Copper plating device for inner wire core of enameled wire

By designing a wire core copper plating device including guide components, filter components, flushing components, drying components, reaction components and polishing components, the problem of dirt and oxide on the surface of the wire core affecting the quality of the copper plating layer is solved, and copper plating is realized The high quality and uniformity of the layers reduces the risk of peeling and foaming, and improves corrosion resistance and electrical conductivity.

CN222455296UActive Publication Date: 2025-02-11NANXIONG JINSHENG NEW MATERIALS CO LTD
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Patent Information

Application Number
CN202323242374.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2023-11-29
Publication Date
2025-02-11
Estimated Expiration
2033-11-29

AI Technical Summary

Technical Problem

During the copper plating process of existing wire core copper plating devices, dirt and oxides exist on the surface of the wire core, which affects the adhesion and uniformity of the copper plating layer, resulting in poor quality of the copper plating layer, and even problems such as peeling and bubbles.

Method used

An enameled wire internal wire core copper plating device is designed including a guide assembly, a filter assembly, a rinse assembly, a drying assembly, a reaction assembly and a polishing assembly. The device ensures that the surface of the wire core is clean and flat through pickling, rinsing, drying, copper plating and polishing, thereby improving the quality and uniformity of the copper plating layer.

Benefits of technology

Through the use of this device, dirt and oxides on the surface of the wire core can be effectively removed, high quality and uniformity of the copper plating layer, reducing the peeling and bubble problems of the copper plating layer, and improving the corrosion resistance of the copper plating layer and Conductive properties.

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Abstract

The utility model relates to the technical field of wire core copper plating, in particular to a copper plating device for an internal wire core of an enameled wire. According to an existing wire core copper plating device, an inner wire core of an enameled wire is usually directly put into a reaction tank for copper plating, dirt and oxide exist on the surface of the wire core, and the adhesive force and the uniformity of a copper plating layer can be affected; according to the technical scheme, the copper plating device for the inner wire core of the enameled wire comprises a guiding assembly, a filtering assembly, a flushing assembly, a drying assembly, a reaction assembly and a polishing assembly; compared with a traditional wire core copper plating device which does not carry out effective cleaning before copper plating so that copper plating is not uniform, the method of carrying out acid pickling on the surface of the wire core before copper plating is used for removing dirt and oxide on the surface so as to ensure that the surface of the wire core is clean and flat, so that the quality and the uniformity of a copper plating layer are ensured, and the production efficiency is improved. And then the residual acidic cleaning solution is washed away, so that the situation that chemical substances in the cleaning agent possibly react with the copper layer, and consequently the electrical property of the copper plating layer is reduced is prevented.
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Description

Technical Field

[0001] The utility model relates to the technical field of wire core copper plating, in particular to a device for copper plating the inner core of an enameled wire. Background Art

[0002] The main reason why the inner core of the enameled wire needs to be copper-plated is to improve its conductivity and corrosion resistance. It can also reduce resistance and prevent electromagnetic interference. Specifically, copper plating can form a conductive layer on the surface of the inner core, thereby improving the conductivity of the core, reducing the resistance of the core, and improving transmission efficiency. In addition, copper plating can prevent the inner core from contacting the external environment and causing corrosion, thereby improving the corrosion resistance and service life of the core. In addition, copper plating can also reduce electromagnetic interference, because the copper layer on the surface of the inner core has good conductivity and shielding properties, which can effectively isolate the influence of the external electromagnetic field on the inner core, thereby reducing electromagnetic interference. The uniformity of the copper plating layer attached to the surface of the core plays a vital role in the performance of the inner core of the enameled wire. The existing core copper plating device usually puts the inner core of the enameled wire directly into the reaction tank for copper plating. The presence of dirt and oxides on the surface of the core will affect the adhesion and uniformity of the copper plating layer, resulting in poor quality of the copper plating layer, and even peeling, blistering and other problems. Utility Model Content

[0003] In order to overcome the problem that during the copper plating process of the wire core copper plating device, the existing wire core copper plating device usually puts the inner core of the enameled wire directly into the reaction tank for copper plating. The dirt and oxides on the surface of the wire core will affect the adhesion and uniformity of the copper plating layer, resulting in poor quality of the copper plating layer, and even peeling, blistering and other problems.

