Stylus heat dissipation structure and stylus
By setting heat conductors and magnetic suction parts on the PCB board of the stylus to absorb and transfer heat, the problem of insufficient heat dissipation ability of the existing stylus is solved, and the heat dissipation efficiency is significantly improved.
Patent Information
- Application Number
- CN202323530079.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-22
- Publication Date
- 2025-02-14
- Estimated Expiration
- 2033-12-22
AI Technical Summary
The existing stylus has relatively limited heat dissipation capabilities and cannot effectively extend the duration of over-temperature protection of charging ICs.
Set a heat conductor on the PCB board and arrange the heating components below the heat conductor to absorb heat to dissipate heat; set a magnetic suction piece on the heat conductor to absorb heat from the heat conductor using the thermal conductor performance of the magnetic suction piece to absorb heat on the heat conductor, and Heat is transferred out of the stylus.
By adding the device of magnetic suction and heat conduction parts, the heat dissipation ability of the stylus is improved. Compared with the PCB board that relies solely on copper to dissipate heat, the heat dissipation efficiency is significantly improved.
Smart Images
Figure CN222482707U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of touch pens, and in particular to a touch pen heat dissipation structure and a touch pen. Background Art
[0002] With the widespread use of smart phones and tablets, more and more application software requires higher precision touch, such as painting software, and the demand for the use of stylus is gradually becoming more widespread, and the performance requirements for stylus are also getting higher and higher. Active stylus is a high-precision, low-cost stylus solution with excellent user experience that is implemented on the hardware basis of the existing capacitive touch screen system.
[0003] The existing stylus heat dissipation method is generally to transfer the heat in the device to the PCB board for device heat dissipation by laying copper in the free space of the PCB board in the stylus. The heat dissipation of this method is related to the size of the copper laying area. However, since the thickness of the PCB board itself is relatively thin, even if the copper laying area is increased as much as possible, the heat dissipation capacity of this method is relatively limited. Therefore, this heat dissipation method is also of limited help in extending the time it takes to reach the over-temperature protection of the charging IC. Utility Model Content
[0004] The main purpose of the utility model is to provide a stylus heat dissipation structure, aiming to improve the heat dissipation capacity of the stylus.
[0005] To achieve the above-mentioned purpose, the utility model proposes a stylus heat dissipation structure, including: a PCB board, a heat-conducting member and a magnetic attraction member, the PCB board is provided with a heat-generating component; the heat-conducting member is arranged on the PCB board, the heat-conducting member has a first area covering the heat-generating component; the magnetic attraction member is arranged in the first area of the heat-conducting member.
[0006] Optionally, the magnetic attraction member is arranged on a side of the heat conductive member away from the heat generating component.
[0007] Optionally, the heat conducting member is a heat conducting steel sheet.
[0008] Optionally, the heat conductive part includes a middle sheet and side sheets arranged on opposite sides of the middle sheet, the side sheets are offset by a preset distance in a direction away from the heat generating component, the side sheets are arranged above the heat generating component, and the middle sheet is arranged on a flat part of the PCB board.
[0009] Optionally, a heat conductor is further included, and the heat conductor is arranged between the heat-generating component and the side sheet, and the heat conductor is also arranged between the magnetic attraction member and the heat-conducting member.
[0010] Optionally, the heat conductor is thermally conductive silica gel and / or thermally conductive silicone grease.
[0011] Optionally, a charging coil is further included, and the charging coil is arranged on a side of the middle sheet away from the PCB board.
[0012] Optionally, the heat conductor is provided between the charging coil and the heat conductor.
[0013] Optionally, two magnetic suction members are provided, and the two magnetic suction members are respectively arranged on the side of the side sheet body facing away from the heat generating component.
[0014] The utility model further provides a touch pen, comprising a shell and a heat dissipation structure installed in the shell, wherein the heat dissipation structure is any one of the above heat dissipation structures of the touch pen.
[0015] The technical solution of the utility model is to set a heat-conducting member on the PCB board, and arrange the main heat-generating components of the PCB board under the heat-conducting member to absorb the heat of the PCB board for dissipation, and set a magnetic suction member on the heat-conducting member, and use the thermal conductivity of the magnetic suction member to absorb the heat on the heat-conducting member, and transfer the heat out of the stylus for structural heat dissipation. In this solution, on the basis of the heat dissipation capacity of the PCB board itself, the magnetic suction member and the heat-conducting member are added to dissipate heat for the device, which improves the heat dissipation capacity of the structure compared to the PCB board that only relies on copper cloth for heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.
