Film pasting equipment

Abstract

The utility model discloses film pasting equipment which comprises a wafer bearing assembly which comprises a bottom plate and a first annular boss surrounding the bottom plate in the circumferential direction, the first annular boss is used for bearing a wafer, a first adsorption hole is formed in the first annular boss, the first adsorption hole is used for adsorbing the wafer, a first air hole is formed in the bottom plate, and a second air hole is formed in the bottom plate; the first air hole is used for adjusting the air pressure of a cavity formed between the wafer and the wafer bearing assembly; second adsorption holes are formed in the circumferential edge of the side, facing the wafer bearing assembly, of the thin film adsorption assembly, and the second adsorption holes are used for adsorbing a thin film; wherein the thin film adsorption assembly can be switched between a first position and a second position, when the thin film adsorption assembly is located at the first position, the thin film and the wafer are spaced by a preset distance, and when the thin film adsorption assembly is located at the second position, the thin film is attached to the wafer. According to the film pasting equipment provided by the utility model, the film and the wafer can be more fitted, and the film pasting quality is improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and more specifically to a film pasting device. Background Art

[0002] During the manufacturing process of semiconductor devices, wafer surface film can effectively protect the wafer and reduce damage and contamination during processing.

[0003] When the existing film attaching mechanism attaches the film, the film chuck fixes the film, and the wafer chuck carries and fixes the wafer. When attaching the film to the wafer, the film chuck is controlled to drive the film close to the wafer so that the film covers the entire surface of the wafer. The above-mentioned film attaching mechanism adopts the traditional method, directly driving the film down to attach to the wafer, and the wafer attaching effect is poor.

[0004] Therefore, improvements are needed to at least partially solve the above problems. Utility Model Content

[0005] A series of simplified concepts are introduced in the utility model content section, which will be further described in detail in the detailed implementation section. The utility model content section of the utility model does not mean to attempt to define the key features and essential technical features of the technical solution claimed for protection, nor does it mean to attempt to determine the scope of protection of the technical solution claimed for protection.

[0006] In order to at least partially solve the above problems, according to a first aspect of the utility model, a film attaching device is provided, comprising: a wafer carrying assembly, comprising a bottom plate and a first annular boss surrounding the bottom plate in a circumferential direction, the first annular boss being used to carry a wafer, a first adsorption hole being provided in the first annular boss, the first adsorption hole being used to adsorb the wafer, a first air hole being provided in the bottom plate, the first air hole being used to adjust the air pressure of a chamber formed between the wafer and the wafer carrying assembly;

[0007] A film adsorption component, wherein a second adsorption hole is provided at a circumferential edge of the film adsorption component on a side facing the wafer bearing component, and the second adsorption hole is used for adsorbing the film;

[0008] Wherein, the film adsorption assembly can switch between a first position and a second position. When the film adsorption assembly is located at the first position, the film is spaced a preset distance from the wafer. When the film adsorption assembly is located at the second position, the film is bonded to the wafer.

[0009] For example, a plurality of second air holes are evenly arranged in the middle of the thin film adsorption component on one side facing the wafer supporting component.

[0010] For example, the film adsorption assembly includes a top seat and a pressure plate;

[0011] The top seat comprises a top plate and a second annular boss surrounding the top plate in a circumferential direction, wherein the second annular boss is provided with the second adsorption hole;

[0012] The pressure plate is arranged inside the annular boss, a plurality of the second air holes are evenly arranged on the pressure plate, and the pressure plate is configured to be switchable between a third position and a fourth position;

[0013] When the pressure plate is in the third position, the side of the pressure plate facing the wafer bearing assembly is flush with the side of the second annular boss facing the wafer bearing assembly;

[0014] When the pressure plate is in the fourth position, the side of the pressure plate facing the wafer supporting assembly protrudes beyond the side of the second annular boss facing the wafer supporting assembly.

[0015] For example, the film adsorption assembly further includes a connecting column;

[0016] A through hole is provided in the middle of the top plate, and the connecting column is passed through the through hole and connected to the pressure plate.

