Accompanying plating matching plate and electroplating device thereof
By setting up an electroplating part and a plating resist part on the substrate of the plating and matching plate, the electroplating area is reduced, and the copper and electroplating water loss caused by the large electroplating area of the existing plating and matching plate is solved, and the effect of reducing production costs is achieved.
Patent Information
- Application Number
- CN202420598598.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-26
- Publication Date
- 2025-02-11
- Estimated Expiration
- 2034-03-26
AI Technical Summary
The existing plating and matching boards have large electroplating area, which leads to loss of copper and electroplating potions and increases the production cost of printed circuit boards.
A plating matching plate is designed, by setting an electroplating part and a plating resist part on the substrate, 30%-70% of the conductive layer is retained to reduce the electroplating area.
On the premise of ensuring the plating performance, the consumption of copper and electroplating agents during the electroplating process is reduced, and the production cost of printed circuit boards is reduced.
Smart Images
Figure CN222464957U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of printed circuit boards, in particular to a plating matching board and an electroplating device thereof. Background Art
[0002] In the production of printed circuit boards (PCBs), vertical electroplating lines are usually used, including gantry vertical electroplating lines and continuous vertical electroplating lines. This type of electroplating line connects the circuit board to be plated with the negative electrode of the rectifier through electroplating clamps and cables. Under the action of current and electroplating agents, copper ions are electroplated onto the circuit board. In order to improve the electroplating quality of printed circuit boards, during the production process, it is necessary to add accompanying plating matching plates at both ends of the gantry electroplating line or at the beginning of the inlet and outlet of the continuous electroplating line. The accompanying plating matching plate can prevent the electroplating tip effect from acting on the printed circuit board to be plated, avoid burning the board, and avoid problems such as uneven copper thickness. Secondly, the accompanying plating matching plate is also used to support the shielding frame at the bottom of the negative electrode to prevent the printed circuit board from bending and deforming due to insufficient thickness. The existing accompanying plating matching plate has the problem of large electroplating area, resulting in loss of copper and electroplating solution, and increasing the production cost of the printed circuit board. Utility Model Content
[0003] In order to solve the above problems, the purpose of the utility model is to provide a plating matching board and a plating device thereof, which can reduce the plating area of the plating matching board by setting a plating part and a resist plating part, thereby saving the production cost of the printed circuit board.
[0004] The technical solution adopted by the utility model to solve the problem is:
[0005] The first aspect of the utility model is a plating matching plate, comprising a substrate, wherein the substrate comprises a plating portion and a resist portion, wherein the resist portion is located inside the plating portion; the material of the plating portion is plastic or metal, and a conductive layer is formed on the surface of the plating portion; the resist portion is formed by etching the plating portion, and an insulating layer is formed on the surface of the resist portion; the percentage of the area of the plating portion to the area of the substrate is between 30% and 70%.
[0006] The above-mentioned accompanying plating board has at least the following beneficial effects: by setting the electroplating part and the resist plating part, 30%-70% of the conductive layer is retained on the substrate, and under the premise of ensuring the accompanying plating performance of the substrate, the consumption of copper and electroplating agents in the electroplating process is reduced, thereby saving the production cost of the printed circuit board.
[0007] Furthermore, the substrate is made of copper-clad laminate. Copper-clad laminate is a plate-shaped material made of electronic glass fiber cloth or other reinforcing materials impregnated with resin, covered with copper foil on one or both sides and hot-pressed. It mainly plays the role of interconnection, insulation and support for printed circuit boards. The substrate is made of copper-clad laminate, which can effectively ensure the conductive performance of the electroplating part, facilitate cutting and assembly of the substrate, and save the production cost of the accompanying plating board.
[0008] Furthermore, the thickness of the substrate is between 1.5 and 4 mm, which can effectively ensure that the thickness of the accompanying plating board is consistent with that of the printed circuit board, thereby improving the protective performance of the accompanying plating board.
