Ceramic packaging airtight structure

Abstract

The utility model relates to the technical field of packaging, and discloses a ceramic packaging airtight structure which comprises a cover plate, two clamping blocks are connected to the top of the cover plate in a clamped mode, one ends of the two clamping blocks penetrate through the outer side of the cover plate to be connected with a base, and two inserting blocks are connected to the two sides of the base in a clamped mode. One ends of the two inserting blocks penetrate through the outer side of the base to be connected with clamping blocks, the tops of the two clamping blocks are in threaded connection with limiting rods, and one ends of the two limiting rods penetrate through the outer sides of the clamping blocks to be connected with the base; the cover plate is clamped along the placement groove of the base, the clamping block sequentially penetrates through the cover plate, the base and the clamping groove, then the insertion block sequentially penetrates through the outer side of the base, the insertion hole of the clamping block and the insertion groove formed in one side of the square groove, and then the limiting rod penetrates into the groove position of the bottom face of the square groove from the outer side of the clamping block; and slot position clamping is completed on the outer side of the placement slot on the outer side of the base, so that the effects of enhancing airtightness and preventing the cover plate from being separated from the base are achieved.

Description

Technical Field

[0001] The present application relates to the field of packaging technology, and in particular to an airtight structure of a ceramic package. Background Art

[0002] Ceramic packaging is a packaging form that uses ceramic materials as the main packaging material. Compared with traditional metal packaging, ceramic packaging has the advantages of higher insulation performance, stronger corrosion resistance and lower thermal expansion coefficient. These advantages make ceramic packaging have better stability and reliability in harsh environments such as high temperature, high humidity, and high salt spray. Therefore, it is widely used in aviation, aerospace, military, medical and other fields;

[0003] Existing ceramic packages are fixed directly with bolts or snaps. Bolt fixing and disassembly are cumbersome and the chip is easily scratched during the disassembly process. The snap fixing cover and the base are loose and have poor air tightness. Utility Model Content

[0004] In order to solve the problems of cumbersome disassembly and poor airtightness, the present application provides a ceramic packaging airtight structure.

[0005] The ceramic packaging airtight structure provided in this application adopts the following technical solution:

[0006] A ceramic packaging airtight structure comprises a cover plate, wherein the top of the cover plate is snap-connected with two card blocks, one end of each of the two card blocks penetrates from the outside of the cover plate to connect to a base, two plug blocks are snap-connected on both sides of the base, one end of each of the two plug blocks penetrates from the outside of the base to connect to the card blocks, the tops of the two card blocks are threadedly connected with limiting rods, one end of each of the two limiting rods penetrates from the outside of the card blocks to connect to the base.

[0007] Preferably, a damping plate is fixedly mounted on the bottom end of the cover plate, four telescopic columns are fixedly mounted on the bottom surface of the damping plate, and a polymer rubber plate is fixedly mounted on one end of the telescopic column.

[0008] Preferably, four blocks are fixedly mounted on the bottom surface of the cover plate, and one side of the block is snap-connected with a base.

[0009] Preferably, four square grooves are provided on both sides of the top of the base, and a placement groove is provided in the middle of the base.

[0010] Preferably, two clamping holes are provided on the top of the cover plate.

[0011] In summary, this application includes the following beneficial technical effects:

[0012] 1. The cover plate is engaged along the placement groove of the base, the card block is passed through the cover plate, the base and the card groove in sequence, and then the plug block is passed through the outside of the base, the plug hole of the card block, and the slot opened on one side of the square groove in sequence, and then the limiting rod is passed from the outside of the card block to the slot on the bottom surface of the square groove, and the slot engagement is completed on the outside of the placement groove on the outside of the base, which does not affect the airtightness in the placement groove; compared with the prior art, it has the effects of convenient disassembly and assembly, preventing the cover plate from being separated from the base, and enhancing the airtightness;

[0013] 2. The polymer rubber plate of the cover plate is placed close to the chip in the placement groove, and the telescopic column will shrink according to the thickness of the chip. After the square block is engaged with the square groove, the damping plate is also engaged with the placement groove. The damping plate and the polymer rubber plate are equal in size to the placement groove, filling the space of the placement groove; compared with the existing technology, it has the effect of enhancing air tightness and protecting chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the overall structure of the embodiment of the application;

[0015] Figure 2 It is a schematic diagram of the exploded structure of an embodiment of the application;

[0016] Figure 3 It is a schematic diagram of the cover plate structure of an embodiment of the application.

[0017] Explanation of the reference numerals: 1. cover plate; 2. block; 3. base; 4. insert block; 5. limiting rod; 6. damping plate; 7. telescopic column; 8. polymer rubber plate; 9. block; 10. square groove. DETAILED DESCRIPTION

[0018] The following is combined with Figure 1-3 This application is described in further detail.

