Inverted RGB LED support

Abstract

The utility model discloses an inverted RGB LED support, which comprises an insulating body, a first conductive terminal, a second conductive terminal, a third conductive terminal and a fourth conductive terminal, a first bonding pad is arranged on the rear side of a common bonding pad and is matched with the common bonding pad for longitudinal inversion of an external first chip, and a second bonding pad is arranged beside the common bonding pad and is matched with the common bonding pad for transverse inversion of an external second chip. And the third bonding pad is arranged beside the common bonding pad and is matched with the common bonding pad for transverse flip mounting of an external third chip, so that the RGB LED bracket with the structure can realize all flip mounting of the chip without wire bonding, the production cost of a product is greatly reduced, the product is more competitive, the price advantage of the product is improved, and the production efficiency is improved. The overall size of the product can be effectively reduced, miniaturization design of the product is facilitated, and existing requirements are met.

Description

Technical Field

[0001] The utility model relates to the technology of LED bracket field, in particular to an inverted RGB LED bracket. Background Art

[0002] With the development of social economy and the improvement of people's living standards, more and more electrical appliances are manufactured. LED lights are welcomed by more and more people and are widely used because of their high brightness and energy saving.

[0003] RGB LED light is a light source composed of red, green and blue LED lamp beads. Among them, RGB stands for red, green and blue, which are the basic elements of all visible light, namely the three primary colors. By controlling the brightness and combination of the three colors in the RGB LED light, various desired colors can be formed. Therefore, RGBLED lights can not only emit light in a single color, but also mix various colors by adjusting the ratio. The colors of RGBLED lights are particularly clear and bright.

[0004] like Figure 8 As shown, the current RGB LED bracket usually includes an L-shaped main pad 10' and three independent pads arranged on both sides of the L-shaped main pad. When packaging, the three chips 50' of red, green and blue are placed on the L-shaped main pad 10', and a gold wire is punched from one pole of each chip 50' to the first independent pad 20' for connection and conduction, and the other poles of the two chips 50' are respectively punched with gold wires to the second independent pad 30' and the third independent pad 40' for connection and conduction, and the other pole of the other chip 50' is soldered to the L-shaped main pad 10' with solder paste. Although this structure is simple, it requires the use of multiple gold wires, the production cost of the product is high, and the product is not very competitive. Due to the unreasonable design structure, it is impossible to achieve full flip chip, the chip has no position to be fixed, and the overall volume of the product is large, which is not conducive to the miniaturization design of the product and cannot meet the existing needs. Therefore, it is necessary to improve the current RGB LED bracket. Utility Model Content

[0005] In view of this, the utility model aims to solve the deficiencies in the prior art, and its main purpose is to provide a flip-chip RGB LED bracket, which can effectively solve the problems of the prior RGB LED bracket, such as the need to use multiple gold wires, high production costs, low competitiveness, unreasonable structural design resulting in the inability to flip-chip all chips, and a large overall size, which is not conducive to miniaturization design.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0007] A flip-chip RGB LED bracket includes an insulating body, a first conductive terminal, a second conductive terminal, a third conductive terminal and a fourth conductive terminal;

[0008] The upper surface of the insulating body is inwardly concavely provided with a packaging cavity;

[0009] The first conductive terminal, the second conductive terminal, the third conductive terminal and the fourth conductive terminal are all embedded in the insulating body, the second conductive terminal is arranged at the rear side of the first conductive terminal, the third conductive terminal is arranged at the side of the first conductive terminal, and the fourth conductive terminal is arranged at the side of the third conductive terminal;

[0010] A common pad, a first pad, a second pad, and a third pad are respectively disposed on the first conductive terminal, the second conductive terminal, the third conductive terminal, and the fourth conductive terminal. The common pad, the first pad, the second pad, and the third pad are all exposed on the bottom surface of the packaging cavity. The first pad is disposed on the rear side of the common pad and cooperates with the common pad for longitudinal flip-chipping of an external first chip. The second pad is disposed on the side of the common pad and cooperates with the common pad for lateral flip-chipping of an external second chip. The third pad is disposed on the side of the common pad and cooperates with the common pad for lateral flip-chipping of an external third chip.

