Electronic equipment

Abstract

The utility model relates to electronic equipment which comprises a shell, a screen, a heating device, a heat conduction assembly and a heat conduction connecting piece, the shell comprises a middle frame and a rear cover, the screen is installed in the middle frame, the rear cover and the screen are distributed on the two sides of the middle frame in the thickness direction of the electronic equipment, and the heating device is located in a containing cavity of the electronic equipment. The heat conduction assembly is connected with the heating device and connected with the screen and / or the rear cover. The heat conduction connecting piece is connected with at least part of the heat conduction assembly, so that the heat dissipation channels formed by the heat conduction assembly are connected in parallel, heat of the heating device can be uniformly conducted to each heat dissipation surface of the electronic equipment, the temperature uniformity of each heat dissipation surface of the electronic equipment is improved, the risk of local high temperature of the electronic equipment is reduced, and the service life of the electronic equipment is prolonged. And the holding experience of the user is improved. Meanwhile, thermal resistance can be reduced, heat dissipation efficiency is improved, and the service life of the heating device and the electronic equipment is prolonged.

Description

Technical Field

[0001] The present application relates to the technical field of electronic products, and in particular to an electronic device. Background Art

[0002] The electronic device includes a shell and a screen installed on the shell, and the shell includes a middle frame and a back cover, wherein the middle frame, the back cover and the screen form a housing cavity of the electronic device for accommodating electronic devices. During the operation of the electronic device, some electronic devices in the housing cavity will generate heat, and the heat is mainly conducted to the back cover and the screen through the heat-conducting components, and then dissipated into the air through the back cover and the screen to prevent the temperature inside the electronic device from being too high. Because electronic devices need to be held in the hand or worn for a long time, it is extremely important to control the surface temperature of their casing. In different usage scenarios of electronic devices, the heat generated in different areas of the electronic devices is also different, and the heat conducted to the back cover and the screen through the heat-conducting components is also different, resulting in different temperatures of the back cover and the screen, causing local high temperatures, which makes the user experience poor when using the electronic device. Utility Model Content

[0003] In view of this, the present application provides an electronic device to solve the technical problem in the prior art that different areas of electronic devices generate different amounts of heat in different usage scenarios, resulting in local high temperatures in the electronic device, affecting the user experience.

[0004] The present application provides an electronic device, which includes: a shell, the shell includes a middle frame and a back cover; a screen, the screen is installed on the middle frame, and the back cover and the screen are distributed on both sides of the middle frame along the thickness direction of the electronic device; a heating device, the heating device is located in a receiving cavity of the electronic device; at least one heat-conducting component, the heat-conducting component is connected to the heating device and to the screen and / or the back cover; wherein the electronic device also includes a heat-conducting connector, the heat-conducting connector connects at least part of the heat-conducting component.

[0005] In this embodiment, the heat-conducting connector connects at least part of the heat-conducting components of the device. When the heat-conducting components include a first heat-conducting component and a second heat-conducting component, the heat-conducting connector connects the first heat-conducting component and the second heat-conducting component, so that the heat of the first heat-conducting component can be transferred to the second heat-conducting component through the heat-conducting connector, and the heat of the second heat-conducting component can also be transferred to the first heat-conducting component, so that the heat of the heating device can be transferred to each heat dissipation surface of the electronic device (such as the screen and the back cover) more evenly, improving the temperature uniformity of each heat dissipation surface of the electronic device, reducing the risk of local high temperature in the electronic device, and improving the user's holding experience. At the same time, when multiple heat-conducting components are connected through the heat-conducting connector, the heat dissipation channels formed by each heat-conducting component are connected in parallel, thereby reducing thermal resistance, improving heat dissipation efficiency, and extending the service life of the heating device and the electronic device.

[0006] In a specific embodiment, the thermally conductive connecting member includes a first thermally conductive connecting section, and the first thermally conductive connecting section connects the thermally conductive components distributed along the thickness direction of the electronic device;

[0007] The first heat-conducting connection section extends along the thickness direction of the electronic device, or the first heat-conducting connection section is inclined relative to the thickness direction of the electronic device, or the first heat-conducting connection section is a bent structure.

[0008] In this embodiment, the first thermally conductive connecting section connects the thermally conductive components distributed along the thickness direction of the electronic device, so that heat can be conducted between the thermally conductive components distributed along the thickness direction of the electronic device, thereby making the heat conducted from the heating device to the screen and the back cover more uniform, thereby reducing the temperature difference between the screen and the back cover.

[0009] In a specific embodiment, the thermally conductive connecting member further comprises a second thermally conductive connecting section connected to the first thermally conductive connecting section, and the second thermally conductive connecting section connects the thermally conductive components distributed along the length direction of the electronic device;

[0010] The second heat-conducting connecting section extends along the length direction of the electronic device, or the second heat-conducting connecting section is inclined relative to the length direction of the electronic device, or the second heat-conducting connecting section is a bent structure.

[0011] In this embodiment, the first heat-conducting connecting section connects the heat-conducting components distributed along the thickness direction of the electronic device, and the second heat-conducting connecting section connects the heat-conducting components distributed along the length direction of the electronic device, that is, the heat-conducting connecting piece can connect the heat-conducting components located in the first shell, and can also connect the heat-conducting components located in the second shell, so that the heat emitted by the heating device can be conducted to the first shell and the second shell distributed along the length direction of the electronic device, and can also be conducted to the screen and the back cover distributed along the thickness direction of the electronic device, so that the temperature difference between the screen and the back cover of the electronic device is small, and the temperature difference at various locations of the screen along the length direction is small, and the temperature difference at various locations of the back cover along the length direction is small, that is, the heat of the heating device can be evenly distributed on various heat dissipation surfaces and various positions of the heat dissipation surfaces of the electronic device, further improving the heat dissipation effect.

[0012] In a specific embodiment, the housing includes a first housing and a second housing distributed along the length direction of the electronic device, and the electronic device further includes a rotating shaft, and the first housing and the second housing are connected to the rotating shaft and can rotate relative to each other;

[0013] The heat-conducting connector connects the heat-conducting component in the first shell and the heat-conducting component in the second shell.

[0014] In this embodiment, the thermally conductive connector can connect the various thermally conductive components located in the first shell, and can also connect the various thermally conductive components located in the second shell, so that the heat emitted by the heating device can be conducted to the first shell and the second shell distributed along the length direction of the electronic device, and can also be conducted to the screen and the back cover distributed along the thickness direction of the electronic device, so that the temperature difference between the screen and the back cover of the electronic device is small, and the temperature difference at various locations of the screen along the length direction is small, and the temperature difference at various locations of the back cover along the length direction is small, that is, the heat of the heating device can be evenly distributed on various heat dissipation surfaces and various positions of the heat dissipation surfaces of the electronic device, further improving the heat dissipation effect.

[0015] In a specific embodiment, the electronic device comprises at least a first heat-conducting component, a second heat-conducting component and a third heat-conducting component, a portion of the first heat-conducting component is located in the first shell, and a portion thereof extends into the second shell, a portion of the second heat-conducting component is located in the first shell, and a portion thereof extends into the second shell, and the third heat-conducting component is located in the second shell;

[0016] The heat-conducting connector connects the first heat-conducting component, the second heat-conducting component and the third heat-conducting component.

[0017] In this embodiment, the first heat-conducting component is connected to the screen, and at least part of the first heat-conducting component extends to the other side of the rotating shaft along the length direction of the electronic device, that is, part of the first heat-conducting component is located in the first shell, and the other part is located in the second shell. The second heat-conducting component is connected to the back cover, and at least part of the second heat-conducting component extends to the other side of the rotating shaft along the length direction of the electronic device, that is, part of the second heat-conducting component is located in the first shell, and the other part is located in the second shell. The third heat-conducting component is located in the second shell and connected to the back cover and / or the screen, so that the first heat-conducting component, the second heat-conducting component and the third heat-conducting component are connected through the heat-conducting connector.

[0018] In a specific embodiment, the thermally conductive connecting member is located in the first shell or the second shell.

[0019] In this embodiment, the heat-conducting connector is located on one side of the rotating shaft, so as to facilitate the bending of the heat-conducting connector and save space. The heat-conducting connector and the heating device can be located in the first shell, or the heat-conducting connector can be located in the second shell and the heating device can be located in the first shell.

[0020] In a specific embodiment, the heat-conducting component includes one or more heat-conducting parts, and the heat-conducting connecting part is connected to any of the heat-conducting parts of the heat-conducting component.

[0021] In this embodiment, the first heat-conducting component may include one or more heat-conducting parts, and the second heat-conducting component may include one or more heat-conducting parts. When the first heat-conducting component and the second heat-conducting component are connected by a heat-conducting connector, the heat-conducting connector can be connected to any heat-conducting part of the first heat-conducting component and any heat-conducting part of the second heat-conducting component.

[0022] In a specific embodiment, the electronic device further includes a battery and a mainboard, the mainboard has a main chip, and the main chip is the heating device; the thermal conductive connector is also connected to the battery.

