Cooling and refrigerating device

Abstract

The utility model discloses a heat dissipation and refrigeration device, and relates to the technical field of heat dissipation and cooling of electronic equipment. The device comprises a fin radiator, a TEC and a cooling fan, the fin radiator is arranged on the TEC, the cooling fan is arranged on one side of the fin radiator, and the fin radiator comprises a heat pipe fin radiator which is connected with the hot end of the TEC and used for cooling the hot end of the TEC; the refrigeration fin radiator is arranged on the cold end of the TEC; one part of the water-cooling circulating system is arranged in the refrigeration fin radiator, the other part of the water-cooling circulating system is arranged outside the refrigeration fin radiator, and the water-cooling circulating system is used for exchanging heat for a heating component. By the adoption of the technical scheme, heat dissipation and cooling can be effectively conducted on heating components such as a CPU, and therefore the working stability of the heating components is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation and temperature reduction of electronic equipment, in particular to a heat dissipation and refrigeration device. Background Art

[0002] Chip components are widely used in electronic devices, and as core components, electronic components such as central processing units generate a lot of heat during operation. In order to prevent the temperature of the heat-generating electronic components from rising due to heat accumulation, which leads to unstable operation, the electronic components usually need to be equipped with a heat sink to assist in heat dissipation.

[0003] Generally, as disclosed in the patent publication number CN115792570A, a temperature control device and its assembly process, the temperature control device (heat dissipation device) is mainly composed of TEC, fin heat sink and heat dissipation fan, heat insulation board, and aluminum pressure head. The heat dissipation fan is arranged on one side of the fin heat sink, the heat insulation board is floatingly arranged on the upper end of the fin heat sink, the heat insulation board is provided with a mounting groove, the TEC is arranged in the mounting groove and contacts the fin heat sink, the aluminum pressure head is arranged on the heat insulation board, the lower end of the aluminum pressure head is connected to the TEC, and the upper end of the aluminum pressure head is provided with at least two contact platforms. The fin heat sink cooperates with the heat dissipation fan to provide strong convection air to the fin heat sink to accelerate the heat dissipation. However, with the development of the computer industry, the integration and function of electronic components are continuously improved, resulting in more heat generated on the central processing unit, and more and more electronic components need to dissipate heat. The air heat dissipation method alone can no longer meet the needs of users. Therefore, the heat dissipation device needs to be further optimized. Utility Model Content

[0004] In order to overcome at least one defect of the prior art described above, the utility model provides a heat dissipation refrigeration device and a control method thereof, which can effectively dissipate heat and cool down heat-generating components such as a CPU, thereby improving the working stability of the heat-generating components.

[0005] To achieve the above-mentioned purpose, the technical solution adopted by the utility model is: a heat dissipation refrigeration device, including a fin heat sink, a TEC and a heat dissipation fan, the fin heat sink is arranged on the TEC, the heat dissipation fan is arranged on one side of the fin heat sink, the fin heat sink includes a heat pipe fin heat sink connected to the hot end of the TEC and used to dissipate heat for the hot end of the TEC; and, a cooling fin heat sink arranged on the cold end of the TEC; the heat dissipation refrigeration device also includes: a water cooling circulation system with a part arranged in the cooling fin heat sink and the other part arranged outside the cooling fin heat sink, and the water cooling circulation system is used to exchange heat for the heat-generating components.

[0006] Optionally, the water cooling circulation system includes: a water tank, which is used to store liquid; a circulation pump connected to the water tank through a first connecting pipe; a metal refrigeration pipe, part of which is located in the TEC and the other part is passed through the refrigeration fin radiator, one end of the metal refrigeration pipe is connected to the circulation pump through a second connecting pipe; and a heat exchange head connected to the other end of the metal refrigeration pipe through a third connecting pipe and used for exchanging heat for heat-generating components, the liquid can flow in the heat exchange head, and the heat exchange head is connected to the water tank through a fourth connecting pipe.

[0007] Optionally, a semiconductor cooling sheet is provided in the TEC, and a heat insulating cotton layer is provided below the TEC and directly below the semiconductor cooling sheet.

[0008] Optionally, the cooling fan is fixedly disposed on a side of the cooling fin radiator away from the heat pipe fin radiator.

