side will retract to adjust the inclination angle of the second protective shell 29, and then adjust the angle of the liquid outlet head 25 set in the second protective shell 29, thereby reducing the trouble of not being able to align with some special positions during vertical glue dispensing, so that the device can more accurately inject the glue into the required position.

[0040] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A dispensing device for semiconductor packaging, comprising a workbench (1), characterized in that: The front end and the rear end of the upper surface of the workbench (1) are both provided with a first slide groove (6), a slide rod (31) is fixedly connected inside the first slide groove (6) at the front end of the upper surface of the workbench (1), a support block (7) is arranged inside the first slide groove (6), a first electric telescopic rod (8) is fixedly connected at the center of the upper surface of the support block (7), a placement rack (9) is fixedly connected to the upper surface of the first electric telescopic rod (8), and a second slide groove (12) is provided in the middle of the outer wall of one side of the placement rack (9); A moving block (13) is arranged inside the second slide groove (12); the outer wall of the moving block (13) on the side away from the placement rack (9) is fixedly connected to a connecting block (15); the outer wall of the connecting block (15) on the side away from the moving block (13) is fixedly connected to a first conveying pipe (16); an end of the outer wall of the first conveying pipe (16) close to the connecting block (15) is fixedly connected to a first non-return valve (17); a liquid storage block (18) is fixedly connected at the center of the upper surface of the connecting block (15); and a second electric telescopic rod (20) is fixedly connected at the center of the upper surface of the liquid storage block (18); The lower surface of the second electric telescopic rod (20) is fixedly connected to a push plate (21), the center of the lower surface of the connecting block (15) is fixedly connected to a second delivery pipe (23), the upper end of the outer wall of the second delivery pipe (23) is fixedly connected to a second one-way valve (24), the end of the second delivery pipe (23) away from the connecting block (15) is fixedly connected to a liquid outlet head (25), and the lower surface of the connecting block (15) is fixedly connected to a first protective shell (26); The upper ends of both sides of the outer wall of the first protective shell (26) are fixedly connected to third electric telescopic rods (27), the lower surface of the first protective shell (26) is hingedly connected to the second protective shell (29), and both sides of the upper surface of the second protective shell (29) are fixedly connected to steel wire ropes (30).

2. A semiconductor packaging glue dispensing device according to claim 1, characterized in that: The four corners of the lower surface of the workbench (1) are all fixedly connected to supporting legs (2), and the middle part of the front end outer wall of the workbench (1) is fixedly connected to a controller (3).

3. A semiconductor packaging glue dispensing device according to claim 1, characterized in that: A first servo motor (4) is fixedly connected to the rear end of an outer wall of one side of the workbench (1), and a first threaded rod (5) is fixedly connected to the output end of the first servo motor (4).

4. A semiconductor packaging glue dispensing device according to claim 1, characterized in that: A second servo motor (10) is fixedly connected to the center of the rear end outer wall of the placement rack (9), and a second threaded rod (11) is fixedly connected to the output end of the second servo motor (10).

5. The semiconductor packaging dispensing device according to claim 1, characterized in that: A fixing groove (14) is provided at the center of the outer wall of the moving block (13) on the side away from the placement rack (9).

6. The semiconductor packaging dispensing device according to claim 1, characterized in that: A display window (19) is fixedly connected to the center of the front end of the outer wall of the liquid storage block (18).

7. The semiconductor packaging dispensing device according to claim 1, characterized in that: A sealing gasket (22) is fixedly connected to the lower end of the outer wall of the push plate (21).

8. The semiconductor packaging dispensing device according to claim 1, characterized in that: The lower ends of both sides of the outer wall of the first protective shell (26) are fixedly connected to limit rings (28).

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