[0019] The present application embodiment discloses a ceramic package airtight structure, referring to Figure 1When the cam 3 is unlocked, the cam 3 is unlocked, and the two ends of the cam 3 are unlocked, so that the cam 3 can be unlocked easily.

[0020] Reference Figure 1 A damping plate 6 is fixedly installed at the bottom end of the cover plate 1, and four telescopic columns 7 are fixedly installed on the bottom surface of the damping plate 6. A polymer rubber plate 8 is fixedly installed at one end of the telescopic column 7. During transportation, the chip will shake and scratch in the placement groove, which will damage the performance of the chip. The polymer rubber plate 8 is close to the chip to protect the chip. When the chip is placed in the placement groove of the base 3, the polymer rubber plate 8 of the cover plate 1 is close to the chip in the placement groove. The telescopic column 7 will shrink according to the thickness of the chip. After the square block 9 is engaged with the square groove 10, the damping plate 6 is also engaged with the placement groove. The damping plate 6 and the polymer rubber plate 8 are equal in size to the placement groove, filling the space of the placement groove, thereby enhancing the air tightness and protecting the chip.

[0021] Reference Figure 1 Four blocks 9 are fixedly mounted on the bottom surface of the cover plate 1, and one side of the block 9 is snap-connected with the base 3. The four blocks 9 assist in the strength of the snap-fit ​​to prevent the cover plate 1 from being directly separated from the base 3.

[0022] Reference Figure 1 Four square grooves 10 are provided on both sides of the top of the base 3, and a placement groove is provided in the middle of the base 3. The four square grooves 10 assist in the engagement.

[0023] Reference Figure 1 Two card holes are opened on the top of the cover plate 1, which provide conditions for the card block 2 to pass through, further enhancing the air tightness of the structure.

[0024] The implementation principle of the airtight structure of a ceramic package in the embodiment of the present application is as follows: first, the chip is placed in the base 3, and then the cover plate 1 is engaged along the placement groove of the base 3. Secondly, when the chip is placed in the placement groove of the base 3, when the polymer rubber plate 8 of the cover plate 1 is close to the chip in the placement groove, the telescopic column 7 will shrink according to the thickness of the chip. After the square block 9 is engaged with the square groove 10, the damping plate 6 is also engaged with the placement groove. The damping plate 6 and the polymer rubber plate 8 are equal in size to the placement groove, filling the space of the placement groove to achieve the effect of enhancing airtightness and protecting the chip. Finally, the card block 2 is passed through the cover plate 1, the base 3 and the card groove in turn, and the insertion block 4 is passed through the outside of the base 3, the jack of the card block 2, and the slot opened on one side of the square groove 10 in turn, and then the limiting rod 5 is passed from the outside of the card block 2 to the slot on the bottom surface of the square groove 10, and the slot engagement is completed on the outside of the placement groove on the outside of the base 3, without affecting the airtightness in the placement groove, thereby achieving the effect of enhancing airtightness.

[0025] Finally, a few points should be explained: First, in the description of this application, it should be noted that, unless otherwise specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, which may refer to mechanical connection or electrical connection, or internal communication between two components, or direct connection. "upper", "lower", "left", "right", etc. are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may change;

[0026] Secondly: In the drawings of the embodiments disclosed in the present utility model, only the structures related to the embodiments disclosed in the present utility model are involved, and other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of the present utility model can be combined with each other;

[0027] Finally: The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present utility model should be included in the protection scope of the present utility model.

[0028] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A ceramic package airtight structure, comprising a cover plate (1), characterized in that: The top of the cover plate (1) is snap-connected with two card blocks (2), one end of each of the two card blocks (2) passes through the outside of the cover plate (1) to connect to the base (3), two plug blocks (4) are snap-connected on both sides of the base (3), one end of each of the two plug blocks (4) passes through the outside of the base (3) to connect to the card blocks (2), the tops of the two card blocks (2) are threadedly connected with limiting rods (5), one end of each of the two limiting rods (5) passes through the outside of the card blocks (2) to connect to the base (3).

2. The ceramic packaging airtight structure according to claim 1, characterized in that: A damping plate (6) is fixedly mounted on the bottom end of the cover plate (1), four telescopic columns (7) are fixedly mounted on the bottom surface of the damping plate (6), and a polymer rubber plate (8) is fixedly mounted on one end of the telescopic column (7).

3. The ceramic packaging airtight structure according to claim 1, characterized in that: Four blocks (9) are fixedly mounted on the bottom surface of the cover plate (1), and one side of the block (9) is snap-connected with a base (3).

4. The ceramic packaging airtight structure according to claim 1, characterized in that: Four square grooves (10) are provided on both sides of the top of the base (3), and a placement groove is provided in the middle of the base (3).

5. The ceramic packaging airtight structure according to claim 1, characterized in that: Two clamping holes are provided on the top of the cover plate (1).

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