LED chip aging test device

Abstract

The utility model relates to an LED chip aging test device, comprising a base plate, a radiator and a circuit board, the radiator is installed on the base plate, the radiator is provided with a plurality of placing grooves used for placing LED chips, the bottom of the circuit board is also provided with probes respectively corresponding to two antennas of the LED chips in the placing grooves, and the probes are arranged on the base plate. One probe corresponding to the same LED chip is electrically connected with one probe corresponding to an adjacent LED chip on a series path of the same LED chip, and the other probe corresponding to the same LED chip is electrically connected with one probe corresponding to another adjacent LED chip on the series path of the same LED chip; the circuit board is provided with a through hole at a position corresponding to the LED chip, and the probe upwards penetrates through the circuit board and forms a fixing column used for installing the test probe. The test probe installed on the fixing column stretches into the LED chip through the through hole, aging detection can be carried out on the LED chip located below the through hole, and the problems of secondary pollution and damage to the LED chip in the process of taking out the LED chip are avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of LED chip testing, and more specifically, to an LED chip aging testing device. Background Art

[0002] The LED chip aging test device is an electrical installation device used to measure the LED chip working under a specific ambient temperature and for a long time. At present, the more conventional test devices are all measured by the module or chip provided by the manufacturer, and there is no fixed test device. In addition, in the timed monitoring of the aging process, the chip needs to be removed from the device before measurement, and then it needs to be reinstalled in the fixture after measurement, which can easily cause secondary contamination or damage to the chip. Utility Model Content

[0003] The utility model provides an LED chip aging test device to overcome the problem in the prior art that when performing regular monitoring on chip aging, the chip needs to be disassembled from the aging test device, thereby causing secondary contamination or damage to the chip.

[0004] In order to solve the above technical problems, the technical solution adopted by the utility model is: an LED chip aging test device, including a base plate, a heat sink and a circuit board, the heat sink is installed on the base plate, and the heat sink is provided with a plurality of placement grooves for placing LED chips. The bottom of the circuit board is also provided with probes for two tentacles of the LED chips in each placement groove respectively, one of the probes corresponding to the same LED chip is electrically connected to a probe corresponding to an adjacent LED chip on its series path, and the other probe corresponding to the same LED chip is electrically connected to a probe corresponding to another adjacent LED chip on its series path; a through hole is opened on the circuit board corresponding to the position of the LED chip, and the probe passes through the circuit board upward and forms a fixing column for installing the test probe.

[0005] In the technical solution of the present application, each LED chip to be tested is placed in a placement slot and the position of the LED chip is defined, a circuit board is placed above each LED chip, and the probes of the two tentacles corresponding to the LED chip in the placement slot are electrically connected to the wiring ears of the LED chip, and the positive and negative poles of the external power supply are respectively connected to one of the probes at the head and one of the probes at the tail, so that the entire circuit is connected in series and the LED chip is powered, thereby realizing an aging test of the LED chip. During the test, the test probe can be installed on the fixed column, and the test probe installed on the fixed column is inserted through the through hole, and the aging test of the LED chip located under the through hole can be performed, which reduces the process of taking the LED chip out of the placement slot and then testing it, and avoids the problem of secondary contamination and damage to the LED chip during the process of taking out the LED chip.

[0006] Preferably, the fixing column is provided with a mounting boss. In this technical solution, since the fixing column is provided with a mounting boss, it is convenient to install the test probe, and the test probe installed on the fixing column is prevented from sliding in the vertical direction.

[0007] Preferably, the circuit board is provided with a first terminal and a second terminal, the first terminal is electrically connected to the first probe on the series path, and the second terminal is electrically connected to the last probe on the series path. In this technical solution, the first terminal is connected to the positive pole of the external power supply, and the second terminal is connected to the negative pole of the external power supply, so that the entire series circuit can be powered by the external power supply.

[0008] Preferably, grooves are provided on the heat sink and located on both sides of the placement groove, and the grooves are connected to the placement groove. In this technical solution, since the grooves are provided on both sides of the prevention groove and the grooves are connected to the placement groove, it is convenient to place the LED chip.