[0017] For example, the film sticking device further includes a first actuator and a second actuator;

[0018] The first actuator is connected to the top seat and is used to drive the top seat to move in a direction toward the wafer carrying assembly and a direction away from the wafer carrying assembly;

[0019] The second actuator is connected to the connecting column, and is used for driving the connecting column and the pressure plate to move in a direction toward the wafer carrying assembly and in a direction away from the wafer carrying assembly.

[0020] For example, the film attaching device further includes a first vacuum device and a second vacuum device, wherein the first vacuum device is communicated with the first adsorption hole, and the second vacuum device is communicated with the second adsorption hole.

[0021] For example, the first vacuum device is a vacuum pump or a vacuum generator;

[0022] The second vacuum equipment is a vacuum pump or a vacuum generator.

[0023] By way of example, the film-sticking equipment also includes an exhaust device, a first gas regulating valve and a second gas regulating valve, wherein the first end of the first gas regulating valve is connected to the first air hole, the second end of the first gas regulating valve is connected to the exhaust device, the first end of the second gas regulating valve is connected to the second air hole, and the second end of the second gas regulating valve is connected to the exhaust device.

[0024] For example, there are a plurality of first air holes, which are evenly arranged on the bottom plate.

[0025] For example, the film attaching equipment further includes a heater, and the wafer supporting assembly is disposed on the heater.

[0026] According to the film laminating device of the utility model, a first air hole is provided in the bottom plate, and the first air hole is used to adjust the air pressure of the chamber formed between the wafer and the wafer supporting assembly. The present application adjusts the air pressure of the chamber formed between the wafer and the wafer supporting assembly through the first air hole, so that the wafer bulges to a certain height, so that the middle part of the film contacts the wafer first, and then the film can be attached to the wafer in a way of spreading outward from the center of the circle, so that the film and the wafer are more docile, and the quality of film laminating is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The following drawings of the present application are hereby used as part of the present application for understanding the present application. The drawings show the embodiments of the present application and their descriptions, and are used to explain the device and principle of the present application. In the drawings,

[0028] Figure 1 It is a structural schematic diagram of a film laminating device according to an embodiment of the present application.

[0029] Figure 2 It is a structural schematic diagram of a film laminating device according to an embodiment of the present application.

[0030] Figure 3a-3b The figure is a schematic diagram of the process of laminating a film on the back side of a Taiko wafer by a film laminating equipment according to an embodiment of the present application.

[0031] Figure 4a-4b It is a schematic diagram of the process of laminating the entire front surface of a Taiko wafer using a laminating device according to an embodiment of the present application.

[0032] Figure 5a-5b It is a schematic diagram of the process of laminating the front middle film of a Taiko wafer by a film laminating device according to one embodiment of the present application.

[0033] Description of reference numerals:

[0034] 100 - wafer carrying assembly, 110 - first adsorption hole, 120 - first air hole;

[0035] 200 - film adsorption assembly, 210 - second adsorption hole, 220 - second air hole, 230 - top seat, 240 - pressure plate, 250 - connection column;

[0036] 300-First vacuum equipment;

[0037] 400-second vacuum equipment;

[0038] 500-first gas regulating valve;

[0039] 600-second gas regulating valve;

[0040] 700-exhaust device, 710-exhaust pump, 720-exhaust pump;

[0041] 10-wafer, 20-film. DETAILED DESCRIPTION

[0042] In the following description, a large number of specific details are provided to provide a more thorough understanding of the present application. However, it is apparent to those skilled in the art that the present application can be implemented without one or more of these details. In other examples, in order to avoid confusion with the present application, some technical features well known in the art are not described.

[0043] It should be understood that the present application can be implemented in different forms and should not be construed as being limited to the embodiments presented herein. On the contrary, providing these embodiments will make the disclosure thorough and complete and fully convey the scope of the present application to those skilled in the art. In the accompanying drawings, the sizes and relative sizes of layers and regions may be exaggerated for clarity. The same reference numerals throughout represent the same elements.

[0044] It should be understood that although the terms first, second, third, etc. can be used to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the teachings of the present application, the first element, component, region, layer or part discussed below can be represented as a second element, component, region, layer or part.