[0011] As a preferred embodiment, the first conductive terminal has a common pad, a first fixing portion and a first welding foot which are integrally connected in sequence, the first fixing portion is buried in the insulating body, and the first welding foot extends outward from the insulating body; the second conductive terminal has a first pad, a second fixing portion and a second welding foot which are integrally connected in sequence, the second fixing portion is buried in the insulating body, and the second welding foot extends outward from the insulating body; the third conductive terminal has a second pad, a third fixing portion and a third welding foot which are integrally connected in sequence, the third fixing portion is buried in the insulating body, and the third welding foot extends outward from the insulating body; the fourth conductive terminal has a third pad, a fourth fixing portion and a fourth welding foot which are integrally connected in sequence, the fourth fixing portion is buried in the insulating body, and the fourth welding foot extends outward from the insulating body.

[0012] As a preferred solution, the common pad is formed by bending at the upper end of the first fixed part, and the first welding leg is formed by bending at the lower end of the first fixed part, and the first welding leg is fitted and arranged at the bottom of the insulating body; the first pad is formed by bending at the upper end of the second fixed part, and the second welding leg is formed by bending at the lower end of the second fixed part, and the second welding leg is fitted and arranged at the bottom of the insulating body; the second pad is formed by bending at the upper end of the third fixed part, and the third welding leg is formed by bending at the lower end of the third fixed part, and the third welding leg is fitted and arranged at the bottom of the insulating body; the third pad is formed by bending at the upper end of the fourth fixed part, and the fourth welding leg is formed by bending at the lower end of the fourth fixed part, and the fourth welding leg is fitted and arranged at the bottom of the insulating body.

[0013] As a preferred solution, the heights of the first fixing portion, the second fixing portion, the third fixing portion and the fourth fixing portion are all 0.85 mm.

[0014] As a preferred solution, the first conductive terminal, the second conductive terminal, the third conductive terminal and the fourth conductive terminal are all structures of copper plates stretched and bent in one step. This structure can effectively prevent the penetration of red ink during the red ink test, improve the reliability of the product, and is suitable for outdoor LED display screens.

[0015] As a preferred solution, the inner diameter of the packaging cavity gradually increases from bottom to top.

[0016] As a preferred solution, the bottoms of the common pad, the first pad, the second pad and the third pad are all provided with pockmarks, which increases the contact area between the common pad, the first pad, the second pad, the third pad and the insulating body, enhances the bonding strength of the structure, improves the stability of the structure, makes it difficult for moisture to penetrate into the interior of the product, and has better airtightness.

[0017] As a preferred solution, the upper surfaces of the common pad, the first pad, the second pad and the third pad are flush with the bottom surface of the packaging cavity.

[0018] As a preferred solution, four positioning grooves are set at the bottom of the insulating body, and every two positioning grooves are symmetrically arranged on the left and right. The third conductive terminal and the first conductive terminal are arranged on the left and right, and the fourth conductive terminal and the second conductive terminal are arranged on the left and right. The above-mentioned first welding foot, second welding foot, third welding foot, and fourth welding foot are respectively arranged in the corresponding positioning grooves to enhance the stability of the structure.