[0023] In this embodiment, the thermally conductive connector is connected to the battery, that is, the thermally conductive connector can also transfer the heat of the main chip to the battery, so that part of the heat is stored and dissipated through the battery, further improving the heat dissipation effect of the electronic device.

[0024] In a specific embodiment, a reinforcement portion is further provided in the bending region of the thermally conductive connector.

[0025] In this embodiment, the heat-conducting connector may also be provided with a reinforcement portion, which is located in the bending region of the heat-conducting connector, that is, at the connection between the first connection segment, the second connection segment, and the fourth connection segment and the third connection segment and the fifth connection segment. The reinforcement portion can protect the bending region of the heat-conducting connector and prevent the bending region of the heat-conducting connector from breaking. In addition, during the assembly of the heat-conducting connector, the reinforcement portion can prevent other components from wearing the bending region and causing damage to the bending region, thereby extending the service life of the heat-conducting connector.

[0026] In a specific embodiment, the thermally conductive connector is a C-shaped structure, a Z-shaped structure, or a Y-shaped structure.

[0027] In this embodiment, along the thickness direction of the electronic device, the first connecting section is attached to and connected with the bottom surface of the second heat conducting member, and the second connecting section is attached to and connected with the bottom surface of the third heat conducting member. The first connecting section and the second connecting section are aligned along the length direction of the electronic device, that is, the heat conducting connecting member in this embodiment is a C-shaped structure.

[0028] Along the thickness direction of the electronic device, the first connecting section is attached to and connected with the top surface of the second heat conducting member, and the second connecting section is attached to and connected with the bottom surface of the third heat conducting member. The first connecting section and the second connecting section are staggered with each other along the length direction of the electronic device, that is, the heat conducting connecting member in this embodiment is a Z-shaped structure.

[0029] Along the thickness direction of the electronic device, the first connecting section is attached to and connected with the top surface of the second heat conducting member, the fourth connecting section is attached to and connected with the bottom surface of the second heat conducting member, and the second connecting section is attached to and connected with the top surface of the third heat conducting member. The first connecting section and the second connecting section are staggered with each other along the length direction of the electronic device, and the first connecting section and the fourth connecting section are aligned along the length direction of the electronic device, that is, the heat conducting connecting member in this embodiment is a Y-shaped structure.

[0030] In a specific embodiment, the thermally conductive connector is an integrated structure or a split structure.

[0031] In this embodiment, each connecting section of the heat-conducting connector can be an integrated structure or a split structure, and the materials of each connecting section can be the same or different. The specific structure and material of the heat-conducting connector can be selected according to actual use, thereby reducing the difficulty of assembly and improving the applicability of the heat-conducting connector.

[0032] In a specific embodiment, the thermally conductive connector is a film or sheet material, and can be bent during the assembly of the electronic device.

[0033] In this embodiment, the thermally conductive connector may be a film material or a sheet material. When the thermally conductive connector is a film material or a sheet material, a graphite sheet, graphene, or a boron nitride heat dissipation film may be selected. Graphite sheets, graphene, and boron nitride heat dissipation films all have good thermal conductivity, which can improve the thermal conductivity efficiency between the thermally conductive connector and the thermally conductive component, and improve the heat dissipation effect of the electronic device. At the same time, graphite sheets, graphene, and boron nitride heat dissipation films all have good flexibility. The thermally conductive connector may be a planar structure before assembly, which is convenient for storage and transportation, reduces costs, and is easy to bend during the assembly process, so as to connect multiple thermally conductive components and reduce the difficulty of assembly.

[0034] In a specific embodiment, the thermally conductive connector is a rigid structure.

[0035] In this embodiment, the heat-conducting connector can also be made of rigid material. When the heat-conducting connector is made of rigid material, copper foil can be used. Copper foil has good thermal conductivity, which can improve the thermal conductivity between the heat-conducting connector and the heat-conducting component, and improve the heat dissipation effect of the electronic device. At the same time, the heat-conducting connector made of copper foil material is first molded before assembly so that it can connect multiple heat-conducting components, thereby reducing assembly steps and improving assembly efficiency. The copper foil and the rigid heat dissipation bracket have high strength and stability, which can support the electronic device, further improve the strength of the electronic device, and extend the service life of the heat-conducting connector.

[0036] In a specific embodiment, the thermally conductive connector includes one or more of a two-phase heat dissipation component, a carbon material, and a liquid cooling component.

[0037] In this embodiment, the heat-conducting connector may also include one or more of a two-phase heat-dissipating component, a carbon material, and a liquid cooling component. When a two-phase heat-dissipating component, a carbon material, or a liquid cooling component is selected, it has a high thermal conductivity coefficient, can improve the heat-conducting efficiency between the heat-conducting component and the heat-conducting connector, and has good flexibility, and can be bent and formed to reduce the difficulty of assembly, and can be spliced ​​in multiple pieces, so that the heat-conducting connector can be a composite structure of multiple materials to improve the applicability of the heat-conducting connector.

[0038] In a specific embodiment, the thermally conductive connecting member includes one or more of a graphite sheet, a graphene film, a boron carbide heat dissipation film, a temperature averaging plate, and a copper foil.

[0039] In this embodiment, the thermally conductive connector can also be a composite structure of both rigid and flexible materials. In this embodiment, the thermally conductive connector can include a variety of materials such as graphite sheets, graphene films, boron carbide heat dissipation films, temperature averaging plates, and copper foils to improve the applicability of the thermally conductive connector. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1A schematic diagram of the structure of an electronic device provided in this application in a specific embodiment;

[0041] Figure 2 A partial cross-sectional view of an electronic device in a specific embodiment;

[0042] Figure 3 for Figure 1 A partial cross-sectional view of the electronic device in another specific embodiment;

[0043] Figure 4 for Figure 3 A schematic diagram of the connection structure of the middle heat-conducting connecting member, the second heat-conducting member and the third heat-conducting member in a specific embodiment;

[0044] Figure 5 for Figure 3 A schematic diagram of the connection structure of the middle heat-conducting connecting member, the second heat-conducting member and the third heat-conducting member in another specific embodiment;

[0045] Figure 6 for Figure 3 A schematic diagram of the connection structure between the middle heat-conducting connector and the second heat-conducting component and the third heat-conducting component in another specific embodiment;

[0046] Figure 7 for Figure 3 A schematic diagram of the connection structure between the middle heat-conducting connector and the second heat-conducting component and the third heat-conducting component in another specific embodiment;

[0047] Figure 8 for Figure 1 A partial cross-sectional view of the electronic device in yet another specific embodiment;

[0048] Fig. 9 for Figure 8 A partial enlarged view of part I;

[0049] Fig.10 for Fig.10 for Figure 1 An exploded view of the electronic device in yet another specific embodiment;

[0050] Fig.11 for Fig.11 for Figure 1 A partial cross-sectional view of the electronic device in yet another specific embodiment;

[0051] Fig.12 for Fig.12 for Figure 1 A partial cross-sectional view of the electronic device in yet another specific embodiment;

[0052] Fig.13 for Fig.11A schematic diagram of the connection structure of the middle heat-conducting connecting member, the second heat-conducting member and the third heat-conducting member in a specific embodiment;

[0053] Fig.14 for Fig.11 A schematic diagram of the connection structure of the middle heat-conducting connecting member, the second heat-conducting member and the third heat-conducting member in another specific embodiment;

[0054] Fig.15 for Fig.11 A schematic diagram of the connection structure between the middle heat-conducting connector and the second heat-conducting component and the third heat-conducting component in another specific embodiment;

[0055] Fig.16 for Fig.11 A schematic structural diagram of a heat-conducting connecting member in a specific embodiment;

[0056] Fig.17 for Fig.16 Rear view of

[0057] Fig.18 for Fig.16 A front view of

[0058] Fig.19 It is a schematic diagram of the connection structure between the heat-conducting connecting member and the second heat-conducting member and the third heat-conducting member in a specific embodiment;

[0059] Fig. 20 is a schematic diagram of a connection structure between a heat-conducting connecting member and a second heat-conducting member and a third heat-conducting member in another specific embodiment;

[0060] Fig.21 The figure is a schematic diagram of the connection structure between the heat-conducting connecting member, the second heat-conducting member and the third heat-conducting member in another specific embodiment.

[0061] Description of reference numerals:

[0062] 1- Electronic equipment;

[0063] 11- housing;

[0064] 111-accommodating chamber;

[0065] 112- rear cover;

[0066] 12-heating device;

[0067] 121-Main chip

[0068] 13-middle frame;

[0069] 14- thermally conductive connector;

[0070] 141-first connecting section;

[0071] 142- second connecting section;

[0072] 143-third connecting section;

[0073] 144- fourth connecting section;

[0074] 145-fifth connecting section;

[0075] 15-Screen;

[0076] 161-a first heat conducting component;

[0077] 161a-first heat conducting member;

[0078] 161b - second heat conducting member;

[0079] 162- second heat conducting component;

[0080] 162a-third heat conducting member;

[0081] 162b- fourth heat conducting member;

[0082] 163-third heat conducting component;

[0083] 17- rotating shaft;

[0084] 18-shielding cover;

[0085] 191-first thermal conductive gel;

[0086] 192-second thermal conductive gel;

[0087] 20-battery;

[0088] 21- ferrite beads;

[0089] 22- Mainboard;

[0090] 23- RF circuit board;

[0091] 24-Stand;

[0092] 25-Equalizing plate.

