Hot pressing equipment for semiconductor processing

Abstract

The utility model discloses hot pressing equipment for semiconductor processing, and belongs to the field of semiconductor processing. The hot pressing equipment for semiconductor processing comprises a machine body and a machine door, a semiconductor placing plate is arranged in the machine body, the hot pressing equipment further comprises a limiting plate fixedly connected to the bottom of the semiconductor placing plate, and four limiting grooves are formed in the surface of the limiting plate. According to the hot-pressing equipment for semiconductor processing, a semiconductor is placed on a semiconductor placing plate, then the semiconductor placing plate is pressed downwards to drive a limiting plate at the bottom to enter a mounting cylinder downwards, the limiting plate abuts against a clamping plate, the clamping plate slides towards the outside of the mounting cylinder by extruding a sliding rod and a spring, and therefore the limiting plate slides through the clamping plate; when the limiting plate abuts against the inner wall of the bottom of the mounting cylinder, the clamping plate enters the limiting groove of the limiting plate under the reset acting force of the spring to fixedly clamp the limiting plate, so that the semiconductor placement plate is fixedly mounted, operation is simple and rapid, and a large amount of time is saved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing, in particular to a hot pressing device for semiconductor processing. Background Art

[0002] Semiconductors refer to materials with electrical conductivity between conductors and insulators at room temperature. Semiconductors are widely used in radios, televisions, and temperature measurement. For example, diodes are devices made of semiconductors. Semiconductors refer to materials with controllable electrical conductivity, ranging from insulators to conductors. Whether from the perspective of science and technology or economic development, semiconductors are of great importance. A hot press is a device that heats two pre-tinned parts with flux to a temperature sufficient to melt and flow the solder. After solidification, a permanent electrical and mechanical connection is formed between the parts and the solder. The heating rate can be selected according to different products, and can be used for hot pressing of semiconductors.

[0003] After searching, the Chinese patent authorization number CN 216966621 U discloses a hot pressing device for semiconductor processing, including a body and a support plate, a machine door is movably installed on the front surface of the body, a slide groove is provided inside the body, a mounting plate is detachably installed on the upper surface of the support plate, a bayonet is provided on one side of the mounting plate, a placement plate is detachably installed on the upper surface of the mounting plate, guide columns are fixedly installed on both sides of the placement plate, a limit block is fixedly installed on one end of the guide column, a spring is sleeved on the outer surface of the guide column, a buckle is fixedly installed on one end of the spring, a fixed block is fixedly installed on one side of the upper surface of the support plate, and a limit plate is movably installed inside the fixed block. The mounting plate, support plate, and placement plate in the above patent have the following shortcomings: since the temperature of the semiconductor is high after hot pressing, the surface of the mounting plate and the support plate will also have a high temperature, it is inconvenient to slide the support plate out, and it is impossible to quickly remove the semiconductor on the placement plate. The entire operation process is too cumbersome, affecting work efficiency. Utility Model Content

[0004] The utility model aims to solve the problem in the prior art that a semiconductor placement plate cannot be quickly stabilized, and proposes a hot pressing device for semiconductor processing.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A hot pressing device for semiconductor processing comprises a machine body and a machine door, wherein a semiconductor placement plate is arranged inside the machine body, and further comprises: a limit plate fixedly connected to the bottom of the semiconductor placement plate, wherein the surface of the limit plate is provided with four limit grooves; a mounting cylinder slidably arranged in the machine body, wherein four clamping plates are slidably connected inside the mounting cylinder, wherein the clamping plates are slidably connected to the limit grooves of the limit plate; a sliding rod fixedly connected to the side surface of the clamping plate, wherein a spring is sleeved on the sliding rod.

[0007] Preferably, the sliding rod passes through the mounting cylinder and is slidably connected to the mounting cylinder. Four groups of sliding rods are provided and are arranged in a circular array with the center line of the mounting cylinder as the axis of symmetry.

[0008] Preferably, one end of the spring is fixedly connected to the clamping plate, and the other end of the spring is fixedly connected to the inner wall of the mounting cylinder.

