Packaging structure of surface-mounted power device and surface-mounted power device
By introducing heat conductors into the package structure of the patch power device and passing through the through holes on the circuit board, the problem of poor heat dissipation of patch power devices in the prior art is solved, and more efficient heat transfer and devices are achieved Performance improvement.
Patent Information
- Application Number
- CN202420242829.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-31
- Publication Date
- 2025-02-14
- Estimated Expiration
- 2034-01-31
AI Technical Summary
The heat dissipation effect of existing patch power devices is poor, mainly due to the low thermal conductivity of the circuit board, which leads to insufficient heat transfer, affecting device performance.
A package structure of a patch power device is designed, including a device body, a heat conductor and a circuit board. The heat conductor is arranged in the through hole on the circuit board and extends toward the side away from the device body to form a step structure and a through hole. Edge contact, optimize heat transfer.
Through the optimized design of the thermal conductivity parts, the heat dissipation effect of the device body is improved, the heat accumulation problem caused by poor thermal conductivity of the circuit board is reduced, and the service life of the device is extended.
Smart Images
Figure CN222483362U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of electronic devices, and in particular to a packaging structure of a patch power device and the patch power device. Background Art
[0002] As core components in new energy vehicles, chip power devices (such as MOS, diodes, IGBTs, etc.) play a vital role in vehicle engines, drives, charging systems, etc. With the continuous development and iteration of new energy vehicles, the demand for heat dissipation of chip power devices is also increasing.
[0003] In the prior art, most of the heat generated by the chip power device (such as MOS) itself first passes through the circuit board in contact with it, then transfers to the metal shell, and finally takes it away through water channel cooling to achieve the purpose of heat dissipation. However, due to the presence of more insulating layers inside the circuit board, the thermal conductivity of the circuit board is low. Therefore, direct contact between the chip power device and the circuit board will lead to poor heat dissipation, greatly affecting the performance of the device. Utility Model Content
[0004] The utility model aims to provide a packaging structure of a patch power device and a patch power device, which can solve the problem of poor heat dissipation of the patch power device in the prior art.
[0005] The embodiment of the utility model is achieved as follows:
[0006] The first aspect of the embodiment of the utility model provides a packaging structure of a patch power device, comprising a device body, a heat conductor and a circuit board, wherein the device body and the heat conductor are fixedly connected, a through hole is provided on the circuit board, the heat conductor is inserted into the through hole and extends toward a side away from the device body, and the edges of the device body and the heat conductor are in contact with the edges of the through hole. The packaging structure of the patch power device can solve the problem of poor heat dissipation of the patch power device in the prior art.
[0007] Optionally, the device body includes a packaging shell, a chip and a pin, the chip is accommodated in the packaging shell, one end of the pin is connected to the chip, the other end of the pin passes through the packaging shell and is connected to the circuit board, and the heat conductor is fixedly connected to the bottom of the packaging shell.
[0008] Optionally, the packaging shell and the heat conducting component are formed into an integrated structure through an insert injection molding process.
[0009] Optionally, a soldering pad is provided on the circuit board, and the other end of the pin is soldered to the soldering pad.
[0010] Optionally, the heat conducting component includes a first heat conducting part and a second heat conducting part fixedly connected to the first heat conducting part, the first heat conducting part is fixedly connected to the device body, the second heat conducting part is passed through the through hole and extends toward a side away from the device body, the cross-sectional area of the first heat conducting part is larger than the cross-sectional area of the second heat conducting part, so as to form a step structure at the connection between the first heat conducting part and the second heat conducting part, and the table top of the step structure contacts the edge of the through hole.
[0011] Optionally, a cross-sectional area of the through hole is larger than a cross-sectional area of the second heat conducting portion, and a cross-sectional area of the through hole is smaller than a cross-sectional area of the first heat conducting portion.
[0012] Optionally, a shape of the second heat conducting portion matches a shape of the through hole.
[0013] Optionally, the thickness of the second heat conducting portion matches the thickness of the circuit board.
[0014] Optionally, the heat conducting member is made of metal.
