Chip gluing device

Abstract

The utility model relates to the technical field of chip gluing, in particular to a chip gluing device which comprises a working table and a gluing device arranged on the working table, and further comprises a discharging assembly which comprises a cross-shaped supporting frame arranged on the working table and used for placing a chip and a cross-shaped sliding groove formed in the cross-shaped supporting frame and communicated with the cross-shaped supporting frame; the downward moving assembly is arranged at the end of one side of the cross-shaped supporting frame and used for moving the discharging assembly and the chips positioned and placed on the discharging assembly in the vertical direction; and the translation assembly is arranged on the workbench and is used for taking out the glued chip. According to the utility model, by arranging the downward moving assembly, the translation assembly and the starting motor, the glued chip is translated and taken out, so that the taking-out operation of a worker is facilitated, the chip is prevented from being damaged, and the operation is convenient; and through the arrangement of the discharging assembly, chips of multiple sizes and specifications can be better supported and fixed, the stability is improved, and the actual gluing requirement is better met.

Description

Technical Field

[0001] The utility model relates to the technical field of chip gluing, in particular to a chip gluing device. Background Art

[0002] Chip coating may refer to a process in the semiconductor chip manufacturing process. Coating is usually used to protect the chip surface or fill tiny gaps to improve the performance and reliability of the chip. This process can help prevent dust, moisture or other contaminants from entering the chip, and can also enhance the mechanical stability of the chip.

[0003] At present, after the glue coating process is completed, since the chip is relatively thin, the staff needs to press the chip to remove it, which is difficult and can easily cause damage to the chip.

[0004] The above contents are only used to assist in understanding the technical solution of the present invention, and do not constitute an admission that the above contents are the closest prior art. Utility Model Content

[0005] The purpose of the utility model is to solve the above-mentioned shortcomings and provide a chip glue coating device.

[0006] In order to solve the above technical problems, the utility model adopts the following technical solution: a chip gluing device, including a workbench, a gluing device arranged on the workbench, and also including:

[0007] The material discharging assembly comprises a cross support frame arranged on the workbench for placing the chips, and a cross-shaped slide groove arranged on the cross support frame and connected to the cross support frame;

[0008] A downward moving assembly is arranged at one end of the cross support frame and is used to move the discharge assembly and the chips positioned and placed on the discharge assembly in a vertical direction;

[0009] The translation assembly is arranged on the workbench and is used to take out the chip after the glue coating is completed.

[0010] Furthermore, the discharge assembly also includes four suction heads arranged in the slide groove and used to suck and fix the chips, and a sliding block that slides in cooperation with the suction head is arranged outside each suction head and in the slide groove, and connecting rods are rotatably arranged at the lower ends of the four sliding blocks, and connecting blocks are rotatably arranged at the lower ends of the four connecting rods, and a hydraulic rod connected to the connecting block is arranged on the cross support frame.

[0011] Furthermore, the downward moving assembly includes a supporting frame arranged at one end of a cross supporting frame, and two supporting plates symmetrically arranged on the sides of the supporting frame. A screw is arranged on both support plates, a worm gear is arranged at the lower end of the screw, a worm is arranged in the middle of the two worm gears, and a motor is arranged at one end of the worm.

[0012] Furthermore, the translation assembly includes a support platform which is arranged on the workbench and fixed in the area separated by the cross support frame, and a conveyor belt is arranged on the support platform.

[0013] Furthermore, the air source interface at the lower side of the suction head is provided with a vacuum pump for use therewith.

[0014] Furthermore, a support frame for stably mounting the motor is provided on the motor.