[0009] Preferably, the end of the sliding rod away from the clamping plate is fixedly connected to a connecting block, the bottom of the connecting block is fixedly connected to a driving rod, the top surface of the mounting cylinder is fixedly connected to an L-shaped connecting plate, and the end of the L-shaped connecting plate away from the mounting cylinder is fixedly connected to a supporting ring.

[0010] Preferably, a circular groove is provided on the inner wall of the supporting ring, a steel ball is rotatably connected in the circular groove of the supporting ring, a side of the steel ball away from the supporting ring is rotatably connected to a circular plate, a sliding groove matching the steel ball is provided on the side surface of the circular plate, four arc-shaped sliding holes are provided on the surface of the circular plate, and the driving rod passes through the arc-shaped sliding holes of the circular plate and is slidably connected to the arc-shaped sliding holes of the circular plate.

[0011] Preferably, a first support plate is fixedly connected to the left surface of the support ring, a second support plate is fixedly connected to the right side of the support ring, and sliding grooves are opened on the inner walls on both sides of the body, and the first support plate and the second support plate slide in the sliding grooves on the left and right sides of the body respectively.

[0012] Preferably, a rotating rod is fixedly connected to the bottom surface of the circular plate, the rotating rod passes through the supporting ring and is rotatably connected to the supporting ring, a gear passes through the surface of the rotating rod and is fixedly connected to the rotating rod, and a moving block is rotatably connected to the bottom of the rotating rod.

[0013] Preferably, a threaded rod passes through the interior of the moving block and is threadedly connected to the moving block, both ends of the threaded rod are rotatably connected to the inner wall of the machine body, a handle is fixedly connected to the surface of the threaded rod near the machine door, the handle passes through the machine body and is rotatably connected to the machine body, a rack is fixedly connected to the inner wall of the machine body near the handle, and the rack is meshed with the gear.

[0014] Compared with the prior art, the utility model provides a hot pressing device for semiconductor processing, which has the following beneficial effects:

[0015] 1. The hot pressing equipment for semiconductor processing places the semiconductor on a semiconductor placement plate, and then presses down the semiconductor placement plate to drive the limit plate at the bottom to move downward into the installation cylinder. The limit plate contacts the clamping plate, and the clamping plate slides to the outside of the installation cylinder by squeezing the sliding rod and the spring, so that the limit plate slides over the clamping plate. When the limit plate contacts the bottom inner wall of the installation cylinder, the clamping plate enters the limit groove of the limit plate under the action of the spring return force, fixes and clamps the limit plate, and thus the semiconductor placement plate is fixedly installed. The operation is simple and fast, saving a lot of time.

[0016] 2. The hot pressing equipment for semiconductor processing drives the threaded rod to rotate by turning the handle, and the rotation of the threaded rod drives the moving block to slide to the edge of the machine body. When the moving block drives the top rotating rod, the supporting ring, the mounting cylinder, and the semiconductor placement plate to slide to the edge of the machine body, the gear and the rack engage, so that the gear drives the rotating rod and the circular plate to rotate. When the circular plate rotates, it drives the driving rod to slide in the arc-shaped sliding hole of the circular plate, so that the driving rod pulls the sliding rod to slide to the outside of the mounting cylinder through the connecting block, thereby driving the card plate to disengage from the limiting groove of the limiting plate, releasing the limit on the semiconductor placement plate. The entire process does not require manual labor to pick up the semiconductor, which can prevent burns and achieve automatic disassembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the overall structure of a hot pressing device for semiconductor processing proposed by the utility model;

[0018] Figure 2 This is a schematic structural diagram of the top cross-section of a body in a hot pressing device for semiconductor processing proposed by the utility model;

[0019] Figure 3 A hot pressing device for semiconductor processing proposed by the utility model Figure 2 Schematic diagram of the structure of part A;

[0020] Figure 4 This is a schematic diagram of the structure of a cutaway support ring in a hot pressing device for semiconductor processing proposed by the utility model;

[0021] Figure 5 A hot pressing device for semiconductor processing proposed by the utility model Figure 4 Schematic diagram of the structure of part C;

[0022] Figure 6 The utility model is a schematic diagram of the structure of a cylinder installed in a hot pressing device for semiconductor processing from a top view.