[0004] The technical scheme of the utility model is: a device for copper plating the inner core of an enameled wire, comprising a guide component, a filter component, a flushing component, a drying component, a reaction component and a polishing component; a filter component for treating harmful gases generated during a cleaning process is arranged on one side of the guide component, a flushing component for flushing residual cleaning agent on the surface is arranged on the other side of the guide component, a drying component is arranged above the flushing component, a reaction component is arranged on one side of the drying component, and a polishing component is arranged on one side of the reaction component.

[0005] Preferably, by setting a guide component, direction and power can be provided for the movement of the wire core; by setting a filtering component, harmful gases generated during the pickling process can be filtered to reduce pollution to the environment; by setting a flushing component, the acidic substances on the surface after the pickling are flushed to prevent the chemical substances in the cleaning agent from reacting with the copper layer, resulting in a decrease in the electrical properties of the copper plating layer, such as an increase in resistivity and a deterioration in conductivity; by setting a drying component, the cleaned wire core can be dried to prevent the formation of an oxide film on the surface of the copper layer, which reduces the corrosion resistance and makes it easy to be oxidized or corroded; the wire core is plated with a copper layer by the reaction component to effectively prevent the surface of the wire core from contacting the external environment and causing corrosion; by setting a polishing component, the surface of the copper layer can be made smoother and tiny protrusions and depressions can be reduced, thereby enhancing the corrosion resistance of the copper layer, while removing surface oxides and impurities and improving the conductivity of the copper layer.

[0006] Preferably, the guide assembly includes a bottom plate, a pickling box, a fixing part, a first guide plate, a first fixed plate, a first motor, a first rotating column and a guide wheel; a pickling box is arranged above the bottom plate, a fixing part is arranged on the inner bottom surface of the pickling box, a first guide plate is arranged above the pickling box, two groups of the first guide plates are arranged, a first fixed plate is arranged on one side of the first guide plate, two groups of the first fixed plates are arranged, a first rotating column is arranged on one side of the first fixed plate, two groups of the first rotating columns are arranged, the first rotating column passes through the first fixed plate, and a first motor is arranged on one side of the first rotating column. Two groups of first motors are provided, and the output end of the first motor is rotatably connected to the first rotating column. A guide wheel is provided on the other side of the first rotating column. Two groups of guide wheels are provided. The wire core passes through the first guide plate, and then passes through the fixing piece and the other group of first guide plates, so that the wire core is completely immersed in the acid cleaning agent to remove dirt and oxides on the surface to ensure that the surface of the wire core is clean and smooth, thereby ensuring the quality and uniformity of the copper plating layer. Starting the first motor can drive the first rotating column to rotate, and then drive the guide wheel to rotate, providing power for the movement of the wire core, thereby achieving the effect of continuously cleaning the wire core.

[0007] Preferably, the filter assembly includes a hinge, a cover plate, a first fan, a first exhaust duct, an air purifier and a second exhaust duct; a hinge is provided on one side of the first guide plate, a cover plate is provided above the hinge, the cover plate is rotatably connected to the pickling box through the hinge, a first fan is provided on one side of the cover plate, a first exhaust duct is provided on one side of the first fan, an air purifier is provided on one side of the first exhaust duct, and a second exhaust duct is provided on one side of the air purifier. The cover plate is opened, the acid cleaning agent is injected into the pickling box, the cover plate is closed, and the first fan is started to suck the harmful gas generated during the cleaning process into the first exhaust duct, and the harmful gas is discharged from the second exhaust duct after being filtered by the air purifier, thereby reducing the pollution of the harmful gas to the environment.

[0008] Preferably, the flushing component includes a first water storage tank, a first water pump, a first water pumping pipe, a first nozzle and a first wastewater collecting tank; a first wastewater collecting tank is arranged on one side of the pickling tank, a first water storage tank is arranged on one side of the first wastewater collecting tank, a first water pump is arranged above the first water storage tank, a first water pump is arranged above the first water pump, a first water pumping pipe is arranged at one end of the first water pumping pipe is arranged with a first nozzle, and multiple groups of first nozzles are arranged. After cleaning, the wire core passes through another group of first guide plates to reach the top of the first wastewater collecting tank. The first water pump is started and the water in the first water storage tank is pumped to the multiple groups of first nozzles through the first water pumping pipe to flush the wire core to prevent the chemical substances remaining in the acid cleaning agent from reacting with the copper layer, resulting in a decrease in the electrical properties of the copper plating layer, such as an increase in resistivity and a deterioration in conductivity. By setting the first wastewater collecting tank, the flushing wastewater can be collected to prevent pollution to the environment.

