Lifting type copper substrate cleaning device

Abstract

The utility model relates to the technical field of copper substrate cleaning, in particular to a lifting type copper substrate cleaning device which comprises a cleaning tank, a cleaning cabinet and a lifting mechanism. The cleaning cabinet enters or leaves the cleaning tank through a lifting mechanism, the cleaning cabinet comprises an outer frame and a plurality of cleaning drawers, a plurality of layers of partition plates are arranged in the outer frame at equal intervals, and a plurality of first through holes are formed in the outer frame and the partition plates; and a cleaning drawer is placed on the partition plate, the cleaning drawer is provided with a containing groove for containing products, a plurality of second through holes are formed in the bottom of the containing groove, cleaning liquid enters the cleaning cabinet through the first through holes, then the copper substrates in the cleaning cabinet can be cleaned in the cleaning groove, and practicability is high.

Description

Technical Field

[0001] The utility model relates to the technical field of copper substrate cleaning, in particular to a lifting type copper substrate cleaning device. Background Art

[0002] In the packaging process of IGBT (Insulated gate bipolar transistor), solder paste process is mostly used. After welding, the semi-finished products need to be ultrasonically immersed and cleaned with a cleaning agent to ensure that the cleanliness of the chip, DBC (Direct Bonding Copper) and the copper substrate meets the bonding requirements. There is only one empty slot in the traditional cleaning device. When cleaning the copper substrate, only one layer is placed at a time, which leads to a waste of cleaning space. Workers need to pick up and put it frequently, and the cleaning efficiency is low. Based on this, a new type of copper substrate cleaning device is needed. Utility Model Content

[0003] In view of the above technical problems, the utility model provides a lifting type copper substrate cleaning device.

[0004] The technical solution of the utility model to solve the above technical problems is as follows:

[0005] A lifting type copper substrate cleaning device comprises a cleaning tank, a cleaning cabinet and a lifting mechanism; the cleaning cabinet enters or leaves the cleaning tank through the lifting mechanism, wherein the cleaning cabinet comprises an outer frame and a plurality of cleaning drawers, a plurality of layers of partitions are arranged at equal intervals in the outer frame, and a plurality of first through holes are arranged on the outer frame and the partitions; a cleaning drawer is placed on the partition, the cleaning drawer is slidably connected to the outer frame, the cleaning drawer is provided with a receiving tank for placing products, a plurality of second through holes are arranged at the bottom of the receiving tank, and the positions of the second through holes correspond to the first through holes.

[0006] Furthermore, the lifting mechanism includes a lifting column and a lifting cylinder, the lifting cylinder is connected to the lifting column, the outer frame is provided with a lifting hole that cooperates with the lifting column, and the lifting mechanism drives the cleaning cabinet to move up and down in the cleaning tank.

[0007] Furthermore, a drain port for draining the cleaning liquid is provided at the bottom of the cleaning tank.

[0008] Furthermore, it also includes an ultrasonic generator, which is arranged at the bottom of the cleaning tank.

[0009] Furthermore, it also includes a heating mechanism, which is arranged in the cleaning tank.

[0010] Furthermore, a guide rail is provided inside the outer frame, and the washing drawer is provided with a slide rail that slidably cooperates with the corresponding guide rail.

[0011] In summary, compared with the prior art, the utility model has the following technical effects:

[0012] (1) In the utility model, multiple layers of partitions are arranged at equal intervals in the outer frame to accommodate more copper substrates; multiple first through holes are arranged on the outer frame and the partitions, and multiple second through holes are arranged at the bottom of the accommodating tank, and the second through holes are connected to the first through holes. The cleaning liquid enters the cleaning cabinet through the first through holes, so that the copper substrate in the cleaning cabinet can be cleaned in the cleaning tank;

