Intelligent processing tank device based on plasma nanometer polishing

Abstract

The utility model provides an intelligent processing groove device based on plasma nanometer polishing, which relates to the technical field of plasma nanometer polishing and comprises a processing groove, a sealing cover and a workpiece hanging frame. The processing groove is filled with a polishing solution; the sealing cover is arranged at the top of the machining groove and used for sealing the machining groove. The workpiece hanging frame is installed in the sealing cover and used for hanging a polished workpiece. During machining, the workpiece hanging frame is electrically connected with the positive electrode of the power source, and the workpiece hanging frame and the workpiece are machining anodes. The processing tank is electrically connected with the cathode of the power supply; and the processing tank and the polishing solution are processing cathodes. The utility model provides an intelligent processing tank device based on plasma nanometer polishing. The interference that water vapor diffuses in a working environment when plasma nanometer polishing is carried out on a workpiece is avoided. Meanwhile, water vapor is recycled, and water consumption is reduced; and the liquid level height and temperature of the polishing liquid in the machining groove are automatically adjusted without manual work, the working efficiency is improved, and higher intelligence is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of plasma nano-polishing, in particular to an intelligent processing groove device based on plasma nano-polishing. Background Art

[0002] Plasma nanopolishing is a new type of workpiece surface treatment polishing process. The workpiece to be polished is used as the anode and the polishing liquid is used as the cathode. After the workpiece is immersed in the polishing liquid, voltage is applied between the two electrodes. Heat will be released between the anode workpiece surface and the cathode polishing liquid due to the applied voltage, and then a gas layer mainly composed of water vapor will be formed on the workpiece surface, isolating the cathode polishing liquid and the anode workpiece surface. The burrs on the workpiece surface are removed by discharging through the gas layer by electric current, and the workpiece surface is polished.

[0003] However, when a gas layer dominated by water vapor is formed on the surface of the workpiece, the water vapor will diffuse in the working environment and will not dissipate for a long time, seriously affecting the working line of sight. At the same time, since the water in the polishing liquid is evaporated when the gas layer is formed, the concentration of the polishing liquid will increase, which will affect the polishing quality of the workpiece surface. Therefore, it is usually necessary to mark the initial liquid level and continuously replenish water manually. As the water in the polishing liquid is continuously evaporated, the depth of the workpiece being polished immersed in the polishing liquid decreases, and the placement of the workpiece needs to be repeatedly adjusted to ensure that the workpiece is completely polished. When replenishing water to the polishing liquid, the temperature of the replenishing water may cause the temperature of the polishing liquid to decrease, so it is also necessary to continuously control the temperature and heat the polishing liquid. The existing processing tank device based on plasma nanopolishing usually has a relatively simple function. When polishing the surface of the workpiece, it is impossible to avoid water vapor diffusing in the working environment, affecting the line of sight; at the same time, it is also necessary to manually replenish water and control the temperature, as well as adjust the placement of the workpiece, which has low work efficiency and is not smart enough. Utility Model Content

[0004] The purpose of the utility model is to provide an intelligent processing tank device based on plasma nano-polishing to solve at least one of the above-mentioned technical problems existing in the prior art.

[0005] In order to solve the above technical problems, the utility model provides an intelligent processing tank device based on plasma nano-polishing, comprising: a processing tank, a sealing cover and a workpiece hanger;

[0006] The processing tank is filled with a polishing liquid of a specific concentration and temperature, and the polishing liquid is a polishing salt solution;

[0007] The sealing cover is arranged on the top of the processing tank, communicated with the processing tank, and used to seal the processing tank to prevent the overflow of water vapor during processing;

[0008] The workpiece hanger is installed in the sealing cover and is used to hang the workpiece to be polished so that the workpiece is completely immersed in the polishing liquid;

[0009] During processing, the workpiece hanger is electrically connected to the positive pole of the power supply, and the workpiece hanger and the workpiece are the processing anode; the processing tank is electrically connected to the negative pole of the power supply, and the processing tank and the polishing liquid are the processing cathode; high voltage is applied by the power supply to achieve plasma nano-polishing of the workpiece.