[0019] Compared with the prior art, the utility model has obvious advantages and beneficial effects. Specifically, it can be seen from the above technical solution that:

[0020] By respectively arranging a common pad, a first pad, a second pad, and a third pad on the first conductive terminal, the second conductive terminal, the third conductive terminal, and the fourth conductive terminal, and cooperating to arranging the common pad, the first pad, the second pad, and the third pad to be exposed on the bottom surface of the packaging cavity, the first pad is arranged at the rear side of the common pad and cooperates with the common pad for the external first chip to be flipped vertically, the second pad is arranged at the side of the common pad and cooperates with the common pad for the external second chip to be flipped horizontally, and the third pad is arranged at the side of the common pad and cooperates with the common pad for the external third chip to be flipped horizontally. The RGB LED bracket with this structure can realize the full flipping of the chip without the need for wire bonding, greatly reducing the production cost of the product, making the product more competitive, and improving the price advantage of the product. In addition, it can effectively reduce the overall volume of the product, which is conducive to the miniaturized design of the product and meets the existing needs.

[0021] In order to more clearly illustrate the structural features and functions of the present invention, the present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a three-dimensional structural schematic diagram of a preferred embodiment of the utility model;

[0023] Figure 2 It is a three-dimensional structural schematic diagram of another angle of a preferred embodiment of the utility model;

[0024] Figure 3 It is an exploded view of a preferred embodiment of the utility model;

[0025] Figure 4 It is an exploded view from another angle of the preferred embodiment of the utility model;

[0026] Figure 5 It is a cross-sectional view of a preferred embodiment of the utility model;

[0027] Figure 6 It is a three-dimensional structural schematic diagram of the first conductive terminal, the second conductive terminal, the third conductive terminal and the fourth conductive terminal in a preferred embodiment of the utility model;

[0028] Figure 7 This is a schematic diagram of the structure of a preferred embodiment of the utility model when the first chip, the second chip, and the third chip are flipped;

[0029] Figure 8 It is a structural schematic diagram of an RGB LED bracket in the prior art.

[0030] Description of the accompanying drawings:

[0031] 10', L-shaped main pad 20', first independent pad

[0032] 30', second independent pad 40', third independent pad

[0033] 50', chip;

[0034] 10. Insulation body 11. Packaging cavity

[0035] 12. Positioning groove 20. First conductive terminal

[0036] 21. Common pad 22. First fixing portion

[0037] 23. First solder leg 30. Second conductive terminal

[0038] 31. First pad 32. Second fixing portion

[0039] 33, second solder leg 40, third conductive terminal

[0040] 41. Second pad 42. Third fixing portion

[0041] 43, third solder leg 50, fourth conductive terminal

[0042] 51. third pad 52. fourth fixing portion

[0043] 53, fourth solder pin 60, first chip

[0044] 70. Second chip 80. Third chip DETAILED DESCRIPTION

[0045] Please refer to Figures 1 to 7 , which shows the specific structure of a preferred embodiment of the present utility model, including an insulating body 10 , a first conductive terminal 20 , a second conductive terminal 30 , a third conductive terminal 40 and a fourth conductive terminal 50 .

[0046] The upper surface of the insulating body 10 is provided with a packaging cavity 11 inwardly recessed. In the present embodiment, the inner diameter of the packaging cavity 11 gradually increases from bottom to top. The bottom of the insulating body 10 is provided with four positioning grooves 12, and every two positioning grooves 12 are symmetrically arranged.

[0047] The first conductive terminal 20, the second conductive terminal 30, the third conductive terminal 40 and the fourth conductive terminal 50 are all embedded in the insulating body 10, the second conductive terminal 30 is arranged at the rear side of the first conductive terminal 20, the third conductive terminal 40 is arranged at the side of the first conductive terminal 20, and the fourth conductive terminal 50 is arranged at the side of the third conductive terminal 40;

[0048] A common pad 21, a first pad 31, a second pad 41, and a third pad 51 are respectively disposed on the first conductive terminal 20, the second conductive terminal 30, the third conductive terminal 40, and the fourth conductive terminal 50. The common pad 21, the first pad 31, the second pad 41, and the third pad 51 are all exposed on the bottom surface of the packaging cavity 11. The first pad 31 is disposed on the rear side of the common pad 21 and cooperates with the common pad 21 for the external first chip 60 to be flipped longitudinally. The second pad 41 is disposed on the side of the common pad 21 and cooperates with the common pad 21 for the external second chip 70 to be flipped laterally. The third pad 51 is disposed on the side of the common pad 21 and cooperates with the common pad 21 for the external third chip 80 to be flipped laterally.