[0013] (2) In the utility model, the cleaning cabinet is driven by the lifting mechanism to enter the cleaning tank along the depth direction of the cleaning tank, and the ultrasonic generator is arranged at the bottom of the cleaning tank, which can perform ultrasonic vibration cleaning on the cleaned copper substrate in the cleaning tank. When the cleaning of the cleaned copper substrate is completed, the cleaning cabinet is taken away from the cleaning tank along the depth direction of the cleaning tank by the lifting mechanism; thus, the lifting type copper substrate cleaning device can automatically clean the cleaned copper substrate and effectively improve the cleanliness of the cleaned copper substrate, and has strong practicality. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic structural diagram of a lifting type copper substrate cleaning device of the utility model;

[0015] Figure 2 It is a schematic diagram of the top view of the cleaning cabinet of the utility model;

[0016] Figure 3 This is a schematic diagram of the structure of the cleaning drawer of the utility model;

[0017] Figure 4 It is a structural schematic diagram of the cleaning cabinet of the utility model.

[0018] In the accompanying drawings, the component names represented by the reference numerals are listed as follows:

[0019] 100, cleaning tank; 101, drain port; 200, cleaning cabinet; 201, outer frame; 202, first through hole; 300, cleaning drawer; 301, accommodating tank; 302, second through hole; 303, groove; 400, ultrasonic generator; 500, heating mechanism; 601, lifting column; 602, lifting cylinder. DETAILED DESCRIPTION

[0020] The principles and features of the present invention are described below in conjunction with the accompanying drawings. The examples given are only used to explain the present invention and are not used to limit the scope of the present invention.

[0021] Reference Figure 1-Figure 4The present embodiment discloses a lifting type copper substrate cleaning device, which comprises a cleaning tank 100, a cleaning cabinet 200 and a lifting mechanism; the cleaning cabinet 200 enters or leaves the cleaning tank 100 through the lifting mechanism, wherein the cleaning tank 100 is a structure with an open upper end; the cleaning cabinet 200 comprises an outer frame 201 and a plurality of cleaning drawers 300, the outer frame 201 is a structure with an open side, a plurality of layers of partitions are arranged at equal intervals in the outer frame 201, the partitions are arranged integrally with the outer frame 201, and a plurality of first through holes 202 are arranged on the outer frame 201 and the partitions; a cleaning drawer 300 is placed on the partition, the cleaning drawer 300 is slidably connected to the outer frame 201, the cleaning drawer 300 is provided with a receiving groove 301 for placing the copper substrate, a plurality of second through holes 302 are arranged at the bottom of the receiving groove 301, and when the cleaning drawer 300 is pushed into the outer frame 201, the second through holes 302 are communicated with the first through holes 202. The cleaning tank 100 can accommodate the cleaning cabinet 200, so that the cleaning cabinet 200 can enter the cleaning tank 100 under the action of the lifting mechanism. The cleaning tank 100 contains cleaning liquid, and the cleaning liquid enters the cleaning cabinet 200 through the first through hole 202, so that the copper substrate in the cleaning cabinet 200 can be cleaned in the cleaning tank 100, wherein the cleaning liquid used can be deionized water.

[0022] In this embodiment, the upper wall and the lower wall of the outer frame 201 are provided with a plurality of first through holes 202, the inner wall of the outer frame 201 is provided with a guide rail, and the cleaning drawer 300 is provided with a slide rail that slidably cooperates with the corresponding guide rail. The outer frame 201 is a multi-layer arrangement, and the multi-layer cleaning drawer 300 is convenient for placing more copper substrates.

[0023] In this embodiment, the cleaning drawer 300 is provided with a groove 303 for convenient pushing and pulling.

[0024] In this embodiment, an ultrasonic generator 400 is further included. The ultrasonic generator 400 is disposed at the bottom of the cleaning tank 100 and can perform ultrasonic vibration cleaning on the copper substrate to be cleaned in the cleaning tank 100 .

[0025] In this embodiment, a heating mechanism 500 is further included, which is disposed in the cleaning tank 100 and is used to heat the cleaning liquid; the heating mechanism 500 may be a heating tube. In a specific embodiment, a temperature controller may be disposed in the cleaning tank 100 to set the heating temperature, and the cleaning liquid is heated to a specified temperature.