[0015] Compared with the prior art, the utility model has the following beneficial effects: the utility model starts the motor through the setting of the downward moving component and the translation component, controls the rotation of the worm, and drives the worm wheel and the lead screw on the worm wheel that are meshed with it and arranged on both sides to rotate, so that the discharge component fixedly connected on the carrier frame moves down a distance to separate from the chip, and then the chip coated with glue is translated and taken out under the horizontal transmission of the translation component, which is convenient for the staff to take out the operation, avoids chip damage, and is easy to operate; and through the setting of the discharge component, the hydraulic rod is started to synchronously move the four suction heads outward or inward, so that the chips of multiple sizes are better supported and fixed, the stability is improved, and the actual gluing needs are better met. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The drawings constituting part of the present application are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention. In the drawings:

[0017] Figure 1 A three-dimensional structural diagram of an embodiment of the utility model from a single perspective;

[0018] Figure 2 It is a three-dimensional structural diagram from one perspective of a material discharging assembly, a downward moving assembly and a translation assembly according to an embodiment of the utility model;

[0019] Figure 3 It is a three-dimensional structural diagram from another perspective of the material discharging assembly, the downward moving assembly and the translation assembly of one embodiment of the utility model;

[0020] Figure 4 for Figure 3 Enlarged structural diagram at point A in the middle.

[0021] In the figure: 1. workbench; 2. glue coating device; 3. material discharge assembly; 31. cross support frame; 32. suction head; 33. slider; 34. connecting rod; 35. connecting block; 36. hydraulic rod; 4. lowering assembly; 41. bearing frame; 42. screw; 43. worm gear; 44. worm; 45. motor; 5. translation assembly; 51. support table; 52. conveyor belt. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the present invention are described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. In the absence of conflict, the embodiments in this application and the features in the embodiments can be combined with each other. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0023] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0024] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing in the full text includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or schemes that satisfy both A and B. In addition, "multiple" refers to more than two. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the utility model.

[0025] like Figure 1-4 As shown, the utility model provides a chip glue coating device, comprising a workbench 1, a glue coating device 2 arranged on the workbench 1, and further comprising:

[0026] The material discharging assembly 3 includes a cross support frame 31 disposed on the workbench 1 for placing chips, and a cross-shaped slide groove disposed on and connected to the cross support frame 31;

[0027] The downward moving assembly 4 is arranged at one end of the cross support frame 31, and is used to move the discharge assembly 3 and the chips positioned and placed on the discharge assembly 3 in a vertical direction;

[0028] The translation component 5 is arranged on the workbench 1 and is used to take out the chip after the glue coating. In this design, the discharging component 3 arranged on the workbench 1 and the lowering component 4 and the translation component 5 used in conjunction can stably place chips of various sizes and specifications, and conveniently take out the chip after the glue coating, which is easy to operate and effectively avoids chip damage.

[0029] In one embodiment, the discharge assembly 3 also includes four suction heads 32 arranged in the slide groove and used to suck and fix the chips, and a sliding block 33 is arranged outside each suction head 32 and in the slide groove for matching sliding. A connecting rod 34 is rotatably arranged at the lower end of the four sliding blocks 33, and a connecting block 35 is rotatably arranged at the lower end of the four connecting rods 34. A hydraulic rod 36 connected to the connecting block 35 is arranged on the cross support frame 31. With this design, the hydraulic rod 36 is vertically installed between the cross support frame 31 and the connecting block 35, and the connecting rod 34 rotatably connected to the connecting block 35 around the lower end of the hydraulic rod 36 and the correspondingly distributed sliders 33 rotatably connected to the upper side of the connecting rod 34 are started. When the hydraulic rod 36 is lowered, the four sliders 33 connected by the connecting rod 34 and the suction heads 32 fixed on the end faces of the sliders 33 will shrink inwardly under the limit of the slide groove of the cross support frame 31 to ensure that smaller chips can be adsorbed. When rising, the four suction heads 32 slidably connected in the slide groove expand outwardly to accommodate larger chips, thereby improving the stability of placing chips of multiple sizes and having a good use effect.