[0015] The second aspect of the embodiment of the utility model provides a chip power device, including the packaging structure of the chip power device mentioned above. The packaging structure of the chip power device can solve the problem of poor heat dissipation of the chip power device in the prior art.
[0016] The beneficial effects of the embodiments of the utility model include:
[0017] The packaging structure of the chip power device includes a device body, a heat conductor and a circuit board. The device body and the heat conductor are fixedly connected. A through hole is provided on the circuit board. The heat conductor is inserted into the through hole and extends toward a side away from the device body. The edges of the device body and the heat conductor are in contact with the edges of the through hole. In this way, most of the heat generated by the device body when working will be preferentially transferred to the metal shell through the heat conductor fixedly connected to the device body, and only a small part of the heat will be transferred to the metal shell through the circuit board in contact with the device body, and then the heat will be dissipated by water cooling through the water channel provided on the metal shell. Since the heat conductor has good thermal conductivity, unlike the circuit board which has poor thermal conductivity due to the existence of an insulating layer inside, it can effectively improve the heat dissipation effect of the device body. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.
[0019] Figure 1 One of the structural schematic diagrams of the packaging structure of the SMD power device provided in the embodiment of the utility model;
[0020] Figure 2 The second structural schematic diagram of the packaging structure of the chip power device provided in the embodiment of the utility model.
[0021] Icons: 100 - packaging structure; 10 - device body; 11 - packaging shell; 12 - pins; 20 - heat conducting member; 21 - first heat conducting part; 22 - second heat conducting part; 23 - step structure; 30 - circuit board; 31 - through hole. DETAILED DESCRIPTION
[0022] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Generally, the components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.
[0023] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the present invention to be protected, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0024] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.
[0025] In the description of the present utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate the orientation or position relationship based on the orientation or position relationship shown in the accompanying drawings, or the orientation or position relationship in which the utility model product is usually placed when in use, which is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.
[0026] In addition, the terms "horizontal", "vertical" and the like do not mean that the components are required to be absolutely horizontal or suspended, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.
[0027] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be a connection between two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0028] Please refer to Figure 1 and Figure 2 The present invention provides a package structure 100 of a SMD power device, including a device body 10, a heat conductor 20 and a circuit board 30. The device body 10 and the heat conductor 20 are fixedly connected. A through hole 31 is provided on the circuit board 30. The heat conductor 20 is inserted into the through hole 31 and extends toward a side away from the device body 10. The edges of the device body 10 and the heat conductor 20 are in contact with the edges of the through hole 31. The package structure 100 of the SMD power device can solve the problem of poor heat dissipation of the SMD power device in the prior art.
[0029] It should be noted that if Figure 1 As shown, the packaging structure 100 includes a device body 10 and a circuit board 30, and the device body 10 and the circuit board 30 are electrically connected so that the device body 10 can be connected to the power circuit and play a corresponding function. Since the device body 10 generates a lot of heat when working, when the temperature of the device body 10 itself is too high, the service life of the device body 10 will be shortened, and in severe cases, the device body 10 will even be burned. Therefore, the device body 10 needs to be cooled when in use.
[0030] The surface of the device body 10 is in contact with the surface of the circuit board 30, so most of the heat generated by the device body 10 during operation will be transferred to the metal shell through the circuit board 30, and then dissipated by water cooling through the water channel set on the metal shell. Since there are many insulating layers inside the circuit board 30, the thermal conductivity of the circuit board 30 is low. Therefore, the heat dissipation of the device body 10 in direct contact with the circuit board 30 is poor, which greatly affects the performance of the device.
[0031] In order to solve the above problems, Figure 1As shown, in the present application, the packaging structure 100 further includes a heat conductor 20, the device body 10 and the heat conductor 20 are fixedly connected, a through hole 31 is provided on the circuit board 30, the heat conductor 20 is penetrated in the through hole 31 and extends toward a side away from the device body 10, and the edges of the device body 10 and the heat conductor 20 are in contact with the edges of the through hole 31 to prevent the device body 10 and the heat conductor 20 from falling through the through hole 31 due to the vibration between the boards. As the name implies, the heat conductor 20 is a part with good thermal conductivity.