[0093] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application. DETAILED DESCRIPTION

[0094] In order to better understand the technical solution of the present application, the embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0095] In a specific embodiment, the present application is further described in detail below through specific embodiments and in conjunction with the accompanying drawings.

[0096] The terms used in the embodiments of the present application are only for the purpose of describing specific embodiments, and are not intended to limit the present application. The singular forms of "a", "said" and "the" used in the embodiments of the present application and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings.

[0097] It should be understood that the term "and / or" used in this article is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0098] It should be noted that the directional words such as "upper", "lower", "left", and "right" described in the embodiments of the present application are described at the angles shown in the accompanying drawings and should not be understood as limiting the embodiments of the present application. In addition, in the context, it is also necessary to understand that when it is mentioned that an element is connected to another element "upper" or "lower", it can not only be directly connected to another element "upper" or "lower", but also indirectly connected to another element "upper" or "lower" through an intermediate element.

[0099] like Figure 1 As shown, Figure 1 1 is a schematic diagram of the structure of an electronic device 1 in a specific embodiment. The electronic device includes, for example, a mobile phone, a tablet computer, a personal digital assistant (PDA), a laptop computer, a car computer, a foldable display device, a foldable display screen, a wearable device, and any other device with a foldable screen function. The embodiment of the present application does not impose any special restrictions on the specific form of the above-mentioned electronic device. For the convenience of explanation, the following description is made by taking the electronic device as an example of a mobile phone. The electronic device 1 of the present application is introduced in the following specific embodiment.

[0100] Figure 1 The electronic device 1 shown includes a housing 11 and a screen 15 mounted on the housing 11. Figure 2 As shown, Figure 2 It is a partial cross-sectional view of an electronic device in a specific embodiment, wherein the housing 11 includes a middle frame 13 and a back cover 112, and the screen 15 and the back cover 112 are arranged opposite to each other along the thickness direction Z of the electronic device 1. The screen 15 and the back cover 112 are mounted on the middle frame 13, and the middle frame 13, the back cover 112 and the screen 15 form a receiving cavity 111 of the electronic device 1, and the receiving cavity 111 is used to receive electronic devices such as a mainboard 22, a radio frequency circuit board 23, and a battery.

[0101] In a specific embodiment, Figure 2As shown, in the electronic device 1, the screen 15 is installed on the middle frame 13, the mainboard 22 is connected to the shielding cover 18, and the shielding cover 18 is located on the outside of the main chip 121, which is used to reduce the interference of other electronic devices on the main chip 121. The RF circuit board 23 is located on the side of the mainboard 22 away from the shielding cover 18, and the RF circuit board 23 is connected to the mainboard 22 through the ferrite bead 21, and there is a gap between the RF circuit board 23 and the mainboard 22. The RF circuit board 23 is installed on the back cover 112 through the bracket 24.

[0102] During the operation of the electronic device 1, the main chip 121 on the mainboard 22 will generate heat, and the battery 20 will also generate heat during charging. It is necessary to dissipate the heat generated by the main chip 121 and other heating devices 12 during operation into the air to prevent the temperature inside the electronic device 1 from being too high. Normally, the heat of the heating device 12 is first conducted to the middle frame 13, the back cover 112 and the screen 15 of the electronic device 1, and then dissipated into the air through the middle frame 13, the back cover 112 and the screen 15. Since the area of ​​the back cover 112 and the screen 15 is larger than that of the middle frame 13, the heat is mainly dissipated into the air through the back cover 112 and the screen 15, that is, the back cover 112 and the screen 15 are the two heat dissipation surfaces of the electronic device 1.

[0103] like Figure 2 In the illustrated embodiment, the main chip 121 and the screen 15 dissipate heat through a first heat dissipation channel, and the main chip 121 and the back cover 112 dissipate heat through a second heat dissipation channel, that is, part of the heat generated by the main chip 121 is conducted to the screen 15 through the first heat dissipation channel, and part of the heat is conducted to the back cover 112 through the second heat dissipation channel. Figure 2 In the illustrated embodiment, the first heat dissipation channel includes a first thermally conductive gel 191, a shielding cover 18, a second thermally conductive gel 192, a temperature homogenizing plate 25, and a graphene film; the second heat dissipation channel includes a main board 22, a gap between the main board 22 and the RF circuit board 23, the RF circuit board 23, a bracket 24, and a graphene film.

[0104] In different usage scenarios of the electronic device 1, the heat generated by the heating device 12 (such as the main chip 121) is different, and the heat generated in different areas is also different. For example, in the game scenario, along the thickness direction Z of the electronic device 1, the heat on the side of the main chip 121 facing the screen 15 is greater, that is, the heat conducted from the main chip 121 to the screen 15 through the first heat dissipation channel is greater than the heat conducted to the back cover 112 through the second heat dissipation channel. In this scenario, the temperature of the screen 15 is higher than the temperature of the back cover 112, that is, the screen 15 forms a local high temperature. In the video call scenario, along the thickness direction Z of the electronic device 1, the heat on the side of the main chip 121 facing the back cover 112 is greater, that is, the heat conducted from the main chip 121 to the back cover 112 through the second heat dissipation channel is greater than the heat conducted to the screen 15 through the first heat dissipation channel. In this scenario, the temperature of the back cover 112 is higher than the temperature of the screen 15, that is, the back cover 112 forms a local high temperature. In the above two usage scenarios, due to the presence of local high temperatures, the user experience when using the electronic device 1 is poor.

[0105] The embodiment of the present application connects at least part of the heat dissipation channels of the electronic device 1 so that the heat of the heating device is transferred to the heat dissipation surface of the electronic device 1 through each heat dissipation channel, so that the heat of the heating device 12 can be redistributed through the connected heat dissipation channels, thereby improving the uniformity of the heat transferred to each heat dissipation surface, making the temperature difference of each heat dissipation surface of the electronic device 1 smaller, and reducing the risk of forming local high temperature. Among them, the heat dissipation surface of the electronic device 1 includes at least part of the surface visible from the appearance of the electronic device 1, and the surface connected to the heat conductive component 16 is the heat dissipation surface described above. The surface visible from the appearance of the electronic device includes two surfaces of the electronic device 1 along the thickness direction Z and each side surface of the electronic device 1.

[0106] The following is a detailed description of the solution of the present application in conjunction with the accompanying drawings. The present application embodiment provides an electronic device 1, such as Figure 3 As shown, Figure 3 for Figure 1 FIG. 1 is a partial cross-sectional view of an electronic device 1 in another specific embodiment, wherein the electronic device 1 comprises a middle frame 13, a rear cover 112, a screen 15 and a heating device 12, wherein the middle frame 13, the rear cover 112 and the screen 15 form a heat dissipation surface of the electronic device 1. Since the rear cover 112 and the screen 15 have a large area, the heat dissipation surface in this embodiment may be the rear cover 112 and the screen 15. The heating device 12 is located in a receiving cavity 111 surrounded by the housing 11 and the screen 15.

[0107] The electronic device 1 may further include at least two heat-conducting components 16 respectively connected to the screen 15 and the back cover 112, that is, the electronic device 1 includes at least a first heat-conducting component 161 and a second heat-conducting component 162, wherein the screen 15 is connected to the heating device 12 via the first heat-conducting component 161, and the back cover 112 is connected to the heating device 12 via the second heat-conducting component 162, so that the heat of the heating device 12 can be conducted to the screen 15 via the first heat-conducting component 161, and can also be conducted to the back cover 112 via the second heat-conducting component 162.

[0108] In this embodiment, the electronic device 1 further includes a heat-conducting connector 14, which connects at least part of the heat-conducting components of the device. When the heat-conducting components include the first heat-conducting component 161 and the second heat-conducting component 162, the heat-conducting connector 14 connects the first heat-conducting component 161 and the second heat-conducting component 162, so that the heat of the first heat-conducting component 161 can be transferred to the second heat-conducting component 162 through the heat-conducting connector 14, and the heat of the second heat-conducting component 162 can also be transferred to the first heat-conducting component 161, so that the heat of the heating device 12 can be transferred to each heat dissipation surface of the electronic device 1 (such as the screen 15 and the back cover 112) more evenly, improve the temperature uniformity of each heat dissipation surface of the electronic device 1, reduce the risk of local high temperature in the electronic device 1, and improve the user's holding experience. At the same time, when multiple heat-conducting components are connected through the heat-conducting connector 14, the heat dissipation channels formed by each heat-conducting component are connected in parallel, thereby reducing thermal resistance, improving heat dissipation efficiency, and extending the service life of the heating device 12 and the electronic device 1.