[0009] Preferably, the drying component includes a support column, a second fixed plate and a second fan; a support column is arranged on one side of the first water tank, two groups of support columns are arranged, a second fixed plate is arranged above the support column, and a second fan is arranged below the second fixed plate. The second fan is started to dry the wire core to prevent the formation of an oxide film on the surface of the copper layer, which reduces the corrosion resistance and makes it easy to be oxidized or corroded.

[0010] Preferably, the reaction component includes a copper plating reaction tank, an electrode sheet, a second guide plate and a third guide plate; a copper plating reaction tank is arranged on one side of the first wastewater collection box, an electrode sheet is arranged on the inner side wall of the copper plating reaction tank, two groups of electrode sheets are arranged, a second guide plate is arranged above the copper plating reaction tank, two groups of second guide plates are arranged, a third guide plate is arranged on one side of the second guide plate, two groups of third guide plates are arranged, and the wire core after cleaning and drying is passed through the two groups of second guide plates and third guide plates so that the wire core is completely immersed in the copper plating reaction tank, and then the two groups of electrode sheets are energized so that copper ions are evenly attached to the surface of the wire core to form a copper plating layer.

[0011] Preferably, the polishing assembly includes a second water reservoir, a second water pump, a second water pumping pipe, a second nozzle, a second wastewater collection box, a third fixed plate, a second motor, a second rotating column and a polishing wheel; a second wastewater collection box is arranged on one side of the copper plating reaction tank, a second water reservoir is arranged on one side of the second wastewater collection box, a second water pump is arranged above the second water reservoir, a second water pump is arranged above the second water pump, a second water pumping pipe is arranged at one end of the second water pumping pipe, a second nozzle is arranged in multiple groups, a third fixed plate is arranged on the other side of the second wastewater collection box, a second rotating column is arranged on one side of the third fixed plate, the second rotating column passes through the third fixed plate, a second motor is arranged at one end of the second rotating column, and the output of the second motor The first end is rotatably connected to the second rotating column, and the other end of the second rotating column is provided with a polishing wheel. The wire core after copper plating is completed passes through the second guide plate to the second wastewater collection tank, and the second water pump is started to pump water in the second water reservoir to multiple groups of second nozzles through the second pumping pipe to flush the copper plating solution remaining on the wire core. The flushing wastewater can be collected by setting up the second wastewater collection tank. While flushing, the second motor is started to drive the second rotating column to rotate, thereby driving the polishing wheel to move, removing surface oxides and impurities, improving the conductivity of the copper layer, polishing the surface of the wire core, making the surface of the copper layer smoother, reducing tiny protrusions and depressions, thereby enhancing the corrosion resistance of the copper layer, and the debris of the copper plating layer will flow into the second wastewater collection tank with the water flow.

[0012] Beneficial effects of the utility model:

[0013] 1. Compared with the traditional copper plating device for the wire core, which does not perform effective cleaning before copper plating, resulting in uneven copper plating, the method of pickling the surface of the wire core before copper plating is to remove the surface dirt and oxides to ensure the cleanliness and flatness of the surface of the wire core, thereby ensuring the quality and uniformity of the copper plating layer, and then rinse off the residual acid cleaning solution to prevent the chemical substances in the cleaning agent from reacting with the copper layer, resulting in a decrease in the electrical properties of the copper plating layer;

[0014] 2. Start the second pumping pump to pump water from the second water reservoir to the plurality of second nozzles through the second pumping pipe to flush the copper plating solution remaining on the wire core. The second wastewater collection box can be used to collect the flushing wastewater. While flushing, start the second motor to drive the second rotating column to rotate, thereby driving the polishing wheel to move, remove the oxides and impurities on the surface, improve the conductivity of the copper layer, polish the surface of the wire core, make the surface of the copper layer smoother, reduce tiny protrusions and depressions, and thus enhance the corrosion resistance of the copper layer;

[0015] 3. Starting the first motor can drive the first rotating column to rotate, and then drive the guide wheel to rotate, providing power for the movement of the wire core, so as to realize the function of continuously cleaning the wire core. Starting the first fan will suck the harmful gas generated in the cleaning process into the first exhaust duct, and then discharge it from the second exhaust duct after being filtered by the air purifier, so as to reduce the pollution of harmful gases to the environment. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 What is shown is a right-side perspective structural diagram of the wire core copper plating device of the utility model;

