Wafer cutting positioning device

Abstract

The utility model discloses a wafer cutting positioning device, which comprises a cutting wafer mounting frame, a transverse plate and a turntable, the transverse plate is transversely mounted in the cutting wafer mounting frame, a moving frame is mounted at the top end of the transverse plate, a mounting block is arranged in the moving frame, a synchronous motor is mounted at the top end of the mounting block, and a rotating shaft is mounted at the top end of the synchronous motor. A synchronous motor is installed at the top end of the cutting wafer installation frame, a rotary disc is installed at the top end of the synchronous motor through a coupler, a Z-shaped fixing support is installed at the top end of the cutting wafer installation frame, a fixing sliding rod is arranged between the inner walls of the Z-shaped fixing support, a transverse lead screw is installed in the Z-shaped fixing support through a bearing, and a transverse displacement sliding block penetrating through the fixing sliding rod is installed on the outer wall of the transverse lead screw. According to the wafer cutting device, the supporting and positioning balls are arranged to make contact with a wafer above the rotating disc for pressing, then the wafer is cut through the fixing frame, the structure is easy to operate, labor is saved, and stability during cutting is conveniently achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer cutting, in particular to a wafer cutting positioning device. Background Art

[0002] The raw material of the wafer is silicon, and there is an inexhaustible supply of silicon dioxide on the surface of the earth's crust. The silicon dioxide ore is refined in an electric arc furnace, chlorinated with hydrochloric acid, and distilled to produce high-purity polysilicon with a purity of up to 99.9999999999%. The wafer manufacturing plant then melts the polysilicon, plants seed crystals in the melt, and then slowly pulls them out to form a cylindrical single-crystal silicon rod. Since the silicon rod is gradually generated from a seed crystal with a determined crystal plane orientation in the molten silicon raw material, this process is called "crystal growth". The silicon rod is then cut, rolled, sliced, chamfered, polished, laser engraved, and packaged to become the basic raw material for the integrated circuit factory - silicon wafers, which are "wafers."

[0003] However, the existing wafer cutting positioning device has the following problems during use: the traditional processing method is not convenient for adjusting the position between the cutting equipment and the wafer, which makes positioning and wafer cutting inconvenient, affects work efficiency, and leads to low production efficiency. Utility Model Content

[0004] The purpose of the utility model is to provide a wafer cutting positioning device to solve the related problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a wafer cutting positioning device, comprising a cutting wafer mounting frame, a horizontal plate and a turntable, the cutting wafer mounting frame is laterally installed with a horizontal plate inside, and a moving frame is installed at the top of the horizontal plate, a mounting block is arranged inside the moving frame, a synchronous motor is installed at the top of the mounting block, and a turntable is installed at the top of the synchronous motor through a coupling, a Z-shaped fixed bracket is installed at the top of the cutting wafer mounting frame, and a fixed slide rod is arranged between the inner walls of the Z-shaped fixed bracket, a horizontal screw rod is installed inside the Z-shaped fixed bracket through a bearing, and a horizontal displacement slider penetrating the fixed slide rod is installed on the outer wall of the horizontal screw rod, and an electric telescopic rod is arranged at the bottom end of the horizontal displacement slider, a fixed bracket is installed on the electric telescopic rod, and a cutting pressing outer shell is arranged at the bottom end of the fixed bracket.

[0006] The technical solution provides a wafer cutting positioning device, wherein a second motor is arranged on one side of the movable frame, and a longitudinal screw rod penetrating the mounting block is installed at the output end of the second motor.

[0007] The technical solution provides a wafer cutting positioning device, wherein the inner wall of the movable frame is installed with a sliding rail, and the sliding rail is adapted to the outer wall of the mounting block.

[0008] The technical solution provides a wafer cutting positioning device, wherein a first motor is arranged on one side of the Z-shaped fixed bracket, and an output end of the first motor is connected to one end of a transverse screw rod.

