Heat dissipation structure based on integrated circuit
By using multiple independent thermal conductivity rods and mounting plates in the integrated circuit heat dissipation structure, the precise cooling of each electronic component in the integrated circuit is achieved, the problem of unbalanced heat dissipation in the existing technology is solved, and the stability of heat dissipation is improved and targeted.
Patent Information
- Application Number
- CN202420417905.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-05
- Publication Date
- 2025-02-11
- Estimated Expiration
- 2034-03-05
AI Technical Summary
The existing integrated circuit heat dissipation devices are difficult to cool down for specific electronic components, and the overall cooling method leads to poor heat dissipation effect at the rear half of the cooling liquid flow.
A heat dissipation structure based on integrated circuit is designed, using multiple independent thermal rods to cooperate with the mounting plate, and the heat conducting sheet at the bottom of the thermal rod is in contact with the electronic components, and the cooling box and the drainage pump are connected through the drainage tube to achieve the independence of the thermal rod. Circulate heat dissipation.
It improves the pertinence and stability of heat dissipation, ensures that each electronic component in the integrated circuit can effectively cool down, and avoids the problem of poor heat dissipation effect at the rear half of the flow of coolant.
Smart Images
Figure CN222462900U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of heat dissipation structure design of integrated circuits, in particular to a heat dissipation structure based on integrated circuits. Background Art
[0002] Integrated Circuit (IC) is a microelectronic device that integrates multiple electronic components (such as transistors, diodes, resistors, etc.) on a silicon chip or other semiconductor materials. It can perform a variety of functions, such as amplifier circuits, logic gates, counters, etc. The development of integrated circuits has made electronic products more compact, high-performance and low-power. It is widely used in various fields such as computers, communication equipment, household appliances, automotive electronics, medical equipment, etc. According to the degree of integration, integrated circuits can be divided into small-scale integrated circuits (SSI), medium-scale integrated circuits (MSI), large-scale integrated circuits (LSI) and very large-scale integrated circuits (VLSI). With the advancement of technology, the scale of integrated circuits has become larger and larger. At present, there are tens of millions or even hundreds of millions of electronic components integrated on a chip, which is called very large-scale integrated circuits (ULSI).
[0003] Integrated circuit heat dissipation is one of the important issues to ensure the stable operation of the circuit. Integrated circuits generate heat during operation. If the heat cannot be effectively dissipated, it may cause the circuit temperature to rise or even damage the circuit.
[0004] Most existing heat dissipation devices cool the integrated circuit by integrally bonding it to the integrated circuit. They cannot specifically cool the electronic components on the integrated circuit that need to be cooled. In addition, since the integrated circuit is uneven, it is difficult for the cooling device to contact the flat electronic components. In the overall cooling method, the coolant gradually heats up during the flow process, so the electronic components at the second half of the flow path cannot be effectively cooled. Utility Model Content
[0005] The purpose of the utility model is to provide a heat dissipation structure based on integrated circuits to solve the problems existing in the above-mentioned background technology.
[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:
[0007] A heat dissipation structure based on integrated circuits, comprising a cooling device, a mounting device is arranged at the bottom of the cooling device, and a plurality of heat-conducting devices are arranged at the bottom of the mounting device; the mounting device comprises a mounting plate, four lower fixing plates are symmetrically fixedly arranged on both sides of the mounting plate, a plurality of mounting holes are evenly and throughly arranged on the mounting plate, and a mounting groove is arranged at the top of the mounting hole; the heat-conducting device comprises a heat-conducting rod, a heat-conducting plate is fixedly arranged at the bottom of the heat-conducting rod, two drainage tubes are arranged on one side of the heat-conducting rod, a limiting block is fixedly arranged at the top of the heat-conducting rod, a gasket is arranged at the top of the limiting block, and a mounting bolt is arranged at the top of the gasket.
[0008] Furthermore: the cooling device includes a cooling box, a plurality of heat sinks are evenly fixed on the cooling box, a drainage pump is installed at the bottom of the cooling box, a plurality of connecting heads are arranged in parallel in front of the cooling box and the drainage pump, four upper fixing plates are symmetrically fixed on both sides of the cooling box, and a plurality of fans are installed on the outside of the cooling box.