[0045] Spatially relative terms such as "under", "beneath", "below", "under", "above", "above", etc., may be used herein for convenience of description to describe the relationship of one element or feature to other elements or features shown in the figures. It should be understood that the spatially relative terms are intended to encompass different orientations of the device in use and operation in addition to the orientation shown in the figures.

[0046] The purpose of the terms used herein is only to describe specific embodiments and is not intended to be limiting of the present application. When used herein, the singular forms "one", "an" and "said / the" are also intended to include plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "consisting of" and / or "comprising", when used in this specification, determine the presence of the features, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups. When used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0047] Embodiments of the utility model are described herein with reference to cross-sectional views as schematic diagrams of ideal embodiments (and intermediate structures) of the present application. In this way, variations in the shapes shown due to, for example, manufacturing techniques and / or tolerances can be expected. Therefore, the embodiments of the present application should not be limited to the specific shapes shown herein, but include shape deviations due to, for example, manufacturing. Therefore, what is shown in the figures is schematic in nature, and their shapes are not intended to display the actual shape of the device and are not intended to limit the scope of the present application.

[0048] See attached Figure 1 -5 exemplarily describes a film attaching device according to an embodiment of the present application. The film attaching device includes a wafer carrying component 100 and a film adsorption component 200.

[0049] The wafer bearing assembly 100 includes a bottom plate and a first annular boss surrounding the bottom plate in the circumferential direction, the first annular boss is used to carry the wafer, and the first annular boss is provided with a first adsorption hole 110, and the first adsorption hole 110 is used to adsorb the wafer. In the embodiment of the present application, the first adsorption hole 110 is set to be multiple, and the multiple first adsorption holes 110 are evenly arranged in the circumference of the first annular boss, and the multiple first adsorption holes 110 are conducive to improving the stability of wafer fixation. In the embodiment of the present application, the film bonding equipment also includes a first vacuum equipment 300, the first vacuum equipment 300 is connected to the first adsorption hole 110, and the first vacuum equipment 300 generates a negative pressure in the first adsorption hole 110 by exhausting air to adsorb and fix the wafer. Specifically, the first vacuum equipment 300 can be a vacuum pump, which can mechanically extract the gas to form a vacuum, or the first vacuum equipment 300 can also be a vacuum generator, which can eject a high-speed jet through a nozzle to form a vacuum at the first adsorption hole 110. The skilled person can choose according to actual needs.

[0050] A first air hole 120 is provided in the bottom plate, and the first air hole 120 is used to adjust the air pressure of the chamber formed between the wafer and the wafer carrier assembly 100. The air pressure of the chamber formed between the wafer and the wafer carrier assembly 100 is adjusted by the first air hole 120 specifically including: supplying air to the chamber formed between the wafer and the wafer carrier assembly 100 so that it is in a positive pressure state, thereby enabling the wafer to bulge to a certain height. Furthermore, different air pressures can be set according to the thickness of the wafer so that the bulging height is between 50um and 200um, and those skilled in the art can set the specific height of the wafer bulging according to actual conditions. Before the wafer is filmed, the wafer is bulged to a certain height, so that the middle part of the film can contact the wafer first, thereby allowing the film to be attached to the wafer in a manner of spreading outward from the center of the circle, thereby making the film and the wafer more fit, thereby improving the quality of filming.

[0051] In the embodiment of the present application, there are multiple first air holes 120, and they are evenly arranged on the bottom plate. In some other embodiments, the first air hole 120 can be set to only one. The technicians can set the number and distribution of the first air holes 120 according to actual conditions, as long as the air pressure of the chamber formed between the wafer and the wafer supporting assembly 100 can be adjusted through the first air holes 120.