[0109] In a specific embodiment, the first heat-conducting component 161 may include one or more heat-conducting parts, and the second heat-conducting component 162 may include one or more heat-conducting parts. When the first heat-conducting component 161 and the second heat-conducting component 162 are connected through the heat-conducting connector 14, the heat-conducting connector 14 can be connected to any heat-conducting part of the first heat-conducting component 161 and any heat-conducting part of the second heat-conducting component 162.

[0110] like Figure 3 In the illustrated embodiment, the first heat-conducting component 161 may include a first heat-conducting member 161a and a second heat-conducting member 161b, wherein the first heat-conducting member 161a is connected to the screen 15, and the second heat-conducting member 161b is connected to the first heat-conducting member 161a and is located on a side of the first heat-conducting member 161a away from the screen 15. The main chip 121 is connected to the shielding cover 18 via a first heat-conducting gel 191, and the shielding cover 18 is directly or indirectly connected to the second heat-conducting member 161b via a second heat-conducting gel 192. Figure 3In the illustrated embodiment, the second heat-conducting component 162 includes a third heat-conducting member 162 a . The second heat-conducting member 161 b of the first heat-conducting component 161 is connected to the third heat-conducting member 162 a of the second heat-conducting component 162 via a heat-conducting connector 14 .

[0111] Figure 3 In the embodiment shown, the heat of the main chip 121 is conducted to the screen 15 through the first heat dissipation channel and to the back cover 112 through the second heat dissipation channel. The first heat dissipation channel includes the first heat conductive gel 191, the shielding cover 18, the second heat conductive gel 192, the heat conductive connector 14, the second heat conductive connector 161b, and the first heat conductive connector 161a. The second heat dissipation channel includes the main board 22, the ferrite beads 21, the RF circuit board 23, the third heat conductive connector 162a, the heat conductive connector 14, and the bracket 24. Therefore, the first heat dissipation channel and the second heat dissipation channel are connected in parallel through the heat conductive connector 14.

[0112] In a specific embodiment, the first heat conductor 161a can be a two-phase heat dissipation component, such as a heat pipe, a temperature equalizer, etc., or a carbon material, such as graphene, graphite, etc., or a liquid cooling component. The second heat conductor 161b can be a two-phase heat dissipation component, such as a heat pipe, a temperature equalizer, etc., or a carbon material, such as graphene, graphite, etc., or a liquid cooling component. The third heat conductor 162a can be a two-phase heat dissipation component, such as a heat pipe, a temperature equalizer, etc., or a carbon material, such as graphene, graphite, etc., or a liquid cooling component. Therefore, the embodiment of the present application does not limit the specific materials of the first heat conductor 161a, the second heat conductor 161b and the third heat conductor 162a.

[0113] In a specific embodiment, the thermally conductive connector 14 includes a first thermally conductive connecting section, which connects the thermally conductive components distributed along the thickness direction Z of the electronic device 1, so that heat can be conducted between the thermally conductive components distributed along the thickness direction Z of the electronic device 1, thereby making the heat conducted from the heating device 12 to the screen 15 and the back cover 112 more uniform, thereby reducing the temperature difference between the screen 15 and the back cover 112.

[0114] The first thermally conductive connection section is configured in at least one of the following three forms: the first thermally conductive connection section extends along the thickness direction Z of the electronic device 1; the second type: the first thermally conductive connection section is inclined relative to the thickness direction Z of the electronic device 1 (not shown in the figure); the third type, the first thermally conductive connection section is a bent structure (not shown in the figure).

[0115] The following describes in detail possible implementations of the thermally conductive connector. Figure 4 As shown, Figure 4 for Figure 3A schematic diagram of the connection structure of the heat-conducting connector 14 with the second heat-conducting component 161b and the third heat-conducting component 162a in a specific embodiment, the heat-conducting connector 14 includes a first connecting section 141, a second connecting section 142 and a third connecting section 143 connecting the two, wherein the first connecting section 141 is attached to and connected with the first heat-conducting component, and the second connecting section 142 is attached to and connected with the second heat-conducting component. The first connecting section 141 and the second connecting section 142 are parallel to each other, and the third connecting section 143 is perpendicular to and connected to the two. The third connecting section 143 in this embodiment is a possible implementation of the above-mentioned first heat-conducting connecting section.

[0116] Among them, the first connecting section 141 can be a structure with the same area as the second heat-conducting member 161b of the first heat-conducting component, and the second connecting section 142 can be a structure with the same area as the third heat-conducting member 162a of the second heat-conducting component. The connection area between the heat-conducting connector 14 and the first heat-conducting component and the second heat-conducting component in this embodiment is large, which improves the connection reliability and helps to conduct heat to the first heat-conducting component and the second heat-conducting component. And along the thickness direction of the electronic device 1, the first connecting section 141 can be attached to and connected with the top surface or bottom surface of the second heat-conducting member 161b in the first heat-conducting component, and / or, the second connecting section 142 can be attached to and connected with the top surface or bottom surface of the third heat-conducting member 162a in the second heat-conducting component.

[0117] Figure 4 In the illustrated embodiment, along the thickness direction Z of the electronic device 1, the first connecting section 141 is attached to and connected with the bottom surface of the second heat conducting member 161b, and the second connecting section 142 is attached to and connected with the bottom surface of the third heat conducting member 162a. The first connecting section 141 and the second connecting section 142 are aligned along the length direction X of the electronic device 1, that is, the heat conducting connecting member 14 in this embodiment is a C-shaped structure.

[0118] Figure 5 In the embodiment shown, Figure 5 for Figure 3 A schematic diagram of the connection structure of the heat-conducting connector 14 with the second heat-conducting member 161b and the third heat-conducting member 162a in another specific embodiment, along the thickness direction Z of the electronic device 1, the first connecting section 141 is attached to and connected with the top surface of the second heat-conducting member 161b, and the second connecting section 142 is attached to and connected with the top surface of the third heat-conducting member 162a. The first connecting section 141 and the second connecting section 142 are aligned along the length direction X of the electronic device 1, that is, the heat-conducting connector 14 in this embodiment is a C-shaped structure.

[0119] Figure 6 In the embodiment shown, Figure 6 for Figure 3A schematic diagram of the connection structure of the heat-conducting connector 14 with the second heat-conducting connector 161b and the third heat-conducting connector 162a in another specific embodiment, along the thickness direction Z of the electronic device 1, the first connecting section 141 is attached to and connected with the bottom surface of the second heat-conducting connector 161b, and the second connecting section 142 is attached to and connected with the top surface of the third heat-conducting connector 162a. The first connecting section 141 and the second connecting section 142 are aligned along the length direction X of the electronic device 1, that is, the heat-conducting connector in this embodiment is a C-shaped structure.

[0120] Figure 7 In the embodiment shown, Figure 7 for Figure 3 A schematic diagram of the connection structure of the heat-conducting connector 14 with the second heat-conducting member 161b and the third heat-conducting member 162a in another specific embodiment, along the thickness direction of the electronic device 1, the first connecting section 141 is attached to and connected with the top surface of the second heat-conducting member 161b, and the second connecting section 142 is attached to and connected with the bottom surface of the third heat-conducting member 162a. The first connecting section 141 and the second connecting section 142 are aligned along the length direction X of the electronic device 1, that is, the heat-conducting connector 14 in this embodiment is a C-shaped structure.

[0121] In another specific embodiment, Figure 8 As shown, Figure 8 for Figure 1 A partial cross-sectional view of the electronic device 1 in another specific embodiment. The electronic device 1 includes a first heat-conducting component 161 and a second heat-conducting component 162, wherein the screen 15 is connected to the main chip 121 (heat-generating device 12) through the first heat-conducting component 161, and the back cover 112 is connected to the main chip 121 (heat-generating device 12) through the second heat-conducting component 162, so that the heat of the main chip 121 (heat-generating device 12) can be transferred to the screen 15 through the first heat-conducting component 161, and can also be transferred to the back cover 112 through the second heat-conducting component 162.

[0122] Reference Fig. 9 , Fig. 9 for Figure 8 In the partial enlarged view of part I, the first heat-conducting component 161 may include a first heat-conducting member 161a and a second heat-conducting member 161b, wherein the first heat-conducting member 161a is connected to the screen 15, and the second heat-conducting member 161b is connected to the first heat-conducting member 161a and is located on the side of the first heat-conducting member 161a away from the screen 15. The main chip 121 is located in the cavity of the shielding cover 18, and the main chip 121 is connected to the shielding cover 18 through the first heat-conducting gel 191, and the shielding cover 18 is directly or indirectly connected to the second heat-conducting member 161b through the second heat-conducting gel 192. Fig. 9In the illustrated embodiment, the second heat-conducting component 162 includes a third heat-conducting member 162 a and a fourth heat-conducting member 162 b . The fourth heat-conducting member 162 b is connected to the third heat-conducting member 162 a and is located on a side of the third heat-conducting member 162 a that is away from the screen 15 .