[0032] In this way, most of the heat generated by the device body 10 when it is working will be preferentially transferred to the metal shell through the heat-conducting part 20 fixedly connected to the device body 10, and only a small part of the heat will be transferred to the metal shell through the circuit board 30 in contact with the device body 10, and then the heat will be dissipated by water cooling through the water channels set on the metal shell. Since the heat-conducting part 20 has good thermal conductivity, unlike the circuit board 30 which has poor thermal conductivity due to the existence of an insulating layer inside, it can effectively improve the heat dissipation effect of the device body 10.
[0033] In addition, the packaging structure 100 provided in the present application only requires opening a through hole 31 on the circuit board 30 and inserting the heat conductive component 20 into the through hole 31. The preparation process is simple, the installation operation is easy, the risk rate is reduced, and the manufacturing cost is greatly reduced.
[0034] Alternatively, if Figure 1 As shown, the device body 10 includes a packaging shell 11, a chip and a pin 12. The chip is accommodated in the packaging shell 11, one end of the pin 12 is connected to the chip, and the other end of the pin 12 passes through the packaging shell 11 and is connected to the circuit board 30, so that the device body 10 is electrically connected to the circuit board 30, and the heat conductor 20 is fixedly connected to the bottom of the packaging shell 11 to transfer the heat generated by the device body 10 during operation to the metal shell through the heat conductor 20.
[0035] Optionally, the packaging shell 11 and the heat conductive component 20 are integrated into an integral structure through an insert injection molding process, so that the packaging shell 11 and the heat conductive component 20 are fully combined, thereby preventing the heat conductive component 20 and the packaging shell 11 from being separated and falling through the through hole 31 due to the vibration between the boards.
[0036] Optionally, a pad is provided on the circuit board 30, and the other end of the pin 12 is welded to the pad to electrically connect the device body 10 and the circuit board 30, so that the device body 10 can be connected to the power circuit and play a corresponding function.
[0037] Alternatively, if Figure 2As shown, the heat conducting member 20 includes a first heat conducting portion 21 and a second heat conducting portion 22 fixedly connected to the first heat conducting portion 21, the first heat conducting portion 21 is fixedly connected to the device body 10, the second heat conducting portion 22 is penetrated in the through hole 31 and extends toward a side away from the device body 10, so that the second heat conducting portion 22 can extend out of the through hole 31 and contact the metal shell, the cross-sectional area of the first heat conducting portion 21 is greater than the cross-sectional area of the second heat conducting portion 22, so as to form a step structure 23 at the connection between the first heat conducting portion 21 and the second heat conducting portion 22, and the table top of the step structure 23 contacts the edge of the through hole 31.
[0038] It should be noted that the cross-sectional area of the first heat-conducting part 21 is larger than the cross-sectional area of the second heat-conducting part 22, so as to form a step structure 23 at the connection between the first heat-conducting part 21 and the second heat-conducting part 22. The top of the step structure 23 contacts the edge of the through hole 31, so that the second heat-conducting part 22 can be inserted into the through hole 31, and the first heat-conducting part 21 will be supported by the edge of the through hole 31, thereby preventing the heat-conducting member 20 from falling through the through hole 31. In addition, the first heat-conducting part 21 can also be better combined with the package shell 11 through the insert injection molding process.
[0039] Optionally, the cross-sectional area of the through hole 31 is larger than the cross-sectional area of the second heat conducting part 22, and the cross-sectional area of the through hole 31 is smaller than the cross-sectional area of the first heat conducting part 21. Thus, the second heat conducting part 22 can be inserted into the through hole 31, and the first heat conducting part 21 can be pressed against by the edge of the through hole 31, and the table surface of the step structure 23 at the connection between the first heat conducting part 21 and the second heat conducting part 22 can contact the edge of the through hole 31.