[0017] Figure 2 The schematic diagram of the cross-sectional three-dimensional structure of the guide assembly of the wire core copper plating device of the utility model is shown;

[0018] Figure 3 What is shown is a three-dimensional structural schematic diagram of a reaction component of a wire core copper plating device of the utility model;

[0019] Figure 4 What is shown is a three-dimensional structural schematic diagram of the polishing assembly of the wire core copper plating device of the utility model;

[0020] Explanation of reference numerals: 1. guide assembly; 2. filter assembly; 3. rinse assembly; 4. dry assembly; 5. reaction assembly; 6. polishing assembly; 101. bottom plate; 102. pickling box; 103. fixing member; 104. first guide plate; 105. first fixing plate; 106. first motor; 107. first rotating column; 108. guide wheel; 201. hinge; 202. cover plate; 203. first fan; 204. first exhaust duct; 205. air purifier; 206. second exhaust duct; 301. first water storage tank; 302. first A water pump; 303, a first water pump; 304, a first nozzle; 305, a first wastewater collection box; 401, a support column; 402, a second fixed plate; 403, a second fan; 501, a copper plating reaction tank; 502, an electrode sheet; 503, a second guide plate; 504, a third guide plate; 601, a second water reservoir; 602, a second water pump; 603, a second water pump; 604, a second nozzle; 605, a second wastewater collection box; 607, a third fixed plate; 608, a second motor; 609, a second rotating column; 610, a polishing wheel. DETAILED DESCRIPTION

[0021] The utility model is further described below in conjunction with the accompanying drawings and embodiments.

[0022] See also Figure 1The utility model provides an embodiment: a copper plating device for the inner core of an enameled wire, comprising a guide component 1, a filter component 2, a flushing component 3, a drying component 4, a reaction component 5 and a polishing component 6; a filter component 2 for treating harmful gases generated during a cleaning process is arranged on one side of the guide component 1, a flushing component 3 for flushing residual cleaning agents on the surface is arranged on the other side of the guide component 1, a drying component 4 is arranged above the flushing component 3, a reaction component 5 is arranged on one side of the drying component 4, and a polishing component 6 is arranged on one side of the reaction component 5.

[0023] See also Figure 2In this embodiment, the guide assembly 1 includes a bottom plate 101, a pickling box 102, a fixing member 103, a first guide plate 104, a first fixing plate 105, a first motor 106, a first rotating column 107 and a guide wheel 108; the pickling box 102 is arranged above the bottom plate 101, the inner bottom surface of the pickling box 102 is provided with a fixing member 103, the first guide plate 104 is arranged above the pickling box 102, two groups of the first guide plates 104 are arranged, one side of the first guide plate 104 is provided with a first fixing plate 105, two groups of the first fixing plate 105 are arranged, one side of the first fixing plate 105 A first rotating column 107 is provided, and two groups of the first rotating column 107 are provided. The first rotating column 107 passes through the first fixed plate 105. A first motor 106 is provided on one side of the first rotating column 107. Two groups of the first motor 106 are provided. The output end of the first motor 106 is rotatably connected to the first rotating column 107. A guide wheel 108 is provided on the other side of the first rotating column 107. Two groups of the guide wheels 108 are provided. The wire core passes through the first guide plate 104, and then passes through the fixing piece 103 and another group of first guide plates 104, so that the wire core is completely immersed in the acid cleaning agent to remove dirt and oxides on the surface. To ensure that the surface of the wire core is clean and flat, thereby ensuring the quality and uniformity of the copper plating layer, starting the first motor 106 can drive the first rotating column 107 to rotate, and then drive the guide wheel 108 to rotate, providing power for the movement of the wire core, and realizing the function of continuously cleaning the wire core. The filter assembly 2 includes a hinge 201, a cover plate 202, a first fan 203, a first exhaust duct 204, an air purifier 205 and a second exhaust duct 206; a hinge 201 is provided on one side of the first guide plate 104, and a cover plate 202 is provided above the hinge 201. The cover plate 202 is connected to the pickling box through the hinge 201 102 is rotatably connected, a first fan 203 is arranged on one side of the cover 202, a first exhaust duct 204 is arranged on one side of the first fan 203, an air purifier 205 is arranged on one side of the first exhaust duct 204, a second exhaust duct 206 is arranged on one side of the air purifier 205, the cover 202 is opened, the acid cleaning agent is injected into the pickling box 102, the cover 202 is closed, the first fan 203 is started to suck the harmful gas generated in the cleaning process into the first exhaust duct 204, and the harmful gas is filtered by the air purifier 205 and then discharged from the second exhaust duct 206, so as to reduce the pollution of the harmful gas to the environment.