[0052] The film adsorption component 200 is provided with a second adsorption hole 210 at the circumferential edge of the side facing the wafer bearing component 100, and the second adsorption hole 210 is used to adsorb the film. In the embodiment of the present application, the second adsorption hole 210 is set to be multiple, and the multiple second adsorption holes 210 are evenly arranged along the circumference of the film adsorption component 200, and the multiple second adsorption holes 210 are conducive to improving the stability of film fixation. In the embodiment of the present application, the film sticking equipment also includes a second vacuum equipment 400, and the second vacuum equipment 400 is connected to the second adsorption hole 210. The second vacuum equipment 400 generates a negative pressure in the second adsorption hole 210 by exhausting air to adsorb and fix the film. Specifically, the second vacuum equipment 400 can be a vacuum pump, which can mechanically extract the gas to form a vacuum, or the second vacuum equipment 400 can also be a vacuum generator, which can eject a high-speed jet through a nozzle to form a vacuum at the second adsorption hole 210. The skilled technician can choose according to actual needs.

[0053] The film adsorption assembly 200 can be switched between a first position and a second position. When the film adsorption assembly 200 is in the first position, the film is spaced a preset distance from the wafer. When the film adsorption assembly 200 is in the second position, the film is bonded to the wafer. Before bonding the film to the surface of the wafer, the film adsorption assembly 200 is located in the first position, and the wafer is adsorbed and fixed through the first adsorption hole 110 and the film is adsorbed and fixed through the second adsorption hole 210. When bonding the film to the surface of the wafer, the film adsorption assembly 200 is controlled to switch from the first position to the second position. By switching the position of the film adsorption assembly 200, the film is driven close to the wafer, so that the film is bonded to the wafer.

[0054] In the embodiment of the present application, a plurality of second air holes 220 are evenly arranged in the middle of the film adsorption assembly 200 on one side facing the wafer carrier assembly 100, and the second air holes 220 are used to adjust the air pressure of the chamber formed between the film and the film adsorption assembly 200. After the film and the wafer are bonded together as a whole, the air pressure of the chamber formed between the wafer and the wafer carrier assembly 100, and the air pressure of the chamber formed between the film and the film adsorption assembly 200 are respectively adjusted through the first air hole 120 and the second air hole 220. Specifically, the first air hole 120 and the second air hole 220 are respectively used to blow air into the chamber formed between the wafer and the wafer carrier assembly 100, and the chamber formed between the film and the film adsorption assembly 200, so that the film and the wafer can be continuously pressurized after the film and the wafer are bonded together as a whole, so as to remove bubbles between the film and the wafer and enhance the bonding effect of the film.

[0055] In the embodiment of the present application, the film adsorption assembly 200 includes a top seat 230 and a pressure plate 240. The top seat 230 includes a top plate and a second annular boss surrounding the top plate in a circumferential direction, and a second adsorption hole 210 is provided in the second annular boss. The pressure plate 240 is arranged inside the annular boss, and a plurality of second air holes 220 are evenly arranged on the pressure plate 240. The pressure plate 240 is configured to be able to switch between the third position and the fourth position. When the pressure plate 240 is in the third position, as shown in FIG. Figure 1 As shown, the side of the pressure plate 240 facing the wafer bearing assembly 100 is flush with the side of the second annular boss facing the wafer bearing assembly 100; when the pressure plate 240 is in the fourth position, as shown Figure 2As shown, the pressure plate 240 protrudes from the side of the second annular boss toward the wafer supporting assembly 100. In the embodiment of the present application, the film adsorption assembly 200 also includes a connecting column 250. A through hole is provided in the middle of the top plate, and the connecting column 250 is penetrated through the through hole and connected to the pressure plate 240. The through hole matches the size of the connecting column 250, so that the connecting column 250 can move along the through hole in the direction close to the wafer supporting assembly 100 and away from the wafer supporting assembly 100. For wafers with a thickness difference between the middle part and the edge part, the specific position of the pressure plate 240 protruding from the second annular boss can be adjusted according to the thickness difference between the middle part of the wafer and the edge part of the wafer, and then the film is fixed tightly against the top seat 230 and the pressure plate 240 to achieve film bonding of such wafers.