[0040] Optionally, the shape of the second heat conducting portion 22 matches the shape of the through hole 31. Figure 1 and Figure 2 As shown, in this embodiment, the second heat conducting part 22 is a rectangular parallelepiped structure, and its cross-sectional shape is rectangular, and the cross-sectional shape of the through hole 31 is also rectangular. Of course, in other embodiments, the second heat conducting part 22 can also be a cylindrical structure, and its cross-sectional shape is circular, in which case, the cross-sectional shape of the through hole 31 should be circular.
[0041] Optionally, the thickness of the second heat conducting part 22 matches the thickness of the circuit board 30. For example, in this embodiment, the thickness of the second heat conducting part 22 is slightly greater than the thickness of the circuit board 30, so that the second heat conducting part 22 can extend out of the through hole 31 and contact the metal shell, thereby transferring heat to the water channel on the metal shell.
[0042] Optionally, the material of the heat conductor 20 is a metal with good thermal conductivity, such as copper, etc., to improve the heat transfer effect of the heat conductor 20, thereby improving the heat dissipation performance of the device body 10. When the material of the heat conductor 20 is metal, the heat conductor 20 can also be welded to the circuit board 30 to play a conductive role.
[0043] Regarding the specific selection of metal materials, those skilled in the art can flexibly design and select according to different types of device bodies 10, and proportionally design the heat conductor 20 according to its heat dissipation requirements, so as to solve the problem of poor heat dissipation capacity of the device body 10 to the greatest extent.
[0044] The present application also provides a chip power device, including the above-mentioned chip power device packaging structure 100. Since the structure and beneficial effects of the chip power device packaging structure 100 have been described in detail in the above-mentioned embodiments, they will not be repeated here.
[0045] The above description is only the preferred embodiment of the utility model, and is not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.
[0046] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, the present utility model will not further describe various possible combinations.
Claims
1. A packaging structure of a chip power device, characterized in that: It includes a device body, a heat conductive member and a circuit board, wherein the device body and the heat conductive member are fixedly connected, a through hole is provided on the circuit board, the heat conductive member is inserted into the through hole and extends toward a side away from the device body, and the edges of the device body and the heat conductive member are in contact with the edges of the through hole.
2. The packaging structure of the chip power device according to claim 1, characterized in that: The device body comprises a packaging shell, a chip and a pin. The chip is accommodated in the packaging shell. One end of the pin is connected to the chip, and the other end of the pin passes through the packaging shell and is connected to the circuit board. The heat conductor is fixedly connected to the bottom of the packaging shell.
3. The packaging structure of the chip power device according to claim 2, characterized in that: The packaging shell and the heat conducting component are formed into an integrated structure through an insert injection molding process.
4. The packaging structure of the chip power device according to claim 2, characterized in that: A soldering pad is arranged on the circuit board, and the other end of the pin is soldered to the soldering pad.
5. The packaging structure of the chip power device according to claim 1, characterized in that: The heat conducting member includes a first heat conducting portion and a second heat conducting portion fixedly connected to the first heat conducting portion, the first heat conducting portion is fixedly connected to the device body, the second heat conducting portion is penetrated in the through hole and extends toward a side away from the device body, the cross-sectional area of the first heat conducting portion is greater than the cross-sectional area of the second heat conducting portion, so as to form a step structure at the connection between the first heat conducting portion and the second heat conducting portion, and the table top of the step structure contacts the edge of the through hole.
6. The packaging structure of the chip power device according to claim 5, characterized in that: The cross-sectional area of the through hole is larger than the cross-sectional area of the second heat conducting portion, and the cross-sectional area of the through hole is smaller than the cross-sectional area of the first heat conducting portion.
7. The packaging structure of the chip power device according to claim 5, characterized in that: The shape of the second heat conducting portion matches the shape of the through hole.
8. The packaging structure of the chip power device according to claim 5, characterized in that: The thickness of the second heat conducting portion matches the thickness of the circuit board.
9. The packaging structure of the chip power device according to claim 1, characterized in that: The material of the heat conducting element is metal.
10. A chip power device, characterized in that: A packaging structure comprising a chip power device as described in any one of claims 1 to 9.