[0024] See also Figure 3In this embodiment, the flushing component 3 includes a first water storage tank 301, a first water pump 302, a first water pumping pipe 303, a first nozzle 304 and a first wastewater collection tank 305; the first wastewater collection tank 305 is arranged on one side of the pickling tank 102, the first water storage tank 301 is arranged on one side of the first wastewater collection tank 305, the first water pump 302 is arranged above the first water storage tank 301, the first water pump 302 is arranged above the first water pump 302, the first water pumping pipe 303 is arranged at one end of the first water pumping pipe 303, and the first nozzle 304 is arranged in multiple groups, and the cleaning is completed The wire core passes through another set of first guide plates 104 and reaches the top of the first wastewater collection box 305. The first pumping pump 302 is started to pump the water in the first water storage tank 301 to the multiple sets of first nozzles 304 through the first pumping pipe 303 to rinse the wire core to prevent the chemical substances remaining in the acid cleaning agent from reacting with the copper layer, resulting in a decrease in the electrical properties of the copper plating layer, such as an increase in resistivity and a deterioration in conductivity. The first wastewater collection box 305 can be set to collect the flushing wastewater to prevent pollution to the environment. The drying component 4 includes a support column 401, a second fixed plate 402 and a second fan 403; a support column 401 is arranged on one side of the first water storage tank 301, and two groups of support columns 401 are arranged, a second fixed plate 402 is arranged above the support column 401, and a second fan 403 is arranged below the second fixed plate 402. The second fan 403 is started to dry the wire core to prevent the formation of an oxide film on the surface of the copper layer, reduce the corrosion resistance, and make it easy to be oxidized or corroded. The reaction component 5 includes a copper plating reaction pool 501, an electrode sheet 502, a second guide plate 503 and a third guide plate 504; a copper plating reaction tank 501 is arranged on one side of the first wastewater collection tank 305. Reaction pool 501, the inner side wall of the copper plating reaction pool 501 is provided with electrode sheets 502, and two groups of electrode sheets 502 are provided. A second guide plate 503 is provided above the copper plating reaction pool 501, and two groups of second guide plates 503 are provided. A third guide plate 504 is provided on one side of the second guide plate 503, and two groups of third guide plates 504 are provided. After cleaning and drying, the wire core is inserted into the two groups of second guide plates 503 and third guide plates 504 to make the wire core completely immersed in the copper plating reaction pool 501, and then the two groups of electrode sheets 502 are energized to make copper ions evenly adhere to the surface of the wire core to form a copper plating layer.

[0025] See also Figure 4In this embodiment, the polishing assembly 6 includes a second water reservoir 601, a second water pump 602, a second water pumping pipe 603, a second nozzle 604, a second wastewater collection box 605, a third fixed plate 607, a second motor 608, a second rotating column 609 and a polishing wheel 610; a second wastewater collection box 605 is arranged on one side of the copper plating reaction tank 501, a second water reservoir 601 is arranged on one side of the second wastewater collection box 605, a second water pump 602 is arranged above the second water reservoir 601, a second water pump 603 is arranged above the second water pump 602, a second water pumping pipe 603 is arranged at one end of the second water pumping pipe 603, a second nozzle 604 is arranged in multiple groups, a third fixed plate 607 is arranged on the other side of the second wastewater collection box 605, a second rotating column 609 is arranged on one side of the third fixed plate 607, the second rotating column 609 penetrates the third fixed plate 607, and the second rotating column 609 A second motor 608 is provided at one end, and the output end of the second motor 608 is rotatably connected to the second rotating column 609. A polishing wheel 610 is provided at the other end of the second rotating column 609. After the copper plating is completed, the wire core passes through the second guide plate 503 to reach the second wastewater collection box 605, and the second pumping pump 602 is started to pump water in the second water reservoir 601 to multiple groups of second nozzles 604 through the second pumping pipe 603 to rinse the copper plating solution remaining on the wire core. The second wastewater collection box 605 can be used to collect the flushing wastewater. While flushing, the second motor 608 is started to drive the second rotating column 609 to rotate, thereby driving the polishing wheel 610 to move, remove surface oxides and impurities, improve the conductivity of the copper layer, polish the surface of the wire core, make the surface of the copper layer smoother, reduce tiny protrusions and depressions, thereby enhancing the corrosion resistance of the copper layer, and the debris of the copper plating layer will flow into the second wastewater collection box 605 with the water flow.