[0009] Optionally, the TEC is fixedly disposed on the upper surface of the cold-heat exchange head, and the thermal insulation cotton layer is disposed between the TEC and the cold-heat exchange head and covers the upper surface of the cold-heat exchange head.

[0010] Optionally, a liquid replenishing port is provided on the water tank, and a sealing plug is detachably mounted on the liquid replenishing port.

[0011] Optionally, the metal refrigeration pipe is made of copper or aluminum.

[0012] Optionally, an air inlet of the cooling fan faces one side of the cooling fin radiator.

[0013] After adopting the above technical scheme, the beneficial effects of the utility model are as follows: a heat dissipation and refrigeration device, including a fin radiator, a TEC, a heat dissipation fan and a water cooling circulation system, the fin radiator is arranged on the TEC, the heat dissipation fan is arranged on one side of the fin radiator, and the fin radiator includes a heat pipe fin radiator and a cooling fin radiator. A part of the cold water circulation system is bonded to a heat generating component such as a CPU chip, so that the heat generated by the heat generating component is taken away by the flowing liquid. The heat pipe fin radiator TEC heats away heat at the hot end. The cooling fin radiator dissipates the heat of the liquid flowing through the cooling fin radiator into the air, thereby cooling the liquid flowing through so that the liquid in the water cooling circulation system takes away the heat of the heat generating component during the circulation process, and the cold end of the TEC is used to quickly cool and refrigerate the liquid flowing through the cold end of the TEC, further accelerating the heat dissipation of the liquid in the water cooling circulation system, thereby improving the efficiency of the liquid in the water cooling circulation system taking away the heat of the heat generating component during the circulation process, thereby reducing the probability of abnormality of the heat generating component due to excessive temperature, and improving the reliability of the operation of the heat generating component. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0015] Figure 1 It is a structural schematic diagram of the utility model;

[0016] Figure 2 It is an explosion schematic diagram of the utility model.

[0017] Explanation of the reference numerals: 1. TEC; 11. Semiconductor refrigeration chip; 2. Cooling fan; 3. Heat pipe fin radiator; 31. Heat pipe; 4. Water cooling circulation system; 41. Water tank; 42. Circulation pump; 43. Metal refrigeration pipe; 44. Hot and cold exchange head; 45. Sealing plug; 5. Thermal insulation cotton layer; a. Liquid filling port; 6. Refrigeration fin radiator; 7. First connecting pipe; 8. Second connecting pipe; 9. Third connecting pipe; 10. Fourth connecting pipe. DETAILED DESCRIPTION

[0018] The utility model is further described in detail below in conjunction with the accompanying drawings.

[0019] This specific embodiment is merely an explanation of the present invention and is not a limitation of the present invention. After reading this specification, those skilled in the art may make non-creative modifications to the present embodiment as needed, but such modifications are protected by patent law as long as they are within the scope of the claims of the present invention.

[0020] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0021] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0022] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of some utility models, "plurality" means two or more, unless otherwise clearly and specifically defined.

[0023] This embodiment relates to a heat dissipation refrigeration device, such as Figure 1 , 2 As shown, it includes a fin heat sink, TEC1 and a cooling fan 2. The fin heat sink is arranged on TEC1, and the cooling fan 2 is arranged on one side of the fin heat sink. The fin heat sink includes a heat pipe fin heat sink 3 and a cooling fin heat sink 6.

[0024] The heat pipe fin radiator 3 is connected to the hot end of TEC1, and the heat pipe fin radiator 3 is used to dissipate heat for the hot end of TEC1. The cooling fin radiator 6 is arranged on the cold end of TEC1. The heat dissipation refrigeration device also includes: a water cooling circulation system 4, a part of the water cooling circulation system 4 is arranged inside the cooling fin radiator 6, and the other part is arranged outside the cooling fin radiator 6, and the water cooling circulation system 4 is used to exchange heat for the heat generating component, and the heat generating component can be a central processing unit (CPU). The fin radiator and TEC1 are used to cool the heat generating component, and the water cooling circulation system 4 is used to further dissipate heat for the heat generating component, and the heat of the heat generating component is taken away by the flowing liquid, so as to further improve the heat dissipation efficiency of the heat generating component, thereby reducing the probability of abnormality of the heat generating component due to excessive temperature, and improving the reliability of the operation of the heat generating component.

