Stacking packaging device of integrated circuit chip

Abstract

The utility model discloses a stacking and packaging device for integrated circuit chips, which comprises a base, two sides of the top of the base are fixedly connected with side plates, a bottom plate is arranged between the two side plates in a sliding manner, the bottom plate is horizontally arranged, sliding mechanisms for sliding the bottom plate are arranged in the two side plates, two moving blocks are arranged at the top of the bottom plate in a sliding manner, and the moving blocks are arranged on the bottom plate in a sliding manner. The top of each moving block is fixedly connected with two stand columns, every two of the four stand columns form a pair, clamping plates are fixedly connected between the two pairs of stand columns, a top plate is arranged at the top of the base, four connecting grooves are formed in the top of the top plate, and the four stand columns slide in the four connecting grooves correspondingly. The two clamping plates slide on the top of the top plate, and a clamping mechanism is arranged on the surface of the bottom plate. According to the utility model, through the arrangement of the connecting rod, an integrated circuit chip can be clamped when being packaged, and meanwhile, the integrated circuit chip is more stable, so that the use effect of the device is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip packaging devices, and in particular to a stacking packaging device for integrated circuit chips. Background Art

[0002] Integrated circuit chips are a technology that connects multiple electronic components and circuits on the same semiconductor chip. It is one of the most important components in modern electronic technology. Integrated circuit chips are usually made of semiconductor materials such as silicon and germanium, and are manufactured through process steps such as photolithography, diffusion, and thin film deposition. The main function of integrated circuit chips is to realize various functions in electronic devices, such as computing, storage, signal processing, and communication. It can integrate hundreds to billions of electronic components to realize complex circuit functions, and has the advantages of small size, low power consumption, and high reliability. When producing integrated circuit chips, the chip and other necessary electronic components need to be encapsulated in a shell to protect the chip from the external environment and facilitate connection with other circuits.

[0003] However, some existing integrated circuit chips are not stable enough during the packaging process. Due to the demand for integrated circuit chips, the stability of packaging is required to be high during the production process, resulting in a low yield rate during the production process, thereby causing large losses. In addition, some existing devices for clamping integrated circuit chips are less effective and have low efficiency during the clamping process. Therefore, there is an urgent need to solve this problem. Utility Model Content

[0004] The utility model aims to solve the shortcomings in the prior art and proposes a stacking packaging device for integrated circuit chips.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A stacking packaging device for integrated circuit chips comprises a base, side plates are fixedly connected to both sides of the top of the base, a bottom plate slides between the two side plates, the bottom plate is horizontally arranged, and a sliding mechanism for sliding the bottom plate is arranged inside the two side plates, two moving blocks slide on the top of the bottom plate, two columns are fixedly connected to the top of the two moving blocks, four columns form a pair of two, and a clamping plate is fixedly connected between the two pairs of columns, a top plate is arranged on the top of the base, four connecting grooves are opened on the top of the top plate, the four columns slide in the four connecting grooves respectively, the two clamping plates slide on the top of the top plate, and a clamping mechanism is arranged on the surface of the bottom plate. Through the arrangement of the device, the integrated circuit chip can be clamped when it is packaged, and at the same time, the integrated circuit chip is made more stable.

[0007] Furthermore, the sliding mechanism includes a belt, which rotates inside one of the side panels. Two pulleys are provided inside the belt, and one end of the two pulleys is fixedly connected to a rotating shaft. A servo motor is installed on the surface of one of the side panels, and the output shaft of the servo motor is fixedly connected to the center of the surface of one of the pulleys. A protective box is installed on the surface of one of the side panels, and the protective box is mounted on the surface of the servo motor to drive the two belts to rotate at the same time.

[0008] Preferably, two sliders are fixedly connected on both symmetrical sides of the bottom plate surface, and a slide groove is horizontally opened on one side of the side plate surface, and both of the sliders slide inside the slide groove, and two of the sliders are fixedly connected to the top of the belt to drive the bottom plate to slide horizontally.