[0049] In this embodiment, the first conductive terminal 20 has a common pad 21, a first fixing portion 22 and a first solder leg 23 which are integrally connected in sequence. The first fixing portion 22 is buried in the insulating body 10, and the first solder leg 23 extends outward from the insulating body 10. Specifically, the common pad 21 is formed by bending at the upper end of the first fixing portion 22, and the first solder leg 23 is formed by bending at the lower end of the first fixing portion 22. The first solder leg 23 is fitted to the bottom of the insulating body 10. The height of the first fixing portion 22 is 0.85 mm; the first conductive terminal 20 is a structure in which the copper plate is stretched and bent in one step. This structure can effectively prevent the penetration of red ink during the red ink test, improve the reliability of the product, and is suitable for outdoor LED display screens; the bottom of the common solder pad 21 is provided with pitting, which increases the contact area between the common solder pad 21 and the insulating body 10, enhances the bonding strength of the structure, improves the stability of the structure, makes it difficult for moisture to penetrate into the interior of the product, and has better airtightness; the upper surface of the common solder pad 21 is flush with the bottom surface of the packaging cavity 11.

[0050] In this embodiment, the second conductive terminal 30 has a first pad 31, a second fixing portion 32, and a second solder leg 33 which are integrally connected in sequence. The second fixing portion 32 is buried in the insulating body 10, and the second solder leg 33 extends outward from the insulating body 10. Specifically, the first pad 31 is bent at the upper end of the second fixing portion 32, and the second solder leg 33 is bent at the lower end of the second fixing portion 32. The second solder leg 33 is fitted to the bottom of the insulating body 10. The height of the second fixing portion 32 is 0.85 mm; the second conductive terminal 30 is a structure in which the copper plate is stretched and bent in one step. This structure can effectively prevent the penetration of red ink during the red ink test, improve the reliability of the product, and is suitable for outdoor LED display screens; the bottom of the first solder pad 31 is provided with pitting, which increases the contact area between the first solder pad 31 and the insulating body 10, enhances the bonding strength of the structure, improves the stability of the structure, makes it difficult for moisture to penetrate into the interior of the product, and has better airtightness; the upper surface of the first solder pad 31 is flush with the bottom surface of the packaging cavity 11.

[0051] In this embodiment, the third conductive terminal 40 has a second pad 41, a third fixing portion 42 and a third solder leg 43 which are integrally connected in sequence, the third fixing portion 42 is buried in the insulating body 10, and the third solder leg 43 extends outward from the insulating body 10; specifically, the second pad 41 is bent at the upper end of the third fixing portion 42, the third solder leg 43 is bent at the lower end of the third fixing portion 42, and the third solder leg 43 is fitted to the bottom of the insulating body 10; the height of the third fixing portion 42 is 0.85 mm; the third conductive terminal 40 is a structure in which the copper plate is stretched and bent in one step. This structure can effectively prevent the penetration of red ink during the red ink test, thereby improving the reliability of the product and being suitable for outdoor LED display screens; the bottom of the second solder pad 41 is provided with pitting, which increases the contact area between the second solder pad 41 and the insulating body 10, enhances the bonding strength of the structure, improves the stability of the structure, makes it difficult for moisture to penetrate into the interior of the product, and has better airtightness; the upper surface of the second solder pad 41 is flush with the bottom surface of the packaging cavity 11.

