Band-pass filter assembling device

By designing a bandpass filter assembly device, and using the linkage of the bracket module, drive module and glue injection module, automatic glue injection is realized, solving the problem of time-consuming and labor-intensive manual glue injection in the existing technology, and improving assembly efficiency and stability.

CN222490767UActive Publication Date: 2025-02-18JIAXING JIEHUA ELECTRONIC TECH CO LTD
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Patent Information

Application Number
CN202421152108.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-05-22
Publication Date
2025-02-18
Estimated Expiration
2034-05-22

AI Technical Summary

Technical Problem

In the assembly of existing bandpass filters, glue injection mainly relies on manual operations, which leads to time-consuming, labor-intensive and inefficient.

Method used

A bandpass filter assembly device is designed, including a bracket module, a drive module and a glue injection module, and the glue injection port of the bandpass filter is automatically injected through linkage.

Benefits of technology

It realizes automatic glue injection, improves assembly efficiency, and has the advantages of stable structure and high practicality.

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Abstract

The utility model discloses a band-pass filter assembling device, which is used for injecting glue to a band-pass filter and comprises a support module, a driving module and a glue injection module, the driving module is arranged on the support module, the glue injection module is arranged on the driving module, the support module comprises a top plate, a side plate and a bottom plate, and the side plate is arranged on the top plate. The side plates are located between the top plate and the bottom plate, and the bottom plate is used for placing a band-pass filter to be subjected to glue injection. The utility model discloses a band-pass filter assembling device, which is linked through a bracket module, a driving module and a glue injection module so as to automatically inject glue into a glue injection port of a band-pass filter, and has the advantages of stable structure, high efficiency, high practicability and the like.
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Description

Technical Field

[0001] The utility model belongs to the technical field of glue injection assembly of bandpass filters, and in particular relates to an assembly device for bandpass filters. Background Art

[0002] In the assembly of bandpass filters, it is necessary to inject thermal glue into the internal components of the assembled filter to fix the components and facilitate heat dissipation. Many existing glue injections are done manually, which is time-consuming, labor-intensive and inefficient.

[0003] Therefore, further improvements are made to the above problems. Utility Model Content

[0004] The main purpose of the utility model is to provide a bandpass filter assembly device, which is linked by a bracket module, a driving module and a glue injection module, so as to automatically inject glue into the glue injection port of the bandpass filter, and has the advantages of stable structure, high efficiency and high practicality.

[0005] To achieve the above purpose, the utility model provides a bandpass filter assembly device for injecting glue into the bandpass filter, comprising a bracket module, a driving module and an injection module, wherein the driving module is mounted on the bracket module and the injection module is mounted on the driving module, wherein:

[0006] The support module comprises a top plate, a side plate and a bottom plate, wherein the side plate is located between the top plate and the bottom plate, and the bottom plate is used for placing the bandpass filter to be injected with glue;

[0007] The driving module comprises a first mounting plate, a second mounting plate, a cylinder mounting block, a fixing rod and a driving cylinder, wherein the first mounting plate is fixedly mounted on a side of the top plate close to the bottom plate and the second mounting plate is mounted on the first mounting plate, the cylinder mounting block is mounted on the second mounting plate and the fixing rod and the driving cylinder are both mounted on a side of the cylinder mounting block away from the second mounting plate;

[0008] The glue injection module includes a glue injection bracket, a glue storage tube, a transmission tube, a glue injection head and a glue injection drive block. The glue injection bracket is fixedly installed on the fixed rod and the glue storage tube is fixedly installed on the side plate through a protective cover. The glue injection head is fixedly installed on the glue injection bracket and the transmission tube is connected between the glue storage tube and the glue injection head. One end of the glue injection drive block is connected to the driving end of the driving cylinder and the other end is connected to the driving piston built into the glue injection head.

[0009] As a further preferred technical solution of the above technical solution, the first mounting plate is provided with a first slide groove and a second slide groove in a first direction, and the second mounting plate is provided with a first slider and a second slider on a side close to the first mounting plate, the first slider is installed in the first slide groove and the second slider is installed in the second slide groove.

