HDI circuit board laser drilling device

By designing a laser drilling device including a clamping mechanism, a rotating mechanism, a transmission mechanism, a drilling mechanism and a blowing mechanism, the problem of automatic positioning and cleaning in the prior art is solved, the precise positioning of the HDI circuit board and cleaning during the drilling process are realized, and the accuracy and efficiency of the drilling are improved.

CN119589166AActive Publication Date: 2025-03-11JIAN HUAYANGPCB

Patent Information

Application Number
CN202411705654.4
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-11-26
Publication Date
2025-03-11
Estimated Expiration
2044-11-26

AI Technical Summary

Technical Problem

The existing HDI circuit board laser drilling device cannot achieve automatic positioning and cleaning effects after drilling.

Method used

A laser drilling device including a clamping mechanism, a rotating mechanism, a transmission mechanism, a drilling mechanism and a blowing mechanism are designed. The precise positioning of the HDI circuit board is achieved through the cooperation of the clamping mechanism and the rotating mechanism. The transmission mechanism drives the air blowing mechanism to remove debris during the drilling process and surface cleaning is carried out through the drilling mechanism after the drilling is completed.

Benefits of technology

Accurate positioning of HDI circuit boards is achieved, the accuracy and efficiency of drilling holes is improved, the scrap rate is reduced, and the cleaning and temperature stability of the drilling area is ensured, and the overall quality and efficiency are improved.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN119589166A_ABST
    Figure CN119589166A_ABST
Patent Text Reader

Abstract

The invention discloses an HDI circuit board laser drilling device, and particularly relates to the technical field of HDI circuit board drilling, the HDI circuit board laser drilling device comprises an operation table, a rotating mechanism is rotatably connected to the right side of the middle of the upper end of the operation table, a transmission mechanism is rotatably connected to the front side of the upper end of the operation table, and a drilling mechanism is fixedly connected to the middle of the upper end of the operation table; an air blowing mechanism is arranged on the left side of the lower portion of the drilling mechanism. According to the HDI circuit board laser drilling device, in the descending process of the laser drilling head, a baffle is driven to be matched with a rectangular block, the HDI circuit board can be automatically and accurately positioned, the drilling precision and efficiency are improved, in the drilling process, a spray head is matched with a limiting pipe and a first sliding block, and therefore the HDI circuit board can be accurately drilled. According to the HDI circuit board drilling device, the surface of a drilled HDI circuit board is cleaned through the soft brush, chippings and dust generated in the drilling process can be removed, meanwhile, in the reset process of the laser drilling head, the surface of the drilled HDI circuit board is cleaned through the soft brush, the residual chippings and dust can be removed, and the cleanliness of the HDI circuit board is guaranteed.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The invention relates to the technical field of HDI circuit board drilling, and in particular to a HDI circuit board laser drilling device. Background Art

[0002] HDI circuit board, or high-density interconnect circuit board, is a technology for producing printed circuit boards. It uses micro-blind buried hole technology and has a high line distribution density. HDI circuit board laser drilling is an advanced manufacturing process that uses the high energy density and focusing of the laser beam to achieve fast and accurate drilling on the HDI circuit board. During the laser drilling process of HDI circuit boards, it is necessary to pay attention to the fact that the performance of the laser drilling machine directly affects the quality and efficiency of drilling. It is necessary to select a laser drilling machine with stable performance and high precision, and equip it with a suitable fixture and positioning system to ensure the accuracy and stability of drilling. After drilling, the holes need to be cleaned and processed to remove the debris and residues generated during the drilling process.

[0003] Chinese patent announcement number CN214815853U discloses a laser drilling device for HDI circuit boards, including a processing table, vertical plates are symmetrically arranged on both sides of the top of the processing table, a horizontal plate is arranged on the top of the vertical plates, a laser drill is arranged on the horizontal plate, an HDI circuit board is arranged on the top of the processing table, a fixed plate is arranged on the left side of the HDI circuit board, the fixed plate is arranged on the top of the processing table, a clamping mechanism is arranged on the right side of the HDI circuit board, a square opening is opened in the processing table, the square opening passes through the processing table from top to bottom, supporting legs and a material guide plate are arranged at the bottom of the processing table, the material guide plate is connected to the processing table through a connecting component, and a placement plate is arranged between the supporting legs. The utility model can clamp and fix the HDI circuit board through the clamping mechanism, so that the HDI circuit board is more stable during drilling, and the waste generated by drilling can be collected through the material guide plate and the collection box.