[0009] Furthermore: the cooling box is U-shaped.
[0010] Furthermore: the cross-sections of the mounting hole and the limiting block are both square, the mounting groove is circular, and the gasket is annular.
[0011] Furthermore: the lower fixing plate is welded to the mounting plate.
[0012] Furthermore: the heat conducting sheet and the heat conducting rod are integrally formed, and the heat conducting sheet is square.
[0013] Furthermore: the mounting bolt is threadedly connected to the limiting block.
[0014] Compared with the prior art, the beneficial effects of the utility model are:
[0015] 1. According to the position of the components to be cooled in the integrated circuit, insert the corresponding number of heat-conducting rods at the bottom of the mounting plate. The limit block at the top of the heat-conducting rod has the same shape as the mounting hole to determine the position of the heat-conducting rod to prevent it from rotating. The heat-conducting sheet at the bottom of the heat-conducting rod corresponds to the electronic component one by one. Place the corresponding number of gaskets in the mounting groove above the heat-conducting rod, and finally screw in the mounting bolts to fix the heat-conducting rod on the mounting plate. The two drainage pipes on the side of the heat-conducting rod are respectively connected to the connectors of the cooling box and the drainage pump to achieve preliminary installation. By evenly arranging the mounting holes on the mounting plate, the heat-conducting rod can be freely installed according to the position of the electronic component, improving the adaptability of the device and making the heat dissipation more targeted. The electrical components in the integrated circuit are of different heights. The independently arranged heat-conducting rod can reduce the difficulty of installation, so that the heat-conducting sheet can accurately contact the electronic components to be cooled.
[0016] 2. The design of independent circulation heat dissipation of several heat-conducting rods can prevent the problem of poor heat dissipation effect in the second half of the coolant flow path during overall heat dissipation, thereby improving the heat dissipation stability. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.
[0018] Figure 1 It is a structural schematic diagram of a heat dissipation structure based on an integrated circuit described in the utility model;
[0019] Figure 2 It is a structural schematic diagram of a cooling device based on a heat dissipation structure of an integrated circuit according to the utility model;
[0020] Figure 3 It is a structural schematic diagram of an installation device of a heat dissipation structure based on an integrated circuit according to the utility model;
[0021] Figure 4 It is a partial cross-sectional view of a heat-conducting device based on a heat dissipation structure of an integrated circuit described in the utility model.
[0022] Figure 5 It is an assembly diagram of a mounting device and a heat conducting device of a heat dissipation structure based on an integrated circuit described in the utility model.
[0023] In the accompanying drawings: 1. cooling device; 101. cooling box; 102. heat sink; 103. drainage pump; 104. connector; 105. upper fixing plate; 106. fan; 2. mounting device; 201. mounting plate; 202. lower fixing plate; 203. mounting hole; 204. mounting groove; 3. heat conducting device; 301. heat conducting rod; 302. heat conducting plate; 303. drainage pipe; 304. limit block; 305. gasket; 306. mounting bolt. DETAILED DESCRIPTION
[0024] In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the present utility model, unless otherwise specified, "multiple" means two or more.
[0025] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood by specific circumstances.
[0026] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0027] See also Figure 1-Figure 5 A heat dissipation structure based on an integrated circuit includes a cooling device 1, a mounting device 2 is arranged at the bottom of the cooling device 1, and a plurality of heat conducting devices 3 are arranged at the bottom of the mounting device 2.
