Multi-wire cutting filtering device and multi-wire cutting equipment
By setting up a support structure at the return port of the multi-wire cutting equipment to support the broken silicon wafer, the problem of blockage of the return port is solved, ensuring smooth return of the mortar, and improving the flatness and cutting quality of the silicon wafer.
Patent Information
- Application Number
- CN202420202434.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-26
- Publication Date
- 2025-02-18
- Estimated Expiration
- 2034-01-26
AI Technical Summary
During the multi-wire cutting process, the return port is easily blocked by broken silicon wafers, resulting in poor return of the mortar, affecting the flatness and cutting quality of the silicon wafer.
A multi-wire cutting filter device is designed, arranged at the return port, including a filter mesh and a support structure. The support structure consists of a plurality of spaced support columns, which are located on one side of the filter mesh, extending in a direction perpendicular to the plane of the filter mesh, and at least part of the support bars have different lengths.
The crushed silicon wafer is supported by the support structure, making it unevenly arranged, avoiding clogging of the return port, ensuring smooth return of the mortar, and improving cutting quality.
Smart Images
Figure CN222494908U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of multi-wire cutting, in particular to a multi-wire cutting filter device and a multi-wire cutting equipment. Background Art
[0002] As the most basic material in the semiconductor industry, silicon wafers have many preparation processes. In simple terms, they mainly include several major process modules such as crystal pulling, molding, polishing, and cleaning. The entire production process has extremely strict control requirements for flatness. The flatness of silicon wafers includes Warp (bend, which indicates the maximum deviation of the silicon wafer surface from the plane. It measures the distance between the highest point and the lowest point of the silicon wafer), Bow (bow, defined by measuring the maximum deviation between the center and edge of the silicon wafer), TTV (Total Thickness Variation, the difference between the maximum thickness and the minimum thickness), etc. The crystal rod to silicon wafer is processed by a wire cutting machine. The warp and bow in the flatness are basically finalized after wire cutting. It is difficult to improve the warp and bow in subsequent processing, so the processing quality of wire cutting is particularly important.
[0003] Wire cutting mainly uses steel wire to drive mortar abrasive to cut crystal rods. Mortar is an important processing condition. It is supplied from the equipment mixing tank to the cutting chamber, and then flows back to the mixing tank from the return port at the bottom of the cutting chamber, and circulates continuously. In order to ensure the quality of the mortar returned to the mixing tank, the return port is equipped with a filter to block broken silicon wafers or other foreign matter generated during cutting. However, broken silicon wafers piled flat on the filter will also block the mortar reflux, causing the mortar to accumulate and precipitate, reducing the mortar cutting ability, thereby affecting the flatness quality of the product. Utility Model Content
[0004] In order to solve the above technical problems, the utility model provides a multi-wire cutting filter device and a multi-wire cutting device to solve the problem of reflux port blockage.
[0005] In order to achieve the above-mentioned purpose, the technical solution adopted by the utility model is: a multi-wire cutting filter device, arranged at the reflux port of the multi-wire cutting chamber, for filtering the refluxed mortar of the multi-wire cutting chamber, including a filter screen and a support structure, the support structure including a plurality of support columns arranged at intervals, the support columns are located on the side of the filter screen facing the interior of the multi-wire cutting chamber, the extension direction of the support columns is perpendicular to the plane where the filter screen is located, and the lengths of at least some of the support columns are different.
[0006] Optionally, the support structure includes a plurality of support units, each of the support units includes two sleeved annular structures, each of the annular structures includes a plurality of support columns arranged at intervals, and the support columns in the two annular structures in the same support unit have different lengths.
[0007] Optionally, at least some of the support columns in the same annular structure have different lengths.
[0008] Optionally, the support structure includes a support platform, the support column is fixed on the support platform, the support platform is arranged parallel to the plane where the filter screen is located, and the support platform is provided with through holes that expose the filter holes of the filter screen.
[0009] Optionally, the orthographic projection of the through hole on the filter net covers at least one of the filter holes.
[0010] Optionally, the filter screen is arranged on a side of the support platform where the support column is not arranged; or,
[0011] The filter net is arranged on one side of the support platform and the support column, and the filter net is provided with a hollow hole for the support column to pass through.
[0012] Optionally, the support platform and the filter screen are integrated.
