Ejector pin cap structure capable of assisting chip suction

Abstract

The utility model discloses an ejector pin cap structure capable of assisting chip suction, which comprises an outer cover cap, a jacking mechanism arranged in the outer cover cap and an ejector pin connected with the jacking mechanism, a cap base is arranged on the jacking mechanism, the upper end of the cap base is fixedly connected with the lower end of the outer cover cap, the lower end of the cap base is arranged on full-automatic equipment, and the ejector pin is arranged on the outer cover cap. A plurality of negative pressure holes are formed in the outer cover cap in the circumferential direction in an array mode, and an extending hole is formed in the center of the upper portion of the outer cover cap. The beneficial effects of the utility model are that the ejector pin cap structure can assist a chip suction process, ejects a target chip from an adhesive film at the bottom, adsorbs the surrounding film through negative pressure to prevent the film from being influenced by vibration in the height direction, can improve the adsorption stability, finally improves the overall yield of full-automatic die bonding equipment, is good in use effect, and is suitable for large-scale production. The operation is convenient.

Description

Technical Field

[0001] The utility model relates to the technical field of crystal bonding machines, in particular to a pin cap structure which can assist chip absorption. Background Art

[0002] When the fully automatic die bonding machine is working, there is a process of using a negative pressure suction head to suck the chip crystal from the crystal disc for the subsequent die bonding process; when the chip crystal comes out of the previous production process, it is neatly arranged and adhered to a layer of soft, sticky film; after the equipment absorbs the target crystal, it is lifted and moved vertically, and the sticky film underneath will be adhered and lifted, and the surrounding chip crystals will be affected in the height direction and vibrate, which will eventually affect the overall yield;

[0003] In view of the above situation, it is necessary to improve the existing chip suction mechanism so that it can adapt to the current needs of chip suction use. Utility Model Content

[0004] The utility model aims to solve the above problems and designs a pin cap structure which can assist chip suction.

[0005] To achieve the above-mentioned purpose, the technical solution of the utility model is a pin cap structure that can assist chip suction, comprising an outer cap, a lifting mechanism arranged in the outer cap, and a pin connected to the lifting mechanism, wherein a cap base is provided on the lifting mechanism, the upper end of the cap base is fixedly connected to the lower end of the outer cap, the lower end of the cap base is mounted on a fully automatic device, a plurality of negative pressure holes are arranged in a circumferential array on the outer cap, and a protrusion hole is arranged at the center position above the outer cap.

[0006] As a further supplement to the technical solution, a sealing ring is provided between the outer cover cap and the cap base, and the sealing ring is installed in a groove in the outer cover cap.

[0007] As a further supplement to the technical solution, the ejector pin is connected to the lifting mechanism via an ejector pin base, and the ejector pin base and the lifting mechanism are connected and fixed via hexagon socket screws.

[0008] As a further supplement to the technical solution, a locking nut is installed on the outer side of the ejector base, and the locking nut is threadedly connected to the ejector base.

[0009] As a further supplement to the technical solution, the inner side of the locking nut and the upper outer side of the ejector base are conical.

[0010] The beneficial effect is that the pin cap structure can assist the chip absorption process, lift the target chip from the sticky film at the bottom, and adsorb the surrounding film through negative pressure so that it is not affected by height vibration, thereby improving its adsorption stability and ultimately improving the overall yield of the fully automatic crystal bonding equipment. It has good use effect and is easy to operate. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0012] Figure 2 It is a schematic diagram of the cross-sectional structure of the utility model;

[0013] In the figure, 1. outer cover cap; 2. lifting mechanism; 3. ejector pin; 4. cap base; 5. negative pressure hole; 6. extension hole; 7. sealing ring; 8. ejector pin base; 9. locking nut; 10. chip film; 11. chip crystal; 12. negative pressure suction head. DETAILED DESCRIPTION

[0014] In order to make the technical solution more clear to those skilled in the art, Figure 1 -2 Detailed description of the technical solution of the utility model:

[0015] A pin cap structure that can assist chip suction, comprising an outer cap 1, a lifting mechanism 2 arranged in the outer cap 1, and a pin 3 connected to the lifting mechanism 2, wherein a cap base 4 is arranged on the lifting mechanism 2, the upper end of the cap base 4 is fixedly connected to the lower end of the outer cap 1, and the lower end of the cap base 4 is installed on a fully automatic device, a plurality of negative pressure holes 5 are arranged in a circumferential array on the outer cap 1, and the upper surface thereof is in contact with a chip film 10; the upper end surface of the outer cap 1 is smooth and connected with a rounded corner, wherein the upper end surface is smooth, which is conducive to the adhesion with the adhesive film, and the rounded corner is designed to prevent the card material from scratching; an extension hole 6 is arranged at the center position above the outer cap 1, which is convenient for the pin 3 to extend and eject the chip crystal 11 from the chip film 10; the lower part of the lifting mechanism 2 is connected to the fully automatic device, and the upper part is used to install the structural parts, and the height direction movement instruction issued by the device is transmitted to a series of structures above; the bottom of the cap base 4 is connected to the fully automatic device, and the upper part is installed in cooperation with the outer cap 1, and the cavity inside can be controlled to provide negative pressure;

[0016] A sealing ring 7 is provided between the outer cap 1 and the cap base 4. The sealing ring 7 is installed in a groove in the outer cap 1. The sealing ring 7 is installed above the cap base 4 to provide sealing and friction.

[0017] The ejector pin 3 is connected to the lifting mechanism 2 through an ejector pin base 8, and the ejector pin base 8 is fixed to the lifting mechanism 2 through a hexagon socket screw, wherein a locking nut 9 is installed on the outer side of the ejector pin base 8, and the bottom of the locking nut 9 is threadedly connected to the ejector pin base 8, and the upper inner side of the locking nut 9 and the upper outer side of the ejector pin base 8 are conical, and the two are arranged in coordination. After the thread is locked, the conical surface generates pressure to tighten the outer ring of the ejector pin base 8 to achieve the purpose of locking the ejector pin 3; the ejector pin base 8 has a threaded hole at the bottom, which is locked with the lifting mechanism 2 through a hexagon socket screw, and has a conical surface on the top that cooperates with the locking nut 9, and has a groove on the top that cooperates with the ejector pin 3. After the thread of the locking nut 9 is tightened, the diameter of the groove structure is reduced to fix the ejector pin 3.

[0018] Working principle: the process (of sucking up the chip crystal 11) starts, the negative pressure suction head 12 of the equipment moves to the top of the extracted chip crystal 11, and the ejector cap structure moves to the bottom of the crystal; the ejector pin 3 does not extend out of the outer cap 1, and the upper surface of the outer cap 1 fits with the bottom of the film; the inner cavity of the cap base 4 of the equipment provides negative pressure, and the outer cap 1 is installed on the cap base 4 through the sealing ring 7, and the inner cavity formed forms a negative pressure, which sucks the film from the surrounding negative pressure holes 5. The suction force provides friction to the film, so that the chip crystal 11 around the extracted chip can be stabilized on the plane of the outer cap 1; the lifting mechanism 2 moves vertically upward for a certain stroke, and through a series of structural transmissions, the ejector pin 3 extends from the extension hole 6 of the outer cap 1 to lift the chip crystal 11; the negative pressure suction head 12 sucks the lifted chip crystal 11 and moves to the next process.

[0019] The above technical solutions only reflect the preferred technical solutions of the technical solutions of the utility model. Some changes that may be made to certain parts thereof by technicians in this technical field all reflect the principles of the utility model and fall within the protection scope of the utility model.

Claims

1. A pin cap structure that can assist chip suction, characterized in that: The invention comprises an outer cap (1), a lifting mechanism (2) arranged in the outer cap (1), and a thimble (3) connected to the lifting mechanism (2); a cap base (4) is arranged on the lifting mechanism (2); the upper end of the cap base (4) is fixedly connected to the lower end of the outer cap (1); the lower end of the cap base (4) is mounted on a fully automatic device; a plurality of negative pressure holes (5) are arranged in a circumferential array on the outer cap (1); and a protrusion hole (6) is arranged at the center position above the outer cap (1).

2. The ejector cap structure capable of assisting chip suction according to claim 1, characterized in that: A sealing ring (7) is provided between the outer cap (1) and the cap base (4), and the sealing ring (7) is installed in a groove in the outer cap (1).

3. The ejector cap structure capable of assisting chip suction according to claim 2, characterized in that: The ejector pin (3) is connected to the ejection mechanism (2) via an ejector pin base (8), and the ejector pin base (8) and the ejection mechanism (2) are connected and fixed via hexagon socket screws.

4. The ejector cap structure capable of assisting chip suction according to claim 3, characterized in that: A locking nut (9) is installed on the outer side of the ejector base (8), and the locking nut (9) is threadedly connected to the ejector base (8).

5. The ejector cap structure capable of assisting chip suction according to claim 4, characterized in that: The inner side of the locking nut (9) and the upper outer side of the ejector base (8) are conical.

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