[0026] In this embodiment, the lifting mechanism includes a lifting column 601 and a lifting cylinder 602. The lifting cylinder 602 is located below the lifting column 601 and is connected to the lifting column 601. With the help of the lifting cylinder 602, the lifting column 601 can be extended and retracted up and down, and the cleaning cabinet 200 can be lifted and lowered as the lifting column 601 is extended and retracted up and down. In a specific embodiment, the outer frame 201 is provided with a lifting hole that cooperates with the lifting column 601, and the lifting cylinder 602 is arranged in the cleaning tank 100. The lifting mechanism can drive the cleaning cabinet 200 to extend out of the cleaning tank 100, or be pulled back from the outside of the cleaning tank 100 to the inside of the cleaning tank 100; when it is necessary to clean the copper substrate, the cleaning cabinet 200 can be driven by the lifting mechanism to enter the cleaning tank 100 to clean the copper substrate.

[0027] In a preferred embodiment, a drain port 101 for draining the cleaning liquid is disposed at the bottom of the cleaning tank 100 , and the cleaning liquid in the cleaning tank 100 after washing the copper substrate is drained through the drain port 101 .

[0028] In the utility model, a cleaning liquid is put into the cleaning tank 100, and a heating mechanism can heat the cleaning liquid; the cleaning cabinet 200 is lifted by a lifting mechanism; the groove 303 is pulled by hand to pull the cleaning drawer 300 out of the cleaning cabinet 200, the copper substrate to be cleaned is put into the cleaning drawer 300, and the cleaning drawer 300 is pushed into the outer frame 201; the cleaning cabinet 200 is driven by the lifting mechanism to enter the cleaning tank 100 along the depth direction of the cleaning tank 100, and soaked for a certain time according to the process requirements, and the ultrasonic generator 400 is arranged at the bottom of the cleaning tank 100, which can perform ultrasonic vibration cleaning on the cleaned copper substrate in the cleaning tank 100, and when the cleaning of the cleaned copper substrate is completed, the cleaning cabinet 200 is taken away from the cleaning tank 100 along the depth direction of the cleaning tank 100 by the lifting mechanism; thereby, the lifting type copper substrate cleaning device can automatically clean the cleaned copper substrate, and can effectively improve the cleanliness of the cleaned and disinfected articles, and has strong practicality.

[0029] The above description is only a preferred embodiment of the utility model and is not intended to limit the utility model. Although the utility model is described in detail with reference to the above embodiments, those skilled in the art can still modify the technical solutions recorded in the above embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A lifting type copper substrate cleaning device, characterized in that: It includes a cleaning tank, a cleaning cabinet and a lifting mechanism; the cleaning cabinet enters or leaves the cleaning tank through the lifting mechanism, wherein the cleaning cabinet includes an outer frame and a plurality of cleaning drawers, a plurality of layers of partitions are arranged at equal intervals in the outer frame, and a plurality of first through holes are arranged on the outer frame and the partitions; a cleaning drawer is placed on the partition, and the cleaning drawer is slidably connected to the outer frame; the cleaning drawer is provided with a receiving groove for placing products, and a plurality of second through holes are arranged at the bottom of the receiving groove.

2. The lifting type copper substrate cleaning device according to claim 1, characterized in that: The lifting mechanism includes a lifting column and a lifting cylinder, the lifting cylinder is connected to the lifting column, the outer frame is provided with a lifting hole matched with the lifting column, and the lifting mechanism drives the cleaning cabinet to move up and down in the cleaning tank.

3. The lifting type copper substrate cleaning device according to claim 1, characterized in that: The bottom of the cleaning tank is provided with a drain port for draining the cleaning liquid.

4. The lifting type copper substrate cleaning device according to claim 1, characterized in that: It also includes an ultrasonic generator, which is arranged at the bottom of the cleaning tank.

5. The lifting type copper substrate cleaning device according to claim 1, characterized in that: The utility model also comprises a heating mechanism, and the heating mechanism is arranged in the cleaning tank.

6. The lifting type copper substrate cleaning device according to claim 1, characterized in that: A guide rail is arranged inside the outer frame, and a slide rail which is slidably matched with the corresponding guide rail is arranged in the washing drawer.

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