[0013] Optionally, a positioning column is provided on a side of the support platform away from the multi-wire cutting chamber, and the positioning column can fit with the inner wall of the reflux port.
[0014] The embodiment of the utility model further provides a multi-wire cutting device, comprising a multi-wire cutting chamber, wherein the multi-wire cutting chamber comprises a reflux port, and the multi-wire cutting filtering device is arranged at the reflux port.
[0015] The beneficial effect of the utility model is that broken silicon wafers can be supported by the setting of the supporting structure, and at least some of the supporting columns in the supporting structure have different lengths, thereby avoiding the flat arrangement of broken silicon wafers, ensuring smooth reflux of mortar, and improving the problem of reflux port blockage. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 A schematic diagram showing the structure of the filter device in the embodiment of the utility model Figure 1 ;
[0017] Figure 2 A schematic diagram showing the structure of the filter device in the embodiment of the utility model Figure 2 ;
[0018] Figure 3 A schematic diagram showing the structure of the filter device in the embodiment of the utility model Figure 3 . DETAILED DESCRIPTION
[0019] In order to make the purpose, technical solution and advantages of the embodiments of the present disclosure clearer, the technical solution of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.
[0020] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, similar words such as "one", "one" or "the" do not indicate quantity restrictions, but indicate that there is at least one. Similar words such as "include" or "comprise" mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Similar words such as "connect" or "connected" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.
[0021] refer to Figure 1-Figure 3 The present embodiment provides a multi-wire cutting filter device, which is arranged at the reflux port 10 of the multi-wire cutting chamber, and is used to filter the refluxed mortar of the multi-wire cutting chamber, including a filter screen 1 and a support structure, wherein the support structure includes a plurality of support columns 21 arranged at intervals, wherein the support columns 21 are located on the side of the filter screen 1 facing the interior of the multi-wire cutting chamber, wherein the extension direction of the support columns 21 is perpendicular to the plane where the filter screen 1 is located, and at least some of the support columns 21 have different lengths.
[0022] The broken silicon wafers can be supported by the setting of the support structure, and at least some of the support columns 21 in the support structure have different lengths, thereby avoiding the broken silicon wafers from being laid flat, ensuring smooth reflux of the mortar, and improving the problem of blockage of the reflux port 10.
[0023] The broken silicon wafer 100 is supported on the support column 21 after falling. Figure 3 , Figure 3 In the process, the broken silicon wafers 100 are tilted and do not affect the slurry backflow.
[0024] The plurality of support pillars 21 can be distributed in a variety of ways, and can be arranged evenly or unevenly. This is because the broken silicon wafers are of different sizes and their falling locations are not unique. Therefore, in order to effectively prevent the problem of blockage of the reflux port 10 caused by the flattening of the broken silicon wafers, in some embodiments, the plurality of support pillars 21 are evenly distributed.
[0025] In an exemplary embodiment, the support structure includes a plurality of support units, each of which includes two sleeved annular structures (see Figure 2 The first annular structure 201 and the second annular structure 202 are each annular structures, wherein each annular structure comprises a plurality of support columns 21 arranged at intervals, and the lengths of the support columns 21 in the two annular structures in the same support unit are different.
[0026] It should be noted that the structural form of the support structure is not limited to that shown above, that is, the arrangement of the multiple support columns 21 is not limited to the arrangement of the multiple annular structures set above, for example, it can also be an array arrangement.
[0027] Since the support columns 21 in the first annular structure 201 and the support columns 21 in the second annular structure 202 are of different lengths, the broken silicon wafers will not be laid flat after falling, but will overlap the corresponding support columns 21 at a certain angle, thereby preventing mortar blockage.
[0028] It should be noted that the first annular structure 201 and the second annular structure 202 may be two adjacent annular structures, or may be two non-adjacent annular structures. Figure 2 In the figure, the first annular structure 201 and the second annular structure 202 are arranged adjacent to each other, which only represents a structural form of the support unit and does not limit the structural form of the support unit.