[0004] Although the above device has a simple structure, it cannot be automatically positioned through coordination during implementation, and it cannot achieve the effect of cleaning after drilling. Summary of the invention

[0005] The main purpose of the present invention is to provide a HDI circuit board laser drilling device, which can effectively solve the problem that automatic positioning cannot be performed through cooperation and cleaning cannot be achieved after drilling is completed.

[0006] To achieve the above object, the technical solution adopted by the present invention is: A laser drilling device for an HDI circuit board comprises an operating table, wherein a clamping mechanism is symmetrically arranged on the rear side of the upper end of the operating table, a rotating mechanism is rotatably connected to the right side of the middle part of the upper end of the operating table, a transmission mechanism is rotatably connected to the front side of the upper end of the operating table, a drilling mechanism is fixedly connected to the middle part of the upper end of the operating table, and an air blowing mechanism is arranged on the left side of the lower part of the drilling mechanism.

[0007] Preferably, a loading roller is fixedly connected to the rear side of the upper end of the operating table, a guide rail is symmetrically fixedly connected to the upper end of the operating table, a through hole is opened on the right side of the middle part of the upper end of the operating table, and a unloading roller is fixedly connected to the front side of the upper end of the operating table.

[0008] Preferably, the transmission mechanism includes a motor fixedly connected to the front side of the upper end of the operating table, the output end of the motor is fixedly connected to a one-way rotating shaft, the rear end of the one-way rotating shaft is fixedly connected to a two-way screw rod, a slider 2 is arranged on the rear side of the outer surface of the two-way screw rod, and the middle part of the outer surface of the motor output end is transmission-connected to a threaded rod.

[0009] Preferably, the clamping mechanism includes a rectangular block slidably connected to the outer surface of the guide rail, a limiting plate is symmetrically fixedly connected to the left side of the upper end of the rectangular block, a slide plate is provided at the upper end of the rectangular block, a rotating rod is rotatably connected to the front side of the lower end of the slide plate, and the front side of the lower end of the rotating rod is rotatably connected to the upper end of the second slider.

[0010] Preferably, a guide rod is fixedly connected to the middle of the upper end of the rectangular block, a rectangular plate is fixedly connected to the right side of the upper end of the rectangular block, the outer surface of the guide rod is slidably connected to the lower end of the skateboard, and a plurality of rubber rollers are fixedly connected to the left side of the upper end of the skateboard.

[0011] Preferably, the blowing mechanism includes a slider 1 threadedly connected to the rear side of the outer surface of the threaded rod, the rear end of the slider 1 is fixedly connected to a limiting tube, the rear side of the outer surface of the limiting tube is provided with a hose, and the output end of the hose is fixedly connected to a plurality of nozzles.

[0012] Preferably, a second one-way valve is fixedly connected to the front side of the outer surface of the limiting tube, a first one-way valve is fixedly connected to the rear side of the outer surface of the limiting tube, and the lower side of the outer surface of the hose is fixedly connected to the first one-way valve.

[0013] Preferably, the drilling mechanism includes a hydraulic cylinder fixedly connected to the middle part of the upper end of the operating table, the output end of the hydraulic cylinder is fixedly connected to a push plate, the middle part of the lower end of the push plate is fixedly connected to a laser drilling head, the right side of the laser drilling head is fixedly connected to a rack, and the rear side of the push plate is fixedly connected to the upper end of the nozzle.

[0014] Preferably, the rotating mechanism includes a gear that can mesh with the rear end of the rack, the inner surface of the gear is fixedly connected to roller one, the left side of the outer surface of roller one is transmission-connected to roller two, the lower part of the outer surface of roller two is fixedly connected to a circular plate, and the upper part of the outer surface of roller two is fixedly connected to a soft brush.

[0015] Preferably, a baffle is fixedly connected to the rear side of the upper end of the circular plate, and the second roller is rotatably connected to the upper end of the operating table.

