Circuit substrate inserting device

Abstract

The utility model discloses an inserting device of a circuit substrate. The inserting device comprises a main frame body; the main frame body is provided with a plurality of layers of inserting mechanisms which are arranged up and down and can be used for obliquely placing the substrate; and each inserting mechanism can support a plurality of circuit substrates which are inserted in parallel, so that two adjacent circuit substrates are arranged at intervals. According to the device, the multiple layers of inserting mechanisms are arranged on the main frame body up and down, the inserting mechanisms comprise the first inserting plates and the second inserting plates which are used for positioning the circuit substrates, the first inserting plates and the second inserting plates are obliquely arranged, the high-temperature circuit substrates are directly inserted into the inserting grooves, and the adjacent circuit substrates are separated by the separating blocks; and the heat dissipation fan is arranged at the bottom of the insertion mechanism, so that the heat dissipation of the circuit substrates can be accelerated.

Description

Technical Field

[0001] The utility model belongs to the technical field of circuit board production devices, and in particular relates to a circuit substrate insertion and placement device. Background Art

[0002] There are multiple production processes in the production of hard substrates for circuit boards. In some processes, the substrate temperature will be high. Usually, it needs to be cooled after the previous process, and it is necessary to ensure that the substrate does not contact during the cooling process. Therefore, a device that can place the circuit substrates independently is needed to help cool them down. Utility Model Content

[0003] The purpose of the utility model is to provide a circuit substrate insertion device to solve the problems raised in the above background technology.

[0004] In view of this, the utility model provides a circuit substrate insertion device, comprising:

[0005] Main frame;

[0006] The main frame is provided with multiple layers of insertion and placement mechanisms arranged up and down and capable of obliquely placing the circuit substrate;

[0007] Each of the insertion mechanisms can support a plurality of circuit substrates inserted in parallel, so that two adjacent circuit substrates are spaced apart.

[0008] In the utility model, a further implementation scheme is that the insertion mechanism includes a support frame fixedly set on the main frame, and a first plug plate and a second plug plate fixed on the support frame, the first plug plate is fixed on the top of the support frame, the second plug plate is fixed on the rear of the support frame, and the angle formed between the first plug plate and the second plug plate matches the angle formed by the support frame.

[0009] In the utility model, a further implementation scheme is that the support frames form a right angle with each other, and a positioning tube is further provided at the rear of the support frame. When the circuit substrate is inserted into the insertion mechanism, the positioning tube abuts against the circuit substrate.

[0010] In the present invention, a further implementation scheme is that the first plug board and the second plug board are consistent.

[0011] In the utility model, a further implementation scheme is that the cross-section of the first plug-in board is wavy and includes interconnected slots and spacers. When the circuit substrate is inserted into the slots, the spacers are used to separate adjacent circuit substrates. The slot positions between the first plug-in board and the second plug-in board correspond.

[0012] In the utility model, a further implementation scheme is that a cooling fan is also provided on the main frame at the lower part of the insertion mechanism, and the cooling fan is fixed on a fixing frame on the main frame to blow air toward the first plug-in board.

[0013] In the present invention, a further implementation scheme is that heat dissipation holes are provided on the slots of the first plug board and the second plug board.

[0014] In the utility model, a further implementation scheme is that universal wheels are arranged around the bottom of the main frame.

[0015] In the present invention, a further implementation scheme is that the main frame is provided with handles inclined outwards on both sides of the insertion and placement mechanism.

[0016] The beneficial effects of the utility model are:

[0017] The device is provided with an upper and lower multi-layer insertion mechanism on a main frame, wherein the insertion mechanism comprises a first insertion plate and a second insertion plate for positioning the circuit substrate, and the first insertion plate and the second insertion plate are both arranged obliquely, and the high-temperature circuit substrate is directly inserted into the slot, and the spacer separates the adjacent circuit substrates, so that the circuit substrates are inserted obliquely in rows, and a heat dissipation fan is arranged at the bottom of the insertion mechanism to help accelerate the heat dissipation of the circuit substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the structure of the utility model;

[0019] Figure 2 It is a side view schematic diagram of the utility model;

[0020] Figure 3 yes Figure 1 A magnified schematic diagram of area A in the middle. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present application to clearly describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the present application belong to the scope of protection of this application.

[0022] In the description of the present application, it should be noted that the terms used herein are only for describing specific embodiments, and are not intended to limit the exemplary embodiments according to the present application. For ease of description, the sizes of the various parts shown in the drawings are not drawn according to the actual proportional relationship. The technology, methods and equipment known to ordinary technicians in the relevant field may not be discussed in detail, but in appropriate cases, the technology, methods and equipment should be regarded as part of the authorization specification. In all examples shown and discussed here, any specific value should be interpreted as merely exemplary, rather than as a limitation. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that similar numbers and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0023] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0024] It should be noted that, in the description of the present application, the orientation or positional relationship indicated by terms such as "front, back, up, down, left, right", "lateral, vertical, perpendicular, horizontal" and "top, bottom" are usually based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description. Unless otherwise stated, these orientation words do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the scope of protection of the present application; the orientation words "inside and outside" refer to the inside and outside relative to the contour of each component itself.