[0009] Preferably, the heat sink is provided with a plurality of positioning pins, and the circuit board is provided with positioning holes corresponding to the positions of the positioning pins, and the positioning pins are inserted into the positioning holes. In this technical solution, the positioning pins on the heat sink can be inserted into the positioning holes to locate the installation position of the circuit board. After the LED chip is placed in the placement groove, the circuit board is installed on the positioning pins through the positioning holes, and the probes on the circuit board can be electrically connected to the two antennae of the LED chip opposite to it, so that the LED chips are connected in series.

[0010] Preferably, the heat sink includes a heat dissipation top plate and heat dissipation fins, the heat dissipation top plate is connected to a connection column connected to it at one end, the other end of the connection column is connected to the bottom plate, the heat dissipation fins are formed at intervals on the bottom surface of the heat dissipation top plate, and the placement groove is opened on the heat dissipation top plate. In this technical solution, the groove is opened on the heat dissipation top plate, and the LED chip is placed in the placement groove. Heat is generated during the aging test of the LED chip, and the heat generated by the LED chip is conducted to the heat dissipation fins through the heat dissipation top plate, and then the heat is dissipated through the heat dissipation fins.

[0011] Preferably, each of the heat dissipating fins is spaced apart from the base plate in the vertical direction. In this technical solution, since there is a space between the bottom of the heat dissipating fin and the base plate, the space allows air to flow, which is beneficial for heat exchange between the heat dissipating fin and the air, and facilitates heat dissipation by the heat dissipating fin.

[0012] Preferably, the circuit board is a ceramic structure. In this technical solution, since the circuit board is a ceramic structure, when the LED chip is an ultraviolet LED chip, the radiation of the ultraviolet LED chip is prevented from aging the circuit board.

[0013] Preferably, a pressing device is also provided on the bottom plate, and the pressing device has a pressing part for pressing the circuit board onto the heat sink. In the technical solution of the present application, the pressing part can press the circuit board onto the heat sink, thereby ensuring the stability of the contact between the probe and the contact of the LED chip.

[0014] Preferably, the clamping device includes a mounting seat and an operating handle, a first connection portion and a second connection portion are provided on the side of the clamping portion away from the circuit board, the first connection portion is located above the second connection portion, the first connection portion is hinged to one end of the operating handle, the second connection portion is hinged to the mounting seat, a third connection portion is provided in the middle of the operating handle, the third connection portion is connected to a connection block with one end hinged thereto, and the other end of the connection block is hinged to the mounting seat. In this technical solution, the operating handle is pushed in the direction close to the circuit board side, and since the first connection portion is hinged to the operating handle and the second connection portion is hinged to the mounting seat, the operating handle drives the clamping portion to rotate and press on the circuit board, thereby achieving the clamping of the circuit board.

[0015] Preferably, the probe is a spring probe, and one end of the probe connected to the LED chip is provided with a sawtooth structure. In the technical solution of the present application, the end of the spring probe used is a sawtooth structure, which increases the contact area between the probe and the LED chip antenna connection and can adapt to uneven chip solder joints.

[0016] Compared with the prior art, the beneficial effect of the present invention is that during the aging test of the LED chip by the LED chip aging test device of the present invention, the test probe installed on the fixed column is inserted through the through hole, and the aging test of the LED chip located under the through hole can be performed, thereby reducing the process of taking the LED chip out of the placement slot for testing, and avoiding the problem of secondary contamination and damage to the LED chip during the process of taking out the LED chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a three-dimensional diagram of the LED chip aging test device of the utility model;

[0018] Figure 2 This is a stereoscopic diagram of the LED chip aging test device of the utility model from another perspective;

[0019] Figure 3 yes Figure 2 The enlarged view of point A in the middle;

[0020] Figure 4 This is an exploded view of the LED chip aging test device of the utility model;

[0021] Figure 5This is a schematic diagram of the structure of the circuit board in the LED chip aging test device of the utility model;

[0022] Figure 6 This is a schematic diagram of the LED chip aging test device of the utility model in which the probe and the LED chip are connected in series;

[0023] Figure 7 It is a schematic diagram of the LED chips connected in series in the LED chip aging test device of the utility model.