[0010] The present application seals the processing groove by a sealing cover, thereby avoiding interference such as water vapor spreading in the working environment for a long time and not being able to dissipate when the workpiece is subjected to plasma nano-polishing, thereby preventing interference such as affecting the working vision.

[0011] Furthermore, a condensation water pipe is provided on the top of the sealing cover for condensing water vapor;

[0012] Both ends of the condensing water pipe are connected to the water tank, and water is circulated continuously in the condensing water pipe through a water pump, so that the condensing water pipe maintains a relatively low condensation temperature.

[0013] Preferably, the condensing water pipe is in an S-shaped disk on the top of the sealing cover, which increases the contact area with the water vapor and improves the condensation efficiency of the water vapor.

[0014] Furthermore, a slope structure is provided at the bottom of the sealing cover, so that water droplets condensed from water vapor can flow back into the processing tank.

[0015] During processing, the water vapor in the sealing cover is condensed into water droplets through the condenser pipe and the inner wall of the sealing cover, and the water droplets flow back into the processing tank along the slope structure, thereby realizing the recycling of water and reducing water consumption.

[0016] Furthermore, the side plate of the sealing cover on which the workpiece hanging plate is installed is an insulating plate, which is used to isolate the positive and negative poles of the power supply to prevent the power supply from short circuit.

[0017] Preferably, the sealing cover is provided with a door for opening and sealing the sealing cover.

[0018] When in use, the door of the sealing cover is opened, and the workpiece to be polished is hung on the workpiece hanger so that the workpiece is completely immersed in the polishing liquid; when processing, the door of the sealing cover is closed to seal the intelligent processing tank device based on plasma nano-polishing to prevent water vapor from spreading in the working environment for a long time and affecting the working line of sight.

[0019] Preferably, an observation window is provided on the door of the sealing cover for observing the processing conditions in the intelligent processing tank device based on plasma nanopolishing. When dangers such as workpiece falling occur, the intelligent processing tank device based on plasma nanopolishing can be closed in time to ensure safety.

[0020] Furthermore, a water supply pipe is provided on the side of the processing tank for supplying water into the processing tank;

[0021] The water replenishment pipe is connected to the water tank, and when the processing tank needs to be replenished with water, water is replenished into the processing tank through a water pump.

[0022] Preferably, an intelligent valve is provided on the water supply pipe to control the on-off of the water flow in the water supply pipe.

[0023] Furthermore, a liquid level sensor is provided in the processing tank for detecting the liquid level of the polishing liquid in the processing tank, controlling the switch of the intelligent valve, and then replenishing water into the processing tank through the water replenishing pipe.

[0024] During the processing, the liquid level height of the polishing liquid in the processing tank is detected by the liquid level sensor. When the liquid level height of the polishing liquid is lower than the set liquid level height, the liquid level sensor sends a signal to the intelligent valve, the intelligent valve opens, and water is replenished into the processing tank through the water replenishment pipe; when the liquid level of the polishing liquid reaches the set liquid level height, the liquid level sensor stops sending signals to the intelligent valve, the intelligent valve closes, and water replenishment stops.

[0025] Among them, setting the liquid level height can ensure that the workpiece being polished is completely immersed in the polishing liquid and the concentration requirement of the polishing liquid is met.

[0026] Furthermore, a plurality of high-power heating tubes are arranged in the processing tank for heating the polishing liquid in the processing tank.

[0027] Furthermore, a temperature sensor is provided in the processing tank for detecting the temperature of the polishing liquid in the processing tank and controlling the heating tube to heat the polishing liquid in the processing tank.

[0028] During the processing, the temperature of the polishing liquid in the processing tank is detected by the temperature sensor. When the temperature of the polishing liquid is lower than the set temperature, the temperature sensor sends a signal to the heating tube, and the heating tube starts to quickly heat the polishing liquid. When the polishing liquid reaches the set temperature, the temperature sensor stops sending signals to the heating tube, and the heating tube is turned off and stops heating.