[0028] In this embodiment: the cooling device 1 includes a cooling box 101, on which a plurality of heat sinks 102 are evenly and fixedly arranged, a drainage pump 103 is installed at the bottom of the cooling box 101, a plurality of connectors 104 are arranged in parallel in front of the cooling box 101 and the drainage pump 103, four upper fixing plates 105 are symmetrically and fixedly arranged on both sides of the cooling box 101, a plurality of fans 106 are installed on the outside of the cooling box 101, and the cooling box 101 is U-shaped, the coolant absorbs the heat of the heat-conducting rod 301 and then heats up, and flows into the cooling box 101 along another drainage pipe 303, the cooling box 101 is heated and heats up and transfers the temperature to the heat sink 102, the heat sink 102 expands the heat dissipation area of the cooling box 101, and the fan 106 rotates to guide the airflow to take away the heat of the heat sink 102, so that the coolant in the cooling box 101 is cooled synchronously, and a cooling cycle is realized;
[0029] In this embodiment: the mounting device 2 includes a mounting plate 201, four lower fixing plates 202 are symmetrically fixedly arranged on both sides of the mounting plate 201, a plurality of mounting holes 203 are evenly arranged on the mounting plate 201, and a mounting groove 204 is arranged on the top of the mounting hole 203. The cross-sections of the mounting hole 203 and the limit block 304 are both square, the mounting groove 204 is circular, and the gasket 305 is annular. The lower fixing plate 202 and the mounting plate 201 are welded together. By evenly arranging the mounting holes 203 on the mounting plate 201, the heat-conducting rod 301 can be freely installed according to the position of the electronic components, thereby improving the adaptability of the device and making the heat dissipation more targeted. The lower fixing plate 202 on the top of the mounting plate 201 is aligned with the upper fixing plate 105 at the bottom of the cooling box 101, and the lower fixing plate 202 and the upper fixing plate 105 are fixed by bolts. At this time, the mounting plate 201 is fixed to the bottom of the cooling box 101 to complete the overall installation;
[0030] In this embodiment: the heat conduction device 3 includes a heat conduction rod 301, a heat conduction sheet 302 is fixedly arranged at the bottom of the heat conduction rod 301, two drainage tubes 303 are arranged on one side of the heat conduction rod 301, a limit block 304 is fixedly arranged on the top of the heat conduction rod 301, a gasket 305 is arranged on the top of the limit block 304, and a mounting bolt 306 is arranged on the top of the gasket 305. The heat conduction sheet 302 and the heat conduction rod 301 are integrally formed, the heat conduction sheet 302 is square, and the mounting bolt 306 is threadedly connected with the limit block 304. According to the position of the components to be cooled in the integrated circuit, a corresponding number of heat conduction rods 301 are inserted at the bottom of the mounting plate 201, wherein the limit block 304 on the top of the heat conduction rod 301 has the same shape as the mounting hole 203, determines the position of the heat conduction rod 301, and prevents it from rotating. The heat conduction sheet 302 at the bottom of the heat conduction rod 301 corresponds to the electronic component one by one. A corresponding number of gaskets 305 are placed in the mounting grooves 204 above the heat-conducting rod 301, and finally the mounting bolts 306 are screwed in to fix the heat-conducting rod 301 on the mounting plate 201. The two drainage pipes 303 on the sides of the heat-conducting rod 301 are respectively connected to the connectors 104 of the cooling box 101 and the drainage pump 103 to achieve preliminary installation. The electrical components in the integrated circuit are of different heights. The independently arranged heat-conducting rods 301 can reduce the difficulty of installation, so that the heat-conducting sheet 302 can accurately contact the electronic components to be cooled. The design of independent circulation heat dissipation of several heat-conducting rods 301 can prevent the problem of poor heat dissipation effect in the second half of the coolant flow path during overall heat dissipation, thereby improving the heat dissipation stability. When in use, the heat-conducting sheet 302 is closely attached to the upper surface of the electronic component from above, and the heat generated by the electronic component is absorbed by the heat-conducting sheet 302 into the heat-conducting rod 301.