[0009] The technical solution provides a wafer cutting and positioning device, wherein an arc-shaped groove is opened at the bottom end of the cutting and pressing outer shell, and a supporting and positioning ball is arranged inside the arc-shaped groove.

[0010] Compared with the prior art, the present invention provides a wafer cutting positioning device having the following features:

[0011] Beneficial effects:

[0012] 1. The utility model presses the outer shell position by cutting to support the positioning ball to move downward, so that the supporting positioning ball contacts and presses the wafer above the turntable, and then the fixed frame cuts the wafer. The structure is simple to operate, saves labor, and is easy to achieve stability during cutting.

[0013] 2. The utility model starts the second motor to drive the longitudinal screw to rotate, so that the longitudinal screw drives the mounting block to move forward and backward in the sliding rail, making it easy to align the position of the fixed frame, and then the synchronous motor can be started to drive the turntable to rotate, so as to move the wafer cutting direction. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic diagram of the main cross-sectional structure of the utility model;

[0015] Figure 2 This is a schematic diagram of the main structure of the utility model;

[0016] Figure 3 It is a schematic diagram of the cross-sectional structure of the utility model from above.

[0017] In the figure: 1. Cutting wafer mounting frame; 2. Horizontal plate; 3. Moving frame; 4. Sliding rail; 5. Mounting block; 6. First motor; 7. Horizontal screw rod; 8. Synchronous motor; 9. Turntable; 10. Fixed slide rod; 11. Electric telescopic rod; 12. Fixed frame; 13. Cutting pressing outer shell; 14. Support positioning ball; 15. Longitudinal screw rod; 16. Second motor; 17. Z-shaped fixed bracket; 18. Horizontal shift slider. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0019] Embodiment 1, as Figure 1-2 As shown, the utility model provides a technical solution: a wafer cutting positioning device, comprising a cutting wafer mounting frame 1, a transverse plate 2 and a turntable 9, the cutting wafer mounting frame 1 is laterally installed with a transverse plate 2, and a moving frame 3 is installed at the top of the transverse plate 2, a mounting block 5 is arranged inside the moving frame 3, a synchronous motor 8 is arranged at the top of the mounting block 5, and a turntable 9 is installed at the top of the synchronous motor 8 through a coupling, a second motor 16 is arranged on one side of the moving frame 3, and a longitudinal screw rod 15 penetrating the mounting block 5 is arranged at the output end of the second motor 16, a sliding rail 4 is installed on the inner wall of the moving frame 3, and the sliding rail 4 is adapted to the outer wall of the mounting block 5, the longitudinal screw rod 15 is driven to rotate by starting the second motor 16, and the longitudinal screw rod 15 drives the mounting block 5 to move forward and backward in the sliding rail 4, so that it is convenient to align the position of the fixed frame 12, and then the synchronous motor 8 can be started to drive the turntable 9 to rotate, so as to facilitate the cutting direction of the moving wafer.

[0020] Embodiment 2, as Figure 1-3 As shown, the utility model provides a technical solution: a wafer cutting positioning device, comprising a Z-shaped fixed bracket 17 installed on the top of a cutting wafer mounting frame 1, and a fixed slide bar 10 is arranged between the inner walls of the Z-shaped fixed bracket 17, a transverse screw rod 7 is installed inside the Z-shaped fixed bracket 17 through a bearing, and a transverse displacement slider 18 penetrating the fixed slide bar 10 is installed on the outer wall of the transverse screw rod 7, and an electric telescopic rod 11 is arranged at the bottom end of the transverse displacement slider 18, a fixed frame 12 is installed on the electric telescopic rod 11, and a cutting pressing outer shell 13 is arranged at the bottom end of the fixed frame 12, a first motor 6 is arranged on one side of the Z-shaped fixed bracket 17, and the output end of the first motor 6 is connected to the output end of the first motor 6. One end of the transverse screw rod 7 is connected, and an arc groove is opened at the bottom end of the cutting and pressing outer shell 13, and a supporting positioning ball 14 is arranged inside the arc groove. By starting the first motor 6, the transverse shift slider 18 is driven to move left and right in the fixed slide rod 10, and then the fixed frame 12 can move left and right. When height adjustment is required, the electric telescopic rod 11 can be started to push the fixed frame 12 downward and squeeze it. At the same time, the supporting positioning ball 14 at the position of the cutting and pressing outer shell 13 moves downward, so that the supporting positioning ball 14 is in contact and pressed with the wafer above the turntable 9, and then the fixed frame 12 cuts the wafer. This structure is simple to operate, saves labor, and is convenient for achieving stability during cutting.