[0025] It should be noted that, in the present application, the terms "comprise", "include" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises one..." does not exclude the presence of other identical elements in the process, method, article or device including the element. In addition, it should be noted that the scope of the method and device in the embodiment of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in reverse order according to the functions involved, for example, the described method may be performed in an order different from that described, and various steps may also be added, omitted, or combined. In addition, the features described with reference to certain examples may be combined in other examples.

[0026] like Figure 1 and Figure 2 As shown, the utility model provides a circuit substrate insertion device, including a main frame 1, wherein the main frame 1 is provided with multiple layers of insertion mechanisms 3 arranged up and down and capable of obliquely placing circuit substrates 2, each insertion mechanism 3 can support multiple circuit substrates 2 inserted in parallel, so that two adjacent circuit substrates 2 are arranged at intervals. In addition, it is convenient to place the circuit substrates 2 separately, and no contact occurs during the cooling process.

[0027] In detail, the insertion mechanism 3 includes a support frame 30 fixedly arranged on the main frame body 1, and a first plug plate 31 and a second plug plate 32 fixed on the support frame 30;

[0028] Among them, the first plug plate 31 is fixed on the top of the support frame 30, and the second plug plate 32 is fixed on the rear of the support frame 30, and the angle formed by the first plug plate 31 and the second plug plate 32 matches the angle formed by the support frame 30, and the support frames 30 form a right angle, and a positioning tube 33 is also provided at the rear of the support frame 30. When the circuit substrate 2 is inserted into the insertion mechanism 3, the positioning tube 33 presses against the circuit substrate 2. In this way, when the circuit substrate 2 is inserted, it maintains a certain inclination and presses against the positioning tube 33, and there will be no safety hazard of falling.

[0029] More specifically, the first plug board 31 and the second plug board 32 are consistent, and the cross section of the first plug board 31 is wavy, such as Figure 3 , and includes connected slots 310 and spacers 311, the slots 310 between the first plug-in board 31 and the second plug-in board 32 correspond to each other, and when the circuit substrate 2 is inserted into the slots 310, the spacers 311 are used to separate adjacent circuit substrates 2.

[0030] In addition, heat dissipation holes are provided on the slots 310 of the first plug board 31 and the second plug board 32, and a heat dissipation fan (not shown in the figure) is provided on the main frame 1 at the lower part of the insertion mechanism 3. The heat dissipation fan is fixed on the fixing frame 10 on the main frame 1 to blow air toward the first plug board 31, thereby accelerating the heat dissipation efficiency of the circuit substrate 2 by blowing air.

[0031] In addition, universal wheels 4 are provided around the bottom of the main frame 1, and handles 5 inclined outwards are provided on both sides of the insertion mechanism 3 of the main frame 1, so that other supporting tools can be placed between the handles 5 and the main frame 1.

[0032] The embodiments of the present application are described above in conjunction with the accompanying drawings. In the absence of conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. A circuit substrate insertion device, characterized in that: include: Main frame; The main frame is provided with multiple layers of insertion and placement mechanisms arranged up and down and capable of obliquely placing the circuit substrate; Each of the insertion mechanisms can support a plurality of circuit substrates inserted in parallel, so that two adjacent circuit substrates are spaced apart.

2. The circuit substrate insertion and placement device according to claim 1, characterized in that: The insertion mechanism includes a support frame fixed on the main frame, and a first plug plate and a second plug plate fixed on the support frame, the first plug plate is fixed on the top of the support frame, the second plug plate is fixed on the rear of the support frame, and the angle formed between the first plug plate and the second plug plate matches the angle formed by the support frame.

3. The circuit substrate insertion and placement device according to claim 2, characterized in that: The support frames are formed at right angles with each other, and a positioning tube is further provided at the rear of the support frame. When the circuit substrate is inserted on the insertion mechanism, the positioning tube abuts against the circuit substrate.

4. The circuit substrate insertion and placement device according to claim 2, characterized in that: The first plugboard is consistent with the second plugboard.

5. The circuit substrate insertion and placement device according to claim 2, characterized in that: The first plug-in board has a wavy cross-section and includes connected slots and spacers. When the circuit substrate is inserted into the slots, the spacers are used to separate adjacent circuit substrates. The slot positions between the first plug-in board and the second plug-in board correspond.

6. The circuit substrate insertion device according to claim 2, characterized in that: A cooling fan is also provided on the main frame at the lower part of the insertion mechanism, and the cooling fan is fixed on a fixing frame on the main frame to blow air toward the first plug-in board.

7. The circuit substrate insertion and placement device according to claim 2, characterized in that: The slots of the first plugboard and the second plugboard are both provided with heat dissipation holes.

8. The circuit substrate insertion and placement device according to claim 1, characterized in that: Universal wheels are arranged around the bottom of the main frame.

9. The circuit substrate insertion and placement device according to claim 1, characterized in that: The main frame is also provided with handles inclined outwards on both sides of the insertion and placement mechanism.

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