Circuit board assembly

Abstract

The utility model discloses a circuit board assembly which comprises a first sealing shell, a circuit board, a second sealing shell and a sealing layer, the first sealing shell is provided with a containing cavity, the circuit board is matched with the containing cavity, the circuit board is contained in the containing cavity, and the second sealing shell is connected with the first sealing shell in a butt joint mode and covers the containing cavity in a sealing mode. A gap between the first sealing shell and the second sealing shell is sealed by a sealing layer; when the circuit board assembly is assembled, the circuit board is placed in the containing cavity of the first sealing shell, then the sealing layer is arranged on the first sealing shell, and finally the second sealing shell and the first sealing shell are connected in a butt joint mode and cover the containing cavity in a sealing mode so that the circuit board can be wrapped in the containing cavity. The sealing layer correspondingly seals the gap between the first sealing shell and the second sealing shell, the whole circuit board sealing process does not need to be carried out in a high-temperature and high-pressure environment, the circuit board cannot be impacted, and damage to the circuit board due to high temperature, high pressure and impact is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a circuit board assembly. Background Art

[0002] PCBA, or printed circuit board, is a module with electronic parts on it that can realize a certain function. PCBA has different requirements for the casing due to different usage environments. For example, it needs to be waterproof for outdoor use, and a soft rubber casing is needed when there is impact or direct contact with the skin.

[0003] In the prior art, the sealing method of using silicone rubber or rubber as the outer shell generally adopts the encapsulation process for sealing, that is, the silicone rubber is heated (melted) and pressurized (to ensure that the molten silicone rubber can flow and fill the mold cavity) for sealing. However, some electronic parts are not resistant to high temperatures, such as film capacitors, crystal oscillators, etc., and some electronic parts are not resistant to impact, such as parts of ceramic shells or glass shells. In addition, uneven force may also cause poor solder joints. In the actual production process, there are 1 to 3% defects, and a certain proportion of shipments will be defective due to the influence of this process. Utility Model Content

[0004] The main purpose of the utility model is to provide a circuit board assembly, aiming to solve the problem in the prior art that when a circuit board is sealed using a silicone rubber or rubber shell and a rubber encapsulation process, the circuit board is damaged due to the circuit board's inability to withstand high temperature and high pressure and impact.

[0005] To achieve the above object, the utility model provides a circuit board assembly, which includes:

[0006] A first sealing shell is provided with a containing cavity;

[0007] A circuit board is adapted to the accommodating cavity, and the circuit board is accommodated in the accommodating cavity;

[0008] A second sealing shell, connected to the first sealing shell and covering the accommodating cavity;

[0009] The sealing layer is used to seal the gap between the first sealing shell and the second sealing shell.

[0010] In some embodiments, a side of the first sealing shell facing the second sealing shell is provided with an annular boss, and the accommodating cavity is formed in the annular boss;

[0011] An annular side portion is protrudingly provided on one side of the second sealing shell facing the first sealing shell. The annular side portion is arranged along the edge of the second sealing shell and is located at the periphery of the annular boss.

[0012] In some embodiments, the sealing layer includes a first sealing layer located between the annular side portion and the first sealing shell.

[0013] In some embodiments, a surface of the first sealing layer facing away from the annular boss is flush with the outer surfaces of the first sealing shell and the second sealing shell.

[0014] In some embodiments, the sealing layer includes a second sealing layer, and the second sealing layer is located between the inner wall of the annular side portion and the outer wall of the annular boss.

[0015] In some embodiments, the sealing layer includes a third sealing layer, and the third sealing layer is located between the annular boss and the second sealing shell.

[0016] In some embodiments, the sealing layer is an adhesive layer.

[0017] In some embodiments, at least one first electronic component is disposed on one side of the circuit board facing the bottom wall of the accommodating cavity, and at least one first avoidance hole is disposed on the bottom wall of the accommodating cavity, and each first electronic component is accommodated in one of the first avoidance holes.

[0018] In some embodiments, at least one second electronic component is disposed on a side of the circuit board facing the second sealed shell, and the second sealed shell is provided with at least one second avoidance hole, and each second electronic component is accommodated in one of the second avoidance holes.

[0019] When assembling the circuit board assembly in the present application, the circuit board is placed in the accommodating cavity of the first sealing shell, and then a sealing layer is arranged on the first sealing shell. Finally, the second sealing shell is docked and connected with the first sealing shell and the accommodating cavity is sealed to cover the circuit board therein. The sealing layer seals the gap between the first sealing shell and the second sealing shell accordingly. The entire circuit board sealing process does not need to be carried out in a high temperature and high pressure environment, and will not impact the circuit board, thereby avoiding damage to the circuit board caused by high temperature, high pressure and impact. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic diagram of the exploded structure of a circuit board assembly in one embodiment of the utility model;

[0021] Figure 2 for Figure 1 A schematic cross-sectional view of the overall structure of the circuit board assembly in the embodiment;

[0022] Figure 3 for Figure 1 A schematic structural diagram of the second sealing shell in the embodiment. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the scheme in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0025] It should also be noted that when an element is referred to as being "fixed on" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element at the same time. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be an intermediate element at the same time.