[0010] As a further preferred technical solution of the above technical solution, the second mounting plate is provided with a third slide groove and a fourth slide groove in the second direction on the side away from the first mounting plate, and the cylinder mounting block is provided with a third slider and a fourth slider on the side close to the second mounting plate, the third slider is installed in the third slide groove and the fourth slider is installed in the fourth slide groove.

[0011] As a further preferred technical solution of the above technical solution, the side panel is provided with an operating window.

[0012] As a further preferred technical solution of the above technical solution, the bottom plate is provided with a button mounting plate and the button mounting plate is installed with control buttons. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 The utility model is a structural schematic diagram of a bandpass filter assembly device.

[0014] Figure 2 The utility model is a structural schematic diagram of a bandpass filter assembly device.

[0015] Figure 3 The utility model is a structural schematic diagram of a bandpass filter assembly device.

[0016] The reference numerals include: 100, bracket module; 110, top plate; 120, side plate; 121, operating window; 130, bottom plate; 131, button mounting plate; 132, control button; 200, drive module; 210, first mounting plate; 211, first slide groove; 212, second slide groove; 220, second mounting plate; 221, first slider; 222, second slider; 223, third slide groove; 224, fourth slide groove; 230, cylinder mounting block; 231, third slider; 232, fourth slider; 240, fixing rod; 250, drive cylinder; 300, glue injection module; 310, glue injection bracket; 320, glue storage tube; 330, transmission tube; 340, glue injection head; 350, glue injection drive block; 360, protective cover. DETAILED DESCRIPTION

[0017] The following description is used to disclose the utility model so that those skilled in the art can implement the utility model. The preferred embodiments described below are only examples, and those skilled in the art can think of other obvious variations. The basic principles of the utility model defined in the following description can be applied to other embodiments, variations, improvements, equivalents, and other technical solutions that do not deviate from the spirit and scope of the utility model.

[0018] The utility model discloses a bandpass filter assembly device. The specific embodiments of the utility model are further described below in conjunction with preferred embodiments.

[0019] In the embodiments of the present invention, those skilled in the art will note that the bandpass filter and the like involved in the present invention may be regarded as prior art.

[0020] Preferred embodiments.

[0021] like Figure 1-3 As shown, the utility model discloses a bandpass filter assembly device for injecting glue into the bandpass filter, comprising a bracket module 100, a driving module 200 and an injection module 300, wherein the driving module 200 is mounted on the bracket module 100 and the injection module 300 is mounted on the driving module 200, wherein:

[0022] The support module 100 includes a top plate 110, a side plate 120 and a bottom plate 130, wherein the side plate 120 is located between the top plate 110 and the bottom plate 130, and the bottom plate 130 is used to place the bandpass filter to be injected with glue;

[0023] The driving module 200 includes a first mounting plate 210, a second mounting plate 220, a cylinder mounting block 230, a fixing rod 240 and a driving cylinder 250, wherein the first mounting plate 210 is fixedly mounted on a side of the top plate 110 close to the bottom plate 130 and the second mounting plate 220 is mounted on the first mounting plate 210, the cylinder mounting block 230 is mounted on the second mounting plate 220 and the fixing rod 240 and the driving cylinder 250 are both mounted on a side of the cylinder 250 mounting block away from the second mounting plate 220;

[0024] The glue injection module 300 includes a glue injection bracket 310, a glue storage tube 320, a transmission tube 330, a glue injection head 340 and a glue injection drive block 350. The glue injection bracket 310 is fixedly installed on the fixed rod 240 and the glue storage tube 320 is fixedly installed on the side panel 120 through a protective cover 360. The glue injection head 340 is fixedly installed on the glue injection bracket 310 and the transmission tube 330 is connected between the glue storage tube 320 and the glue injection head 340. One end of the glue injection drive block 350 is connected to the driving end of the driving cylinder 230 and the other end is connected to the driving piston (not shown) built into the glue injection head 340.

[0025] Specifically, the first mounting plate 210 is provided with a first slide groove 211 and a second slide groove 212 in a first direction, and the second mounting plate 220 is provided with a first slider 221 and a second slider 222 on a side close to the first mounting plate 210, the first slider 221 is installed in the first slide groove 211 and the second slider 222 is installed in the second slide groove 212.

