Semiconductor device packaging shell comprising ceramic component

Abstract

The utility model provides a semiconductor device packaging shell containing a ceramic component, and relates to the technical field of semiconductor device packaging shells, the semiconductor device packaging shell comprises an outer frame plate, a packaging mold and a bottom plate, the center in the packaging mold is provided with an inner sleeve opening, the outer side of the inner sleeve opening is provided with a die-casting groove, the die-casting groove is filled with the ceramic component, and the ceramic component is arranged in the die-casting groove. The outer frame plate is arranged on the ceramic component in a die-casting mode, and a metal connecting plate is arranged at the bottom of the ceramic component and welded in a groove formed in the middle of the bottom plate. An inner pressing opening is formed in the middle of the outer frame plate, and the outer frame plate is made of an oxygen-free copper material; the packaging mold adopts a hollow rectangular body structure; pins are arranged on the front portion and the rear portion of the ceramic component, and an upper packaging plate is installed on the upper end face of the ceramic component. According to the utility model, the upper pins are firstly die-cast by using the ceramic component, and then the upper and lower surfaces of the ceramic component are tightly welded and packaged to form a semiconductor packaging shell structure, so that the structure is firmer, safer and more durable.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor device packaging shells, in particular to a semiconductor device packaging shell comprising a ceramic component. Background Art

[0002] Semiconductor refers to materials whose electrical conductivity at room temperature is between that of conductors and insulators. Semiconductors are widely used in consumer electronics, communication systems, medical equipment and other fields. Any object made of two different types of clay, pottery clay and porcelain clay, through a process of batching, molding, drying, and firing can be called ceramics. Packaging can also be said to be the shell used to install semiconductor integrated circuit chips. It plays a role in installing, fixing, sealing, protecting chips and enhancing electrical and thermal performance.

[0003] In the specification of a semiconductor ceramic packaging shell in the prior art (publication number CN210272313U), it is mentioned that "a metal packaging shell is arranged in the middle of the top of the ceramic base plate, a sealing cover is arranged on the top of the metal packaging shell, and positioning and mounting holes are provided at the front and rear ends of the left side of the top and the front and rear ends of the right side of the top of the ceramic base plate, and the bottom of the inner cavity of the positioning and mounting hole passes through the bottom of the ceramic base plate, and a cross-slot pan head screw is arranged on the top of the inner cavity of the positioning and mounting hole". However, the ceramic package in the prior art uses a cross-slot pan head screw for positioning packaging, and the cross-slot pan head screw is easily rusted and corroded by external factors, which affects the stability and service life of the package and is more durable. Utility Model Content

[0004] In order to overcome the defects of the prior art, a semiconductor device packaging shell including a ceramic component is provided to solve the problem that the ceramic package in the prior art uses a cross-slot pan head screw for positioning packaging, and the cross-slot pan head screw is easily rusted and corroded by external factors, affecting the stability and service life of the package, and is more durable.

[0005] To achieve the above-mentioned purpose, a semiconductor device packaging shell including a ceramic component is provided, including an outer frame plate, a packaging mold and a base plate, an inner sleeve opening is arranged at the center of the packaging mold, and a die-casting groove is arranged on the outer side of the inner sleeve opening, the die-casting groove is filled with the ceramic component, and the outer frame plate is die-cast on the ceramic component, a metal connecting plate is arranged at the bottom of the ceramic component, and the metal connecting plate is welded in a groove opened in the middle of the base plate.

[0006] Furthermore, an internal pressure port is provided in the middle of the outer frame plate, and the outer frame plate is made of oxygen-free copper.

[0007] Furthermore, the packaging mold adopts a hollow rectangular structure.

[0008] Furthermore, a group of side through holes are provided on both the left and right parts of the bottom plate, and the side through holes adopt a cylindrical structure.

[0009] Furthermore, the front and rear parts of the ceramic component are both provided with pins, the upper end surface of the ceramic component is installed with an upper packaging plate, and the ceramic component, the pins, the metal connecting plate and the upper packaging plate are packaged together to form a semiconductor device packaging shell structure.

[0010] The beneficial effects of the utility model are:

[0011] 1. The outer frame plate of the utility model is made of oxygen-free copper with good weldability, so that it can be processed into various semi-finished products through cold and hot plastic processing, and the die-casting process is more convenient and fast.

[0012] 2. The encapsulation mold in the utility model is a mold for casting ceramic plates. The mold structure is simple and easy to manufacture, and ceramic parts can be prepared flexibly, more quickly and conveniently.

[0013] 3. The setting of the bottom plate in the utility model not only ensures safe and stable welding with the metal connecting plate at the bottom of the packaging mold, but also facilitates the packaging of semiconductor devices and helps to speed up the packaging efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic diagram of the structure of the outer frame plate of an embodiment of the utility model;

[0015] Figure 2 A schematic diagram of a packaging mold according to an embodiment of the utility model;

[0016] Figure 3 This is a schematic diagram of the outer frame plate of the embodiment of the utility model being die-cast on a packaging mold;

[0017] Figure 4 It is a top view schematic diagram of a packaged device on a bottom plate of an embodiment of the utility model;

[0018] Figure 5 This is a cross-sectional schematic diagram of a packaged device on a base plate according to an embodiment of the utility model.