[0026] In addition, the descriptions of "first", "second", etc. in the present utility model are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in this field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present utility model.

[0027] The utility model provides a circuit board assembly, referring to Figure 1 , the circuit board assembly comprises:

[0028] The first sealing shell 1 is provided with a receiving cavity 5;

[0029] The circuit board 2 is adapted to the accommodating cavity 5, and the circuit board 2 is accommodated in the accommodating cavity 5;

[0030] The second sealing shell 4 is connected to the first sealing shell 1 and covers the accommodating cavity 5;

[0031] The sealing layer 3 is used to seal the gap between the first sealing shell 1 and the second sealing shell 4 .

[0032] The circuit board assembly in the present application includes a first sealing shell 1, a circuit board 2, a second sealing shell 4 and a sealing layer 3. The first sealing shell 1 is connected to the second sealing shell 4 and covers the accommodating cavity 5. The gap between the first sealing shell 1 and the second sealing shell 4 is sealed by the sealing layer 3. The shapes of the first sealing shell 1 and the second sealing shell 4 can be set according to the shapes of the circuit board 2. Figure 1 The first sealed shell 1 and the second sealed shell 4 are both square shells.

[0033] A sealing layer 3 is provided at the gap between the first sealing shell 1 and the second sealing shell 4. The sealing layer 3 is annular in shape. The annular sealing layer 3 can achieve full-circle sealing without any disconnection in the middle, and has good sealing performance.

[0034] In the circuit board assembly of the present application, the first sealing shell 1, the second sealing shell 4, the circuit board 2 and the sealing layer 3 are relatively independent before being assembled. After the circuit board 2 is placed in the accommodating cavity 5, the sealing layer 3 is placed on the outer surface of the accommodating cavity 5, and finally the second sealing shell 4 is connected to the first sealing shell 1 and the accommodating cavity 5 is sealed to cover the circuit board 2 therein. The entire circuit board sealing process does not need to be carried out in a high temperature and high pressure environment, and will not impact the circuit board, thereby avoiding damage to the circuit board caused by high temperature, high pressure and impact.

[0035] In some embodiments, the first sealing shell 1 is provided with an annular boss 11 on one side facing the second sealing shell 4, and the accommodating cavity 5 is formed in the annular boss 11; the second sealing shell 4 is provided with an annular side portion 41 on one side facing the first sealing shell 1, and the annular side portion 41 is provided along the edge of the second sealing shell 4 and is located at the periphery of the annular boss 11. It can be understood that when the second sealing shell 4 covers the accommodating cavity 5, the provision of the annular boss 11 and the annular side portion 41 increases the contact area between the first sealing shell 1 and the second sealing shell 4, and further increases the contact area between the sealing layer 3 and the first sealing shell 1 and the second sealing shell 4, thereby enhancing the overall sealing performance.

[0036] In some embodiments, reference Figure 2 The sealing layer 3 includes a first sealing layer 31 , and the first sealing layer 31 is located between the annular side portion and the first sealing shell 1 .

[0037] Among them, optionally, the first sealing layer 31 is made of sealant, which is initially in liquid state. The sealant is applied to the contact surface between the annular side portion 41 and the first sealing shell 1, and the first sealing shell 1 and the second sealing shell 4 are squeezed toward each other so that the sealant is evenly spread on the contact surface between the annular side portion 41 and the first sealing shell 1. After standing, it solidifies to form the first sealing layer 31.

[0038] In some embodiments, a surface of the first sealing layer 31 facing away from the annular boss 11 is flush with the outer surfaces of the first sealing shell 1 and the second sealing shell 4 .

[0039] Among them, during the process of making the first sealing layer 31 with sealant, squeezing the first sealing shell 1 and the second sealing shell 4 towards each other will cause the liquid sealant to overflow on the outer surfaces of the first sealing shell 1 and the second sealing shell 4, resulting in an uneven outer surface. At this time, a scraper is used to scrape off the overflowing sealant, so that the first sealing layer 31 can be flush with the outer surfaces of the first sealing shell 1 and the second sealing shell 4, maintaining the overall beauty.

[0040] In some embodiments, reference Figure 1 and Figure 2 The sealing layer 3 includes a second sealing layer 32 , and the second sealing layer 32 is located between the inner wall of the annular side portion 41 and the outer wall of the annular boss 11 .