[0016] Compared with the prior art, the present invention has the following beneficial effects: 1. The present invention can realize accurate positioning of the HDI circuit board through the cooperation of the drilling mechanism, the rotating mechanism and the clamping mechanism, which not only improves the drilling accuracy, but also reduces the scrap rate caused by inaccurate positioning. At the same time, the blowing mechanism continuously blows air during the drilling process, which helps to remove the debris and heat generated during the drilling process, keep the drilling area clean and the temperature stable, thereby further improving the quality and efficiency of drilling. During the resetting process of the drilling mechanism, the rotating mechanism is driven to clean the surface of the HDI circuit board, which can not only effectively remove dust and debris on the surface of the HDI circuit board, but also improve the cleanliness and quality of the circuit board, providing a good foundation for subsequent electronic component installation and welding.

[0017] 2. The present invention drives the baffle to rotate during the descent of the laser drilling head by means of a rack and a gear. The baffle and the rectangular block can automatically and accurately locate the position of the HDI circuit board, thereby avoiding the error of manual positioning, improving the accuracy and efficiency of drilling, and realizing the coordinated work of the baffle and the rectangular block. During the drilling process, the nozzle cooperates with the limit tube and the slider 1 to help remove the debris and dust generated during the drilling process. Not only can the debris be more effectively discharged from the drill hole to prevent it from clogging the drill hole or affecting the drilling quality, but it can also play a cooling role, reduce the working temperature of the laser drilling head, and extend its service life. At the same time, during the resetting process of the laser drilling head, a soft brush is used to clean the surface of the HDI circuit board after drilling, which can remove the residual debris and dust, ensure the cleanliness of the HDI circuit board, and help improve the quality and efficiency of subsequent processes. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is another perspective overall structural schematic diagram of the present invention; Figure 3 It is a schematic diagram of the local structure of the present invention; Figure 4 It is a schematic diagram of the transmission mechanism structure of the present invention; Figure 5 For the present invention Figure 4 The enlarged structural diagram at A in the middle; Figure 6 It is a schematic diagram of the structure of the clamping mechanism of the present invention; Figure 7 It is a schematic diagram of the operating structure of the clamping mechanism of the present invention; Figure 8 It is a structural schematic diagram of the drilling mechanism of the present invention; Fig. 9 It is a schematic diagram of the structure of the rotating mechanism of the present invention; Fig.10 It is a schematic diagram of the structure of the blowing mechanism of the present invention.

[0019] In the figure: 1. operating table; 11. feeding roller; 12. guide rail; 13. through hole; 14. unloading roller; 2. clamping mechanism; 21. rectangular block; 211. rectangular plate; 212. guide rod; 22. limit plate; 23. slide plate; 231. rubber roller; 24. rotating rod; 3. rotating mechanism; 31. roller 1; 32. gear; 33. roller 2; 34. round plate; 341. baffle; 35. soft brush; 4. drilling mechanism; 41. hydraulic cylinder; 42. push plate; 43. laser drilling head; 44. rack; 5. blowing mechanism; 51. slider 1; 52. limit tube; 521. one-way valve 1; 522. one-way valve 2; 53. hose; 54. nozzle; 6. transmission mechanism; 61. motor; 62. two-way screw rod; 63. slider 2; 64. threaded rod; 65. one-way rotating shaft. DETAILED DESCRIPTION

[0020] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.

[0021] Embodiment 1, as Figure 1 and Figure 2 As shown, a laser drilling device for an HDI circuit board includes an operating table 1, a clamping mechanism 2 is symmetrically arranged on the rear side of the upper end of the operating table 1, a rotating mechanism 3 is rotatably connected to the right side of the middle of the upper end of the operating table 1, a transmission mechanism 6 is rotatably connected to the front side of the upper end of the operating table 1, a drilling mechanism 4 is fixedly connected to the middle of the upper end of the operating table 1, and a blowing mechanism 5 is arranged on the left side of the lower part of the drilling mechanism 4.

[0022] When it is necessary to drill holes in the HDI circuit board, the operating table 1 cooperates with the conveying device in the prior art to intermittently convey the HDI circuit board to be drilled to the rear side of the upper end of the operating table 1, and then the transmission mechanism 6 cooperates with the two clamping mechanisms 2 to clamp the HDI circuit board and move it forward. During the forward movement of the HDI circuit board, the drilling mechanism 4 cooperates with the rotating mechanism 3, and the rotating mechanism 3 cooperates with the clamping mechanism 2 in the process of preparing for laser drilling to facilitate the drilling mechanism 4 to cooperate with the HDI circuit board to drill holes. At the same time, the transmission mechanism 6 cooperates with the blowing mechanism 5 to continuously blow air to the HDI circuit board during the cutting process to prevent fine particles generated during the drilling process from affecting subsequent drilling operations; Similarly, after the drilling is completed, the surface of the HDI circuit board is cleaned by cooperating with the rotating mechanism 3 during the resetting process of the drilling mechanism 4, so as to facilitate the subsequent operation of the HDI circuit board. Then the transmission mechanism 6 cooperates with the clamping mechanism 2 to transfer the HDI circuit board after the drilling to the upper front side of the operating table 1, so as to facilitate the subsequent operation of the HDI circuit board.