[0029] Among them, the set temperature can ensure the polishing quality of the polished workpiece.

[0030] Furthermore, a drain pipe is provided at the bottom of the processing tank for discharging the polishing liquid in the processing tank.

[0031] By adopting the above technical solution, the utility model has the following beneficial effects:

[0032] The utility model provides an intelligent processing tank device based on plasma nano-polishing, which avoids the interference of water vapor diffused in the working environment when the workpiece is subjected to plasma nano-polishing; at the same time, the water vapor is recycled to reduce water consumption; the liquid level and temperature of the polishing liquid in the processing tank are automatically adjusted without manual work, thereby improving work efficiency and being more intelligent. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0034] Figure 1 A schematic diagram of the three-dimensional structure of an intelligent processing tank device based on plasma nano-polishing provided in an embodiment of the utility model;

[0035] Figure 2 for Figure 1 The schematic diagram of the internal structure of the intelligent processing tank device based on plasma nano-polishing is shown;

[0036] Figure 3 for Figure 1 A top view of the smart processing tank device based on plasma nanopolishing is shown;

[0037] Figure 4 for Figure 1 The rear view of the smart processing tank device based on plasma nanopolishing is shown.

[0038] Reference numerals:

[0039] 1-processing groove; 11-second conductor; 2-sealing cover; 21-slope structure; 22-insulating board; 23-door; 24-observation window; 3-workpiece hanger; 31-first conductor; 4-condensate pipe; 5-water supply pipe; 51-intelligent valve; 6-liquid level sensor; 7-heating pipe; 8-temperature sensor; 9-drain pipe. DETAILED DESCRIPTION

[0040] The technical solution of the utility model will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0041] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0042] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0043] The present invention will be further explained below in conjunction with specific implementation methods.

[0044] It should also be noted that the following specific embodiments or specific implementations are a series of optimized settings listed in the present invention to further explain the specific contents of the utility model, and these settings can be used in combination or in association with each other.

[0045] like Figure 1-4 As shown, the present embodiment provides an intelligent processing tank device based on plasma nano-polishing, comprising: a processing tank 1, a sealing cover 2 and a workpiece hanger 3; the processing tank 1 is filled with a polishing liquid of a specific concentration and temperature, and the polishing liquid is a polishing saline solution; the sealing cover 2 is arranged at the top of the processing tank 1, connected with the processing tank 1, and is used to seal the processing tank 1 to prevent the overflow of water vapor during processing; the workpiece hanger 3 is installed in the sealing cover 2, and is used to hang the workpiece to be polished so that the workpiece is completely immersed in the polishing liquid; during processing, the workpiece hanger 3 is electrically connected to the positive electrode of the power supply through the first wire 31, and the workpiece hanger 3 and the workpiece are the processing anode; the processing tank 1 is electrically connected to the negative electrode of the power supply through the second wire 11, and the processing tank 1 and the polishing liquid are the processing cathode; a high voltage is applied by the power supply to realize plasma nano-polishing of the workpiece.

[0046] The present application seals the processing groove 1 by the sealing cover 2, thereby preventing water vapor from spreading in the working environment for a long time and not dissipating when the workpiece is subjected to plasma nano-polishing, thereby preventing interference such as affecting the working vision.

[0047] On the basis of the above technical solution, it is further preferred that a condensation water pipe 4 is provided on the top of the sealing cover 2 for condensing water vapor; both ends of the condensation water pipe 4 are connected to the water tank, and water is continuously circulated in the condensation water pipe 4 through a water pump, so that the condensation water pipe 4 maintains a low condensation temperature. More preferably, referring to Figure 3 As shown ( Figure 3 In order to show the structure of the condensation water pipe 4, the outer shell installed on the condensation water pipe 4 is hidden. The condensation water pipe 4 is S-shaped and arranged on the top of the sealing cover 2, which increases the contact area with the water vapor and improves the condensation efficiency of the water vapor.