[0031] Working principle: First, according to the position of the components to be cooled in the integrated circuit, insert the corresponding number of heat-conducting rods 301 at the bottom of the mounting plate 201. The stopper 304 at the top of the heat-conducting rod 301 has the same shape as the mounting hole 203 to determine the position of the heat-conducting rod 301 and prevent it from rotating. The heat-conducting sheet 302 at the bottom of the heat-conducting rod 301 corresponds to the electronic component one by one. Place the corresponding number of gaskets 305 in the mounting groove 204 above the heat-conducting rod 301, and finally screw in the mounting bolts 306 to fix the heat-conducting rod 301 on the mounting plate 201. The two drainage pipes 303 on the side of the rod 301 are respectively connected to the connector 104 of the cooling box 101 and the drainage pump 103 to achieve preliminary installation. By evenly arranging the mounting holes 203 on the mounting plate 201, the heat-conducting rod 301 can be freely installed according to the position of the electronic components, thereby improving the adaptability of the device and making the heat dissipation more targeted. The electrical components in the integrated circuit are of different heights, and the independently arranged heat-conducting rod 301 can reduce the difficulty of installation, so that the heat-conducting sheet 302 can accurately contact the electronic components to be cooled. The design of independent circulation heat dissipation of the rod 301 prevents the problem of poor heat dissipation effect in the second half of the coolant flow path during overall heat dissipation, and improves the heat dissipation stability. Then, the lower fixing plate 202 on the top of the mounting plate 201 is aligned with the upper fixing plate 105 at the bottom of the cooling box 101, and the lower fixing plate 202 and the upper fixing plate 105 are fixed by bolts. At this time, the mounting plate 201 is fixed to the bottom of the cooling box 101 to complete the overall installation. When in use, the heat conductive sheet 302 is closely attached to the upper surface of the electronic component from above, and the heat generated by the electronic component is absorbed by the heat conductive sheet 30 2 is absorbed into the heat-conducting rod 301, and the drainage pump 103 drives the coolant in the cooling box 101 to flow into the heat-conducting rod 301 along the drainage pipe 303. The coolant absorbs the heat of the heat-conducting rod 301 and then heats up, and flows into the cooling box 101 along another drainage pipe 303. The cooling box 101 is heated and the temperature is transferred to the heat dissipation grille 102. The heat dissipation grille 102 expands the heat dissipation area of the cooling box 101. The fan 106 rotates to guide the airflow to take away the heat of the heat dissipation grille 102, so that the coolant in the cooling box 101 is cooled synchronously, and a cooling cycle is realized.
[0032] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A heat dissipation structure based on an integrated circuit, comprising a cooling device (1), characterized in that: The bottom of the cooling device (1) is provided with a mounting device (2), and the bottom of the mounting device (2) is provided with a plurality of heat conducting devices (3); The mounting device (2) comprises a mounting plate (201), four lower fixing plates (202) are symmetrically fixedly arranged on both sides of the mounting plate (201), a plurality of mounting holes (203) are evenly arranged through the mounting plate (201), and a mounting groove (204) is arranged at the top of the mounting hole (203); The heat conduction device (3) comprises a heat conduction rod (301), a heat conduction sheet (302) is fixedly arranged at the bottom of the heat conduction rod (301), two drainage pipes (303) are arranged on one side of the heat conduction rod (301), a limit block (304) is fixedly arranged at the top of the heat conduction rod (301), a gasket (305) is arranged at the top of the limit block (304), and a mounting bolt (306) is arranged at the top of the gasket (305).
2. The heat dissipation structure based on integrated circuit according to claim 1, characterized in that: The cooling device (1) comprises a cooling box (101), a plurality of heat dissipation grilles (102) are evenly and fixedly arranged on the cooling box (101), a drainage pump (103) is installed at the bottom of the cooling box (101), a plurality of connectors (104) are arranged in parallel in front of the cooling box (101) and the drainage pump (103), four upper fixing plates (105) are symmetrically and fixedly arranged on both sides of the cooling box (101), and a plurality of fans (106) are installed on the outside of the cooling box (101).
3. The heat dissipation structure based on integrated circuit according to claim 2, characterized in that: The cooling box (101) is U-shaped.
4. The heat dissipation structure based on integrated circuit according to claim 1, characterized in that: The cross-sections of the mounting hole (203) and the limiting block (304) are both square, the mounting groove (204) is circular, and the gasket (305) is annular.
5. The heat dissipation structure based on integrated circuit according to claim 1, characterized in that: The lower fixing plate (202) and the mounting plate (201) are welded together.
6. The heat dissipation structure based on integrated circuit according to claim 1, characterized in that: The heat conducting sheet (302) and the heat conducting rod (301) are integrally formed, and the heat conducting sheet (302) is square.
7. The heat dissipation structure based on integrated circuit according to claim 1, characterized in that: The mounting bolt (306) is threadedly connected to the limiting block (304).