[0041] Among them, optionally, the second sealing layer 32 is a sealing tape, which is wrapped around the outer side of the annular boss 11, and the first sealing shell 1 and the second sealing shell 4 are pressed toward each other, so that the first sealing shell 1 and the second sealing shell 4 are connected together, and the sealing tape is used to achieve sealing. Optionally, on the basis of the first sealing layer 31, the second sealing layer 32 is further added, thereby increasing the contact area between the sealing layer 3 and the first sealing shell 1 and the second sealing shell 4, thereby enhancing the overall sealing performance.

[0042] In some embodiments, reference Figure 2 The sealing layer 3 includes a third sealing layer 33 , and the third sealing layer 33 is located between the annular boss 11 and the second sealing shell 4 .

[0043] Among them, optionally, the third sealing layer 33 is made of the same material as the first sealing layer 31, and is also made of sealant. The sealant is applied to the top surface of the annular boss 11, and the first sealing shell 1 and the second sealing shell 4 are pressed toward each other, so that the first sealing shell 1 and the second sealing shell 4 are connected together, and the sealing is achieved by the sealing tape. Optionally, on the basis of the first sealing layer 31 and the second sealing layer 32, the third sealing layer 33 is further added, thereby further increasing the contact area between the sealing layer 3 and the first sealing shell 1 and the second sealing shell 4, thereby enhancing the overall sealing performance.

[0044] In some embodiments, the sealing layer 3 is an adhesive layer.

[0045] The adhesive layer is a solid sealing adhesive layer, which is sleeved on the annular boss 11 or placed on the top surface of the annular boss 11. The second sealing shell 4 covers the annular boss 11, and the first sealing shell 1 and the second sealing shell 4 are pressed toward each other to make them bonded to achieve sealing.

[0046] In some embodiments, reference Figure 1-Figure 3At least one first electronic component 21 is provided on one side of the bottom wall of the accommodating cavity 5 of the circuit board 2, and at least one first avoidance hole 12 is provided on the bottom wall of the accommodating cavity 5. Each first electronic component 21 is accommodated in a first avoidance hole 12. When the circuit board assembly is subjected to external pressure, each first electronic component 21 accommodated in a first avoidance hole 12 will not be bent or deformed, or even detached from the circuit board 2, thereby reducing the probability of damage to the electronic parts.

[0047] In some embodiments, at least one second electronic component 22 is provided on one side of the circuit board 2 facing the second sealing shell 4, and the second sealing shell 4 is provided with at least one second avoidance hole 42. Each second electronic component 22 is accommodated in a second avoidance hole 42. When the circuit board assembly is subjected to external pressure, each second electronic component 22 accommodated in a second avoidance hole 42 will not bend or deform, or even detach from the circuit board 2, thereby reducing the probability of damage to the electronic parts.

[0048] The above description is only a partial or preferred embodiment of the present invention. Neither the text nor the drawings can limit the scope of protection of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the overall concept of the present invention, or direct / indirect application in other related technical fields are included in the scope of protection of the present invention.

Claims

1. A circuit board assembly, characterized in that: include: A first sealing shell is provided with a containing cavity; A circuit board is adapted to the accommodating cavity, and the circuit board is accommodated in the accommodating cavity; A second sealing shell, connected to the first sealing shell and covering the accommodating cavity; The sealing layer is used to seal the gap between the first sealing shell and the second sealing shell.

2. The circuit board assembly according to claim 1, characterized in that: A side of the first sealing shell facing the second sealing shell is provided with an annular boss, and the accommodating cavity is formed in the annular boss; An annular side portion is protrudingly provided on one side of the second sealing shell facing the first sealing shell. The annular side portion is arranged along the edge of the second sealing shell and is located at the periphery of the annular boss.

3. The circuit board assembly according to claim 2, characterized in that: The sealing layer includes a first sealing layer located between the annular side portion and the first sealing shell.

4. The circuit board assembly according to claim 3, characterized in that: A surface of the first sealing layer facing away from the annular boss is flush with the outer surfaces of the first sealing shell and the second sealing shell.

5. The circuit board assembly according to claim 2, characterized in that: The sealing layer includes a second sealing layer, and the second sealing layer is located between the inner wall of the annular side portion and the outer wall of the annular boss.

6. The circuit board assembly according to claim 2, characterized in that: The sealing layer includes a third sealing layer, and the third sealing layer is located between the annular boss and the second sealing shell.

7. The circuit board assembly according to any one of claims 1 to 6, characterized in that: The sealing layer is an adhesive layer.

8. The circuit board assembly according to claim 1, wherein: At least one first electronic component is disposed on one side of the circuit board facing the bottom wall of the accommodating cavity. The bottom wall of the accommodating cavity is provided with at least one first avoidance hole. Each of the first electronic components is accommodated in one of the first avoidance holes.

9. The circuit board assembly according to claim 1, characterized in that: At least one second electronic component is disposed on a side of the circuit board facing the second sealed shell. The second sealed shell is provided with at least one second avoidance hole. Each of the second electronic components is accommodated in one of the second avoidance holes.

Images