[0024] In the accompanying drawings: 1. bottom plate; 2. heat sink; 3. circuit board; 4. LED chip; 5. placement groove; 6. probe; 7. through hole; 8. fixing column; 9. mounting boss; 31. first terminal; 32. second terminal; 14. groove; 10. positioning pin; 11. positioning hole; 21. heat dissipation top plate; 22. heat dissipation fin; 23. connecting column; 12. clamping device; 13. support column; 121. clamping part; 122. mounting seat; 123. operating handle; 124. first connecting part; 125. second connecting part; 126. third connecting part; 127. connecting block; 128. first protrusion; 129. second protrusion; 130. limiting groove. DETAILED DESCRIPTION

[0025] The drawings are only for illustrative purposes and cannot be construed as limiting the present invention. To better illustrate the present embodiment, some parts of the drawings may be omitted, enlarged, or reduced, and do not represent the size of the actual product. For those skilled in the art, it is understandable that some well-known structures and their descriptions may be omitted in the drawings. The positional relationships described in the drawings are only for illustrative purposes and cannot be construed as limiting the present invention.

[0026] The same or similar numbers in the drawings of the embodiments of the present invention correspond to the same or similar parts; in the description of the present invention, it should be understood that if the terms "upper", "lower", "left", "right", "long", "short" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the drawings, they are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and cannot be understood as limitations on this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0027] The technical solution of the present invention is further described in detail below through specific embodiments and in conjunction with the accompanying drawings:

[0028] Example 1

[0029] like Figures 1 to 5As shown, an LED chip aging test device includes a base plate 1, a heat sink 2 and a circuit board 3. The heat sink 2 is installed on the base plate 1. The heat sink 2 is provided with a plurality of placement grooves 5 for placing LED chips 4. The bottom of the circuit board 3 is also provided with probes 6 for corresponding to two antennae of the LED chips 4 in each placement groove 5 respectively. One of the probes 6 corresponding to the same LED chip 4 is electrically connected to a probe 6 corresponding to an adjacent LED chip 4 on its series path, and another probe 6 corresponding to the same LED chip 4 is electrically connected to a probe 6 corresponding to another adjacent LED chip 4 on its series path; a through hole 7 is opened on the circuit board 3 at the position corresponding to the LED chip 4, and the probe 6 passes through the circuit board 3 upward and is formed with a fixing column 8 for installing the test probe.

[0030] In this embodiment, each LED chip 4 to be tested is placed in a placement groove 5 and the position of the LED chip 4 is defined. The circuit board 3 is placed above each LED chip 4, and the probes 6 of the two antennae corresponding to the LED chip 4 in the placement groove 5 are electrically connected to the wiring ears of the LED chip 4. The positive and negative electrodes of the external power supply are respectively connected to one of the probes 6 at the head and one of the probes 6 at the tail, so that the entire circuit is connected in series and the LED chip 4 is powered (such as Figure 7 As shown), the aging test of the LED chip 4 can be realized. During the test, the test probe can be installed on the fixing column 8, and the test probe installed on the fixing column 8 is inserted through the through hole 7, so that the aging test of the LED chip 4 located under the through hole 7 can be performed, which reduces the process of taking the LED chip 4 out of the placement groove 5 and then testing it, and avoids the problem of secondary contamination and damage to the LED chip 4 during the process of taking out the LED chip 4. The test probe for testing the LED chip 4 can be positioned by the fixing column 8 and accurately inserted into the through hole 7 to ensure the consistency of the measurement position each time. This design not only simplifies the test process, but also improves the accuracy of the measurement.

[0031] It should be noted that the shape of the placement groove 5 can be set according to the shape of the LED chip 4. In this embodiment, the shape of the placement groove 5 can be set to a hexagonal groove 14, but it is not limited to this shape. Placement grooves 5 of other shapes are also within the protection scope of this application. "One of the probes 6 corresponding to the same LED chip 4 is electrically connected to a probe 6 corresponding to an adjacent LED chip 4 on its series path, and another probe 6 corresponding to the same LED chip 4 is electrically connected to a probe 6 corresponding to another adjacent LED chip 4 on its series path" can be understood as follows: Figure 6As shown, LED chip b, LED chip a and LED chip c need to be connected in series in sequence. Since LED chip a corresponds to two probes (a61; a62) of the antennae, LED chip b corresponds to two probes (b61; b62) of the antennae, LED chip c corresponds to two probes of the antennae (c61; c62), one probe a61 is electrically connected to a probe b62 corresponding to LED chip b, and another probe a62 corresponding to LED chip a is electrically connected to a probe c61 corresponding to LED chip c, and then the LED chips can be connected in series using probe 6. It should be pointed out that since aluminum has a good heat dissipation effect, the heat sink 2 can be made of aluminum.