[0009] Furthermore, the copper thickness of the copper clad plate is Hoz or 1 oz. This thickness of copper material can ensure that the thickness of the copper material covered by the electroplating part is consistent with that of the printed circuit board, thereby ensuring the protective performance of the accompanying plating board.
[0010] Furthermore, the plating resist portions are evenly distributed on the substrate. This structure ensures the structural stability of the substrate and prevents the substrate from tilting and shifting during the electroplating process, which would affect the stability of the accompanying plating plate.
[0011] Furthermore, the plating resistance part is rectangular and is located in the middle of the substrate. This structure effectively increases the area of the plating resistance part, facilitates the processing and forming of the plating resistance part, and reduces the production cost of the accompanying plating plate.
[0012] Furthermore, the plating resistance part is in the form of a plurality of mutually parallel rectangles. This structure can effectively increase the area of the plating resistance part, avoid deformation of the plating part during the electroplating process, and ensure the structural stability of the substrate.
[0013] Furthermore, the plating resistance part is in the shape of diagonal stripes. This structure can effectively improve the structural strength of the electroplating part, avoid deformation of the electroplating part during the electroplating process, and ensure the structural stability of the substrate.
[0014] Furthermore, the electroplating parts between the plurality of the plating resist parts form diagonal stripes. The electroplating parts between the plating resist parts form diagonal stripes, so that the plating resist parts form regular blocks and are evenly distributed inside the substrate. This structure can not only ensure the area of the plating resist parts, but also effectively increase the structural strength of the electroplating parts.
[0015] The second aspect of the utility model is an electroplating device, comprising an electroplating flybar and the accompanying plating matching plate as described above; the substrate is fixed to the two ends of the electroplating flybar by a clamp.
[0016] The beneficial effects of the above-mentioned electroplating device are: by setting up the electroplating part and the resist plating part, 30%-70% of the conductive layer is retained on the substrate, and under the premise of ensuring the accompanying plating performance of the substrate, the consumption of copper and electroplating agents in the electroplating process is reduced, thereby saving the production cost of the printed circuit board; by setting up the electroplating flybar and the accompanying plating matching plate, the substrate can be fixed at both ends of the electroplating flybar, ensuring that the electroplating part can stably plate a thin layer of metal on the conductive layer, thereby improving the accompanying plating performance of the substrate.
[0017] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 This is a structural schematic diagram of a plating matching plate according to an embodiment of the utility model;
[0019] Figure 2 This is a structural schematic diagram of a plating matching plate according to another embodiment of the utility model;
[0020] Figure 3 This is a structural schematic diagram of a plating matching plate according to another embodiment of the utility model;
[0021] Figure 4 This is a structural schematic diagram of a plating matching plate according to another embodiment of the utility model;
[0022] Figure 5 This is a structural schematic diagram of a plating matching plate according to another embodiment of the utility model;
[0023] Figure 6 It is a structural schematic diagram of an electroplating device according to an embodiment of the utility model. DETAILED DESCRIPTION
[0024] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.
[0025] Reference Figures 1 to 5 The embodiment of the utility model provides a plating matching plate, including a substrate 100, the substrate 100 includes a plating part 200 and a plating resistance part 300, the plating resistance part 300 is located inside the plating part 200; the material of the plating part 200 is plastic or metal, and a conductive layer is formed on the surface of the plating part 200; the plating resistance part 300 is formed by etching the plating part 200, and an insulating layer is formed on the surface of the plating resistance part 300; the percentage of the area of the plating part 200 to the area of the substrate 100 is between 30% and 70%.
[0026] By providing the electroplating part 200 and the resist part 300, 30%-70% of the conductive layer is retained on the substrate 100. Under the premise of ensuring the accompanying plating performance of the substrate 100, the consumption of copper and electroplating agents in the electroplating process is reduced, thereby saving the production cost of the printed circuit board.