[0017] Figure 1 An exploded view of an embodiment of a heat dissipation structure of a touch pen according to the utility model;
[0018] Figure 2 It is a structural schematic diagram of an embodiment of a heat dissipation structure of a touch pen of the utility model.
[0019] Description of Figure Numbers:
[0020]
[0021]
[0022] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION
[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0024] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.
[0025] In addition, the descriptions of "first", "second", etc. in the present utility model are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in this field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present utility model.
[0026] The utility model provides a heat dissipation structure of a touch pen.
[0027] Reference Figure 1 In one embodiment, to achieve the above-mentioned purpose, the utility model proposes a stylus heat dissipation structure, including: a PCB board 1, a heat conductive member 2 and a magnetic member 3, the PCB board 1 is provided with a heat generating component 11; the heat conductive member 2 is arranged on the PCB board 1, and the heat conductive member 2 has a first area covering the heat generating component 11; the magnetic member 3 is arranged in the first area of the heat conductive member 2.
[0028] In this embodiment, the PCB board 1 includes a substrate, a path, electronic components and copper foil; the electronic components are fixed on the substrate and generate heat when working. The electronic components are electrically connected through the path and the path is fixed to the substrate to realize the function of the stylus. The copper foil is a heat dissipation structure arranged inside the PCB board 1 to absorb the heat of the electronic components. The larger the area of the copper foil, the higher the heat dissipation efficiency of the PCB board 1. On the basis that the PCB board 1 itself has copper foil for heat dissipation, a heat conductor 2 is arranged outside the PCB board 1, and the electronic components are arranged and fixed in advance in the area covered by the heat conductor 2, so that the heat conductor 2 can absorb the heat of the heat-generating components 11 and dissipate heat for the heat-generating components 11. At the same time, a magnetic attraction member 3 is arranged on the heat conductor 2. The magnetic attraction member 3 is not only used to adsorb the stylus on the device, but also used to absorb the heat from the heat conductor 2 and transfer the heat out of the stylus.
[0029] The technical solution of the utility model is to set a heat conducting member 2 on the PCB board 1, and arrange the main heat generating components 11 of the PCB board 1 under the heat conducting member 2 to absorb the heat of the PCB board 1 for heat dissipation, and set a magnetic member 3 on the heat conducting member 2, and utilize the heat conductivity of the magnetic member 3 to absorb the heat on the heat conducting member 2, and transfer the heat out of the stylus for structural heat dissipation. In this solution, the magnetic member 3 and the heat conducting member 2 are added on the basis of the heat dissipation capacity of the PCB board 1 itself to dissipate heat for the device, which improves the heat dissipation capacity of the stylus compared to the PCB board 1 that only relies on copper cloth for heat dissipation.
[0030] In one embodiment, the magnetic member 3 is disposed on the side of the heat conductive member 2 facing away from the heat generating component 11, so that the heat is transferred from the heat generating component 11 to the heat conductive member 2 and then from the other side to the magnetic member 3, and then transferred out of the structure through the magnetic member 3.
[0031] In one embodiment, the heat conducting member 2 is a heat conducting steel sheet having good thermal conductivity. When in a high heat environment, the heat conducting steel sheet can quickly absorb heat and heat up in a short time. When in contact with a component with lower heat than itself, the heat can be quickly transferred out.
[0032] In one embodiment, the heat-conducting member 2 includes a middle sheet and side sheets disposed on opposite sides of the middle sheet, the side sheets are offset by a preset distance in a direction away from the heat-generating component 11, the side sheets are disposed above the heat-generating component 11, and the middle sheet is disposed at a flat part of the PCB board 1. Since the heat-generating component 11 will form an uneven protrusion above the plane of the substrate after being fixed on the substrate, the heat-conducting steel sheet can be divided into a middle sheet located in the middle of the steel sheet and side sheets connected to both sides of the middle sheet by bending, and the side sheets are not in the same horizontal plane as the middle sheet, but are offset by a certain distance in a direction away from the heat-generating component 11, and the distance can be determined according to the height of the heat-generating component 11 protruding from the PCB board 1, so that when the middle sheet is fixed on a flat part of the PCB board 1, there is enough space below the side sheets on both sides to accommodate the heat-generating component 11 to absorb the heat of the heat-generating component 11.