[0023] During the operation of this embodiment, the drilling mechanism 4 cooperates with the rotating mechanism 3 and the clamping mechanism 2 to achieve accurate positioning of the HDI circuit board, which not only improves the accuracy of drilling, but also reduces the scrap rate caused by inaccurate positioning. At the same time, the blowing mechanism 5 continuously blows air during the drilling process, which helps to remove the debris and heat generated during the drilling process, keep the drilling area clean and the temperature stable, thereby further improving the quality and efficiency of drilling. During the resetting process of the drilling mechanism 4, the rotating mechanism 3 is driven to clean the surface of the HDI circuit board, which can not only effectively remove dust and debris on the surface of the HDI circuit board, but also improve the cleanliness and quality of the circuit board, providing a good foundation for subsequent electronic component installation and welding.

[0024] Embodiment 2: Based on embodiment 1, this embodiment drives the baffle 341 to cooperate with the rectangular block 21 for positioning during the descent of the laser drilling head 43, and uses a soft brush 35 to clean the surface of the HDI circuit board after drilling during the resetting of the laser drilling head 43.

[0025] See also Figure 3 A loading roller 11 is fixedly connected to the rear side of the upper end of the operating platform 1, a guide rail 12 is symmetrically fixedly connected to the upper end of the operating platform 1, a through hole 13 is opened on the right side of the middle part of the upper end of the operating platform 1, and a unloading roller 14 is fixedly connected to the front side of the upper end of the operating platform 1.

[0026] The HDI circuit board is intermittently conveyed to the front side of the upper end of the loading roller 11 by the conveying device in the prior art, so that the two clamping mechanisms 2 cooperate to clamp and convey. Similarly, when the two clamping mechanisms 2 cooperate to convey the HDI circuit board to the upper end of the front unloading roller 14, the two clamping mechanisms 2 no longer clamp, which is convenient for the subsequent picking operation of the HDI circuit board. The two guide rails 12 cooperate with the two clamping mechanisms 2 to guide it to avoid position deviation during the movement.

[0027] See also Figure 4 and Figure 5 The transmission mechanism 6 includes a motor 61 fixedly connected to the front side of the upper end of the operating table 1, a one-way rotating shaft 65 is fixedly connected to the output end of the motor 61, a two-way screw rod 62 is fixedly connected to the rear end of the one-way rotating shaft 65, a slider 2 63 is arranged on the rear side of the outer surface of the two-way screw rod 62, and a threaded rod 64 is transmission-connected to the middle part of the outer surface of the output end of the motor 61.

[0028] The one-way rotating shaft 65 mentioned above is composed of an outer ring, an inner ring, a roller and a spring, and its working principle is as follows: Outer ring: usually fixed to the housing or connected to other components to form a cylinder-like structure; Inner ring: The structure of the inner ring is relatively special. It has a circle with a slope. This slope is a one-way shaft 65 to achieve one-way rotation and locking functions; Roller: The roller is always in contact with the inner and outer rings, and its working surface is also a slope; Spring: The spring is in contact with the roller to maintain the position of the roller and provide a return force when needed; Therefore, the one-way rotating shaft 65 mentioned above is a conventional setting in the prior art and will not be elaborated in detail in this solution.

[0029] See also Figure 5 , through the cooperation of the one-way rotating shaft 65, when the output end of the motor 61 rotates forward, the one-way rotating shaft 65 and the two-way screw rod 62 are driven to rotate at the same time. When the output end of the motor 61 rotates reversely, the two-way screw rod 62 no longer rotates through the cooperation of the one-way rotating shaft 65.

[0030] The middle part of the outer surface of the output end of the above-mentioned motor 61 drives the threaded rod 64 to rotate through the transmission belt in the prior art. At the same time, the radius of the pulley fixed to the middle part of the outer surface of the motor 61 is smaller than the pulley fixed to the outer surface of the threaded rod 64, that is, the rotation speed of the threaded rod 64 is slower during the rotation of the motor 61.