[0052] In this embodiment, the fourth conductive terminal 50 has a third pad 51, a fourth fixing portion 52 and a fourth welding leg 53 which are integrally connected in sequence, the fourth fixing portion 52 is buried in the insulating body 10, and the fourth welding leg 53 extends outward from the insulating body 10; specifically, the third pad 51 is formed by bending at the upper end of the fourth fixing portion 52, and the fourth welding leg 53 is formed by bending at the lower end of the fourth fixing portion 52, and the fourth welding leg 53 is fitted to the bottom of the insulating body 10; the height of the fourth fixing portion 52 is 0.85 mm; the fourth conductive terminal 50 is a structure of a copper plate stretched and bent in one step, which can effectively prevent the penetration of red ink when doing a red ink test. The third pad 51 is transparent, which improves the reliability of the product and is suitable for outdoor LED display screens; the bottom of the third pad 51 is provided with pitting, which increases the contact area between the third pad 51 and the insulating body 10, enhances the bonding strength of the structure, improves the stability of the structure, and makes it difficult for moisture to penetrate into the interior of the product, and the airtightness is better; the upper surface of the third pad 51 is flush with the bottom surface of the packaging cavity 11; the third conductive terminal 40 and the first conductive terminal 20 are arranged on the left and right, the fourth conductive terminal 50 and the second conductive terminal 30 are arranged on the left and right, and the first solder leg 23, the second solder leg 33, the third solder leg 43, and the fourth solder leg 53 are respectively arranged in the corresponding positioning groove 12 to enhance the stability of the structure.

[0053] The production process of this embodiment is described in detail as follows:

[0054] First, a plurality of copper plates are stretched and bent in one step to obtain a first conductive terminal 20, a second conductive terminal 30, a third conductive terminal 40 and a fourth conductive terminal 50; then, the first conductive terminal 20, the second conductive terminal 30, the third conductive terminal 40 and the fourth conductive terminal 50 are placed in a mold for injection molding to form an insulating body 10.

[0055] During packaging, first, the first chip 60 is placed in the packaging cavity 11 and is longitudinally arranged between the first solder pad 31 and the common solder pad 21, and the two poles of the first chip 60 are respectively connected to the first solder pad 31 and the common solder pad 21 by solder paste welding; then, the second chip 70 is placed in the packaging cavity 11 and is transversely arranged between the second solder pad 41 and the common solder pad 21, and the two poles of the second chip 70 are respectively connected to the second solder pad 41 and the common solder pad 21 by solder paste welding; finally, the third chip 80 is placed in the packaging cavity 11 and is transversely arranged between the third solder pad 51 and the common solder pad 21, and the two poles of the third chip 80 are respectively connected to the third solder pad 51 and the common solder pad 21 by solder paste welding. The operation is simple, convenient and fast.

[0056] The design focus of this utility model is:

[0057] By respectively arranging a common pad, a first pad, a second pad, and a third pad on the first conductive terminal, the second conductive terminal, the third conductive terminal, and the fourth conductive terminal, and cooperating to arranging the common pad, the first pad, the second pad, and the third pad to be exposed on the bottom surface of the packaging cavity, the first pad is arranged at the rear side of the common pad and cooperates with the common pad for the external first chip to be flipped vertically, the second pad is arranged at the side of the common pad and cooperates with the common pad for the external second chip to be flipped horizontally, and the third pad is arranged at the side of the common pad and cooperates with the common pad for the external third chip to be flipped horizontally. The RGB LED bracket with this structure can realize the full flipping of the chip without the need for wire bonding, greatly reducing the production cost of the product, making the product more competitive, and improving the price advantage of the product. In addition, it can effectively reduce the overall volume of the product, which is conducive to the miniaturized design of the product and meets the existing needs.