[0019] In the figure: 1. outer frame plate; 2. packaging mold; 20. die-casting groove; 21. inner sleeve port; 22. ceramic component; 23. pin; 24. metal connecting plate; 25. upper packaging plate; 26. semiconductor device packaging shell; 10. internal pressure port; 3. bottom plate; 30. side through hole. DETAILED DESCRIPTION

[0020] In order to make the technical problems, technical solutions and beneficial effects to be solved by the utility model clearer, the utility model is further described in detail in combination with the accompanying drawings and embodiments. The specific embodiments described herein are only used to explain the utility model, and are not used to limit the utility model. Specific details such as specific system structures and technologies are proposed in order to more thoroughly understand the embodiments of the utility model. The described embodiments are part of the embodiments of the present disclosure, rather than all of the embodiments. However, it should be clear to those skilled in the art that the utility model can also be implemented in other embodiments without these specific details. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the present disclosure.

[0021] The specific implementation of the utility model is described in detail below with reference to the accompanying drawings.

[0022] Figure 1 This is a schematic diagram of the outer frame structure of an embodiment of the utility model. Figure 2 Schematic diagram of the packaging mold of the utility model embodiment, Figure 3 This is a schematic diagram of the outer frame plate of the embodiment of the utility model being die-cast on a packaging mold, Figure 4 Schematic diagram of top view of packaging device on the bottom plate of the utility model embodiment and Figure 5 This is a cross-sectional schematic diagram of a packaged device on a base plate according to an embodiment of the utility model.

[0023] Reference Figures 1 to 5 As shown, the utility model provides a semiconductor device packaging shell including a ceramic component, including an outer frame plate 1, a packaging mold 2 and a base plate 3, an inner sleeve 21 is arranged at the center of the packaging mold 2, and a die-casting groove 20 is arranged on the outer side of the inner sleeve 21, the die-casting groove 20 is filled with a ceramic component 22, and the outer frame plate 1 is die-cast on the ceramic component 22, a metal connecting plate 24 is arranged at the bottom of the ceramic component 22, and the metal connecting plate 24 is welded in a groove opened in the middle part of the base plate 3.

[0024] In this embodiment, an internal pressure port 10 is disposed in the middle of the outer frame plate 1 , and the outer frame plate 1 is made of oxygen-free copper.

[0025] As a preferred embodiment, the outer frame plate 1 of the utility model is made of oxygen-free copper with good weldability, so that it can be processed into various semi-finished products through cold and hot plastic processing, and the die-casting process is more convenient and faster.

[0026] In this embodiment, the packaging mold 2 adopts a hollow rectangular structure.

[0027] As a preferred embodiment, the encapsulation mold 2 in the present invention is a mold for casting ceramic panels. The mold structure is simple and easy to manufacture, and ceramic components can be prepared flexibly, more quickly and conveniently.

[0028] In this embodiment, a group of side through holes 30 are opened on the left and right parts of the base plate 3, and the side through holes 30 adopt a cylindrical structure; pins 23 are provided on the front and back parts of the ceramic component 22, and the ceramic component 22, the pins 23, the metal connecting plate 24 and the upper packaging plate 25 are packaged together to form a semiconductor device packaging shell 26 structure.

[0029] As a preferred implementation, the arrangement of the bottom plate 3 in the present invention not only ensures safe and stable welding with the metal connecting plate 24 at the bottom of the packaging mold 2, but also facilitates the packaging of semiconductor devices and helps to increase packaging efficiency.

[0030] The utility model can effectively solve the problem that the ceramic package in the prior art uses cross slot pan head screws for positioning and packaging, and the cross slot pan head screws are easily rusted and corroded by external factors, which affects the stability and service life of the package. The utility model first uses ceramic components to die-cast upper pins, and then tightly welds the upper and lower surfaces of the ceramic components to form a semiconductor packaging shell structure. The structural setting is stronger and more secure, and more durable.

[0031] The above embodiments are used to explain the present invention rather than to limit the present invention. Any modifications and changes made to the present invention within the spirit of the present invention and the scope of the claims for protection shall be included in the protection scope of the present invention.

Claims

1. A semiconductor device package housing comprising a ceramic component, characterized in that: The invention comprises an outer frame plate (1), a packaging mold (2) and a bottom plate (3); an inner sleeve opening (21) is arranged at the center of the packaging mold (2), and a die-casting groove (20) is arranged on the outer side of the inner sleeve opening (21); a ceramic component (22) is filled in the die-casting groove (20), and the outer frame plate (1) is die-cast on the ceramic component (22); a metal connecting plate (24) is arranged at the bottom of the ceramic component (22), and the metal connecting plate (24) is welded in a groove opened in the middle of the bottom plate (3).

2. A semiconductor device package shell comprising a ceramic component according to claim 1, characterized in that: An internal pressure port (10) is provided in the middle of the outer frame plate (1), and the outer frame plate (1) is made of oxygen-free copper.

3. A semiconductor device package housing comprising a ceramic component according to claim 1, characterized in that: The packaging mold (2) adopts a hollow rectangular structure.

4. A semiconductor device package housing comprising a ceramic component according to claim 1, characterized in that: A group of side through holes (30) are provided on both the left and right parts of the bottom plate (3), and the side through holes (30) are cylindrical in structure.

5. A semiconductor device package housing comprising a ceramic component according to claim 1, characterized in that: The front and rear parts of the ceramic component (22) are both provided with pins (23), the upper end surface of the ceramic component (22) is installed with an upper packaging plate (25), and the ceramic component (22), the pins (23), the metal connecting plate (24) and the upper packaging plate (25) are packaged together to form a semiconductor device packaging shell (26) structure.

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