[0029] Exemplarily, the structures of the plurality of support units may be the same, and each of the support units may include the first annular structure 201 and the second annular structure 202 that are adjacent to each other, or may only include the first annular structure 201 and the second annular structure 202 that are non-adjacent to each other. The structures of the plurality of support units may also be different (including completely different, partially different). For example, the plurality of support units include a first support unit and a second support unit, and the first support unit includes the first annular structure 201 and the second annular structure 202 that are adjacent to each other, and the first support unit includes the first annular structure 201 and the second annular structure 202 that are non-adjacent to each other.
[0030] Exemplarily, the support structure is a periodic structure, and each of the support units constitutes a period.
[0031] The length of the support column 21 of the first annular structure 201 is greater than the length of the support column 21 of the second annular structure 202 , or the length of the support column 21 of the first annular structure 201 is less than the length of the support column 21 of the second annular structure 202 .
[0032] It should be noted that, in some specific embodiments, the first annular structure 201 is located on the outside of the second annular structure 202, and the length of the support column 21 of the first annular structure 201 is greater than the length of the support column 21 of the second annular structure 202. In this way, when the broken silicon wafers are overlapped, the lower end of the broken silicon wafers is arranged close to the center of the reflow port 10 to avoid the accumulation of mortar on the periphery of the reflow port 10.
[0033] Exemplarily, at least some of the support pillars 21 in the same annular structure have different lengths, which effectively avoids the flattening of broken silicon wafers.
[0034] Exemplarily, the support structure includes a support platform 22, the support column 21 is fixed on the support platform 22, the support platform 22 is arranged parallel to the plane where the filter screen 1 is located, and the support platform 22 is provided with through holes that expose the filter holes of the filter screen 1.
[0035] The provision of the support platform 22 increases the support strength of the support column 21 , and the provision of the through hole avoids blocking the filter holes of the filter screen 1 .
[0036] Exemplarily, the orthographic projection of the through hole on the filter screen 1 covers at least one of the filter holes. In other words, the orthographic projection of one through hole on the filter screen 1 can overlap with a corresponding filter hole, and the orthographic projection of one through hole on the filter screen 1 can also cover two or more filter holes, so as to reduce the difficulty of manufacturing the support platform 22.
[0037] Exemplarily, the filter screen 1 is arranged on a side of the support platform 22 where the support column 21 is not arranged; or,
[0038] The filter screen 1 is disposed on the support platform 22 disposed on one side of the support column 21 , and the filter screen 1 is provided with a hollow hole 211 for the support column 21 to pass through.
[0039] The filter screen 1 and the support platform 22 can be split structures, and the positional relationship between the filter screen 1 and the support platform 22 can be set according to actual needs, as long as the mortar can be filtered and the broken silicon wafers can be supported to prevent the broken silicon wafers from spreading and blocking the reflux port 10.
[0040] Exemplarily, the support platform 22 and the filter screen 1 are integrated, that is, the base material of the filter screen 1 is made of a hard material, so as to be reused as the support platform 22 .
[0041] It should be noted that the size of the support column 21 in the radial direction is not limited, and the size of the support column 21 in the radial direction can be greater than, less than or equal to the size of the filter hole of the filter screen 1.
[0042] For example, the distribution density of the support columns 21 can be set according to actual needs. For example, the filter screen 1 includes filter holes and a solid part located between the filter holes, and the orthographic projection of the support columns 21 on the filter screen 1 is located on the solid part.
[0043] For example, the cross-sectional shape of the support column 21 in the radial direction may be a geometric shape such as a circle or a square.
[0044] Exemplarily, the supporting end of the supporting column 21 may be a round end or a pointed end.
[0045] Exemplarily, the length of the support column 21 can be set according to actual needs, for example, 2-5 mm, but is not limited thereto.
[0046] Exemplarily, the support column 21 may be a hollow structure to reduce weight.
[0047] refer to Figure 3 Exemplarily, a plurality of hollow holes 211 are provided on the outer circumferential surface of the support shaft, and the plurality of hollow holes 211 penetrate the support column 21 in the radial direction of the support shaft to achieve a weight reduction effect.
[0048] Exemplarily, the supporting platform 22 is larger than the size of the reflow port 10 , and the supporting platform 22 includes an edge region fixed to the outer periphery of the reflow port 10 .
[0049] refer to Figure 2 and Figure 3 Exemplarily, a positioning column 23 is provided on one side of the support platform 22 away from the multi-wire cutting chamber, and the positioning column 23 can fit with the inner wall of the reflux port 10 .