[0025] It should be noted that a part of the cold water circulation system is attached to the heat generating components such as the CPU chip, so that the heat generated by the heat generating components can be taken away by the flowing liquid. The heat pipe fin radiator 3 includes a heat pipe 31 and a heat sink, and a plurality of heat pipes 31 are arranged in parallel, and a plurality of heat sinks are stacked from bottom to top. One end of the heat pipe 31 is connected to the hot end of TEC1, and the other end passes through a plurality of heat sinks from bottom to top. The heat pipe 31 is made of copper or aluminum. The cooling fin radiator 6 includes a plurality of heat sinks stacked on the cold end of TEC1 from bottom to top, so that the heat of the liquid flowing through the cooling fin radiator 6 is dissipated into the air, thereby cooling the liquid flowing through so that the liquid in the water cooling circulation system 4 can take away the heat of the heat generating components during the circulation process. The cold end of TEC1 is used to quickly cool the liquid flowing through the cold end of TEC1, further accelerating the heat dissipation of the liquid in the water cooling circulation system 4, thereby improving the efficiency of the liquid in the water cooling circulation system 4 taking away the heat of the heat generating components during the circulation process.

[0026] Preferably, in order to realize the circulation of liquid in the cold water circulation system to remove heat from the heat-generating components, the water cooling circulation system 4 includes: a water tank 41 , a circulation pump 42 , a metal refrigeration pipe 43 and a cold and heat exchange head 44 .

[0027] The water tank 41 is used to store liquid. The circulating pump 42 is connected to the water tank 41 through the first connecting pipe 7. A part of the metal refrigeration pipe 43 is located in the TEC1, and the other part is arranged in the refrigeration fin radiator 6. One end of the metal refrigeration pipe 43 is connected to the circulating pump 42 through the second connecting pipe 8. The cold and hot exchange head 44 is connected to the other end of the metal refrigeration pipe 43 through the third connecting pipe 9. The cold and hot exchange head 44 is used to exchange heat for the heat generating component. The liquid can flow in the cold and hot exchange head 44. The cold and hot exchange head 44 is connected to the water tank 41 through the fourth connecting pipe 10, so that the cold water circulation system forms a circulation loop. The water tank 41 is used to replenish the liquid for the cold water circulation system, and at the same time, the liquid flowing through the cold and hot exchange head 44, the metal refrigeration pipe 43 and the circulating pump 42 is mixed with the liquid in the water tank 41 to equalize the temperature. Optionally, the first connecting pipe 7, the second connecting pipe 8, the third connecting pipe 9 and the fourth connecting pipe 10 are all hoses. The hose can be a silicone hose. Optionally, the metal refrigeration pipe 43 is a copper product or an aluminum product.

[0028] Optionally, a semiconductor cooling sheet 11 is provided in the TEC1, and a heat insulation cotton layer 5 is provided below the TEC1 and directly below the semiconductor cooling sheet 11 to isolate the hot and cold ends of the TEC1 and prevent condensation of components close to the cold end of the TEC1 when the TEC1 is cooled. The heat insulation cotton layer 5 is adhered and fixed to the lower surface of the TEC1.

[0029] It should be noted that the heat dissipation and refrigeration device of the present application is used to cool down electrical products such as computers or fish tanks. When the heat dissipation and refrigeration device is applied to the fish tank, the heat exchange head 44 is placed in the fish tank, and the fin radiator, the circulation pump 42, the water tank 41, the heat dissipation fan 2 and the TEC1 are all located outside the water tank 41. Optionally, the heat pipe fin radiator 3 and the cooling fin radiator 6 are arranged in parallel, and the heat dissipation fan 2 is used to take away the heat from the heat pipe fin radiator 3 and the cooling fin radiator 6. In this embodiment, the heat dissipation fan 2 is fixedly arranged on the cooling fin radiator 6 on the side away from the heat pipe fin radiator 3. The heat dissipation fan 2 is fixed to one side of the cooling fin radiator 6 by screws. In some embodiments, when the heat dissipation and refrigeration device of the present application is applied to electrical products such as computers, the components of the heat dissipation and refrigeration device are made more compact, the TEC1 is fixedly arranged on the upper surface of the heat exchange head 44, and the heat insulation and heat preservation cotton layer 5 is arranged between the TEC1 and the heat exchange head 44 and covers the upper surface of the heat exchange head 44. TEC1 is fixed to the heat exchange head 44 by screws, and the screws are successively passed through TEC1 and the heat insulation cotton layer 5 and fixed to the heat exchange head 44. Further, in order to stably fix TEC1 to the heat exchange head 44, a spring is sleeved on the screw head, and the spring is located between TEC1 and the screw head.