[0009] Furthermore, the clamping mechanism includes a connecting rod, four slides are fixedly connected to the top of the base plate, the four slides are a pair, two first limit grooves are provided at the bottom of the two moving blocks, the four first limit grooves are respectively sleeved on the four slide surfaces, one side of the two moving block surfaces is fixedly connected with a connecting plate, one end of the bottom of the two connecting plates is fixedly connected to a limit column, the connecting rod is rotatably connected to the center of the top of the base plate, second limit grooves are provided at both ends of the top of the connecting rod, the two limit columns slide inside the two second limit grooves respectively, a gear is rotatably provided at the bottom of the base plate, a fixed shaft is fixedly connected to the top of the gear, the center of the bottom of the connecting rod is fixedly connected to the top of the fixed shaft, the bottom of the base plate is fixedly connected with a first fixed block and a second fixed block, and a rack is horizontally slidable at the bottom of the base plate, the rack is meshed with the gear, and is used to limit the two moving blocks from approaching or moving away from each other.

[0010] Preferably, an electric telescopic rod is installed at the bottom of the base plate, one end of the electric telescopic rod is fixedly connected to the surface of the second fixed block, the other end of the electric telescopic rod is fixedly connected to one end of the rack, the other end of the rack is fixedly connected to a sliding rod, and the sliding rod is sleeved inside the first fixed block to limit the rotation of the gear, thereby driving the connecting rod to rotate.

[0011] The beneficial effects of the utility model are:

[0012] 1. By clamping the integrated circuit chip during use, the integrated circuit chip can be more stable during transportation, and the integrated circuit chip can also be more stable during packaging, thereby improving the use effect of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a schematic diagram of the surface structure of a stacking packaging device for integrated circuit chips proposed by the utility model;

[0014] Figure 2A schematic diagram of a sliding mechanism of a stacking packaging device for integrated circuit chips proposed by the utility model;

[0015] Figure 3 A schematic diagram of the bottom structure of a base plate of a stacking packaging device for integrated circuit chips proposed by the utility model;

[0016] Figure 4 This is a schematic diagram of the bottom and top structures of a stacking packaging device for integrated circuit chips proposed by the utility model;

[0017] Figure 5 This is a partial structural exploded view of a stacking packaging device for integrated circuit chips proposed by the utility model.

[0018] In the figure: 1. base; 11. side panel; 12. protective box; 13. slide; 2. bottom plate; 21. slider; 22. first fixed block; 23. second fixed block; 24. slide; 3. belt; 31. pulley; 32. rotating shaft; 33. servo motor; 4. top plate; 41. connecting groove; 5. gear; 51. rack; 52. electric telescopic rod; 53. slide rod; 6. moving block; 61. column; 62. splint; 63. connecting plate; 64. limiting column; 65. first limiting groove; 7. connecting rod; 71. second limiting groove. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0020] Reference Figure 1-5 A stacking packaging device for integrated circuit chips includes a base 1, side plates 11 are fixedly connected to both sides of the top of the base 1, a bottom plate 2 is slidable between the two side plates 11, the bottom plate 2 is horizontally arranged, and a sliding mechanism for sliding the bottom plate 2 is arranged inside the two side plates 11. Two moving blocks 6 are slidably arranged on the top of the bottom plate 2, and two columns 61 are fixedly connected to the top of the two moving blocks 6. The four columns 61 are a pair, and a clamping plate 62 is fixedly connected between the two pairs of columns 61. A top plate 4 is arranged on the top of the base 1, and four connecting grooves 41 are opened on the top of the top plate 4. The four columns 61 slide in the four connecting grooves 41 respectively, and the two clamping plates 62 slide on the top of the top plate 4. A clamping mechanism is arranged on the surface of the bottom plate 2. Through the arrangement of the device, the integrated circuit chip can be clamped when it is packaged, and at the same time, the integrated circuit chip is made more stable.