[0123] Fig. 9 In the illustrated embodiment, the first heat-conducting component 161 is connected to the second heat-conducting component 162 via a heat-conducting connector 14. The heat-conducting connector 14 can be connected to any heat-conducting component of the first heat-conducting component 161, and the heat-conducting connector 14 can be connected to any heat-conducting component of the second heat-conducting component 162.

[0124] Fig. 9 In the embodiment shown, the heat of the main chip 121 is conducted to the screen 15 through the first heat dissipation channel and to the back cover 112 through the second heat dissipation channel. The first heat dissipation channel includes the first heat conductive gel 191, the shielding cover 18, the second heat conductive gel 192, the heat conductive connector 14, the second heat conductive connector 161b, and the first heat conductive connector 161a. The second heat dissipation channel includes the main board 22, the ferrite beads 21, the RF circuit board 23, the third heat conductive connector 162a, the heat conductive connector 14, and the bracket 24. Therefore, the first heat dissipation channel and the second heat dissipation channel are connected in parallel through the heat conductive connector 14.

[0125] The heat-conducting connector 14 includes a first connecting section 141, a second connecting section 142 and a third connecting section 143 connecting the first and second connecting sections, wherein the first connecting section 141 is attached to and connected with the first heat-conducting component 161, and the second connecting section 142 is attached to and connected with the second heat-conducting component 162. The first connecting section 141 and the second connecting section 142 are parallel to each other, and the third connecting section 143 is perpendicular to and connected with the first and second connecting sections 141 and 142. Along the length direction X of the electronic device 1, the first connecting section 141 and the second connecting section 142 are located on both sides of the third connecting section 143, so the heat-conducting connector 14 in this embodiment can be a Z-shaped structure.

[0126] At the same time, Fig. 9 In the illustrated embodiment, the electronic device 1 further includes a battery 20, and the battery 20 and the mainboard 22 are distributed along the length direction X of the electronic device 1. In this embodiment, the third connecting section 143 of the thermally conductive connector 14 is located between the battery 20 and the mainboard 22 along the length direction X of the electronic device 1, and the second connecting section 142 of the thermally conductive connector 14 extends to the side of the battery 20 away from the screen 15 and is connected to the battery 20, that is, the thermally conductive connector 14 can also transfer the heat of the main chip 121 to the battery 20, thereby storing and dissipating a portion of the heat through the battery 20, further improving the heat dissipation effect of the electronic device 1.

[0127] In another specific embodiment, Fig.10 As shown, Fig.10 for Figure 1 1 is an exploded view of an electronic device 1 in another specific embodiment. The electronic device 1 in this embodiment includes a middle frame 13, a screen 15, a back cover 112, a heat-conducting connector 14, a heating device 12 and a heat-conducting component. The screen 15 and the back cover 112 are respectively installed on both sides of the middle frame 13 along the thickness direction Z, and the heating device 12, the heat-conducting connector 14 and the heat-conducting component are arranged in the cavity of the electronic device 1.

[0128] Fig.10 In the embodiment shown, the electronic device 1 is a foldable electronic device 1, and the screen 15 in the embodiment can be a flexible screen, which can be an active-matrix organic light-emitting diode or an active-matrix organic light-emitting diode (AMOLED) display screen. The AMOLED display screen is a self-luminous display screen and does not need to be provided with a backlight module (BLM). Therefore, when the substrate substrate in the AMOLED display screen is made of a flexible resin material, such as polyethylene terephthalate (PET), the AMOLED display screen can have a bendable property. Exemplarily, the flexible screen can also be an organic light-emitting diode (OLED) display screen, a mini organic light-emitting diode (mini organic light-emitting diode) display screen, a micro organic light-emitting diode (micro organic light-emitting diode) display screen, a micro organic light-emitting diode (micro organic light-emitting diode) display screen, a quantum dot light emitting diode (quantum dot light emitting diodes, QLED) display screen, etc.

[0129] In this embodiment, the housing includes a first housing and a second housing distributed along the length direction Z of the electronic device 1, and a rotating shaft 17 is provided between the first housing and the second housing. The rotating shaft 17 is connected to the first middle frame of the first housing and the second middle frame of the second housing, and is used to drive the first housing and the second housing to rotate relative to each other, so as to realize the folding and unfolding of the electronic device 1. The mainboard 22 and the battery 20 are installed on the middle frame 13 and are located on the same side of the rotating shaft 17 along the length direction X, that is, the mainboard 22 and the battery 20 in this embodiment can be both located in the first housing or both located in the second housing.

[0130] In this embodiment, the electronic device 1 may further include a first heat-conducting component 161, a second heat-conducting component 162, and a third heat-conducting component 163, wherein part of the first heat-conducting component 161 and part of the second heat-conducting component 162 are located in the first housing, another part of the first heat-conducting component 161 and the second heat-conducting component 162 are located in the second housing, and the third heat-conducting component 163 is located in the second housing and connected to part of the second heat-conducting component 162 located in the second housing, that is, the third heat-conducting component 163 and the first heat-conducting component 161 are distributed along the length direction X of the electronic device 1, and the third heat-conducting component 163 and the second heat-conducting component 162 are distributed along the length direction X of the electronic device 1. Therefore, the foldable electronic device 1 in this embodiment includes heat-conducting components distributed along the thickness direction Z, and may also include heat-conducting components distributed along the length X. Of course, the non-foldable electronic device 1 may also include heat-conducting components distributed along the thickness direction Z and heat-conducting components distributed along the length X, and the present application does not limit the specific structure of the electronic device 1.

[0131] In a specific embodiment, Fig.11 As shown, Fig.11 for Figure 1 A partial cross-sectional view of the electronic device 1 in another specific embodiment. The electronic device 1 in this embodiment is a foldable electronic device 1, that is, the middle frame 13 of the electronic device 1 is connected to the shaft 17, and the main board 22 and the battery 20 are located in the first shell on one side of the shaft 17. The screen 15 is connected to the main chip 121 on the main board 22 through the first heat-conducting component 161, and the back cover 112 is connected to the main chip 121 on the main board through the second heat-conducting component 162, so that the heat of the heating device 12 can be transferred to the screen 15 through the first heat-conducting component 161, and can also be transferred to the back cover 112 through the second heat-conducting component 162.

[0132] In this embodiment, the first heat-conducting component 161 includes a first heat-conducting member 161a and a second heat-conducting member 161b. The first heat-conducting member 161a is connected to the screen 15 and extends to the other side of the rotating shaft 17 along the length direction X of the electronic device 1, that is, a part of the first heat-conducting member 161a is located in the first shell, and the other part is located in the second shell. The second heat-conducting member 161b is connected to the first heat-conducting member 161a, and the second heat-conducting member 161b and the main board 22 are both located in the first shell. The main chip 121 of the main board 22 is located in the cavity of the shielding cover 18, and the main chip 121 is connected to the shielding cover 18 through the first heat-conducting gel 191, and the shielding cover 18 is directly or indirectly connected to the second heat-conducting member 161b through the second heat-conducting gel 192. The second heat-conducting component 162 in this embodiment includes a third heat-conducting member 162a and a fourth heat-conducting member 162b. Along the thickness direction Z of the electronic device 1, the third heat-conducting member 162a is connected to the RF circuit board 23 and one end of the bracket 24, and the other end of the bracket 24 is connected to the fourth heat-conducting member 162b. The third heat-conducting member 162a and the mainboard 22 are located on the same side of the rotating shaft 17 along the length direction X, that is, both are located in the first shell, and the fourth heat-conducting member 162b extends to the other side of the rotating shaft 17 along the length direction X of the electronic device 1, that is, a part of the fourth heat-conducting member 162b is located in the first shell, and the other part is located in the second shell. The part of the fourth heat-conducting member 162b located in the second shell is connected to the third heat-conducting component 163, which is located in the second shell and connected to the back cover 112 and / or the screen 15. When there is a heating device in the second shell, the third heat-conducting component 163 is connected to the heating device in the second shell.

[0133] In this embodiment, the thermally conductive connector 14 may include a first thermally conductive connector section and a second thermally conductive connector section connected to the first thermally conductive connector section, wherein the first thermally conductive connector section connects the thermally conductive components distributed along the thickness direction Z of the electronic device 1, and the second thermally conductive connector section connects the thermally conductive components distributed along the length direction of the electronic device 1, that is, the thermally conductive connector 14 can connect the thermally conductive components located in the first shell, and can also connect the thermally conductive components located in the second shell, so that the heat emitted by the heating device 12 can be conducted to the first shell and the second shell distributed along the length direction X of the electronic device 1, and can also be conducted to the screen 15 and the back cover 112 distributed along the thickness direction Z of the electronic device 1, so that the temperature difference between the screen 15 and the back cover 112 of the electronic device 1 is small, and the temperature difference at each location of the screen 15 along the length direction X is small, and the temperature difference at each location of the back cover 112 along the length direction X is small, that is, the heat of the heating device 12 can be evenly distributed on each heat dissipation surface and each position of the heat dissipation surface of the electronic device 1, further improving the heat dissipation effect.