[0030] Optionally, in order to facilitate the user to replenish the liquid in the water tank 41 according to demand, a liquid replenishment port a is provided on the water tank 41, and a sealing plug 45 is detachably installed on the liquid replenishment port a. The sealing plug 45 can be connected to the liquid replenishment port a through a thread. The sealing plug 45 can be an elastic silicone product.

[0031] The above is only used to illustrate the technical solution of the utility model rather than to limit it. Other modifications or equivalent substitutions made to the technical solution of the utility model by ordinary technicians in this field should be included in the scope of the claims of the utility model as long as they do not depart from the spirit and scope of the technical solution of the utility model.

Claims

1. A heat dissipation refrigeration device, comprising a fin heat sink, a TEC (1) and a heat dissipation fan (2), wherein the fin heat sink is arranged on the TEC (1), and the heat dissipation fan (2) is arranged on one side of the fin heat sink, characterized in that: The fin heat sink comprises a heat pipe fin heat sink (3) connected to the hot end of the TEC (1) and used for dissipating heat for the hot end of the TEC (1); and, a cooling fin heat sink (6) disposed on the cold end of the TEC (1); The heat dissipation refrigeration device further comprises: a water cooling circulation system (4) having a portion disposed inside the cooling fin radiator (6) and another portion disposed outside the cooling fin radiator (6), wherein the water cooling circulation system (4) is used for heat exchange for heat generating components.

2. The heat dissipation refrigeration device according to claim 1, characterized in that: The water cooling circulation system (4) comprises: a water tank (41), wherein the water tank (41) is used to store liquid; a circulation pump (42) connected to the water tank (41) via a first connecting pipe (7); a metal refrigeration pipe (43) having a portion located in the TEC (1) and another portion passing through the refrigeration fin heat sink (6), wherein one end of the metal refrigeration pipe (43) is connected to the circulation pump (42) via a second connecting pipe (8); and A heat exchange head (44) for exchanging heat for a heat generating component is connected to the other end of the metal refrigeration pipe (43) via a third connecting pipe (9), wherein the liquid can flow in the heat exchange head (44), and the heat exchange head (44) is connected to the water tank (41) via a fourth connecting pipe (10).

3. The heat dissipation refrigeration device according to claim 2, characterized in that: A semiconductor cooling sheet (11) is arranged in the TEC (1), and a heat insulating cotton layer (5) is arranged below the TEC (1) and directly below the semiconductor cooling sheet (11).

4. The heat dissipation refrigeration device according to claim 1, characterized in that: The cooling fan (2) is fixedly arranged on a side of the cooling fin radiator (6) away from the heat pipe fin radiator (3).

5. The heat dissipation refrigeration device according to claim 3, characterized in that: The TEC (1) is fixedly arranged on the upper surface of the cold and heat exchange head (44), and the heat insulation cotton layer (5) is arranged between the TEC (1) and the cold and heat exchange head (44) and covers the upper surface of the cold and heat exchange head (44).

6. The heat dissipation refrigeration device according to claim 2, characterized in that: The water tank (41) is provided with a liquid replenishing port (a), and a sealing plug (45) is detachably mounted on the liquid replenishing port (a).

7. The heat dissipation refrigeration device according to claim 2, characterized in that: The metal refrigeration pipe (43) is made of copper or aluminum.

8. The heat dissipation refrigeration device according to claim 1, characterized in that: The air inlet of the cooling fan (2) faces one side of the cooling fin heat sink (6).

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