[0031] Specifically, when the HDI circuit board needs to be transported, the motor 61 is stimulated to rotate its output end forward, and then the one-way shaft 65 and the two-way screw 62 rotate at the same time, thereby driving the slider 2 63 to move forward. At the same time, the motor 61 rotates to drive the threaded rod 64 to rotate continuously through the transmission belt.

[0032] See also Figure 6 and Figure 7 The clamping mechanism 2 includes a rectangular block 21 that is slidably connected to the outer surface of the guide rail 12, a limiting plate 22 is symmetrically fixedly connected to the left side of the upper end of the rectangular block 21, a slide plate 23 is provided at the upper end of the rectangular block 21, and a rotating rod 24 is rotatably connected to the front side of the lower end of the slide plate 23, and the front side of the lower end of the rotating rod 24 is rotatably connected to the upper end of the slider 2 63.

[0033] Furthermore, when the slider 2 63 is driven to move forward, the front ends of the two rotating rods 24 are driven to move forward, and at the same time, the two rotating rods 24 rotate and drive the two slide plates 23 to move. At the same time, due to the cooperation of the rectangular block 21, the two slide plates 23 move toward each other. When the two slide plates 23 move to be close to the two limit plates 22 on the same side, the rotating rod 24 continues to be driven forward by the slider 2 63. At this time, the two slide plates 23 no longer continue to approach each other. The rotating rod 24 cooperates with the rectangular block 21 through the slide plate 23 to move forward as a whole. At the same time, the two slide plates 23 close to each other clamp the HDI circuit board to be drilled and move forward to prepare for drilling.

[0034] See also Figure 6 A guide rod 212 is fixedly connected to the middle of the upper end of the rectangular block 21, a rectangular plate 211 is fixedly connected to the right side of the upper end of the rectangular block 21, the outer surface of the guide rod 212 is slidably connected to the lower end of the slide plate 23, and a plurality of rubber rollers 231 are fixedly connected to the left side of the upper end of the slide plate 23.

[0035] See also Figure 7 When the HDI circuit board on the front side of the upper end of the feeding roller 11 needs to be clamped and moved forward, the motor 61 is excited to drive the slider 2 63 to move forward, thereby driving the two rotating rods 24 to pull the two matching slide plates 23 to move, and the two slide plates 23 move toward each other along the guide rod 212, and then the two slide plates 23 drive the rubber rollers 231 on the upper end to move toward each other. When the two slide plates 23 move to be in close contact with the two matching limit plates 22, the rubber rollers 231 on both sides of the upper end cooperate with each other to clamp the HDI circuit board; Subsequently, the rotating rod 24 continues to be driven forward by the slider 2 63, and then the rubber rollers 231 on both sides clamp the HDI circuit board. Then the two rotating rods 24 drive the rectangular block 21 to slide forward along the surface of the guide rail 12 through the slide plate 23 and the guide rod 212 to prepare for laser drilling.

[0036] When drilling and unloading are completed, the slider 2 63 moves backward along the bidirectional screw 62, and then pushes the two rotating rods 24 backward. At this time, the two rotating rods 24 drive the slide plate 23 and a plurality of rubber rollers 231 to move away from each other. At this time, the HDI circuit board is located at the upper end of the unloading roller 14, and the rubber rollers 231 on both sides no longer clamp the HDI circuit board, which is convenient for subsequent processing and picking up of the HDI circuit board. Then the rotating rod 24 cooperates with the slide plate 23 and the rectangular block 21 to move backward to clamp the next HDI circuit board.

[0037] See also Figure 8 The drilling mechanism 4 includes a hydraulic cylinder 41 fixedly connected to the middle part of the upper end of the operating table 1, a push plate 42 is fixedly connected to the output end of the hydraulic cylinder 41, a laser drilling head 43 is fixedly connected to the middle part of the lower end of the push plate 42, and a rack 44 is fixedly connected to the right side of the laser drilling head 43.

[0038] When the rubber rollers 231 on both sides cooperate to clamp the HDI circuit board and move forward, the hydraulic cylinder 41 is activated, and then the output end of the hydraulic cylinder 41 pushes the push plate 42 downward, thereby causing the laser drilling head 43 and the rack 44 to move downward at the same time until the laser drilling head 43 reaches the specified drilling height, and the operation of the hydraulic cylinder 41 can be suspended.