[0033] In one embodiment, a heat conductor 4 is also included. The heat conductor 4 is arranged between the heat-generating component 11 and the side sheet. The heat conductor 4 is also arranged between the magnetic component 3 and the heat-conducting component 2. The heat conductor 4 has viscosity and thermal conductivity, can fill the gap between the heat-conducting component 2 and the heat-generating component 11 and bond them to fix them, and can also bond the magnetic component 3 and the heat-conducting component 2 to fix the magnetic component 3 on the heat-conducting component 2.
[0034] In one embodiment, the heat conductor 4 is thermally conductive silicone and / or thermally conductive silicone grease, which have good resistance to alternating hot and cold, aging resistance and electrical insulation properties, so that the heat conductor 4 can continue to play a role in the future practical use of the stylus pen, ensuring its thermal conductivity and viscosity.
[0035] In one embodiment, the stylus pen heat dissipation structure further includes a charging coil 5 , which is disposed on a side of the middle sheet away from the PCB board 1 , and the heat generated by the charging coil 5 can also be absorbed by the heat conductor 2 through the middle sheet.
[0036] In one embodiment, a heat conductor 4 is provided between the charging coil 5 and the heat conductor 2 , and the bonding and heat transfer between the charging coil 5 and the heat conductor 2 are also achieved through the heat conductor 4 .
[0037] In one embodiment, two magnetic components 3 are provided, and the two magnetic components 3 are respectively arranged on the side of the two side sheets away from the heating element 11, so that the overall structural quality is more balanced, and the active pen can be more stable when it is adsorbed on the device and is not easy to fall off.
[0038] The utility model also proposes a stylus pen, comprising a housing and a heat dissipation structure installed in the housing, which is any one of the above stylus pen heat dissipation structures. The heat dissipation structure is fixed in the housing, and the magnet in the stylus pen heat dissipation structure can be adsorbed on the device through the housing, so that the stylus pen can be magnetically charged and the stylus pen can be dissipated at the same time, and the heat can be transferred out of the housing.
[0039] The above description is only an optional embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the technical concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.
Claims
1. A stylus pen heat dissipation structure, characterized in that: include: A PCB board, wherein the PCB board is provided with heat generating components; A heat conducting member, disposed on the PCB, wherein the heat conducting member has a first area covering the heat generating component; as well as The magnetic attraction component is arranged in the first area of the heat conducting component.
2. The stylus pen heat dissipation structure according to claim 1, characterized in that: The magnetic attraction member is arranged on a side of the heat conducting member away from the heat generating component.
3. The stylus pen heat dissipation structure according to claim 1, characterized in that: The heat conducting member is a heat conducting steel sheet.
4. The stylus pen heat dissipation structure according to claim 1, wherein: The heat-conducting member includes a middle sheet and side sheets arranged on opposite sides of the middle sheet, the side sheets are offset by a preset distance relative to the middle sheet in a direction away from the PCB board, the side sheets are arranged above the heat-generating components, the area where the side sheets are located constitutes the first area of the PCB board, and the middle sheet is arranged in contact with the PCB board.
5. The stylus pen heat dissipation structure according to claim 4, characterized in that: It also includes a heat conductor, which is arranged between the heat-generating component and the side sheet; and / or, the heat conductor is also arranged between the magnetic attraction member and the heat-conducting member.
6. The stylus pen heat dissipation structure according to claim 5, characterized in that: The heat conductor is heat-conducting silica gel and / or heat-conducting silicone grease.
7. The stylus pen heat dissipation structure according to claim 4, characterized in that: It also includes a charging coil, which is arranged on a side of the middle sheet away from the PCB board.
8. The stylus pen heat dissipation structure according to claim 7, wherein: A heat conductor is provided between the charging coil and the heat conductive member.
9. The stylus pen heat dissipation structure according to claim 4, characterized in that: There are two magnetic suction members, and the two magnetic suction members are respectively arranged on the side of the side sheet body facing away from the heating element.
10. A touch pen, characterized in that: It comprises a shell and a heat dissipation structure installed in the shell, and the heat dissipation structure is the stylus heat dissipation structure according to any one of claims 1 to 9.