[0134] The second heat-conducting connection section is configured in at least one of the following three forms: the first form: the second heat-conducting connection section extends along the length direction X of the electronic device 1; the second form: the second heat-conducting connection section is inclined relative to the length direction X of the electronic device 1 (not shown in the figure); the third form: the second heat-conducting connection section is a bent structure (not shown in the figure). The following describes in detail possible implementations of the heat-conducting connector.

[0135] In such Fig.11 In the illustrated embodiment, the heat-conducting connector 14 includes a first connecting section 141, a second connecting section 142, and a third connecting section 143 connecting the first and second connecting sections, wherein the first connecting section 141 is attached to and connected with the first heat-conducting component 161, and the second connecting section 142 is attached to and connected with the second heat-conducting component 162. The first connecting section 141 and the second connecting section 142 are parallel to each other, and the third connecting section 143 is perpendicular to and connected with the first and second connecting sections. In this embodiment, the third connecting section 143 may be a possible implementation of the first heat-conducting connecting section described above, and the second connecting section 142 and / or the first connecting section 141 may be a possible implementation of the second heat-conducting connecting section described above.

[0136] In this embodiment, along the length direction X of the electronic device 1, the first connecting section 141 and the second connecting section 142 are located on both sides of the third connecting section 143, and the third connecting section 143 is located on the side of the mainboard 22 away from the battery 20, and the thermal conductive connector 14 is generally a C-shaped structure. Fig.11 In the illustrated embodiment, the electronic device 1 further includes a battery 20, and the battery 20 and the mainboard 22 are distributed along the length direction X of the electronic device 1, and both are located in the first housing. In this embodiment, the third connecting section 143 of the thermally conductive connector 14 is located between the battery 20 and the mainboard 22 along the length direction X of the electronic device 1, and the second connecting section 142 of the thermally conductive connector 14 extends to the side of the battery 20 away from the screen 15, and is connected to the battery 20, that is, the thermally conductive connector 14 can also transfer the heat of the main chip 121 to the battery 20, so that a part of the heat is stored and dissipated through the battery 20, and the heat dissipation effect of the electronic device 1 is further improved.

[0137] In another specific embodiment, the heating device 12 may also be located in the second shell. In this case, the heat-conducting connector 14 may also be located in the second shell (not shown in the figure). The heat-conducting connector 14 can connect the various heat-conducting components located in the second shell, and can also connect the various heat-conducting components located in the first shell, so that the heat emitted by the heating device 12 can be conducted to the first shell and the second shell distributed along the length direction X of the electronic device 1, and can also be conducted to the screen 15 and the back cover 112 distributed along the thickness direction Z of the electronic device 1, so that the temperature difference between the screen 15 and the back cover 112 of the electronic device 1 is small, and the temperature difference at various locations of the screen 15 along the length direction X is small, and the temperature difference at various locations of the back cover 112 along the length direction X is small, that is, the heat of the heating device 12 can be evenly distributed on various heat dissipation surfaces and various positions of the heat dissipation surfaces of the electronic device 1, further improving the heat dissipation effect.

[0138] In a specific embodiment, Fig.12 As shown, Fig.12 for Figure 1 FIG. 1 is a partial cross-sectional view of an electronic device 1 in another specific embodiment, in which the electronic device is a foldable electronic device, that is, the middle frame 13 of the electronic device 1 is connected to the shaft 17, and the main board 22 and the battery 20 are located in the first housing on one side of the shaft 17. The screen 15 is connected to the main chip 121 on the main board 22 through the first heat conducting component 161, and the back cover 112 is connected to the main chip 121 on the main board 22 through the second heat conducting component 162, so that the heat of the heating device 12 can be conducted to the screen 15 through the first heat conducting component 161, and can also be conducted to the back cover 112 through the second heat conducting component 162.

[0139] In this embodiment, the first heat-conducting component 161 includes a first heat-conducting member 161a and a second heat-conducting member 161b. The first heat-conducting member 161a is connected to the screen 15 and extends to the other side of the rotating shaft 17 along the length direction X of the electronic device 1, that is, a part of the first heat-conducting member 161a is located in the first shell, and the other part is located in the second shell. The second heat-conducting member 161b is connected to the first heat-conducting member 161a, and the second heat-conducting member 161b and the main board 22 are both located in the first shell. The main chip 121 of the main board 22 is located in the cavity of the shielding cover 18, and the main chip 121 is connected to the shielding cover 18 through the first heat-conducting gel 191, and the shielding cover 18 is directly or indirectly connected to the second heat-conducting member 161b through the second heat-conducting gel 192. The second heat-conducting component 162 includes a third heat-conducting member 162a and a fourth heat-conducting member 162b. Along the thickness direction Z of the electronic device 1, the third heat-conducting member 162a is connected to the RF circuit board 23 and one end of the bracket 24, and the other end of the bracket 24 is connected to the fourth heat-conducting member 162b. The third heat-conducting member 162a and the mainboard 22 are located on the same side of the rotating shaft 17 along the length direction X, that is, both are located in the first shell, and the fourth heat-conducting member 162b extends to the other side of the rotating shaft 17 along the length direction X of the electronic device 1, that is, a part of the fourth heat-conducting member 162b is located in the first shell, and the other part is located in the second shell. The part of the fourth heat-conducting member 162b located in the second shell is connected to the third heat-conducting component 163, which is located in the second shell and connected to the back cover 112 and / or the screen 15. When there is a heating device in the second shell, the third heat-conducting component 163 is connected to the heating device in the second shell.

[0140] Fig.12 In the illustrated embodiment, the heat-conducting connector 14 includes a first connecting section 141, a second connecting section 142, and a third connecting section 143 connecting the first and second heat-conducting components 161, wherein the first connecting section 141 is attached to and connected with the first heat-conducting component 161, and the second connecting section 142 is attached to and connected with the second heat-conducting component 162. The first connecting section 141 and the second connecting section 142 are parallel to each other, and the third connecting section 143 is perpendicular to and connected with the first and second heat-conducting components 162. In this embodiment, the third connecting section 143 may be a possible implementation of the first heat-conducting connecting section described above, and the second connecting section 142 and / or the first connecting section 141 may be a possible implementation of the second heat-conducting connecting section described above.

[0141] like Fig.12In the illustrated embodiment, along the length direction X of the electronic device 1, the first connection section 141 and the second connection section 142 are located on the same side of the third connection section 143, the third connection section 143 is located on the side of the mainboard 22 away from the battery 20, and the thermally conductive connector 14 is substantially a C-shaped structure. The connection area between the thermally conductive connector 14 and the first thermally conductive component 161 and the second thermally conductive component 162 is made larger, the connection reliability is improved, and the thermal conductivity efficiency of the thermally conductive connector 14 is further improved.

[0142] In a specific embodiment, Fig.12 As shown, the first heat conductor 161a can be a two-phase heat dissipation component, such as a heat pipe, a temperature plate, etc., or a carbon material, such as graphene, graphite, etc., or a liquid cooling component. The second heat conductor 161b can be a two-phase heat dissipation component, such as a heat pipe, a temperature plate, etc., or a carbon material, such as graphene, graphite, etc., or a liquid cooling component. The third heat conductor 162a can be a two-phase heat dissipation component, such as a heat pipe, a temperature plate, etc., or a carbon material, such as graphene, graphite, etc., or a liquid cooling component. The fourth heat conductor 162b can be a two-phase heat dissipation component, such as a heat pipe, a temperature plate, etc., or a carbon material, such as graphene, graphite, etc., or a liquid cooling component. The fourth heat conductor Therefore, the embodiment of the present application does not limit the specific materials of the first heat conductor 161a, the second heat conductor 161b and the third heat conductor 162a. The material of the third heat-conducting component 163 can be a two-phase heat dissipation component, such as a heat pipe, a temperature plate, etc., or a carbon material, such as graphene, graphite, etc., or a liquid cooling component. Therefore, the embodiment of the present application does not limit the specific materials of the first heat-conducting member 161a, the second heat-conducting member 161b, the third heat-conducting member 162a, the fourth heat-conducting member 162b, the third heat-conducting component 163, and the heat-conducting connector 14.

[0143] exist Fig.12 In the illustrated embodiment, the first heat conductor 161a may be cross-axis graphene, the second heat conductor 161b may be a temperature equalizer, the third heat conductor 162a may be a graphene film, and the fourth heat conductor 162b may be a trans-axis graphene film.