[0039] See also Fig. 9 The rotating mechanism 3 includes a gear 32 that can mesh with the rear end of the rack 44, the inner surface of the gear 32 is fixedly connected to a roller 1 31, the left side of the outer surface of the roller 1 31 is transmission-connected to a roller 2 33, the lower part of the outer surface of the roller 2 33 is fixedly connected to a circular plate 34, and the upper part of the outer surface of the roller 2 33 is fixedly connected to a soft brush 35.

[0040] Furthermore, when the rack 44 is pushed downward by the push plate 42, the rack 44 and the gear 32 begin to mesh, that is, the rack 44 moves downward to rotate the gear 32, and the gear 32 drives the roller 1 31 to rotate in the same direction during the rotation process; The roller 1 31 and the roller 2 33 are connected by a bevel gear transmission group in the prior art. When the roller 1 31 rotates, the roller 2 33 can be rotated at the same time. The specific transmission principle will not be described in detail in this scheme. Furthermore, the first roller 31 drives the second roller 33 to rotate, which in turn drives the soft brush 35 to rotate around the axis of the second roller 33 close to the side of the gear 32, and also causes the circular plate 34 and the second roller 33 to rotate in the same direction.

[0041] See also Fig. 9 A baffle 341 is fixedly connected to the rear side of the upper end of the circular plate 34, and the second roller 33 is rotatably connected to the upper end of the operating table 1.

[0042] When the second roller 33 drives the circular plate 34 to rotate in the same direction, it will drive the baffle 341 to rotate around the axis of the circular plate 34 to the side away from the gear 32. When the laser drilling head 43 descends to a suitable drilling height, the rack 44 cooperates with the gear 32 to rotate the baffle 341 and the soft brush 35 by 90 degrees.

[0043] When the output end of the motor 61 rotates forward, the bidirectional screw 62 rotates, and the slider 2 63 drives the two rotating rods 24 to move forward. The two rectangular blocks 21 move forward along the surface of the guide rail 12. When the front end of the rectangular block 21 on one side moves to be close to the rear side of the baffle 341, the forward rotation of the output end of the motor 61 is paused, and then the positions of the two rectangular blocks 21 no longer move. At this time, the laser drilling head 43 is also moved downward to a suitable height by the output end of the hydraulic cylinder 41 in cooperation with the push plate 42, and then the laser drilling head 43 can be stimulated to drill.

[0044] See also Fig.10 The blowing mechanism 5 includes a slider 51 threadedly connected to the rear side of the outer surface of the threaded rod 64, the rear end of the slider 51 is fixedly connected to a limiting tube 52, a hose 53 is provided on the rear side of the outer surface of the limiting tube 52, a plurality of nozzles 54 are fixedly connected to the output end of the hose 53, and the rear side of the push plate 42 is fixedly connected to the upper end of the nozzle 54.

[0045] When the motor 61 is excited, its output end rotates, and during the rotation of the slider 2 63 driven by the transmission belt, the slider 1 51 moves forward along the slider 2 63, and then the slider 1 51 pulls the limit tube 52 during its movement. At the same time, during the downward movement of the push plate 42, the plurality of nozzles 54 and one end of the hose 53 are driven to move downward at the same time. Similarly, the air outlet angles of the plurality of nozzles 54 are adjusted so that the gases blown out by the plurality of nozzles 54 are uniformly blown forward, so that during the drilling process, the laser drilling head 43 continuously blows air through the plurality of nozzles 54 to blow out the small particles generated during the drilling process, thereby avoiding affecting the cutting and drilling of the entire HDI circuit board.

[0046] See also Fig.10 A one-way valve 522 is fixedly connected to the front side of the outer surface of the limiting tube 52, a one-way valve 521 is fixedly connected to the rear side of the outer surface of the limiting tube 52, and the lower side of the outer surface of the hose 53 is fixedly connected to the one-way valve 521.

[0047] When the output end of the motor 61 rotates forward and drives the threaded rod 64 to rotate, the slider 1 51 drives the front end of the limit tube 52 to move forward, and at the same time, the external gas enters the inside of the limit tube 52 through the one-way valve 2 522. When the laser drilling head 43 is ready to drill a hole, the output end of the motor 61 is reversed, and then the threaded rod 64 is reversed, that is, the slider 1 51 can drive the front end of the limit tube 52 to move backward. At the same time, through the setting of the one-way valve 1 521, the internal gas of the limit tube 52 passes through the one-way valve 1 521 into the inside of the hose 53 and then is ejected from the plurality of nozzles 54. During the continuous drilling process of the laser drilling head 43, the HDI circuit board is blown to prevent small particles in the drilling process from affecting subsequent drilling.