[0032] Among them, Figure 1 As shown, the fixing column 8 is provided with a mounting boss 9. In this embodiment, since the fixing column 8 is provided with the mounting boss 9, it is convenient to install the test probe, and the test probe installed on the fixing column 8 is prevented from sliding in the vertical direction.

[0033] like Figure 2 , Figure 4 and Figure 6 As shown, the circuit board 3 is provided with a first terminal 31 and a second terminal 32, the first terminal 31 is electrically connected to the first probe 6 on the series path, and the second terminal 32 is electrically connected to the last probe 6 on the series path. In this embodiment, the first terminal 31 is connected to the positive pole of the external power supply, and the second terminal 32 is connected to the negative pole of the external power supply, so that the entire series circuit can be powered by the external power supply. It should be noted that the first probe 6 refers to one of the probes 6 corresponding to when one pole (positive or negative pole) of the power supply is connected to the first LED chip 4, and the last probe 6 refers to one of the probes 6 corresponding to when the other pole (positive or negative pole) of the power supply is connected to the last LED chip 4.

[0034] like Figure 2 , Figure 4 As shown, grooves 14 are provided on the heat sink 2 and located on both sides of the placement groove 5, and the grooves 14 are connected to the placement groove 5. In this embodiment, since the grooves 14 are provided on both sides of the prevention groove and the grooves 14 are connected to the placement groove 5, it is convenient to place the LED chip 4.

[0035] like Figure 1 , Figure 2 and Figure 4As shown, a plurality of positioning pins 10 are provided on the heat sink 2, and positioning holes 11 are provided on the circuit board 3 corresponding to the positions of the positioning pins 10, and the positioning pins 10 are inserted into the positioning holes 11. In this embodiment, the positioning pins 10 on the heat sink 2 can be inserted into the positioning holes 11 to locate the installation position of the circuit board 3. After the LED chip 4 is placed in the placement groove 5, the circuit board 3 is installed on the positioning pins 10 through the positioning holes 11, and the probe 6 located on the circuit board 3 can be electrically connected to the two antennae of the LED chip 4 opposite to it, so as to connect each LED chip 4 in series. It should be noted that four positioning pins 10 can be provided, and the four positioning pins 10 are arranged on the heat sink 2 in a rectangular shape, and the corresponding positioning holes 11 are also arranged on the circuit board 3 in a rectangular shape. In order to prevent the problem of reverse installation of the circuit board 3 during installation, the diameter of one of the positioning pins 10 can be larger than the diameter of the other three positioning pins 10, and the positioning hole 11 corresponding to the positioning pin 10 with a larger diameter has a larger aperture relative to the other three positioning holes 11, so that the problem of reverse installation of the circuit board 3 can be avoided.

[0036] like Figure 1 , Figure 2 and Figure 4 As shown, the heat sink 2 includes a heat dissipation top plate 21 and heat dissipation fins 22. The heat dissipation top plate 21 is connected to a connection column 23 connected to the top plate 21 at one end, and the other end of the connection column 23 is connected to the bottom plate 1. The heat dissipation fins 22 are formed at intervals on the bottom surface of the heat dissipation top plate 21, and the placement groove 5 is opened on the heat dissipation top plate 21. In this embodiment, the groove is opened on the heat dissipation top plate 21, and the LED chip 4 is placed in the placement groove 5. The LED chip 4 will generate heat during the aging test. The heat generated by the LED chip 4 will be conducted to the heat dissipation fins 22 through the heat dissipation top plate 21, and then dissipated through the heat dissipation fins 22. Since the heat dissipation fins 22 are formed at intervals on the bottom surface of the heat dissipation top plate 21, the intervals between the fins are conducive to air flow, which strengthens the heat exchange between the fins and the air and improves the heat dissipation effect.