[0056] In an embodiment of the present application, the film pasting device also includes a first actuator and a second actuator. The first actuator is connected to the top seat 230, and is used to drive the top seat 230 to move in the direction toward the wafer bearing assembly 100 and away from the wafer bearing assembly 100. The second actuator is connected to the connecting column 250, and is used to drive the connecting column 250 and the pressure plate 240 to move in the direction toward the wafer bearing assembly 100 and away from the wafer bearing assembly 100. In an embodiment of the present application, the first actuator and the second actuator may adopt a cylinder. In some other embodiments, the first actuator and the second actuator may both include a motor and a transmission structure (such as a ball screw transmission structure, a gear rack transmission structure, etc.), and the motor drives the top seat 230 and the pressure plate 240 to move through the transmission structure, and those skilled in the art can select as needed.

[0057] In the embodiment of the present application, the film attaching device further includes an exhaust device 700, a first gas regulating valve 500 and a second gas regulating valve 600. The first end of the first gas regulating valve 500 is connected to the first air hole 120. The second end of the first gas regulating valve 500 is connected to the exhaust device 700. The first end of the second gas regulating valve 600 is connected to the second air hole 220, specifically, the second air hole 220 is connected through the through hole in the connecting column 250. The second end of the second gas regulating valve 600 is connected to the exhaust device 700. The exhaust device 700 includes an exhaust pump 710 and an exhaust pump 720. Specifically, the exhaust pump 710 and the exhaust pump 720 are respectively connected to the second end of the first gas regulating valve 500, and are used to adjust the air pressure of the chamber formed between the wafer and the wafer supporting assembly 100. The exhaust pump 710 and the exhaust pump 720 are respectively connected to the second end of the second gas regulating valve 600, and are used to adjust the air pressure of the chamber formed between the film and the film adsorption assembly 200. In some other embodiments, the exhaust device 700 includes a first exhaust device and a second exhaust device, both of which are bidirectional pumps that can realize both the exhaust and supply functions. The first exhaust device is connected to the first air hole 120 through the first gas regulating valve 500, and the second exhaust device is connected to the second air hole 220 through the second gas regulating valve 600.

[0058] In the embodiment of the present application, the film laminating device further includes a heater, and the wafer carrying assembly 100 is disposed on the heater. Specifically, the heater includes a frame and components such as a heating wire disposed inside the frame, and the wafer carrying assembly 100 is disposed inside the frame. The heater is used to increase the temperature of the wafer during film laminating, thereby enhancing the film laminating effect when the wafer and the film are attached.

[0059] The prior art includes a wafer with a thickness difference between the middle and edge portions. When applying film to the wafer, it is very inconvenient due to the existence of the step difference. For example, a Taiko wafer is a wafer that has a certain width and thickness at the edge portion of the wafer after thinning in order to enhance the strength of the wafer after thinning. Specifically, the thickness of the edge portion of the wafer is greater than the thickness of the middle portion of the wafer. Figure 3a-Figure 3b , Figure 4a-4b and Figure 5a-Figure 5b As shown, Figure 3a-3b This is a schematic diagram of the process of laminating a film on the back side of a Taiko wafer by a laminating device according to an embodiment of the present application. Figure 4a-4b This is a schematic diagram of the process of laminating the entire front surface of a Taiko wafer using a laminating device according to an embodiment of the present application. Figure 5a-5b It is a schematic diagram of the process of laminating the front middle film of a Taiko wafer by a film laminating device according to one embodiment of the present application.

[0060] Refer to the following Figure 3a-Figure 3b , Figure 4a-4b and Figure 5a-Figure 5b The back film, front full film and front middle film of Taiko wafer are described in detail.

[0061] See also Figure 3a-Figure 3b The specific steps of laminating the back side of the Taiko wafer 10 include:

[0062] 1a, a negative pressure is generated in the first adsorption hole 110 by the first vacuum equipment 300, and the wafer is adsorbed and fixed on the first annular boss, wherein the step portion of the wafer 10 is located on the side of the wafer 10 facing the film adsorption assembly 200.

[0063] 1b, negative pressure is generated in the second adsorption hole 210 by the second vacuum device 400, and the film 20 is adsorbed and fixed on the second annular boss. It should be noted that at this time, the second gas regulating valve 600 can be opened, and the exhaust device 700 is used to evacuate the gas, so that the film 20 is adsorbed and fixed on the pressure plate 240.