[0048] Furthermore, after all the drilling is completed, the hydraulic cylinder 41 is stimulated so that its output end drives the push plate 42 and the laser drilling head 43 to move upward and reset. Similarly, the rack 44 cooperates with the gear 32, and the rack 44 drives the gear 32 to rotate during the upward movement, so that the soft brush 35 rotates to the side away from the gear 32. During the rotation of the soft brush 35, the lower end of the soft brush 35 passes through the upper end of the HDI circuit board clamped by the rubber rollers 231 on both sides. During the rotation of the soft brush 35, the upper end of the HDI circuit board can be cleaned, so that the HDI circuit board can be initially cleaned after drilling, which is convenient for subsequent processing operations of the HDI circuit board. When the soft brush 35 rotates, the baffle 341 rotates toward the side close to the gear 32, and then the baffle 341 no longer blocks the front end of the rectangular block 21, and then the output end of the motor 61 can rotate forward, and through the cooperation of the one-way rotating shaft 65 and the two-way screw rod 62, the slider 2 63 continues to drive the rotating rods 24 on both sides to move forward; At this time, the output end of the motor 61 rotates forward, driving the threaded rod 64 to rotate forward, that is, the slider 1 51 continues to drive the front end of the limiting tube 52 to move forward. At the same time, the pulley radii on the outer surface of the motor 61 and the outer surface of the threaded rod 64 are different, so that the threaded rod 64 rotates slower, that is, the slider 2 63 can move forward to the lower end of the unloading roller 14 and then continue to move backward to the lower end of the loading roller 11. At this time, the slider 1 51 moves forward along the surface of the threaded rod 64, but does not move to the front end of the threaded rod 64.

[0049] Furthermore, when the threaded rod 64 reverses and drives the slider 51 to move backward next time, the slider 51 can be moved to the rear end of the threaded rod 64 by the rotation setting of the motor 61.

[0050] Therefore, in this solution, the rack 44 cooperates with the gear 32 to drive the baffle 341 to rotate during the descent of the laser drilling head 43. The baffle 341 cooperates with the rectangular block 21 to automatically and accurately locate the position of the HDI circuit board, avoiding the error of manual positioning, improving the accuracy and efficiency of drilling, and realizing the coordinated work of the baffle 341 and the rectangular block 21. During the drilling process, the nozzle 54 cooperates with the limit tube 52 and the slider 51 to help remove the debris and dust generated during the drilling process. Not only can the debris be more effectively discharged from the drilled hole to prevent it from clogging the drilled hole or affecting the drilling quality, but it can also play a cooling role, reduce the working temperature of the laser drilling head, and extend its service life. At the same time, during the resetting process of the laser drilling head 43, the soft brush 35 is used to clean the surface of the HDI circuit board after drilling, which can remove the residual debris and dust, ensure the cleanliness of the HDI circuit board, and help improve the quality and efficiency of subsequent processes (such as electroplating, welding, etc.).

[0051] It should be particularly noted that the specific installation method of the hydraulic cylinder 41 and the motor 61, the circuit connection method and the control method used in the present invention are all conventional designs and will not be elaborated in detail in the present invention.

[0052] The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention to be protected. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A laser drilling device for HDI circuit boards, comprising an operating table (1), characterized in that: A clamping mechanism (2) is symmetrically arranged on the rear side of the upper end of the operating table (1); a rotating mechanism (3) is rotatably connected to the right side of the middle of the upper end of the operating table (1); a transmission mechanism (6) is rotatably connected to the front side of the upper end of the operating table (1); a drilling mechanism (4) is fixedly connected to the middle of the upper end of the operating table (1); and a blowing mechanism (5) is arranged on the left side of the lower part of the drilling mechanism (4).

2. The HDI circuit board laser drilling device according to claim 1, characterized in that: A loading roller (11) is fixedly connected to the rear side of the upper end of the operating platform (1), a guide rail (12) is symmetrically fixedly connected to the upper end of the operating platform (1), a through hole (13) is provided on the right side of the middle of the upper end of the operating platform (1), and a unloading roller (14) is fixedly connected to the front side of the upper end of the operating platform (1).