[0050] The provision of the positioning column 23 facilitates the assembly of the filter device and the reflux port 10 , and ensures that the filter device can completely cover the reflux port 10 .
[0051] The shape of the outer circumference of the positioning column 23 may match the shape of the inner wall of the reflow port 10 .
[0052] Exemplarily, the radial cross-section of the positioning post 23 may be circular, semicircular, elliptical, arc-shaped or the like.
[0053] Exemplarily, the shape of the positioning column 23 in the radial direction may be an arc-shaped structure, that is, the positioning column 23 may be a sheet-like structure, and the shape of the arc-shaped structure is consistent with the shape of the inner wall of the reflow port 10 .
[0054] The embodiment of the utility model further provides a multi-wire cutting device, comprising a multi-wire cutting chamber, wherein the multi-wire cutting chamber comprises a reflux port 10 , and the multi-wire cutting filtering device is arranged at the reflux port 10 .
[0055] The multi-wire cutting equipment also includes a stirring tank, which contains mortar and provides mortar for the multi-wire cutting chamber. A reflux port 10 is provided in the multi-wire cutting chamber so that the cut mortar flows back to the stirring tank for recycling. The multi-wire cutting filter device is provided at the reflux port 10 to block broken silicon wafers or other foreign matter generated during cutting. The support structure in the independent display cutting filter device can prevent the broken silicon wafers from being laid flat and prevent the reflux port 10 from being blocked.
[0056] There are a few points to note:
[0057] (1) The drawings of the embodiments of the present disclosure only relate to the structures related to the embodiments of the present disclosure, and other structures may refer to the general design.
[0058] (2) For the sake of clarity, in the drawings used to describe the embodiments of the present disclosure, the thickness of layers or regions is exaggerated or reduced, that is, these drawings are not drawn according to the actual scale. It is understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "under" another element, the element may be "directly" "on" or "under" the other element or there may be intermediate elements.
[0059] (3) In the absence of conflict, the embodiments of the present disclosure and the features therein may be combined with each other to obtain new embodiments.
[0060] It is understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present invention, but the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.
Claims
1. A multi-wire cutting filter device, arranged at the reflux port of the multi-wire cutting chamber, for filtering the refluxed mortar of the multi-wire cutting chamber, characterized in that: It includes a filter screen and a support structure, wherein the support structure includes a plurality of support columns arranged at intervals, the support columns are located on the side of the filter screen facing the interior of the multi-wire cutting chamber, the extension direction of the support columns is perpendicular to the plane where the filter screen is located, and at least some of the support columns have different lengths.
2. The multi-wire cutting filter device according to claim 1, characterized in that: The support structure includes a plurality of support units, each of the support units includes two sleeved annular structures, each of the annular structures includes a plurality of support columns arranged at intervals, and the lengths of the support columns in the two annular structures in the same support unit are different.
3. The multi-wire cutting filter device according to claim 2, characterized in that: At least some of the support columns in the same annular structure have different lengths.
4. The multi-wire cutting filter device according to claim 1, characterized in that: The support structure comprises a support platform, the support column is fixed on the support platform, the support platform is arranged parallel to the plane where the filter screen is located, and a through hole is arranged on the support platform to expose the filter holes of the filter screen.
5. The multi-wire cutting filter device according to claim 4, characterized in that: The orthographic projection of the through hole on the filter net covers at least one of the filter holes.
6. The multi-wire cutting filter device according to claim 4, characterized in that: The filter screen is arranged on the side of the support platform where the support column is not arranged; or, The filter net is arranged on one side of the support platform and the support column, and the filter net is provided with a hollow hole for the support column to pass through.
7. The multi-wire cutting filter device according to claim 4, characterized in that: The supporting platform and the filter screen are integrated.
8. The multi-wire cutting filter device according to claim 4, characterized in that: A positioning column is arranged on one side of the support platform away from the multi-wire cutting chamber, and the positioning column can fit with the inner wall of the reflux port.
9. A multi-wire cutting device, characterized in that: It comprises a multi-wire cutting chamber, wherein the multi-wire cutting chamber comprises a reflux port, and the multi-wire cutting filtering device according to any one of claims 1 to 8 is arranged at the reflux port.