[0048] Reference Figure 1 As shown, more preferably, a slope structure 21 is provided at the bottom of the sealing cover 2, so that water droplets condensed from water vapor can flow back into the processing tank 1. During processing, the water vapor in the sealing cover 2 is condensed into water droplets through the condensation pipe and the inner wall of the sealing cover 2, and the water droplets flow back into the processing tank 1 along the slope structure 21, thereby realizing the recycling of water and reducing water consumption.

[0049] Reference Figure 4 As shown, further, the side plate of the sealing cover 2 on which the workpiece hanging plate is installed is an insulating plate 22, which is used to isolate the positive and negative poles of the power supply to prevent the power supply from short circuit.

[0050] Reference Figure 1 As shown, the sealing cover 2 is provided with a door 23 for opening and sealing the sealing cover 2. When in use, the door 23 of the sealing cover 2 is opened, and the workpiece to be polished is hung on the workpiece hanger 3, so that the workpiece is completely immersed in the polishing liquid; when processing, the door 23 of the sealing cover 2 is closed, so as to seal the intelligent processing tank 1 device based on plasma nanopolishing, and prevent water vapor from spreading in the working environment for a long time without being dissipated and affecting the working sight.

[0051] More preferably, an observation window 24 is provided on the door 23 of the sealing cover 2 for observing the processing conditions in the intelligent processing tank 1 device based on plasma nanopolishing. When dangers such as workpiece falling occur, the intelligent processing tank 1 device based on plasma nanopolishing can be closed in time to ensure safety.

[0052] Reference Figure 4As shown, a water supply pipe 5 is provided on the side of the processing tank 1 for supplying water into the processing tank 1; the water supply pipe 5 is connected to the water tank, and when the processing tank 1 needs to be supplied with water, water is supplied into the processing tank 1 through a water pump. An intelligent valve 51 is provided on the water supply pipe 5 for controlling the on and off of the water flow in the water supply pipe 5. Furthermore, a liquid level sensor 6 is provided at the rear of the processing tank 1 for detecting the liquid level of the polishing liquid in the processing tank 1, controlling the switch of the intelligent valve 51, and then supplying water into the processing tank 1 through the water supply pipe 5. During the processing, the liquid level of the polishing liquid in the processing tank 1 decreases due to the evaporation of water in the polishing liquid. The liquid level of the polishing liquid in the processing tank 1 is detected by the liquid level sensor 6. When the liquid level of the polishing liquid is lower than the set liquid level, the liquid level sensor 6 sends a signal to the smart valve 51, and the smart valve 51 opens to replenish water into the processing tank 1 through the water replenishment pipe 5. When the liquid level of the polishing liquid reaches the set liquid level, the liquid level sensor 6 stops sending a signal to the smart valve 51, and the smart valve 51 closes and stops replenishing water. The set liquid level can ensure that the workpiece being polished is completely immersed in the polishing liquid and the concentration requirement of the polishing liquid is met.

[0053] Reference Figure 2 As shown ( Figure 2 In order to show the internal structure of the intelligent processing tank device based on plasma nanopolishing, the transparency of some components is changed, and the door 23 and the right side plate of the sealing cover 2 are hidden. In this embodiment, three high-power heating tubes 7 are also arranged at the rear of the processing tank 1 to heat the polishing liquid in the processing tank 1. Furthermore, a temperature sensor 8 is also arranged at the rear of the processing tank 1 to detect the temperature of the polishing liquid in the processing tank 1 and control the heating tube 7 to heat the polishing liquid in the processing tank 1. During the processing, the temperature of the polishing liquid in the processing tank 1 drops due to a large amount of water replenishment at one time. The temperature of the polishing liquid in the processing tank 1 is detected by the temperature sensor 8. When the temperature of the polishing liquid is lower than the set temperature, the temperature sensor 8 sends a signal to the heating tube 7, and the heating tube 7 starts to quickly heat the polishing liquid; when the polishing liquid reaches the set temperature, the temperature sensor 8 stops sending a signal to the heating tube 7, and the heating tube 7 is turned off and stops heating. Among them, the set temperature can ensure the polishing quality of the workpiece being polished.