[0026] When copper is plated in the wire core copper plating device, first open the cover plate 202, inject the acid cleaning agent into the pickling box 102, open the cover plate 202, inject the acid cleaning agent into the pickling box 102, pass the wire core through the first guide plate 104, and then pass through the fixing piece 103 and another set of first guide plates 104, immerse the wire core in the acid cleaning agent, start the first motor 106 to drive the first rotating column 107 to rotate, and then drive the guide wheel 108 to rotate, providing power for the movement of the wire core, close the cover plate 202, start the first fan 203 to suck the harmful gas generated during the cleaning process into the first exhaust duct 204, and then discharge it from the second exhaust duct 206 after filtering through the air purifier 205, so as to reduce the pollution of harmful gas to the environment. After the cleaning is completed, the wire core passes through another set of first guide plates 104 to reach the top of the first wastewater collection box 305, and the first pumping pump 302 is started. The water in the first water storage tank 301 is pumped to the multiple sets of first spray The wire core is rinsed in the nozzle 304. The first wastewater collection box 305 is provided to collect the rinsed wastewater to prevent pollution to the environment. The second fan 403 is started to dry the wire core. The wire core after cleaning and drying is inserted into two sets of second guide plates 503 and third guide plates 504, so that the wire core is completely immersed in the copper plating reaction tank 501. Then, the two sets of electrode sheets 502 are energized to make copper ions evenly adhere to the surface of the wire core to form a copper plating layer. After the copper plating is completed, the wire core passes through the second guide plate 503 to reach the second wastewater collection box 605. The second pumping pump 602 is started to pump the water in the second water reservoir 601 through the second pumping pipe 603 to multiple sets of second nozzles 604 to rinse the copper plating solution remaining on the wire core. The second wastewater collection box 605 is provided to collect the rinsed wastewater. While rinsing, the second motor 608 is started to drive the second rotating column 609 to rotate, thereby driving the polishing wheel 610 to move to remove oxides and impurities on the surface.

[0027] Through the above steps, by setting the guide component 1, the direction and power for the movement of the wire core can be provided; by setting the filter component 2, the harmful gas generated during the pickling process can be filtered to reduce pollution to the environment; by setting the flushing component 3, the acidic substances on the surface after the pickling are washed to prevent the chemical substances in the cleaning agent from reacting with the copper layer, resulting in a decrease in the electrical properties of the copper-plated layer, such as an increase in resistivity and a deterioration in conductivity; by setting the drying component 4, the cleaned wire core can be dried to prevent the formation of an oxide film on the surface of the copper layer, which reduces the corrosion resistance and makes it easy to be oxidized or corroded; the wire core is plated with a copper layer by the reaction component 5 to effectively prevent the surface of the wire core from contacting the external environment and causing corrosion; by setting the polishing component 6, the surface of the copper layer can be made smoother, and tiny protrusions and depressions can be reduced, thereby enhancing the corrosion resistance of the copper layer, while removing the surface oxides and impurities and improving the conductivity of the copper layer.

[0028] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of those skilled in the art without departing from the purpose of the present invention.

Claims

1. A device for copper plating the inner core of an enameled wire, comprising a guide assembly (1); characterized in that: The invention also comprises a filtering component (2), a flushing component (3), a drying component (4), a reaction component (5) and a polishing component (6); a filtering component (2) for treating harmful gases generated during the cleaning process is arranged on one side of the guide component (1); a flushing component (3) for flushing cleaning agents remaining on the surface is arranged on the other side of the guide component (1); a drying component (4) is arranged above the flushing component (3); a reaction component (5) is arranged on one side of the drying component (4); and a polishing component (6) is arranged on one side of the reaction component (5).