[0144] In a specific embodiment, Fig.13 As shown, Fig.13 for Fig.11 A schematic diagram of the connection structure of the heat-conducting connector 14 with the second heat-conducting component 161b and the third heat-conducting component 162a in a specific embodiment, wherein the heat-conducting connector 14 includes a first connecting section 141, a second connecting section 142 and a third connecting section 143 connecting the two, wherein the first connecting section 141 is attached to and connected with the first heat-conducting component, and the second connecting section 142 is attached to and connected with the second heat-conducting component. The first connecting section 141 and the second connecting section 142 are parallel to each other, and the third connecting section 143 is perpendicular to and connected with the two.

[0145] Among them, the first connecting section 141 can be a structure with the same area as the second heat-conducting member 161b of the first heat-conducting component, and the second connecting section 142 can be a structure with the same area as the third heat-conducting member 162a of the second heat-conducting component. The connection area between the heat-conducting connector 14 and the first heat-conducting component and the second heat-conducting component in this embodiment is large, which improves the connection reliability and helps to conduct heat to the first heat-conducting component and the second heat-conducting component. And along the thickness direction Z of the electronic device 1, the first connecting section 141 can be attached to and connected with the top surface or bottom surface of the second heat-conducting member 161b in the first heat-conducting component, and / or, the second connecting section 142 can be attached to and connected with the top surface or bottom surface of the third heat-conducting member 162a in the second heat-conducting component.

[0146] Fig.13 In the illustrated embodiment, along the thickness direction of the electronic device 1, the first connecting section 141 is attached to and connected with the top surface of the second heat conducting member 161b, and the second connecting section 142 is attached to and connected with the bottom surface of the third heat conducting member 162a. The first connecting section 141 and the second connecting section 142 are staggered with each other along the length direction X of the electronic device 1, that is, the heat conducting connecting member 14 in this embodiment is a Z-shaped structure.

[0147] Fig.14 In the embodiment shown, Fig.14 for Fig.11 A schematic diagram of the connection structure of the heat-conducting connector 14 with the second heat-conducting connector 161b and the third heat-conducting connector 162a in another specific embodiment, along the thickness direction of the electronic device 1, the first connection section 141 is attached to and connected with the bottom surface of the second heat-conducting connector 161b, and the second connection section 142 is attached to and connected with the top surface of the third heat-conducting connector 162a. The first connection section 141 and the second connection section 142 are staggered with each other along the length direction X of the electronic device 1, that is, the heat-conducting connector 14 in this embodiment is a Z-shaped structure.

[0148] Fig.15 In the embodiment shown, Fig.15 for Fig.11 A schematic diagram of the connection structure of the heat-conducting connector 14 with the second heat-conducting connector 161b and the third heat-conducting connector 162a in another specific embodiment, along the thickness direction of the electronic device 1, the first connecting section 141 is attached to and connected with the bottom surface of the second heat-conducting connector 161b, and the second connecting section 142 is attached to and connected with the top surface of the third heat-conducting connector 162a. The first connecting section 141 and the second connecting section 142 are staggered with each other along the length direction X of the electronic device 1, that is, the heat-conducting connector 14 in this embodiment is a Z-shaped structure.

[0149] In a specific embodiment, Fig.16 As shown, Fig.16 for Fig.11The heat-conducting connector 14 is a schematic diagram of a structure in a specific embodiment, wherein the heat-conducting connector 14 includes a first connecting segment 141, a second connecting segment 142, and a third connecting segment 143 connecting the first connecting segment 141 and the second connecting segment 142, wherein the first connecting segment 141 and the second connecting segment 142 are substantially parallel, and the third connecting segment 143 is bent relative to the first connecting segment 141 and the second connecting segment 142, so that the heat-conducting connector 14 is substantially in a Z-shaped structure. In the heat-conducting connector 14, since the third connecting segment 143 is bent relative to the first connecting segment 141 and the second connecting segment 142, the thickness of the third connecting segment 143 is greater than the thickness of the first connecting segment 141 and the thickness of the second connecting segment 142, so that the strength of the third connecting segment 143 is higher, and the risk of breakage during the bending process is reduced.

[0150] In this embodiment, Fig.17 and Fig.18 As shown, Fig.17 for Fig.16 The rear view of Fig.18 for Fig.16 The front view of Fig.18 The shadow of the middle heat-conducting connector 14 is the adhesive area. Fig.17 The heat-conducting connector 14 shown may be provided with a release paper. When assembling the electronic device 1, the release paper is torn off, and the heat-conducting connector 14 can be bonded through the adhesive area, and then the other end of the heat-conducting connector 14 can be wrapped and pre-fixed, and after the battery 20 is assembled, the wrapped and pre-fixed end is connected to the battery 20.

[0151] The outer contour of the thermally conductive connector 14 may be provided with a plurality of avoidance steps, so as to provide space for adjacent components during the assembly process, avoid interference with other components, and facilitate assembly.

[0152] In a specific embodiment, Figure 19-20 As shown, Fig.19 FIG. 1 is a schematic diagram of a connection structure between the heat-conducting connecting member 14 and the second heat-conducting member 161 b and the third heat-conducting member 162 a in a specific embodiment. Fig. 20Schematic diagram of the connection structure of the heat-conducting connector 14 and the second heat-conducting connector 161b and the third heat-conducting connector 162a in another specific embodiment. The heat-conducting connector 14 may also include a fourth connecting section 144, the first connecting section 141, the second connecting section 142 and the fourth connecting section 144 are parallel to each other, and the third connecting section 143 is perpendicular to and connected to the three. The first connecting section 141 and the fourth connecting section 144 are located on the same side of the third connecting section 143 along the length direction X of the electronic device 1, the first connecting section 141 and the second connecting section 142 are located on both sides of the third connecting section 143 along the length direction X of the electronic device 1, and the second connecting section 142 and the fourth connecting section 144 are located on both sides of the third connecting section 143 along the length direction X of the electronic device 1. The first connecting section 141 and the fourth connecting section 144 are respectively connected to the top surface and the bottom surface of the second heat-conducting component 161b in the first heat-conducting component, and / or the second connecting section 142 is connected to the top surface or the bottom surface of the third heat-conducting component 162a in the second heat-conducting component, that is, the first connecting section 141 and the fourth connecting section 144 are both connected to the first heat-conducting component, and the second connecting section 142 is connected to the second heat-conducting component, so that the first heat-conducting component and the second heat-conducting component are connected through the thermally conductive connector 14.

[0153] Among them, the first connecting section 141 and the fourth connecting section 144 can be structures with the same area as the second heat-conducting member 161b of the first heat-conducting component, and the second connecting section 142 can be a structure with the same area as the third heat-conducting member 162a of the second heat-conducting component. The connection area between the heat-conducting connector 14 and the first heat-conducting component in this embodiment is larger, which improves the connection reliability and further improves the thermal conductivity efficiency between the heat-conducting connector 14 and the first heat-conducting component.

[0154] Fig.19 In the illustrated embodiment, along the thickness direction Z of the electronic device 1, the first connecting section 141 is attached to and connected with the top surface of the second heat conducting member 161b, the fourth connecting section 144 is attached to and connected with the bottom surface of the second heat conducting member 161b, and the second connecting section 142 is attached to and connected with the top surface of the third heat conducting member 162a. The first connecting section 141 and the second connecting section 142 are staggered with each other along the length direction X of the electronic device 1, and the first connecting section 141 and the fourth connecting section 144 are aligned along the length direction X of the electronic device 1, that is, the heat conducting connecting member 14 in this embodiment is a Y-shaped structure.

[0155] Fig. 20In the illustrated embodiment, along the thickness direction Z of the electronic device 1, the first connecting section 141 is attached to and connected with the top surface of the second heat conducting member 161b, the fourth connecting section 144 is attached to and connected with the bottom surface of the second heat conducting member 161b, and the second connecting section 142 is attached to and connected with the bottom surface of the third heat conducting member 162a. The first connecting section 141 and the second connecting section 142 are staggered with each other along the length direction X of the electronic device 1, and the first connecting section 141 and the fourth connecting section 144 are aligned along the length direction X of the electronic device 1, that is, the heat conducting connecting member 14 in this embodiment is a Y-shaped structure.

[0156] In another specific embodiment, in the thermally conductive connector 14, the first connecting segment 141 can be connected to the first thermally conductive component 161, the second connecting segment 142 can be connected to the second thermally conductive component 162, the fourth connecting segment 144 can be connected to the third thermally conductive component 163, and the third connecting segment 143 connects the first connecting segment 141, the second connecting segment 142 and the fourth connecting segment 144, thereby connecting the first thermally conductive component 161, the second thermally conductive component 162 and the third thermally conductive component 163 through the thermally conductive connector 14.