[0021] Reference Figure 1 and Figure 2In a preferred embodiment, the sliding mechanism includes a belt 3, which rotates inside one of the side plates 11. Two pulleys 31 are provided inside the belt 3. One end of each pulley 31 is fixedly connected to a rotating shaft 32. A servo motor 33 is installed on the surface of one of the side plates 11. The output shaft of the servo motor 33 is fixedly connected to the center of the surface of one of the pulleys 31. A protective box 12 is installed on the surface of one of the side plates 11. The protective box 12 is sleeved on the surface of the servo motor 33 and is used to drive the two belts 3 to rotate at the same time.

[0022] Reference Figure 2 In a preferred embodiment, two sliders 21 are fixedly connected to both sides of the surface of the bottom plate 2 symmetrically, and a slide groove 13 is horizontally opened on one side of the surface of one side plate 11, and the two sliders 21 slide inside the slide groove 13, and the two sliders 21 are fixedly connected to the top of the belt 3 to drive the bottom plate 2 to slide horizontally.

[0023] Reference Figure 3-5 In a preferred embodiment, the clamping mechanism includes a connecting rod 7, four slideways 24 are fixedly connected to the top of the bottom plate 2, and the four slideways 24 are a pair. Two first limit grooves 65 are provided at the bottom of the two moving blocks 6, and the four first limit grooves 65 are respectively sleeved on the surfaces of the four slideways 24. A connecting plate 63 is fixedly connected to one side of the surface of the two moving blocks 6, and one end of the bottom of the two connecting plates 63 is fixedly connected to the limit column 64. The connecting rod 7 is rotatably connected to the center of the top of the bottom plate 2, and second limit grooves 71 are provided at both ends of the top of the connecting rod 7. The two limit columns 64 slide in the two second limit grooves 71 respectively. A gear 5 is rotatably provided at the bottom of the bottom plate 2, and a fixed shaft is fixedly connected to the top of the gear 5. The center of the bottom of the connecting rod 7 is fixedly connected to the top of the fixed shaft. The first fixed block 22 and the second fixed block 23 are fixedly connected to the bottom of the bottom plate 2. A rack 51 is horizontally slidable at the bottom of the bottom plate 2, and the rack 51 is meshed with the gear 5 to limit the two moving blocks 6 from approaching or moving away from each other.

[0024] Reference Figure 3 In a preferred embodiment, an electric telescopic rod 52 is installed at the bottom of the base plate 2, one end of the electric telescopic rod 52 is fixedly connected to the surface of the second fixed block 23, the other end of the electric telescopic rod 52 is fixedly connected to one end of the rack 51, and the other end of the rack 51 is fixedly connected to a sliding rod 53, which is sleeved inside the first fixed block 22 to limit the rotation of the gear 5, thereby driving the connecting rod 7 to rotate.

[0025] From the above description, it can be seen that the above embodiment of the utility model achieves the following technical effects: when in use, the integrated circuit chip can be placed and stably clamped by the setting of the top plate 4. When in use, the integrated circuit chip is placed on the top of the top plate 4, and then the electric telescopic rod 52 at the bottom of the bottom plate 2 is driven to slide, which will drive the gear 5 to rotate and the connecting rod 7 to rotate. Under the restriction of the two limit columns 64 and the connection of the two connecting plates 63, the two moving blocks 6 can be close to each other, so that the integrated circuit chip can be clamped, so that the integrated circuit chip is more stable during packaging, thereby improving the packaging effect. Then, one of the pulleys 31 is driven to rotate by driving the servo motor 33, thereby driving the belt 3 to rotate. Under the connection of the rotating shaft 32, the belts 3 inside the two side plates 11 can be rotated at the same time. Under the connection of the four sliders 21, the bottom plate 2 can be driven to slide horizontally, so that the integrated circuit chip can be transported, thereby improving the efficiency of integrated circuit chip packaging.