[0030] In one embodiment, the downward moving assembly 4 includes a carrier frame 41 disposed at one end of the cross support frame 31, two support plates symmetrically disposed at the side of the carrier frame 41, a screw 42 disposed on each of the two support plates, a worm wheel 43 disposed at the lower end of the screw 42, a worm 44 meshed between the two worm wheels 43, and a motor 45 disposed at one end of the worm 44. In this design, through the carrier frame 41 welded at one end of the cross support frame 31 and the screw 42 of corresponding design threadedly rotatingly matched on the support plates symmetrically distributed on both sides of the carrier frame 41, when the motor 45 is started and the worm 44 is driven to rotate, the worm wheels 43 meshed and connected on both sides of the worm 44 will be synchronously driven to rotate, and at this time, the screw 42 fixed on the end face of the worm wheel 43 will rotate accordingly, and then drive the carrier frame 41 and the discharge assembly 3 fixed on the carrier frame 41 to move downward in the vertical direction, so as to realize the separation operation of the chip, and the chip will not be completely attached to the cross support frame 31.

[0031] In one embodiment, the translation assembly 5 includes a support table 51 disposed on the workbench 1 and fixed in the area separated by the cross support frame 31, and a conveyor belt 52 is disposed on the support table 51. In this design, by using the support table 51 welded with support rods in the through opening machined on the workbench 1 and the electrically driven conveyor belt 52 on the support table 51, when the chip is separated from the discharge assembly 3, the electrically driven conveyor belt 52 is started, and the translation removal operation of the chip is completed on the horizontal plane, which is convenient to operate.

[0032] In one embodiment, a vacuum pump is provided at the air source interface on the lower side of the suction head 32. With this design, the vacuum pump designed at the air end on the lower side of the suction head 32 can suck the air from the upper port of the suction head 32 with negative pressure, forming a vacuum at the lower part of the chip, so that the chip is completely attached to the cross support frame 31, ensuring that the chip is stably and fixedly placed, and avoiding the possibility of chip deviation during the glue coating process.

[0033] In one embodiment, a support frame for stably mounting the motor 45 is provided on the motor 45. With this design, the support frame is connected to the mounting surface of the motor 45 by means including but not limited to bolt fixing, and the support frame is welded in the lower fixing area of ​​the workbench 1, so that the motor 45 can be stably mounted by the support frame, thereby reducing the vibration effect caused by the operation of the motor 45.

[0034] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or basic features of the present invention. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims are included in the present invention.

Claims

1. A chip gluing device, comprising a workbench (1) and a gluing device (2) arranged on the workbench (1), characterized in that: Also includes: A material discharging assembly (3) comprises a cross support frame (31) arranged on the workbench (1) for placing chips, and a cross-shaped slide groove arranged on the cross support frame (31) and connected to the chips; A downward moving assembly (4) is arranged at one end of the cross support frame (31) and is used to move the discharge assembly (3) and the chips positioned and placed on the discharge assembly (3) in a vertical direction; The translation assembly (5) is arranged on the workbench (1) and is used to take out the chip after the glue coating is completed.

2. A chip glue coating device according to claim 1, characterized in that: The discharge assembly (3) also includes four suction heads (32) arranged in the slide groove and used for sucking and fixing the chips, each suction head (32) is provided with a sliding block (33) that slides in cooperation with it outside the slide groove, the lower ends of the four sliding blocks (33) are rotatably provided with connecting rods (34), the lower ends of the four connecting rods (34) are rotatably provided with connecting blocks (35), and the cross support frame (31) is provided with a hydraulic rod (36) connected to the connecting block (35).

3. The chip glue coating device according to claim 1, characterized in that: The downward moving assembly (4) comprises a support frame (41) arranged at one end of a cross support frame (31), and two support plates symmetrically arranged at the side of the support frame (41), wherein a screw rod (42) is arranged on the two support plates, a worm wheel (43) is arranged at the lower end of the screw rod (42), a worm (44) is arranged in meshing relationship between the two worm wheels (43), and a motor (45) is arranged at one end of the worm wheel (44).

4. The chip glue coating device according to claim 1, characterized in that: The translation assembly (5) comprises a support platform (51) which is arranged on the workbench (1) and fixed in an area separated by a cross support frame (31); a conveyor belt (52) is arranged on the support platform (51).

5. The chip glue coating device according to claim 2, characterized in that: The air source interface at the lower side of the suction head (32) is provided with a vacuum pump for use with it.

6. The chip glue coating device according to claim 3, characterized in that: The motor (45) is provided with a support frame for stably mounting the motor (45).

Images