2. The device for copper plating the inner core of an enameled wire according to claim 1, characterized in that: The guide assembly (1) comprises a bottom plate (101), a pickling box (102), a fixing member (103), a first guide plate (104), a first fixing plate (105), a first motor (106), a first rotating column (107) and a guide wheel (108); the pickling box (102) is arranged above the bottom plate (101), the fixing member (103) is arranged on the inner bottom surface of the pickling box (102), the first guide plate (104) is arranged above the pickling box (102), two groups of the first guide plates (104) are arranged, and a first fixing plate is arranged on one side of the first guide plate (104). The invention relates to a block (105), wherein two groups of first fixed plates (105) are provided, a first rotating column (107) is provided on one side of the first fixed plate (105), and two groups of first rotating columns (107) are provided, the first rotating column (107) passes through the first fixed plate (105), a first motor (106) is provided on one side of the first rotating column (107), and two groups of first motor (106) are provided, an output end of the first motor (106) is rotatably connected to the first rotating column (107), and a guide wheel (108) is provided on the other side of the first rotating column (107), and two groups of guide wheels (108) are provided.

3. The device for copper plating the inner core of an enameled wire according to claim 2, characterized in that: The filter assembly (2) comprises a hinge (201), a cover plate (202), a first fan (203), a first exhaust duct (204), an air purifier (205) and a second exhaust duct (206); a hinge (201) is arranged on one side of the first guide plate (104), a cover plate (202) is arranged above the hinge (201), the cover plate (202) is rotatably connected to the pickling box (102) via the hinge (201), a first fan (203) is arranged on one side of the cover plate (202), a first exhaust duct (204) is arranged on one side of the first fan (203), an air purifier (205) is arranged on one side of the first exhaust duct (204), and a second exhaust duct (206) is arranged on one side of the air purifier (205).

4. The device for copper plating the inner core of an enameled wire according to claim 2, characterized in that: The flushing assembly (3) comprises a first water storage tank (301), a first water pump (302), a first water pumping pipe (303), a first nozzle (304) and a first wastewater collection tank (305); the first wastewater collection tank (305) is arranged on one side of the pickling tank (102), the first water storage tank (301) is arranged on one side of the first wastewater collection tank (305), the first water pump (302) is arranged above the first water storage tank (301), the first water pump (303) is arranged above the first water pump (302), the first water pumping pipe (303) is arranged at one end of the first water pumping pipe (303), and the first nozzle (304) is arranged in multiple groups.

5. The device for copper plating the inner core of an enameled wire according to claim 3, characterized in that: The drying component (4) comprises a support column (401), a second fixed plate (402) and a second fan (403); a support column (401) is arranged on one side of the first water storage tank (301), two groups of support columns (401) are arranged, a second fixed plate (402) is arranged above the support column (401), and a second fan (403) is arranged below the second fixed plate (402).

6. The device for copper plating the inner core of an enameled wire according to claim 5, characterized in that: The reaction assembly (5) comprises a copper plating reaction tank (501), an electrode sheet (502), a second guide plate (503) and a third guide plate (504); the copper plating reaction tank (501) is arranged on one side of the first wastewater collection box (305); the electrode sheet (502) is arranged on the inner side wall of the copper plating reaction tank (501); the electrode sheet (502) is arranged in two groups; a second guide plate (503) is arranged above the copper plating reaction tank (501); the second guide plate (503) is arranged in two groups; a third guide plate (504) is arranged on one side of the second guide plate (503); the third guide plate (504) is arranged in two groups.

7. The device for copper plating the inner core of an enameled wire according to claim 6, characterized in that: The polishing assembly (6) comprises a second water reservoir (601), a second water pump (602), a second water pumping pipe (603), a second nozzle (604), a second wastewater collection box (605), a third fixed plate (607), a second motor (608), a second rotating column (609) and a polishing wheel (610); a second wastewater collection box (605) is arranged on one side of the copper plating reaction tank (501), a second water reservoir (601) is arranged on one side of the second wastewater collection box (605), a second water pump (602) is arranged above the second water reservoir (601), and a second pump (603) is arranged above the second water pump (602). A water pipe (603), a second nozzle (604) is arranged at one end of the second water pumping pipe (603), and a plurality of groups of the second nozzles (604) are arranged; a third fixed plate (607) is arranged at the other side of the second wastewater collection box (605); a second rotating column (609) is arranged at one side of the third fixed plate (607), and the second rotating column (609) penetrates the third fixed plate (607); a second motor (608) is arranged at one end of the second rotating column (609), and an output end of the second motor (608) is rotatably connected to the second rotating column (609); and a polishing wheel (610) is arranged at the other end of the second rotating column (609).