[0026] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A stacking packaging device for integrated circuit chips, comprising a base (1), characterized in that: Side plates (11) are fixedly connected to both sides of the top of the base (1), a bottom plate (2) is slidably provided between the two side plates (11), the bottom plate (2) is arranged horizontally, a sliding mechanism for sliding the bottom plate (2) is provided inside the two side plates (11), two moving blocks (6) are slidably provided on the top of the bottom plate (2), two upright posts (61) are fixedly connected to the tops of the two moving blocks (6), the four upright posts (61) form a pair, a clamping plate (62) is fixedly connected between the two pairs of upright posts (61), a top plate (4) is provided on the top of the base (1), four connecting grooves (41) are provided on the top of the top plate (4), the four upright posts (61) slide inside the four connecting grooves (41) respectively, the two clamping plates (62) slide on the top of the top plate (4), and a clamping mechanism is provided on the surface of the bottom plate (2).

2. The integrated circuit chip stacking packaging device according to claim 1, characterized in that: The sliding mechanism comprises a belt (3), wherein the belt (3) rotates inside one of the side plates (11), two pulleys (31) are provided inside the belt (3), and one end of each of the two pulleys (31) is fixedly connected to a rotating shaft (32).

3. The integrated circuit chip stacking packaging device according to claim 2, characterized in that: A servo motor (33) is mounted on the surface of one of the side plates (11), and an output shaft of the servo motor (33) is fixedly connected to the center of the surface of one of the pulleys (31). A protection box (12) is mounted on the surface of one of the side plates (11), and the protection box (12) is sleeved on the surface of the servo motor (33).

4. The integrated circuit chip stacking packaging device according to claim 3, characterized in that: Two sliders (21) are fixedly connected to both symmetrical sides of the surface of the bottom plate (2), a sliding groove (13) is horizontally opened on one side of the surface of one of the side plates (11), and both of the sliders (21) slide inside the sliding groove (13), and the two sliders (21) are fixedly connected to the top of the belt (3).

5. The integrated circuit chip stacking packaging device according to claim 1, characterized in that: The clamping mechanism comprises a connecting rod (7), four slideways (24) are fixedly connected to the top of the bottom plate (2), the four slideways (24) are in pairs, two first limit grooves (65) are respectively provided at the bottom of the two moving blocks (6), the four first limit grooves (65) are respectively sleeved on the surfaces of the four slideways (24), one side of the surface of the two moving blocks (6) is fixedly connected to a connecting plate (63), one end of the bottom of the two connecting plates (63) is fixedly connected to a limit column (64), the connecting rod (7) is rotatably connected to the center of the top of the bottom plate (2), the two ends of the top of the connecting rod (7) are provided with second limit grooves (71), and the two limit columns (64) slide in the two second limit grooves (71) respectively.

6. The integrated circuit chip stacking packaging device according to claim 5, characterized in that: A gear (5) is rotatably provided at the bottom of the base plate (2), a fixed shaft is fixedly connected to the top of the gear (5), the center of the bottom of the connecting rod (7) is fixedly connected to the top of the fixed shaft, a first fixed block (22) and a second fixed block (23) are fixedly connected to the bottom of the base plate (2), and a rack (51) is horizontally slidable at the bottom of the base plate (2), and the rack (51) is meshed with the gear (5).

7. The integrated circuit chip stacking packaging device according to claim 6, characterized in that: An electric telescopic rod (52) is installed at the bottom of the base plate (2); one end of the electric telescopic rod (52) is fixedly connected to the surface of the second fixed block (23); the other end of the electric telescopic rod (52) is fixedly connected to one end of the rack (51); the other end of the rack (51) is fixedly connected to a sliding rod (53); and the sliding rod (53) is sleeved inside the first fixed block (22).

Images