[0058] The above description is only a preferred embodiment of the present invention and does not limit the technical scope of the present invention. Therefore, any minor modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A flip-chip RGB LED bracket, characterized in that: It includes an insulating body, a first conductive terminal, a second conductive terminal, a third conductive terminal and a fourth conductive terminal; The upper surface of the insulating body is inwardly concavely provided with a packaging cavity; The first conductive terminal, the second conductive terminal, the third conductive terminal and the fourth conductive terminal are all embedded in the insulating body, the second conductive terminal is arranged at the rear side of the first conductive terminal, the third conductive terminal is arranged at the side of the first conductive terminal, and the fourth conductive terminal is arranged at the side of the third conductive terminal; A common pad, a first pad, a second pad, and a third pad are respectively disposed on the first conductive terminal, the second conductive terminal, the third conductive terminal, and the fourth conductive terminal. The common pad, the first pad, the second pad, and the third pad are all exposed on the bottom surface of the packaging cavity. The first pad is disposed on the rear side of the common pad and cooperates with the common pad for longitudinal flip-chipping of an external first chip. The second pad is disposed on the side of the common pad and cooperates with the common pad for lateral flip-chipping of an external second chip. The third pad is disposed on the side of the common pad and cooperates with the common pad for lateral flip-chipping of an external third chip.

2. The inverted RGB LED bracket according to claim 1, characterized in that: The first conductive terminal comprises a common pad, a first fixing portion and a first welding foot which are integrally connected in sequence, the first fixing portion is buried in the insulating body, and the first welding foot extends outward from the insulating body; the second conductive terminal comprises a first pad, a second fixing portion and a second welding foot which are integrally connected in sequence, the second fixing portion is buried in the insulating body, and the second welding foot extends outward from the insulating body; the third conductive terminal comprises a second pad, a third fixing portion and a third welding foot which are integrally connected in sequence, the third fixing portion is buried in the insulating body, and the third welding foot extends outward from the insulating body; the fourth conductive terminal comprises a third pad, a fourth fixing portion and a fourth welding foot which are integrally connected in sequence, the fourth fixing portion is buried in the insulating body, and the fourth welding foot extends outward from the insulating body.

3. The inverted RGB LED bracket according to claim 2, characterized in that: The common soldering pad is formed by bending at the upper end of the first fixing part, and the first soldering foot is formed by bending at the lower end of the first fixing part, and the first soldering foot is fitted and arranged at the bottom of the insulating body; the first soldering pad is formed by bending at the upper end of the second fixing part, and the second soldering foot is formed by bending at the lower end of the second fixing part, and the second soldering foot is fitted and arranged at the bottom of the insulating body; the second soldering pad is formed by bending at the upper end of the third fixing part, and the third soldering foot is formed by bending at the lower end of the third fixing part, and the third soldering foot is fitted and arranged at the bottom of the insulating body; the third soldering pad is formed by bending at the upper end of the fourth fixing part, and the fourth soldering foot is formed by bending at the lower end of the fourth fixing part, and the fourth soldering foot is fitted and arranged at the bottom of the insulating body.

4. The inverted RGB LED bracket according to claim 3, characterized in that: The heights of the first fixing portion, the second fixing portion, the third fixing portion and the fourth fixing portion are all 0.85 mm.

5. The flip-chip RGB LED bracket according to claim 3, characterized in that: The first conductive terminal, the second conductive terminal, the third conductive terminal and the fourth conductive terminal are all structures formed by one-step stretching and bending of a copper plate.

6. The flip-chip RGB LED bracket according to claim 1, characterized in that: The inner diameter of the packaging cavity gradually increases from bottom to top.

7. The flip-chip RGB LED bracket according to claim 1, characterized in that: The bottoms of the common pad, the first pad, the second pad and the third pad are all provided with pitting spots.

8. The flip-chip RGB LED bracket according to claim 1, characterized in that: The upper surfaces of the common pad, the first pad, the second pad and the third pad are flush with the bottom surface of the packaging cavity.

9. The flip-chip RGB LED bracket according to claim 2, characterized in that: Four positioning grooves are arranged at the bottom of the insulating body, and every two positioning grooves are arranged symmetrically on the left and right. The third conductive terminal and the first conductive terminal are arranged on the left and right, and the fourth conductive terminal and the second conductive terminal are arranged on the left and right. The first welding foot, the second welding foot, the third welding foot, and the fourth welding foot are respectively arranged in the corresponding positioning grooves.

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