[0023] In the figure: 1. body; 2. door; 3. semiconductor placement plate; 4. limit plate; 5. mounting cylinder; 6. clamping plate; 7. sliding rod; 8. spring; 9. connecting block; 10. driving rod; 11. L-shaped connecting plate; 12. supporting ring; 13. steel ball; 14. circular plate; 15. first supporting plate; 16. second supporting plate; 17. rotating rod; 18. gear; 19. moving block; 20. threaded rod; 21. handle; 22. rack. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0025] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0026] Reference Figure 1-Figure 6 A hot pressing device for semiconductor processing includes a machine body 1 and a machine door 2. A semiconductor placement plate 3 is arranged inside the machine body 1, and also includes: a limit plate 4, which is fixedly connected to the bottom of the semiconductor placement plate 3, and the surface of the limit plate 4 is provided with four limit grooves; a mounting cylinder 5, which is slidably arranged in the machine body 1, and the mounting cylinder 5 is slidably connected with four clamping plates 6, and the clamping plates 6 are slidably connected with the limit grooves of the limit plate 4; a sliding rod 7, which is fixedly connected to the side surface of the clamping plate 6, and a spring 8 is sleeved on the sliding rod 7. When the semiconductor needs to be hot-pressed, the semiconductor is placed On the semiconductor placement plate 3, the semiconductor placement plate 3 is then pressed downward to drive the limiting plate 4 at the bottom downward into the installation cylinder 5, and the limiting plate 4 contacts the clamping plate 6, and the clamping plate 6 slides to the outside of the installation cylinder 5 by squeezing the sliding rod 7 and the spring 8, so that the limiting plate 4 slides over the clamping plate 6. When the limiting plate 4 contacts the bottom inner wall of the installation cylinder 5, the clamping plate 6 enters the limiting groove of the limiting plate 4 under the action of the spring 8 to reset, and fixes and clamps the limiting plate 4, thereby fixing and installing the semiconductor placement plate 3. The operation is simple and fast, saving a lot of time.

[0027] The sliding rod 7 passes through the mounting cylinder 5 and is slidably connected to the mounting cylinder 5. There are four groups of sliding rods 7 and they are all arranged in a circular array with the center line of the mounting cylinder 5 as the symmetry axis. The four groups of sliding rods 7 drive the clamping plate 6 to enter the limiting groove of the limiting plate 4, which helps to fix the limiting plate 4 more stably. The four groups of sliding rods 7 provide guidance, making the entire limiting process more stable.

[0028] One end of the spring 8 is fixedly connected to the clamping plate 6, and the other end of the spring 8 is fixedly connected to the inner wall of the mounting cylinder 5. The spring 8 helps to make the clamping plate 6 fit more closely with the limiting groove of the limiting plate 4, thereby achieving a better mounting effect.

[0029] The end of the sliding rod 7 away from the clamping plate 6 is fixedly connected to a connecting block 9, the bottom of the connecting block 9 is fixedly connected to a driving rod 10, the top surface of the mounting cylinder 5 is fixedly connected to an L-shaped connecting plate 11, and the end of the L-shaped connecting plate 11 away from the mounting cylinder 5 is fixedly connected to a supporting ring 12, and the mounting cylinder 5 and the supporting ring 12 can be fixedly connected through the L-shaped connecting plate 11.

