Semiconductor processing chamber

Abstract

The utility model discloses a semiconductor processing chamber which comprises a workbench, the top of the workbench is fixedly connected with a protective cover, the front side wall of the protective cover is fixedly connected with an observation window, the front side wall of the workbench is provided with a placing door, the front side wall of the placing door is fixedly connected with a self-locking hinge, and the front side wall of the self-locking hinge is fixedly connected with a rotating shaft. The number of the self-locking hinges is two. Through the arrangement of a workbench, a protective cover, an observation window, a placement door, a self-locking hinge, a cleaning groove, a cleaning pipe, a suction head, a sliding groove, a strip-shaped gear, a lower electric rod, a gear disc, a connecting rod, a placement table and a dust collector, a semiconductor wafer is placed on the placement table, and the lower electric rod is started to enable the gear disc to rotate under the action of the strip-shaped gear, so that the semiconductor is rotated into the protective cover; the opening area of the protective cover is reduced, meanwhile, the dust collector is started to clean the semiconductor wafer and absorb dust on the semiconductor wafer, and the cleaning degree of the semiconductor wafer is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing, in particular to a semiconductor processing chamber. Background Art

[0002] Semiconductors refer to materials with electrical conductivity between conductors and insulators at room temperature. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, diodes are devices made of semiconductors. Whether from the perspective of science and technology or economic development, semiconductors are very important. Most electronic products, such as computers, mobile phones or digital recorders, have a very close relationship with semiconductors in their core units.

[0003] Existing semiconductor processing chambers are generally of openable semi-enclosed design. This method can easily place semiconductors on processing equipment for processing, but it will also cause dust and impurities in the outside air to enter the processing chamber. After a long time, they will accumulate and cause pollution to the processing chamber, while reducing the semiconductor processing accuracy. In addition, excessive manual contact with semiconductor wafers will also have an adverse effect on the semiconductor wafers. Utility Model Content

[0004] The utility model aims to provide a semiconductor processing chamber, wherein a semiconductor wafer is placed on a placement table, and a lower electric rod is started to rotate a gear plate under the action of a bar gear, thereby transferring the semiconductor into a protective cover, reducing the opening area of ​​the protective cover, and simultaneously starting a vacuum cleaner to clean the semiconductor wafer and absorb dust thereon, thereby improving the cleanliness of the semiconductor wafer. After the semiconductor wafer is transferred into the protective cover, a main motor and an upper electric rod are started to adsorb the semiconductor wafer onto the processing table for processing, thereby greatly reducing the contact time between humans and semiconductors, reducing the contact risk of semiconductors, and improving the processing quality.

[0005] To achieve the above-mentioned purpose, a semiconductor processing chamber is provided, comprising: a workbench, a protective cover is fixedly connected to the top of the workbench, an observation window is fixedly connected to the front side wall of the protective cover, a placement door is arranged on the front side wall of the workbench, a self-locking hinge is fixedly connected to the front side wall of the placement door, two self-locking hinges are arranged and are evenly distributed on the placement door, the placement door is rotatably connected to the workbench through the self-locking hinge, a cleaning groove is arranged on the top of the workbench, the cleaning groove is fan-shaped, a cleaning pipe is fixedly arranged inside the cleaning groove, a suction head is fixedly connected to the circumferential surface of the cleaning pipe, a slide groove is arranged on the workbench, a bar gear is slidably arranged above the slide groove, and a lower electric rod is fixedly connected to the right side wall of the bar gear The gear plate is meshed with the bar gear, and a connecting rod is fixedly connected to the circumferential surface of the gear plate. The connecting rod is located above the bar gear, and one end of the connecting rod away from the gear plate is fixedly connected to the placing table. A processing table and a bracket are provided on the workbench, and the processing table is located in front of the bracket. A moving block is slidably provided at the bottom of the bracket, and a screw rod is rotatably provided at the bottom of the bracket, and the screw rod penetrates the moving block front and back and is threadedly connected to the moving block. The bottom of the moving block is fixedly connected to an upper electric rod, and the bottom of the upper electric rod is fixedly connected to an electric suction cup, the rear side wall of the protective cover is fixedly connected to a main motor, and the left side wall of the protective cover is fixedly connected to a vacuum cleaner.