[0064] 1c, such as Figure 3a As shown, the first gas regulating valve 500 is opened, and gas is supplied to the chamber formed between the wafer 10 and the wafer supporting assembly 100 through the exhaust gas extraction device 700, so that the wafer 10 is lifted to a certain height.

[0065] 1d, the top seat 230 and the pressure plate 240 are driven by the first actuator and the second actuator to move in the direction toward the wafer supporting assembly 100. During this process, the middle part of the film 20 first contacts the wafer 10, thereby gradually achieving overall bonding between the film 20 and the wafer 10.

[0066] 1e, such as Figure 3b As shown, the first gas regulating valve 500 and the second gas regulating valve 600 are opened, and air is blown into the chamber formed between the wafer 10 and the wafer supporting assembly 100 and between the film 20 and the film adsorption assembly 200 through the exhaust device 700, so that the two sides of the wafer 10 and the film 20 as a whole reach the same air pressure, so that the film 20 and the wafer 10 can be continuously pressurized after the film 20 and the wafer 10 are integrally bonded to remove bubbles between the film 20 and the wafer 10, enhance the bonding effect of the film, and avoid damage to the wafer 10.

[0067] See also Figure 4a-4b The specific steps of the front full lamination of Taiko wafer 10 include:

[0068] 2a, a negative pressure is generated in the first adsorption hole 110 by the first vacuum equipment 300, so that the wafer 10 is adsorbed and fixed on the first annular boss, wherein the step portion of the wafer 10 is located on the side of the wafer 10 facing the wafer supporting assembly 100.

[0069] 2b, such as Figure 4a As shown, according to the thickness difference between the middle part and the edge part of the Taiko wafer 10, the second actuator drives the pressure plate 240 to move to the fourth position protruding from the second annular boss (the height of the pressure plate 240 protruding from the second annular boss matches the thickness difference), the film 20 is pressed against the pressure plate 240 and the second annular boss, and a negative pressure is generated in the second adsorption hole 210 by the second vacuum device to adsorb and fix the film 20. It should be noted that at this time, the second gas regulating valve 600 can be opened, and the exhaust device 700 is used to evacuate the gas to adsorb and fix the film 20 on the pressure plate 240.

[0070] 2c, such as Figure 4a As shown, the first gas regulating valve 500 is opened, and the exhaust pump 720 is used to evacuate the chamber formed between the wafer 10 and the wafer supporting assembly 100 so that the wafer 10 swells to a certain height.

[0071] 2d, the top seat 230 is driven by the first actuator to move towards the wafer supporting assembly 100. During this process, the middle part of the film 20 first contacts the wafer 10, thereby gradually achieving overall bonding between the film 20 and the wafer 10.

[0072] 2e, after the film 20 and the wafer 10 are integrally bonded, the second actuator drives the pressure plate 240 to move away from the wafer supporting assembly 100 to the third position.

[0073] 2f, such as Figure 4a As shown, the first gas regulating valve 500 is opened, the second gas regulating valve 600 is opened, and air is blown into the chamber formed between the wafer 10 and the wafer supporting assembly 100 and between the film 20 and the film adsorption assembly 200 through the exhaust pump 720, so that the two sides of the wafer 10 and the film 20 as a whole reach the same air pressure, so that the film 20 and the wafer 10 can be continuously pressurized after the film 20 and the wafer 10 are integrally bonded to remove bubbles between the film 20 and the wafer 10, enhance the bonding effect of the film, and avoid damage to the wafer 10.

[0074] See also Figure 5a-Figure 5b The specific steps of attaching the intermediate film on the front side of the Taiko wafer 10 include:

[0075] 3a, a negative pressure is generated in the first adsorption hole 110 by a first vacuum device, so that the wafer 10 is adsorbed and fixed on the first annular boss, wherein the step portion of the wafer 10 is located on the side of the wafer 10 facing the wafer supporting assembly 100 .