[0054] Furthermore, a drain pipe 9 is provided at the bottom of the processing tank 1 for discharging the polishing liquid in the processing tank 1 .

[0055] The utility model provides an intelligent processing tank 1 device based on plasma nano-polishing. The processing tank 1 is sealed by a sealing cover 2, so that when the workpiece is subjected to plasma nano-polishing, water vapor is diffused in the working environment for a long time and cannot be dissipated, which affects the working line of sight and other interferences; the water vapor is condensed into water droplets and recycled through the condenser and the slope structure 21, thereby reducing water consumption; the water supply pipe 5 is controlled by the linkage of the liquid level sensor 6 and the intelligent valve 51 to replenish water according to the liquid level of the polishing liquid, and the heating pipe 7 is controlled by the temperature sensor 8 to heat according to the temperature of the polishing liquid. The liquid level and temperature of the polishing liquid in the processing tank 1 can be adjusted automatically without manual work, thereby improving work efficiency and being more intelligent.

[0056] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not make the essence of the corresponding technical solution deviate from the scope of the technical solution of the embodiments of the utility model.

Claims

1. An intelligent processing tank device based on plasma nano-polishing, characterized in that: include: Processing tank, sealing cover and workpiece hanger; The processing tank is filled with polishing liquid; The sealing cover is arranged on the top of the processing tank and is used to seal the processing tank; The workpiece hanger is installed in the sealing cover and is used to hang the workpiece to be polished; During processing, the workpiece hanger is electrically connected to the positive electrode of the power supply, and the workpiece hanger and the workpiece are processing anodes; the processing tank is electrically connected to the negative electrode of the power supply, and the processing tank and the polishing liquid are processing cathodes.

2. The intelligent processing tank device based on plasma nano-polishing according to claim 1 is characterized in that: A condensation water pipe is arranged on the top of the sealing cover for condensing water vapor.

3. The intelligent processing tank device based on plasma nano-polishing according to claim 1 is characterized in that: The bottom of the sealing cover is provided with a slope structure for the water droplets condensed from the water vapor to flow back into the processing tank.

4. The intelligent processing tank device based on plasma nano-polishing according to claim 1 is characterized in that: The side plate of the sealing cover on which the workpiece hanging plate is installed is an insulating plate, which is used to isolate the positive and negative poles of the power supply.

5. The intelligent processing tank device based on plasma nano-polishing according to claim 1 is characterized in that: A water supply pipe is arranged on the side of the processing tank for supplying water into the processing tank.

6. The intelligent processing tank device based on plasma nano-polishing according to claim 5 is characterized in that: The water supply pipe is provided with an intelligent valve for controlling the on-off of the water flow in the water supply pipe.

7. The intelligent processing tank device based on plasma nano-polishing according to claim 6 is characterized in that: A liquid level sensor is provided in the processing tank, which is used to detect the liquid level of the polishing liquid in the processing tank and control the switch of the intelligent valve.

8. The intelligent processing tank device based on plasma nano-polishing according to claim 1 is characterized in that: A plurality of high-power heating tubes are also arranged in the processing tank for heating the polishing liquid in the processing tank.

9. The intelligent processing tank device based on plasma nano-polishing according to claim 8 is characterized in that: A temperature sensor is also provided in the processing tank for detecting the temperature of the polishing liquid in the processing tank and controlling the heating tube to heat the polishing liquid in the processing tank.

10. The intelligent processing tank device based on plasma nano-polishing according to claim 1 is characterized in that: A drain pipe is provided at the bottom of the processing tank for discharging the polishing liquid in the processing tank.

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