[0021] Working principle: first, turn on the external power supply, and the operator places the wafer on the top of the turntable 9. The second motor 16 can be started to drive the longitudinal screw 15 to rotate, so that the longitudinal screw 15 drives the mounting block 5 to move forward and backward in the sliding rail 4, so that it is convenient to align the position of the fixed frame 12, and then the synchronous motor 8 can be started to drive the turntable 9 to rotate, so as to move the wafer cutting direction, and then the first motor 6 is started to drive the lateral shift slider 18 to move left and right in the fixed slide bar 10, so that the fixed frame 12 can move left and right. When height adjustment is required, the electric telescopic rod 11 can be started to push the fixed frame 12 downward and squeeze it. At the same time, the support positioning ball 14 at the position of the cutting and pressing outer shell 13 moves downward, so that the support positioning ball 14 is in contact and pressed with the wafer above the turntable 9, and then the fixed frame 12 cuts the wafer. This structure is simple to operate, saves labor, and is convenient for achieving stability during cutting.

[0022] Finally, it should be noted that the above content is only used to illustrate the technical solution of the utility model, rather than to limit the protection scope of the utility model. Simple modifications or equivalent substitutions of the technical solution of the utility model by ordinary technicians in this field do not deviate from the essence and scope of the technical solution of the utility model.

Claims

1. A wafer cutting positioning device, comprising a cutting wafer mounting frame (1), a horizontal plate (2) and a turntable (9), characterized in that: A transverse plate (2) is installed transversely inside the cutting wafer mounting frame (1), and a movable frame (3) is installed on the top of the transverse plate (2). A mounting block (5) is arranged inside the movable frame (3), and a synchronous motor (8) is installed on the top of the mounting block (5), and a turntable (9) is installed on the top of the synchronous motor (8) through a coupling. A Z-shaped fixed bracket (17) is installed on the top of the cutting wafer mounting frame (1), and a fixed slide bar (10) is arranged between the inner walls of the Z-shaped fixed bracket (17). A transverse screw rod (7) is installed inside the Z-shaped fixed bracket (17) through a bearing, and a transverse displacement slider (18) penetrating the fixed slide bar (10) is installed on the outer wall of the transverse screw rod (7), and an electric telescopic rod (11) is arranged at the bottom end of the transverse displacement slider (18), and a fixed bracket (12) is installed on the electric telescopic rod (11), and a cutting pressing outer shell (13) is arranged at the bottom end of the fixed bracket (12).

2. A wafer cutting positioning device according to claim 1, characterized in that: A second motor (16) is provided on one side of the movable frame (3), and a longitudinal screw rod (15) penetrating the mounting block (5) is installed at the output end of the second motor (16).

3. The wafer cutting positioning device according to claim 1, characterized in that: The inner wall of the movable frame (3) is installed with a sliding rail (4), and the sliding rail (4) is matched with the outer wall of the mounting block (5).

4. The wafer cutting positioning device according to claim 1, characterized in that: A first motor (6) is disposed on one side of the Z-shaped fixing bracket (17), and an output end of the first motor (6) is connected to one end of a transverse screw rod (7).

5. The wafer cutting positioning device according to claim 1, characterized in that: An arc-shaped groove is formed at the bottom end of the cutting and pressing outer shell (13), and a supporting and positioning ball (14) is arranged inside the arc-shaped groove.

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