[0076] 3b, such as Figure 5aAs shown, according to the thickness difference between the middle part and the edge part of the Taiko wafer 10, the pressure plate 240 is driven by the second actuator to move to the fourth position protruding from the second annular boss (the height of the pressure plate 240 protruding from the second annular boss matches the thickness difference), the film 20 is pressed against the pressure plate 240, the second gas regulating valve 600 is opened, and the second air hole 220 is evacuated by the vacuum pump 710 through the connecting column 250 and the pressure plate 240 to generate negative pressure, so as to adsorb and fix the film 20.

[0077] 3c, such as Figure 5a As shown, the first gas regulating valve 500 is opened, and gas is supplied to the chamber formed between the wafer 10 and the wafer supporting assembly 100 through the exhaust pump 720 to make the wafer 10 swell to a certain height.

[0078] 3d, the top seat 230 is driven by the first actuator to move towards the wafer supporting assembly 100. During this process, the middle part of the film 20 first contacts the wafer 10, thereby gradually achieving overall bonding between the film 20 and the wafer 10.

[0079] 3e, after the film 20 and the wafer 10 are integrally bonded, the second actuator drives the pressure plate 240 to move away from the wafer supporting assembly 100 to a third position.

[0080] 3f, such as Figure 5b As shown, the first gas regulating valve 500 is opened, the second gas regulating valve 600 is opened, and air is blown into the chamber formed between the wafer 10 and the wafer supporting assembly 100 and between the film 20 and the film adsorption assembly 200 through the exhaust pump 720, so that the two sides of the wafer 10 and the film 20 as a whole reach the same air pressure, so that the film 20 and the wafer 10 can be continuously pressurized after the film 20 and the wafer 10 are integrally bonded to remove bubbles between the film 20 and the wafer 10, enhance the bonding effect of the film, and avoid damage to the wafer 10.

[0081] In some other embodiments, the top seat 230 and the pressure plate 240 can be integrally formed or fixedly connected, and the two can be a whole and cannot move relative to each other. The side of the pressure plate 240 facing the wafer bearing assembly 100 can be flush with the side of the second annular boss facing the wafer bearing assembly 100. Alternatively, the side of the pressure plate 240 facing the wafer bearing assembly 100 can protrude from the side of the second annular boss facing the wafer bearing assembly 100. Accordingly, the film pasting device only includes an actuator, which is connected to the top seat 230, and is used to drive the top seat 230 and the pressure plate 240 to move as a whole in the direction toward the wafer bearing assembly 100 and in the direction away from the wafer bearing assembly 100.

[0082] Although example embodiments have been described herein with reference to the accompanying drawings, it should be understood that the above example embodiments are merely exemplary and are not intended to limit the scope of the present application to this. A person of ordinary skill in the art may make various changes and modifications therein without departing from the scope and spirit of the present application. All these changes and modifications are intended to be included within the scope of the present application as required by the appended claims.

[0083] In the description provided herein, a large number of specific details are described. However, it is understood that the embodiments of the present application can be practiced without these specific details. In some instances, well-known methods, structures and techniques are not shown in detail so as not to obscure the understanding of this description.

[0084] Similarly, it should be understood that in order to streamline the present application and help understand one or more of the various utility model aspects, in the description of the exemplary embodiments of the present application, the various features of the present application are sometimes grouped together into a single embodiment, figure, or description thereof. However, the method of the present application should not be interpreted as reflecting the following intention: the claimed application requires more features than the features clearly stated in each claim. More specifically, as reflected in the corresponding claims, its utility model point is that the corresponding technical problem can be solved with less than all the features of a single disclosed embodiment. Therefore, the claims following the specific embodiment are hereby explicitly incorporated into the specific embodiment, wherein each claim itself serves as a separate embodiment of the present application.

[0085] It will be understood by those skilled in the art that, except for mutually exclusive features, all features disclosed in this specification (including the accompanying claims, abstracts and drawings) and all processes or units of any method or device disclosed in this specification may be combined in any combination. Unless otherwise expressly stated, each feature disclosed in this specification (including the accompanying claims, abstracts and drawings) may be replaced by an alternative feature that provides the same, equivalent or similar purpose.