[0157] In a specific embodiment, Fig.21 As shown, Fig.21 The figure is a schematic diagram of the connection structure between the heat-conducting connector 14 and the second heat-conducting connector 161b and the third heat-conducting connector 162a in another specific embodiment. The heat-conducting connector 14 may also include a fifth connection section 145. The first connection section 141, the second connection section 142 and the fourth connection section 144 are parallel to each other and staggered along the length direction X of the electronic device 1. In this embodiment, the heat-conducting connector 14 is a Y-shaped structure. The third connection section 143 is perpendicular to and connected to the first connection section 141 and the second connection section 142. The fifth connection section 145 connects the second connection section 142 and the fourth connection section 144. The fifth connection section 145 in this embodiment may be a structure extending along the thickness direction Z of the electronic device 1, or may be a bent structure (for example Fig.21 The L-shaped structure in FIG. 1 is formed by connecting the third connecting segment 143, the second connecting segment 142 and the fourth connecting segment 144. The first connecting segment 141 is connected to the second heat-conducting member 161b of the first heat-conducting component, the second connecting segment 142 is connected to the third heat-conducting member 162a of the second heat-conducting component, and the fourth connecting segment 144 is connected to the third heat-conducting component 163, thereby connecting the first heat-conducting component, the second heat-conducting component and the third heat-conducting component 163 through the heat-conducting connector 14.

[0158] In the above embodiments, each connection section of the heat-conducting connector 14 can be an integrated structure or a split structure, and the materials of each connection section can be the same or different. The specific structure and material of the heat-conducting connector 14 can be selected according to the actual use, so as to reduce the difficulty of assembly and improve the applicability of the heat-conducting connector 14.

[0159] The heat-conducting connector can be a film material or a sheet material. In this embodiment, when the heat-conducting connector 14 is a film material or a sheet material, a graphite sheet or graphene or a boron nitride heat dissipation film can be selected. Graphite sheets, graphene and boron nitride heat dissipation films all have good thermal conductivity, which can improve the thermal conductivity efficiency between the heat-conducting connector 14 and the heat-conducting component 16, and improve the heat dissipation effect of the electronic device 1. At the same time, graphite sheets, graphene and boron nitride heat dissipation films all have good flexibility. The heat-conducting connector 14 can be a planar structure before assembly, which is convenient for storage and transportation, reduces costs, and is easy to bend during the assembly process to connect multiple heat-conducting components and reduce assembly difficulty.

[0160] The heat-conducting connector 14 can also be made of a rigid material. In this embodiment, when the heat-conducting connector 14 is made of a rigid material, copper foil can be used. Copper foil has good thermal conductivity, which can improve the thermal conductivity between the heat-conducting connector 14 and the heat-conducting component 16, and improve the heat dissipation effect of the electronic device 1. At the same time, the heat-conducting connector 14 made of copper foil material is first molded before assembly so that it can connect multiple heat-conducting components, thereby reducing assembly steps and improving assembly efficiency. The copper foil and the rigid heat dissipation bracket have high strength and stability, which can support the electronic device 1, further improve the strength of the electronic device 1, and extend the service life of the heat-conducting connector 14.

[0161] The thermally conductive connector 14 can also be a composite structure of both rigid and flexible materials. In this embodiment, the thermally conductive connector 14 can include a variety of materials including graphite sheets, graphene films, boron carbide heat dissipation films, temperature averaging plates, and copper foils to improve the applicability of the thermally conductive connector 14.

[0162] In another specific embodiment, the heat-conducting connector 14 may also include one or more of a two-phase heat-dissipating component, a carbon material, and a liquid-cooling component. In this embodiment, when a two-phase heat-dissipating component, a carbon material, or a liquid-cooling component is selected, it has a high thermal conductivity coefficient, can improve the thermal conductivity efficiency between the heat-conducting component and the heat-conducting connector 14, and has good flexibility, and can be bent and formed to reduce the difficulty of assembly, and can be spliced ​​in multiple pieces, so that the heat-conducting connector 14 can be a composite structure of multiple materials to improve the applicability of the heat-conducting connector 14.

[0163] In the above embodiments, each connecting section of the thermally conductive connecting member 14 may be an integrated structure or a split structure, and the materials of each connecting section may be the same or different.

[0164] In the above embodiments, the heat-conducting connector 14 may also be provided with a reinforcement portion, which is located at the bending region of the heat-conducting connector 14, that is, at the connection between the first connection segment 141, the second connection segment 142, and the fourth connection segment 144 and the third connection segment 143 and the fifth connection segment 145. The reinforcement portion can protect the bending region of the heat-conducting connector 14 and prevent the bending region of the heat-conducting connector 14 from breaking. In addition, during the assembly process of the heat-conducting connector 14, the reinforcement portion can prevent the bending region from being damaged due to wear of other components, thereby extending the service life of the heat-conducting connector 14.

[0165] The reinforcement part may be a PET film, a Teflon film or a Mylar film, all of which have good wear resistance and heat resistance, and good surface flatness and transparency, and can meet the use requirements of the reinforcement part.

[0166] In another specific embodiment, lubricating oil or quick-drying oil may also be coated on the bending area, which can protect the bending area and reduce the friction between other components and the bending area, thereby facilitating the assembly of the thermal conductive connector 14.

[0167] The above is only a specific implementation of the embodiment of the present application, but the protection scope of the embodiment of the present application is not limited thereto, and any changes or replacements within the technical scope disclosed in the embodiment of the present application should be included in the protection scope of the embodiment of the present application. Therefore, the protection scope of the embodiment of the present application should be based on the protection scope of the claims.

Claims

1. An electronic device, characterized in that The electronic device comprises: A housing, the housing comprising a middle frame and a back cover; A screen, wherein the screen is mounted on the middle frame, and the back cover and the screen are distributed on both sides of the middle frame along the thickness direction of the electronic device; A heating device, wherein the heating device is located in the receiving cavity of the electronic device; At least one heat-conducting component, the heat-conducting component is connected to the heating device and to the screen and / or the back cover; Wherein, the electronic device further comprises a heat-conducting connector, and the heat-conducting connector connects at least a part of the heat-conducting component.

2. The electronic device according to claim 1, characterized in that: The heat-conducting connector comprises a first heat-conducting connecting section, and the first heat-conducting connecting section connects the heat-conducting components distributed along the thickness direction of the electronic device; The first heat-conducting connection section extends along the thickness direction of the electronic device, or the first heat-conducting connection section is inclined relative to the thickness direction of the electronic device, or the first heat-conducting connection section is a bent structure.

3. The electronic device according to claim 2, characterized in that: The thermally conductive connecting member further comprises a second thermally conductive connecting section connected to the first thermally conductive connecting section, wherein the second thermally conductive connecting section is connected to the thermally conductive components distributed along the length direction of the electronic device; The second heat-conducting connecting section extends along the length direction of the electronic device, or the second heat-conducting connecting section is inclined relative to the length direction of the electronic device, or the second heat-conducting connecting section is a bent structure.

4. The electronic device according to claim 1, characterized in that: The housing comprises a first housing and a second housing distributed along the length direction of the electronic device, the electronic device further comprises a rotating shaft, the first housing and the second housing are connected to the rotating shaft and can rotate relative to each other; The heat-conducting connector connects the heat-conducting component in the first shell and the heat-conducting component in the second shell.

5. The electronic device according to claim 4, characterized in that: The electronic device at least comprises a first heat-conducting component, a second heat-conducting component and a third heat-conducting component, wherein a portion of the first heat-conducting component is located in the first housing and a portion thereof extends into the second housing, a portion of the second heat-conducting component is located in the first housing and a portion thereof extends into the second housing, and the third heat-conducting component is located in the second housing; The heat-conducting connector connects the first heat-conducting component, the second heat-conducting component and the third heat-conducting component.

6. The electronic device according to claim 5, characterized in that: The heat-conducting connecting member is located in the first shell or the second shell.

7. The electronic device according to any one of claims 1 to 6, characterized in that: The heat-conducting component includes one or more heat-conducting parts, and the heat-conducting connecting part is connected to any heat-conducting part of the heat-conducting component.

8. The electronic device according to any one of claims 1 to 6, characterized in that: The electronic device further comprises a battery and a mainboard, wherein the mainboard has a main chip, and the main chip is the heating device; The thermally conductive connector is also connected to the battery.

9. The electronic device according to any one of claims 1 to 6, characterized in that: The bending area of ​​the thermally conductive connecting piece is further provided with a reinforcement portion.

10. The electronic device according to any one of claims 1 to 6, characterized in that: The heat-conducting connecting piece is a C-shaped structure, a Z-shaped structure or a Y-shaped structure.

11. The electronic device according to any one of claims 1 to 6, characterized in that: The heat-conducting connecting piece is an integrated structure or a split structure.

12. The electronic device according to any one of claims 1 to 6, characterized in that: The heat-conducting connector is a film material or a sheet material, and can be bent during the assembly of the electronic device.

13. The electronic device according to any one of claims 1 to 6, characterized in that: The heat-conducting connecting piece is a rigid structure.

14. The electronic device according to claim 11, characterized in that: The thermally conductive connecting member includes one or more of a two-phase heat dissipation component, a carbon material, and a liquid cooling component.

15. The electronic device according to claim 11, characterized in that: The thermally conductive connecting member includes one or more of a graphite sheet, a graphene film, a boron carbide heat dissipation film, a temperature averaging plate, and a copper foil.

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