3. The HDI circuit board laser drilling device according to claim 2, characterized in that: The transmission mechanism (6) comprises a motor (61) fixedly connected to the front side of the upper end of the operating table (1); the output end of the motor (61) is fixedly connected to a one-way rotating shaft (65); the rear end of the one-way rotating shaft (65) is fixedly connected to a two-way screw rod (62); a second slider (63) is provided on the rear side of the outer surface of the two-way screw rod (62); and a threaded rod (64) is transmission-connected to the middle part of the outer surface of the output end of the motor (61).

4. The HDI circuit board laser drilling device according to claim 3, characterized in that: The clamping mechanism (2) comprises a rectangular block (21) slidably connected to the outer surface of the guide rail (12); a limit plate (22) is symmetrically fixedly connected to the left side of the upper end of the rectangular block (21); a slide plate (23) is provided at the upper end of the rectangular block (21); a rotating rod (24) is rotatably connected to the front side of the lower end of the slide plate (23); and the front side of the lower end of the rotating rod (24) is rotatably connected to the upper end of the second slide block (63).

5. The HDI circuit board laser drilling device according to claim 4, characterized in that: A guide rod (212) is fixedly connected to the middle of the upper end of the rectangular block (21), a rectangular plate (211) is fixedly connected to the right side of the upper end of the rectangular block (21), an outer surface of the guide rod (212) is slidably connected to the lower end of the slide plate (23), and a plurality of rubber rollers (231) are fixedly connected to the left side of the upper end of the slide plate (23).

6. The HDI circuit board laser drilling device according to claim 3, characterized in that: The blowing mechanism (5) comprises a slider (51) threadedly connected to the rear side of the outer surface of the threaded rod (64); the rear end of the slider (51) is fixedly connected to a limit tube (52); a hose (53) is provided on the rear side of the outer surface of the limit tube (52); and the output end of the hose (53) is fixedly connected to a plurality of nozzles (54).

7. The HDI circuit board laser drilling device according to claim 6, characterized in that: The front side of the outer surface of the limit tube (52) is fixedly connected to a second check valve (522), the rear side of the outer surface of the limit tube (52) is fixedly connected to a first check valve (521), and the lower side of the outer surface of the hose (53) is fixedly connected to the first check valve (521).

8. The HDI circuit board laser drilling device according to claim 1, characterized in that: The drilling mechanism (4) comprises a hydraulic cylinder (41) fixedly connected to the middle of the upper end of the operating table (1); the output end of the hydraulic cylinder (41) is fixedly connected to a push plate (42); the middle of the lower end of the push plate (42) is fixedly connected to a laser drilling head (43); the right side of the laser drilling head (43) is fixedly connected to a rack (44); and the rear side of the push plate (42) is fixedly connected to the upper end of the nozzle (54).

9. The HDI circuit board laser drilling device according to claim 8, characterized in that: The rotating mechanism (3) comprises a gear (32) that can mesh with the rear end of the rack (44); the inner surface of the gear (32) is fixedly connected to a first roller (31); the left side of the outer surface of the first roller (31) is drivingly connected to a second roller (33); the lower part of the outer surface of the second roller (33) is fixedly connected to a circular plate (34); and the upper part of the outer surface of the second roller (33) is fixedly connected to a soft brush (35).

10. The HDI circuit board laser drilling device according to claim 9, characterized in that: A baffle (341) is fixedly connected to the rear side of the upper end of the circular plate (34), and the second rotating roller (33) is rotatably connected to the upper end of the operating table (1).

Citation Information

Patent Citations

  • Laser drilling device for multilayer circuit board production and implementation method of laser drilling device

    CN113681181A

  • Multilayer HDI circuit board UV laser drill system of processing

    CN207771116U

  • HDI circuit board laser drilling device

    CN214815853U

  • High-precision laser drilling device for HDI circuit board

    CN217799676U

  • HDI circuit board and method of production of an HDI circuit board

    US20030002263A1

Cited By

  • Micropore forming equipment and method for high-aspect-ratio blind hole multilayer PCB (printed circuit board)

    CN120239183A

  • Semiconductor equipment framework high-precision assembling and welding equipment and tool clamp

    CN121199348A

  • Intelligent welding device for PCBA circuit board manufacturing

    CN121240346A