[0037] like Figure 1 , Figure 2 and Figure 4 As shown, each heat dissipation fin 22 is spaced apart from the bottom plate 1 in the vertical direction. In this embodiment, since there is a space between the bottom of the heat dissipation fin 22 and the bottom plate 1, the space allows air to flow, which is beneficial for heat exchange between the heat dissipation fin 22 and the air, and facilitates heat dissipation by the heat dissipation fin 22.

[0038] The circuit board 3 is a ceramic structure. In this embodiment, since the circuit board 3 is a ceramic structure, when the LED chip 4 is an ultraviolet LED chip 4, the radiation of the ultraviolet LED chip 4 can prevent the circuit board 3 from aging.

[0039] Example 2

[0040] like Figures 1 to 4 As shown, the difference between Example 2 and Example 1 is that a clamping device 12 is also provided on the base plate 1, and the clamping device 12 has a clamping portion 121 for clamping the circuit board 3 onto the heat sink 2. In this embodiment, the clamping portion 121 can clamp the circuit board 3 onto the heat sink 2, thereby ensuring the stability of the contact between the probe 6 and the contact of the LED chip 4. It should also be pointed out that a support column 13 is also provided on the base plate 1, and one end of the support column 13 is connected to the base plate 1. The support column 13 is supported on the bottom of the circuit board 3, so that the circuit board 3 is placed above the LED chip 4, and the height of the support column 13 enables the probe 4 located at the bottom of the circuit board 3 to be electrically connected to the two antennae of the LED chip 4. When the clamping device 12 acts on the circuit board 3, the support column 13 can play a role in supporting the circuit board 3, thereby avoiding the problem of excessive pressure concentrated on the probe 4 and causing damage to the probe 4.

[0041] It should be noted that the clamping device 12 includes a mounting seat 122 and an operating handle 123. A first connecting portion 124 and a second connecting portion 125 are provided on the side of the clamping portion 121 away from the circuit board 3. The first connecting portion 124 is located above the second connecting portion 125. The first connecting portion 124 is hinged to one end of the operating handle 123, and the second connecting portion 125 is hinged to the mounting seat 122. A third connecting portion 126 is provided in the middle of the operating handle 123. The third connecting portion 126 is connected to a connecting block 127 with one end hinged thereto, and the other end of the connecting block 127 is hinged to the mounting seat 122. The working principle of the clamping device 12 is as follows: when the operating handle 123 is pushed toward the direction close to the circuit board 3, since the first connection part 124 is hinged to the operating handle 123, the second connection part 125 is hinged to the mounting seat 122, the third connection part 126 is connected to a connection block 127 with one end hinged thereto, and the other end of the connection block 127 is hinged to the mounting seat 122 (specifically, the fourth connection part 131 of the mounting seat 122 is hinged to the other end of the connection block 127), the operating handle 123 drives the clamping part 121 to rotate and press on the circuit board 3, thereby achieving the clamping of the circuit board 3. Conversely, when the operating handle 123 is pulled toward the direction away from the circuit board 3, since the first connection part 124 is hinged to the operating handle 123, the second connection part 125 is hinged to the mounting seat 122, the operating handle 123 drives the clamping part 121 to separate from the circuit board 3.

[0042] It should be noted that a first protrusion 128 is formed on the mounting seat 122 at the connection with the second connecting portion 125, a second protrusion 129 is formed on the connecting block 127 at the connection with the mounting seat 122, a spacing between the first protrusion 128 and the second protrusion 129 forms a limiting groove 130, and the third connecting portion 126 is a convex block structure adapted to the position of the limiting groove 130. When the operating handle 123 is pushed toward the direction close to the circuit board 3, the third connecting portion 126 can be accommodated in the limiting groove 130 to ensure the clamping force of the clamping portion 121 on the circuit board. When the operating handle 123 is pulled toward the direction away from the circuit board 3, the third connecting portion 126 can be disengaged from the limiting groove 130, so that the clamping portion 121 loses the clamping force on the circuit board.

