Evaporation heat dissipation assembly

Abstract

The evaporation heat dissipation assembly comprises a first water cooling head, a first water pump, a first water bag and a heat dissipation device which are connected in a circulating mode, the first water cooling head is tightly attached to the hot face of a semiconductor chilling plate, the heat dissipation device comprises a shell with a water inlet end and a water outlet end, and a first water storage bin is arranged on the side, close to the water inlet end, in the shell. A first water storage bin is arranged in the shell and provided with a plurality of water inlet holes, a second water storage bin is arranged on the side, close to the water outlet end, in the shell and provided with a plurality of water outlet holes, a water passing part is arranged between the first water storage bin and the second water storage bin, the shell is provided with a plurality of air outlets and air inlets corresponding to the water passing part, and the air inlets are correspondingly provided with fans. The first water pump ensures that water in the evaporation heat dissipation assembly keeps circulating flowing, the water flows to the water passing part through a water inlet hole of the first water storage bin, air flowing in the water passing part takes away heat in the water, then the water flows to the second water storage bin through a water outlet hole and finally flows back to the first water cooling head from the water outlet end along the other end of the first water bag, and the water circulation process is continuously repeated. The design structure is simple, the heat dissipation efficiency is high, and the practicability of the product is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor refrigeration, in particular to an evaporative heat dissipation component. Background Art

[0002] Semiconductor refrigeration technology is widely used in low-power refrigeration occasions due to its advantages of fast refrigeration, no noise, and small size, such as small refrigerators. Its working principle determines that the refrigeration efficiency of the cold surface depends on the heat dissipation efficiency of the hot surface.

[0003] Semiconductor refrigeration chips have been widely used in small refrigeration products such as wine refrigerators, hot and cold dual-purpose boxes for cars, electronic ice cream machines, etc. due to their small size, compact structure, and convenient cooling capacity control. In addition, there are corresponding air cooling systems based on semiconductor refrigeration chip technology, such as the Chinese public patent document "CN105444462B, semiconductor refrigeration system". Based on this technical solution, the semiconductor refrigeration system is mainly studied to set the distance D within the following range: (LF-LT) / 2≤D≤(LF / 2+LT / 5), where LF>LT, which can significantly improve the equivalent heat exchange performance of the semiconductor refrigeration system, thereby effectively increasing the cooling capacity.

[0004] Based on the above theory, although the heat exchange effect of the semiconductor refrigeration plate can be improved, the hot surface of the semiconductor refrigeration plate needs to be cooled. The existing heat dissipation method is to fit a heat sink to the hot surface of the semiconductor refrigeration plate and drive the airflow through a cooling fan to dissipate heat, or fit the hot surface of the semiconductor to a water cooling head and drive the airflow through a cooling fan to dissipate heat, but this heat dissipation efficiency is too low. Utility Model Content

[0005] The purpose of the utility model is to provide an evaporative heat dissipation component to solve the problems raised in the above background technology.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] An evaporative heat dissipation component comprises a water cooling head, a water pump, a water bag and a heat dissipation device which are cyclically connected, wherein the water cooling head is tightly fitted to the hot surface of a semiconductor refrigeration plate, and the heat dissipation device comprises a shell having a water inlet and a water outlet, a water storage tank is provided on the side of the shell near the water inlet, and the water storage tank is provided with a plurality of water inlet holes, a water storage tank is provided on the side of the shell near the water outlet, and the water storage tank is provided with a plurality of water outlet holes, a water passage is provided between the water storage tanks, and a plurality of air outlets and air inlets corresponding to the water passage are provided on the shell, and a fan is installed corresponding to the air inlet.

[0008] Preferably, the water-passing portion comprises a plurality of diverter grooves arranged on the inner side of the shell, one end of the diverter groove is connected to the water inlet hole, and a water-absorbing sheet is arranged on the upper end surface of the diverter groove, and the water-absorbing sheet is in close contact with the inner wall of the shell.

[0009] Preferably, the shell includes an upper cover and a lower cover, the upper cover is provided with a right baffle plate 1 on one side close to the water inlet end, the lower cover is provided with a right baffle plate 2 on one side close to the water inlet end, the right baffle plate 1 and the right baffle plate 2 are fitted together with the upper cover and the lower cover to form a water storage tank 1, the upper cover is provided with a left baffle plate 1 on one side close to the water outlet end, the lower cover is provided with a left baffle plate 2 on one side close to the water outlet end, the left baffle plate 1 and the left baffle plate 2 are fitted together with the upper cover and the lower cover to form a water storage tank 2.

[0010] Preferably, the right baffle plate 1 is provided with a convex portion 1, and the right baffle plate 2 is provided with a concave portion 1 that can be used for the convex portion 1 to be inserted into.

[0011] Preferably, the left baffle plate 1 is provided with a convex portion 2, and the left baffle plate 2 is provided with a concave portion 1 for inserting the convex portion 2 into.