[0026] More specifically, the second mounting plate 220 is provided with a third slide groove 223 and a fourth slide groove 224 in a second direction on the side away from the first mounting plate 210, and the cylinder mounting block 230 is provided with a third slider 231 and a fourth slider 232 on the side close to the second mounting plate 220, the third slider 231 is installed in the third slide groove 223 and the fourth slider 232 is installed in the fourth slide groove 224.

[0027] Furthermore, the side panel 120 is provided with an operation window 121 .

[0028] Furthermore, the bottom plate 130 is provided with a button mounting plate 131 and the button mounting plate 131 is installed with a control button 132 .

[0029] For this utility model:

[0030] Place the bandpass filter to be injected with glue on the bottom plate, adjust the position of the first / second slider in the first / second slide groove, and the position of the third / fourth slider in the third / fourth slide groove, so as to adjust the XY direction of the glue injection right angle, the first direction and the second direction are perpendicular, so as to adapt to filters of different sizes. After the adjustment is completed, start the driving cylinder through the control button, so that the driving end of the driving cylinder pushes the glue injection driving block downward, thereby driving the driving piston located at the glue injection head to move downward, so as to squeeze the glue to the glue injection port of the filter, and the glue storage tube can be replenished with glue through the operation window.

[0031] It is worth mentioning that the technical features such as the bandpass filter involved in this utility model patent application should be regarded as the prior art. The specific structure, working principle and possible control method and spatial layout method of these technical features can be selected by conventional methods in the field and should not be regarded as the inventive point of this utility model patent. This utility model patent will not be further elaborated.

[0032] For those skilled in the art, it is still possible to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present utility model should be included in the protection scope of the present utility model.

Claims

1. A bandpass filter assembly device, used for injecting glue into a bandpass filter, characterized in that: It includes a support module, a driving module and a glue injection module, wherein the driving module is installed on the support module and the glue injection module is installed on the driving module, wherein: The support module comprises a top plate, a side plate and a bottom plate, wherein the side plate is located between the top plate and the bottom plate, and the bottom plate is used for placing the bandpass filter to be injected with glue; The driving module comprises a first mounting plate, a second mounting plate, a cylinder mounting block, a fixing rod and a driving cylinder, wherein the first mounting plate is fixedly mounted on a side of the top plate close to the bottom plate and the second mounting plate is mounted on the first mounting plate, the cylinder mounting block is mounted on the second mounting plate and the fixing rod and the driving cylinder are both mounted on a side of the cylinder mounting block away from the second mounting plate; The glue injection module includes a glue injection bracket, a glue storage tube, a transmission tube, a glue injection head and a glue injection drive block. The glue injection bracket is fixedly installed on the fixed rod and the glue storage tube is fixedly installed on the side plate through a protective cover. The glue injection head is fixedly installed on the glue injection bracket and the transmission tube is connected between the glue storage tube and the glue injection head. One end of the glue injection drive block is connected to the driving end of the driving cylinder and the other end is connected to the driving piston built into the glue injection head.

2. A bandpass filter assembly device according to claim 1, characterized in that: The first mounting plate is provided with a first slide groove and a second slide groove in a first direction, and the second mounting plate is provided with a first slider and a second slider on a side close to the first mounting plate, the first slider is installed in the first slide groove and the second slider is installed in the second slide groove.

3. A bandpass filter assembly device according to claim 2, characterized in that: The second mounting plate is shown as being provided with a third slide groove and a fourth slide groove in a second direction on a side away from the first mounting plate, and the cylinder mounting block is provided with a third slider and a fourth slider on a side close to the second mounting plate, the third slider is installed in the third slide groove and the fourth slider is installed in the fourth slide groove.

4. A bandpass filter assembly device according to claim 3, characterized in that: The side panel is provided with an operating window.

5. A bandpass filter assembly device according to claim 4, characterized in that: The bottom plate is provided with a button mounting plate and the button mounting plate is mounted with control buttons.