[0043] Example 3

[0044] The difference between Example 3 and Example 2 is that the probe 6 is a spring probe 6, and a sawtooth structure is provided at one end of the probe 6 connected to the LED chip 4. In this embodiment, the end of the spring probe 6 used is a sawtooth structure, which increases the contact area of ​​the probe 6 and the LED chip 4, and can adapt to uneven chip solder joints.

[0045] Obviously, the above embodiments of the utility model are only examples for clearly explaining the utility model, and are not intended to limit the implementation methods of the utility model. For ordinary technicians in the relevant field, other different forms of changes or modifications can be made on the basis of the above description. It is not necessary and impossible to list all the implementation methods here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the utility model should be included in the protection scope of the claims of the utility model.

Claims

1. A LED chip aging test device, characterized in that: The invention comprises a base plate (1), a heat sink (2) and a circuit board (3), wherein the heat sink (2) is mounted on the base plate (1), and the heat sink (2) is provided with a plurality of placement grooves (5) for placing LED chips (4). The bottom of the circuit board (3) is also provided with probes (6) for respectively corresponding to the two antennae of the LED chips in each placement groove, wherein one of the probes (6) corresponding to the same LED chip (4) is electrically connected to a probe (6) corresponding to an adjacent LED chip (4) on its series path, and another probe (6) corresponding to the same LED chip (4) is electrically connected to a probe (6) corresponding to another adjacent LED chip (4) on its series path; a through hole (7) is provided on the circuit board (3) at a position corresponding to the LED chip (4), and the probe (6) passes through the circuit board (3) upwards and is formed with a fixing column (8) for mounting a test probe.

2. The LED chip aging test device according to claim 1, characterized in that: The fixing column (8) is provided with a mounting boss (9).

3. The LED chip aging test device according to claim 1, characterized in that: The circuit board (3) is provided with a first wiring terminal (31) and a second wiring terminal (32), wherein the first wiring terminal (31) is electrically connected to a first probe (6) on a series path, and the second wiring terminal (32) is electrically connected to a last probe (6) on the series path.

4. The LED chip aging test device according to claim 1, characterized in that: Grooves (14) are provided on the heat sink (2) and located on both sides of the placement groove (5); the grooves (14) are connected to the placement groove (5).

5. The LED chip aging test device according to claim 1, characterized in that: The heat sink (2) is provided with a plurality of positioning pins (10), and the circuit board (3) is provided with positioning holes (11) corresponding to the positions of the positioning pins (10), and the positioning pins (10) are inserted into the positioning holes (11).

6. The LED chip aging test device according to claim 1, characterized in that: The radiator (2) comprises a heat dissipation top plate (21) and heat dissipation fins (22); the heat dissipation top plate (21) is connected to a connection column (23) having one end connected thereto; the other end of the connection column (23) is connected to the bottom plate (1); the heat dissipation fins (22) are formed at intervals on the bottom surface of the heat dissipation top plate (21); and the placement grooves (5) are provided on the heat dissipation top plate (21).

7. The LED chip aging test device according to claim 1, characterized in that: The circuit board (3) is a ceramic structure.

8. The LED chip aging test device according to any one of claims 1 to 7, characterized in that: A pressing device (12) is also provided on the bottom plate (1), and the pressing device (12) has a pressing portion (121) for pressing the circuit board (3) onto the heat sink (2).

9. The LED chip aging test device according to claim 8, characterized in that: The clamping device (12) comprises a mounting seat (122) and an operating handle (123); a first connecting portion (124) and a second connecting portion (125) are provided on a side of the clamping portion (121) away from the circuit board (3); the first connecting portion (124) is located above the second connecting portion (125); the first connecting portion (124) is hinged to one end of the operating handle (123); the second connecting portion (125) is hinged to the mounting seat (122); a third connecting portion (126) is provided in the middle of the operating handle (123); the third connecting portion (126) is connected to a connecting block (127) having one end hinged thereto; the other end of the connecting block (127) is hinged to the mounting seat (122).

10. The LED chip aging test device according to claim 9, characterized in that: The probe (6) is a spring probe, and one end of the probe (6) connected to the LED chip (4) is provided with a sawtooth structure.

Images