[0012] Beneficial effects of the utility model:

[0013] The utility model is small in size, easy to carry, and highly expandable. It can adopt a multi-layer water-passing part design to meet higher heat dissipation requirements. The water of the evaporative heat dissipation component is kept circulating through a water pump 1. The water flows to the water-passing part through the water inlet hole of the water storage tank 1. The water-passing part cooperates with the water-absorbing sheet and the diverter groove. The diverter groove is a groove that extends to both sides to ensure that the water-absorbing sheet absorbs water evenly, thereby increasing the heat dissipation area to take away the heat in the water, and then flows from the water outlet hole to the water storage tank 2, and finally flows from the water outlet end along the other end of the water bag 1 back to the water cooling head 1. This water circulation process is repeated continuously. This design has a simple structure, high heat dissipation efficiency, and improves the practicality of the product.

[0014] Other features and advantages of the present invention will be described in detail in the subsequent specific implementation section. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 : The overall structure diagram of the utility model.

[0016] Figure 2 : An exploded view of the heat dissipation device of the present invention.

[0017] Figure 3 : The utility model upper cover inner side structure diagram.

[0018] Figure 4 : The water circulation connection structure diagram of the evaporative heat dissipation component of the utility model.

[0019] Figure numerals: 1, water cooling head one; 2, water pump one; 3, water bag one; 4, shell; 5, semiconductor refrigeration plate; 6, water storage tank one; 7, water storage tank two; 8, wind guide baffle; 41, water inlet end; 42, water outlet end; 43, upper cover; 44, lower cover; 45, water inlet hole; 46, water outlet hole; 47, water passage; 48, air outlet; 49, air inlet; 431, right baffle one; 432, left baffle one; 441, right baffle two; 442, left baffle two; 471, diverter groove; 472, water absorbent sheet; 4311, convex part one; 4312, convex part two; 4411, concave part one; 4421, concave part two. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0021] Please refer to Figure 1-4 ;

[0022] An evaporative heat dissipation component comprises a water cooling head 1, a water pump 2, a water bag 3 and a heat dissipation device which are cyclically connected. One end of the water cooling head 1 is sequentially connected to the water pump 2, one end of the water bag 3 and the water inlet of the heat dissipation device, and the other end of the water cooling head 1 is sequentially connected to the other end of the water bag 3 and the water outlet of the heat dissipation device, so as to form a water cycle. The water circulation structure is connected through a water pipe. The water pump 2 is responsible for driving the operation of the entire water circulation system to ensure that the water continues to flow. The water cooling head 1 is tightly fitted to the hot surface of the semiconductor refrigeration plate 5. The heat dissipation device comprises a shell 4 having a water inlet end 41 and a water outlet end 42. The shell 4 can be a rectangular parallelepiped or a cube-shaped structure. The shell 4 is close to the water inlet end 41 and the water outlet end 42. A water storage tank 1 6 is provided on the side, and a water inlet hole 45 is provided on the side of the water storage tank 1 6 away from the water inlet end 41, a water storage tank 2 7 is provided on the side close to the water outlet end 42 in the shell 4, and a water outlet hole 46 is provided on the side of the water storage tank 2 7 away from the water outlet end 42, a water passing part 47 is provided between the water storage tank 1 6 and the water storage tank 2 7, the water storage tank 1 6, the water passing part 47 and the water storage tank 2 7 are connected through the water inlet hole 45 and the water outlet hole 46, and a plurality of air outlets 48 and air inlets 49 corresponding to the water passing part 47 are provided on the shell 4, which are used to guide external air into the water passing part 47, take away the heat in the water, and form a continuous evaporation heat dissipation process, and a fan is installed corresponding to the air inlet 49, and the air flow speed is accelerated by using the fan to improve the heat dissipation efficiency.

[0023] In the working state, the hot end of the semiconductor cooling sheet 5 generates heat, which is quickly transferred to the water cooling head 1 in close contact with it. After the water inside the water cooling head 1 absorbs the heat released by the hot end of the semiconductor cooling sheet 5, the water pump 2 is started at the same time, and the water in the water cooling head 1 is pumped into the water bag 3 through the water pump 2, and flows from the water bag 3 to the water storage tank 6 along the water inlet end 41 of the heat dissipation device, and the water flows through the water inlet hole 45 of the water storage tank 6 to the water passage 47. The air flowing inside the water passage 47 takes away the heat in the water, and then flows from the water outlet hole 46 to the water storage tank 7, and finally flows from the water outlet end 42 along the other end of the water bag 3 back to the water cooling head 1, and this water circulation process is repeated continuously. This design is small in size, easy to carry, and has strong scalability. A multi-layer water passage design can be used to meet higher heat dissipation requirements.

[0024] The water cooling head 1 and the water pump 2 of the utility model are provided with a protective shell on the outside to prevent the components from being damaged due to accidental collision.