[0027] In another embodiment, the substrate 100 is made of a copper-clad laminate. The copper-clad laminate is a plate-shaped material made of electronic glass fiber cloth or other reinforcing materials impregnated with resin, covered with copper foil on one or both sides and hot-pressed. It mainly serves as interconnection, insulation and support for the printed circuit board. The substrate 100 is made of a copper-clad laminate, which can effectively ensure the conductive performance of the electroplating part 200, facilitate cutting and assembly of the substrate 100, and save the production cost of the accompanying plating board.
[0028] In another embodiment, the thickness of the substrate 100 is between 1.5 mm and 4 mm. The substrate 100 of such thickness can effectively ensure that the thickness of the accompanying plating board is consistent with that of the printed circuit board, thereby improving the protection performance of the accompanying plating board.
[0029] In another embodiment, the copper thickness of the copper clad board is Hoz or 1 oz. This thickness of copper material can ensure that the thickness of the copper material covered by the electroplating unit 200 is consistent with that of the printed circuit board, thereby ensuring the protective performance of the accompanying plating board.
[0030] In another embodiment, the plating resist 300 is evenly distributed on the substrate 100. This structure ensures the structural stability of the substrate 100, and prevents the substrate 100 from tilting and shifting during the electroplating process, which affects the stability of the accompanying plating plate.
[0031] Reference Figure 2 In another embodiment, the plating resist portion 300 is rectangular and is located in the middle of the substrate 100. This structure effectively increases the area of the plating resist portion 300, facilitates the processing and forming of the plating resist portion 300, and reduces the production cost of the accompanying plating plate.
[0032] Reference Figure 1 and Figure 3 In another embodiment, the plating resist portion 300 is in the form of a plurality of mutually parallel rectangles. This structure can effectively increase the area of the plating resist portion 300, avoid deformation of the plating portion 200 during the electroplating process, and ensure the structural stability of the substrate 100.
[0033] Reference Figure 4 In another embodiment, the plating resist portion 300 is in a diagonal strip shape. This structure can effectively improve the structural strength of the electroplating portion 200, avoid deformation of the electroplating portion 200 during the electroplating process, and ensure the structural stability of the substrate 100.
[0034] Reference Figure 5In another embodiment, the electroplating parts 200 between the plurality of plating resist parts 300 form diagonal stripes. The electroplating parts 200 between the plating resist parts 300 form diagonal stripes, so that the plating resist parts 300 form regular blocks and are evenly distributed inside the substrate 100. This structure can not only ensure the area of the plating resist parts 300, but also effectively increase the structural strength of the electroplating parts 200.
[0035] Reference Figure 6 The embodiment of the utility model further provides an electroplating device, including an electroplating flybar 400 and the accompanying plating plate as described above; the substrate 100 is fixed at both ends of the electroplating flybar 400 by a clamp 410.
[0036] Specifically, the lower end of the electroplating flybar 400 is fixed with a plurality of PCB boards 500 to be electroplated by a clamp 410, and the two substrates 100 are respectively fixed to the front and rear ends of the plurality of PCB boards 500 by the clamps 410. In some embodiments, the spare clamps 410 need to be hung with substrates 100 to prevent the clamps 410 from being plated with metal, thereby avoiding quality problems such as roughness and plating tumors on the PCB boards 500 during the electroplating process.
[0037] The working principle of the utility model is further explained below.
[0038] During the production process, firstly, a substrate 100 of a non-conductive material having the same size as the PCB board 500 is cut out according to the specifications of the PCB board 500. In some embodiments, a thin layer of chemical copper can be deposited on the cut substrate 100 by a chemical method in a manner consistent with the production of the PCB board, so as to serve as a base for subsequent copper electroplating, that is, copper electroplating is performed on the substrate 100, and then a pattern transfer process is performed, a photosensitive film layer is attached or coated on the treated copper surface, and under the irradiation of ultraviolet light, the pattern on the film consistent with the electroplating part 200 is transferred to the copper surface to form an anti-corrosion mask pattern, and those unnecessary copper foils not protected by the anti-corrosion agent will be etched away in the subsequent chemical etching process, and the anti-corrosion film layer is removed after the etching process to obtain the required electroplating part 200 and the plating resistance part 300. In other embodiments, the substrate 100 may also be directly made of a copper-clad laminate, and then processed by negative film etching to obtain a plating companion plate, that is, a photosensitive film layer is similarly attached or coated on the substrate 100, and under ultraviolet light, the pattern on the film consistent with the plating part 200 is transferred to the substrate 100, and the plating part 200 and the resist plating part 300 are obtained by acid etching.