[0030] A circular groove is provided on the inner wall of the supporting ring 12, a steel ball 13 is rotatably connected in the circular groove of the supporting ring 12, a circular plate 14 is rotatably connected on the side of the steel ball 13 away from the supporting ring 12, a sliding groove adapted to the steel ball 13 is provided on the side surface of the circular plate 14, four arc-shaped sliding holes and a linear sliding groove are provided on the surface of the circular plate 14, the driving rod 10 passes through the arc-shaped sliding hole of the circular plate 14 and is slidably connected with the arc-shaped sliding hole of the circular plate 14, and the circular plate 14 can be rotated in the supporting ring 12 through the steel ball 13 The movement is smoother. When the card plate 6 drives the sliding rod 7 to slide outside, it can enter the linear slide groove of the circular plate 14. After being limited by the limit plate 4, it can automatically return to its original position under the action of the spring 8. When the circular plate 14 rotates, it can drive the driving rod 10 to slide simultaneously in the four arc grooves on its surface. The driving rod 10 can pull the sliding rod 7 to slide to the outside of the mounting cylinder 5 through the connecting block 9, thereby pulling the card plate 6 out of the limit groove of the limit plate 4, releasing the limit on the limit plate 4, and thus disassembling the semiconductor placement plate 3.

[0031] A first support plate 15 is fixedly connected to the left surface of the support ring 12, and a second support plate 16 is fixedly connected to the right side of the support ring 12. Slide grooves are opened on the inner walls of both sides of the body 1, and the first support plate 15 and the second support plate 16 slide in the slide grooves on the left and right sides of the body 1 respectively. The first support plate 15 and the second support plate 16 can provide support for the support ring 12, and at the same time, can prevent the support ring 12 from rotating, which helps to make the rotation of the circular plate 14 more stable.

[0032] A rotating rod 17 is fixedly connected to the bottom surface of the circular plate 14 , and the rotating rod 17 passes through the supporting ring 12 and is rotatably connected to the supporting ring 12 . A gear 18 passes through the surface of the rotating rod 17 and is fixedly connected to the rotating rod 17 . A moving block 19 is rotatably connected to the bottom of the rotating rod 17 .

[0033] A threaded rod 20 penetrates the interior of the moving block 19 and is threadedly connected to the moving block 19. Both ends of the threaded rod 20 are rotatably connected to the inner wall of the body 1. A handle 21 is fixedly connected to the surface of the threaded rod 20 near the machine door 2. The handle 21 penetrates the body 1 and is rotatably connected to the body 1. A rack 22 is fixedly connected to the inner wall of the body 1 near the handle 21, and the rack 22 is meshed with the gear 18. The threaded rod 20 is rotated by rotating the handle 21, so that the moving block 19 can slide toward the edge of the body 1. When the moving block 19 drives the rotating rod 17, the supporting ring 12, the mounting cylinder 5, and the semiconductor placement plate 3 to move to the edge of the body 1, the gear 18 is meshed with the rack 22 to rotate the gear 18, thereby driving the rotating rod 17 and the circular plate 14 to rotate automatically, thereby automatically releasing the limit on the semiconductor placement plate 3.

[0034] In the utility model, when it is necessary to perform hot pressing operation on the semiconductor, the semiconductor is placed on the semiconductor placement plate 3, and then the semiconductor placement plate 3 is pressed downward, driving the bottom limit plate 4 to enter the installation cylinder 5 and contact with the clamping plate 6. When the limit plate 4 contacts the bottom inner wall of the installation cylinder 5, the clamping plate 6 automatically enters the limit groove of the limit plate 4 under the action of the spring 8 to clamp and fix it, thereby completing the rapid installation. When the hot pressing is completed, the handle 21 is turned to drive the threaded rod 20 to rotate, and the rotation of the threaded rod 20 drives the moving block 19 to slide toward the edge of the body 1, and the moving block 19 drives the top When the rotating rod 17, the supporting ring 12, the mounting cylinder 5, and the semiconductor placement plate 3 slide to the edge of the body 1, the gear 18 engages with the rack 22, so that the gear 18 drives the rotating rod 17 and the circular plate 14 to rotate. When the circular plate 14 rotates, it drives the driving rod 10 to slide in the arc-shaped sliding hole of the circular plate 14, so that the driving rod 10 pulls the sliding rod 7 to slide to the outside of the mounting cylinder 5 through the connecting block 9, thereby driving the clamping plate 6 to disengage from the limiting groove of the limiting plate 4, releasing the limiting of the semiconductor placement plate 3. The whole process does not require manual picking up of semiconductors, which can prevent burns and realize automatic disassembly.