[0025] In the utility model, the housing 4 includes an upper cover 43 and a lower cover 44. The upper cover 43 is provided with a right baffle 431 on one side close to the water inlet end 41, and the lower cover 44 is provided with a right baffle 441 on one side close to the water inlet end 41. The right baffle 431 and the right baffle 441 fit together with the upper cover 43 and the lower cover 44 to form a water storage tank 6. The upper cover 43 is provided with a left baffle 432 on one side close to the water outlet end 42, and the lower cover 44 is provided with a left baffle 432 on one side close to the water outlet end 42. The left baffle plate 442 is provided on the side, the left baffle plate 432 and the left baffle plate 442 are fitted with the upper cover 43 and the lower cover 44 to form a water storage tank 7, the right baffle plate 431 is provided with a convex part 4311, the right baffle plate 441 is provided with a recessed part 4411 for inserting the convex part 4311, the left baffle plate 432 is provided with a convex part 4312, and the left baffle plate 442 is provided with a recessed part 4421 for inserting the convex part 4312. Through the embedded installation of the convex part and the recessed part, the sealing effect of the utility model can be enhanced, and at the same time, it can be convenient for assembly and disassembly, and it is convenient for maintenance and cleaning of the heat dissipation device.

[0026] The utility model adopts the water evaporation heat dissipation method, the water passing part 47 includes a diverter groove 471 arranged on the inner side of the shell 4, one end of the diverter groove 471 is connected to the water inlet hole 45, and the upper end surface of the diverter groove 471 is provided with a water absorbing sheet 472, the water absorbing sheet 472 is tightly attached to the inner wall of the shell 4, and the diverter groove 471 is completely covered. The water absorbing sheet 472 is made of a hydrophilic material. Based on this embodiment, the heat dissipation device is placed upright when in use. When water enters the diverter groove, it will be absorbed by the water absorbing sheet. After the sheet is in a saturated state, the water will move downward under the action of gravity and flow from the water outlet 46 into the water storage tank 7. Preferably, the diverter groove is a groove, extending to both sides to ensure that the water-absorbing sheet absorbs water evenly. The diverter groove 471 is connected to the water outlet 46. At the same time, the fan evaporates and dissipates the water adsorbed on the water-absorbing sheet 472, thereby increasing the cooling area through the water-absorbing sheet and accelerating the cooling effect. Of course, evaporation and heat dissipation will cause water loss, so the user needs to replace the water bag in time or add water manually.

[0027] Among them, the water-absorbing sheet is made of carbon fiber cloth. Since the gaps between the fibers of carbon fiber cloth are large, it is difficult to achieve complete sealing, and moisture can penetrate into the interior of the carbon fiber.

[0028] Furthermore, an air guide baffle 8 is provided on the inner wall of the upper cover 43 , and the air guide baffle 8 diverts the airflow entering the interior of the shell 4 to form an air flow channel, and can also be used to fix the water absorbent sheet 472 .

[0029] In addition, the utility model is also connected with an air-cooling main body.

[0030] The air-cooling main body includes a water circulation device 2 and an air-cooling device. The water circulation device 2 includes a water-cooling head 2, a water pump 2 and a water bag 2. The upper end surface of the water-cooling head 2 is in close contact with the cold surface of the semiconductor refrigeration plate 5. The water-cooling head 2 is connected to the water pump 2 and one end of the water bag 2 in sequence, and flows back to the water-cooling head 2 through the other end of the water bag 2. The water bag 2 is arranged in the middle of the air-cooling device. The air-cooling device includes an air inlet, a blower and an air outlet. The blower is used to actively inhale and accelerate the flow of air, and inhale air from the air inlet, thereby air-cooling the water in the water bag 2, further reducing the water temperature in the water bag 2, and finally the inhaled air is discharged from the air outlet, thereby blowing out cold air and achieving a cooling effect.

[0031] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

[0032] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementations that can be understood by those skilled in the art.

Claims

1. An evaporative heat dissipation component, characterized in that: The invention comprises a water cooling head (1), a water pump (2), a water bag (3) and a heat dissipation device which are cyclically connected. The water cooling head (1) is tightly fitted with the hot surface of a semiconductor refrigeration plate (5). The heat dissipation device comprises a shell (4) having a water inlet end (41) and a water outlet end (42). A water storage tank (6) is provided on one side of the shell (4) close to the water inlet end (41). The water storage tank (6) is provided with a plurality of water inlet holes (45). A water storage tank (6) is provided on one side of the shell (4) close to the water outlet end (42). A water storage tank (2) (7) is provided on the side, and the water storage tank (2) (7) is provided with a plurality of water outlet holes (46). A water passage portion (47) is provided between the water storage tank (1) (6) and the water storage tank (2) (7). The water storage tank (1) (6), the water passage portion (47) and the water storage tank (2) (7) are connected through the water inlet hole (45) and the water outlet hole (46). The shell (4) is provided with a plurality of air outlets (48) and air inlets (49) corresponding to the water passage portion (47), and a fan is installed corresponding to the air inlet (49).

2. The evaporative heat dissipation assembly according to claim 1, characterized in that: The water-passing portion (47) comprises a plurality of diverter grooves (471) arranged on the inner side of the shell (4); one end of the diverter groove (471) is connected to the water inlet hole (45); a water-absorbing sheet (472) is arranged on the upper end surface of the diverter groove (471); and the water-absorbing sheet (472) is in close contact with the inner wall of the shell (4).

Images