[0039] During the electroplating process, a plurality of PCB boards 500 to be electroplated are fixed at the lower end of the electroplating flybar 400 by a fixture 410, and two substrates 100 are respectively fixed at the front and rear ends of the plurality of PCB boards 500 by the fixture 410; the electroplating flybar 400 drives the accompanying plating matching plate and the PCB board 500 to enter the electroplating tank for electroplating operation, and the accompanying plating matching plates at both ends of the PCB board 500 can prevent the electroplating tip effect from acting on the PCB board 500, and avoid the problems of burning the PCB board 500 and uneven copper thickness. In addition, after the electroplating tank is treated with copper balls and carbon, it is necessary to hang the accompanying plating matching plate at the lower end of the electroplating flybar 400 for false plating first to determine whether the electroplating agent meets the activity requirements. After the accompanying plating matching plate is used for a period of time, because the copper thickness on the surface of the electroplating part 200 continues to increase, the accompanying plating matching plate will become very heavy, affecting the stability and safety of the electroplating device. At this time, the accompanying plating board can be reused after the copper thickness on the surface of the electroplating part 200 is reduced through the etching line, thereby increasing the service life of the accompanying plating board and reducing the production cost of the PCB board 500.
[0040] From the above description, it can be seen that a plating matching plate and its electroplating device of the utility model retain 30%-70% of the conductive layer on the substrate 100 by setting the electroplating part 200 and the resist plating part 300. Under the premise of ensuring the plating performance of the substrate 100, the consumption of copper and electroplating agents in the electroplating process is reduced, thereby saving the production cost of the printed circuit board; by setting the electroplating flybar 400 and the plating matching plate, the substrate 100 can be fixed at both ends of the electroplating flybar 400, ensuring that the electroplating part 200 can stably plate a thin layer of metal on the conductive layer, thereby improving the plating performance of the substrate 100.
[0041] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the technical field without departing from the purpose of the present invention.
Claims
1. A plating plate, characterized in that: The invention comprises a substrate, wherein the substrate comprises a plating portion and a resist portion, wherein the resist portion is located inside the plating portion; the material of the plating portion is plastic or metal, and a conductive layer is formed on the surface of the plating portion; the resist portion is formed by etching the plating portion, and an insulating layer is formed on the surface of the resist portion; the percentage of the area of the plating portion to the area of the substrate is between 30% and 70%.
2. A plating plate according to claim 1, characterized in that: The substrate is made of a copper clad laminate.
3. A plating plate according to claim 2, characterized in that: The thickness of the substrate is between 1.5-4 mm.
4. A plating plate according to claim 2, characterized in that: The copper thickness of the copper clad laminate is Hoz or 1oz.
5. A plating plate according to claim 1, characterized in that: The plating resistance parts are evenly distributed on the substrate.
6. A plating plate according to claim 5, characterized in that: The plating resistance portion is rectangular and is located in the middle of the substrate.
7. A plating plate according to claim 6, characterized in that: The plating resistance portion is in the form of a plurality of mutually parallel rectangles.
8. A plating plate according to claim 5, characterized in that: The plating resistance portion is in the shape of diagonal stripes.
9. A plating plate according to claim 5, characterized in that: The electroplating parts between the plurality of plating resist parts form diagonal stripes.
10. An electroplating device, characterized in that: It comprises an electroplating flybar and a plating matching plate as described in any one of claims 1 to 9; the substrate is fixed to the two ends of the electroplating flybar by a clamp.