[0086] In addition, those skilled in the art will appreciate that, although some embodiments described herein include certain features included in other embodiments but not other features, the combination of features of different embodiments is meant to be within the scope of the present application and form different embodiments. For example, in the claims, any one of the claimed embodiments can be used in any combination.

[0087] It should be noted that the above-mentioned embodiments illustrate rather than limit the invention and that those skilled in the art will be able to design alternative embodiments without departing from the scope of the appended claims.

Claims

1. A film laminating device, characterized in that: include: A wafer carrying assembly, comprising a bottom plate and a first annular boss circumferentially surrounding the bottom plate, wherein the first annular boss is used to carry a wafer, wherein a first adsorption hole is provided in the first annular boss, wherein the first adsorption hole is used to adsorb the wafer, and wherein a first air hole is provided in the bottom plate, wherein the first air hole is used to adjust the air pressure of a chamber formed between the wafer and the wafer carrying assembly; A film adsorption component, wherein a second adsorption hole is provided at a circumferential edge of the film adsorption component on a side facing the wafer bearing component, and the second adsorption hole is used for adsorbing the film; Wherein, the film adsorption assembly can switch between a first position and a second position. When the film adsorption assembly is located at the first position, the film is spaced a preset distance from the wafer. When the film adsorption assembly is located at the second position, the film is bonded to the wafer.

2. The film laminating device according to claim 1, characterized in that: A plurality of second air holes are evenly arranged in the middle of the film adsorption component on one side facing the wafer carrying component.

3. The film sticking equipment according to claim 2, characterized in that: The film adsorption assembly includes a top seat and a pressure plate; The top seat comprises a top plate and a second annular boss surrounding the top plate in a circumferential direction, wherein the second annular boss is provided with the second adsorption hole; The pressure plate is arranged inside the annular boss, a plurality of the second air holes are evenly arranged on the pressure plate, and the pressure plate is configured to be switchable between a third position and a fourth position; When the pressure plate is in the third position, the side of the pressure plate facing the wafer bearing assembly is flush with the side of the second annular boss facing the wafer bearing assembly; When the pressure plate is in the fourth position, the side of the pressure plate facing the wafer supporting assembly protrudes beyond the side of the second annular boss facing the wafer supporting assembly.

4. The film sticking equipment according to claim 3, characterized in that: The film adsorption assembly also includes a connecting column; A through hole is provided in the middle of the top plate, and the connecting column is passed through the through hole and connected to the pressure plate.

5. The film sticking equipment according to claim 4, characterized in that: The film sticking device further includes a first actuator and a second actuator; The first actuator is connected to the top seat and is used to drive the top seat to move in a direction toward the wafer carrying assembly and a direction away from the wafer carrying assembly; The second actuator is connected to the connecting column, and is used for driving the connecting column and the pressure plate to move in a direction toward the wafer carrying assembly and in a direction away from the wafer carrying assembly.

6. The film sticking equipment according to any one of claims 1 to 5, characterized in that: The film attaching equipment further includes a first vacuum equipment and a second vacuum equipment, wherein the first vacuum equipment is communicated with the first adsorption hole, and the second vacuum equipment is communicated with the second adsorption hole.

7. The film sticking equipment according to claim 6, characterized in that: The first vacuum equipment is a vacuum pump or a vacuum generator; The second vacuum equipment is a vacuum pump or a vacuum generator.

8. The film sticking equipment according to any one of claims 2 to 5, characterized in that: The film-sticking equipment also includes an exhaust device, a first gas regulating valve and a second gas regulating valve, the first end of the first gas regulating valve is connected to the first air hole, the second end of the first gas regulating valve is connected to the exhaust device, the first end of the second gas regulating valve is connected to the second air hole, and the second end of the second gas regulating valve is connected to the exhaust device.

9. The film sticking equipment according to claim 1, characterized in that: There are a plurality of first air holes, which are evenly arranged on the bottom plate.

10. The film laminating device according to claim 1, characterized in that: The film attaching equipment further comprises a heater, and the wafer supporting assembly is arranged on the heater.

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