[0035] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A hot pressing device for semiconductor processing, comprising a body (1) and a door (2), characterized in that: The machine body (1) is provided with a semiconductor placement plate (3) inside, and further comprises: A limiting plate (4) is fixedly connected to the bottom of the semiconductor placement plate (3), and the surface of the limiting plate (4) is provided with four limiting grooves; A mounting cylinder (5) is slidably arranged in the machine body (1); four clamping plates (6) are slidably connected inside the mounting cylinder (5); the clamping plates (6) are slidably connected to the limiting grooves of the limiting plates (4); a sliding rod (7) is fixedly connected to the side surface of the clamping plate (6); a spring (8) is sleeved on the sliding rod (7).

2. A hot pressing device for semiconductor processing according to claim 1, characterized in that: The sliding rod (7) passes through the mounting cylinder (5) and is slidably connected to the mounting cylinder (5). Four groups of the sliding rods (7) are arranged in a circular array with the center line of the mounting cylinder (5) as the axis of symmetry.

3. A hot pressing device for semiconductor processing according to claim 1, characterized in that: One end of the spring (8) is fixedly connected to the clamping plate (6), and the other end of the spring (8) is fixedly connected to the inner wall of the mounting cylinder (5).

4. A hot pressing device for semiconductor processing according to claim 1, characterized in that: The end of the sliding rod (7) away from the clamping plate (6) is fixedly connected to a connecting block (9), the bottom of the connecting block (9) is fixedly connected to a driving rod (10), the top surface of the mounting cylinder (5) is fixedly connected to an L-shaped connecting plate (11), and the end of the L-shaped connecting plate (11) away from the mounting cylinder (5) is fixedly connected to a supporting ring (12).

5. A hot pressing device for semiconductor processing according to claim 4, characterized in that: A circular groove is provided on the inner wall of the supporting circular ring (12), a steel ball (13) is rotatably connected in the circular groove of the supporting circular ring (12), a side of the steel ball (13) away from the supporting circular ring (12) is rotatably connected to a circular plate (14), a side surface of the circular plate (14) is provided with a sliding groove matched with the steel ball (13), a surface of the circular plate (14) is provided with four arc-shaped sliding holes, and the driving rod (10) passes through the arc-shaped sliding holes of the circular plate (14) and is slidably connected to the arc-shaped sliding holes of the circular plate (14).

6. A hot pressing device for semiconductor processing according to claim 4, characterized in that: A first support plate (15) is fixedly connected to the left surface of the support ring (12), and a second support plate (16) is fixedly connected to the right side of the support ring (12). Slide grooves are provided on the inner walls on both sides of the machine body (1), and the first support plate (15) and the second support plate (16) slide in the slide grooves on the left and right sides of the machine body (1), respectively.

7. A hot pressing device for semiconductor processing according to claim 5, characterized in that: The bottom surface of the circular plate (14) is fixedly connected to a rotating rod (17), the rotating rod (17) passes through the supporting ring (12) and is rotatably connected to the supporting ring (12), a gear (18) passes through the surface of the rotating rod (17) and is fixedly connected to the rotating rod (17), and a moving block (19) is rotatably connected to the bottom of the rotating rod (17).

8. A hot pressing device for semiconductor processing according to claim 7, characterized in that: A threaded rod (20) passes through the interior of the moving block (19) and is threadedly connected to the moving block (19); both ends of the threaded rod (20) are rotatably connected to the inner wall of the machine body (1); a handle (21) is fixedly connected to the surface of the threaded rod (20) near the machine door (2); the handle (21) passes through the machine body (1) and is rotatably connected to the machine body (1); a rack (22) is fixedly connected to the inner wall of the machine body (1) near the handle (21); and the rack (22) meshes with the gear (18).

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