[0006] According to the semiconductor processing chamber, the output end of the main motor passes through the protective cover and is fixedly connected to the lead screw.

[0007] According to the semiconductor processing chamber, the slide slot, bar gear, lower electric rod, gear plate, connecting rod and placement table are all located inside the cleaning tank.

[0008] According to the semiconductor processing chamber, the electric suction cup is located above the placement table.

[0009] According to the semiconductor processing chamber, the number of the suction heads is plural and evenly distributed on the cleaning pipe, and the cleaning pipe is connected to the vacuum cleaner through a pipeline.

[0010] According to the semiconductor processing chamber, the cleaning tank is located in front of the processing table.

[0011] The above scheme has the following beneficial effects:

[0012] 1. By setting a workbench, a protective cover, an observation window, a placement door, a self-locking hinge, a cleaning slot, a cleaning tube, a suction head, a slide, a bar gear, a lower electric rod, a gear plate, a connecting rod, a placement table and a vacuum cleaner, a semiconductor wafer is placed on the placement table, and the lower electric rod is started to rotate the gear plate under the action of the bar gear, so that the semiconductor is transferred into the protective cover, reducing the opening area of ​​the protective cover, and at the same time, the vacuum cleaner is started to clean the semiconductor wafer, absorb the dust on it, and improve the cleanliness of the semiconductor wafer;

[0013] 2. By setting up a processing table, a bracket, a moving block, a screw rod, an upper electric rod, an electric suction cup and a main motor, when the semiconductor wafer is transferred into the protective cover, the main motor and the upper electric rod are started to adsorb the semiconductor wafer onto the processing table for processing, which greatly reduces the contact time between people and semiconductors, reduces the risk of contact with semiconductors, and improves the processing quality.

[0014] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The utility model is further described below in conjunction with the accompanying drawings and embodiments;

[0016] Figure 1 This is a front view of a semiconductor processing chamber of the utility model;

[0017] Figure 2 This is an internal structure diagram of a semiconductor processing chamber of the utility model;

[0018] Figure 3 This is a structural diagram of a workbench of a semiconductor processing chamber of the utility model;

[0019] Figure 4 This is a structural diagram of a support for a semiconductor processing chamber according to the utility model.

[0020] Legend:

[0021] 1. Workbench; 2. Protective cover; 3. Observation window; 4. Placement door; 5. Self-locking hinge; 6. Cleaning slot; 7. Cleaning tube; 8. Suction head; 9. Slide; 10. Bar gear; 11. Lower electric rod; 12. Gear plate; 13. Connecting rod; 14. Placement table; 15. Processing table; 16. Bracket; 17. Moving block; 18. Screw rod; 19. Upper electric rod; 20. Electric suction cup; 21. Main motor; 22. Vacuum cleaner. DETAILED DESCRIPTION

[0022] This section will describe in detail the specific embodiments of the utility model. The preferred embodiments of the utility model are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the utility model, but it cannot be understood as a limitation on the protection scope of the utility model.

[0023] Reference Figure 1-4 The present invention provides a semiconductor processing chamber in an embodiment, which comprises: a workbench 1, a protective cover 2 is fixedly connected to the top of the workbench 1, an observation window 3 is fixedly connected to the front side wall of the protective cover 2, a placement door 4 is arranged on the front side wall of the workbench 1, a self-locking hinge 5 is fixedly connected to the front side wall of the placement door 4, two self-locking hinges 5 are arranged and evenly distributed on the placement door 4, the placement door 4 is rotatably connected to the workbench 1 through the self-locking hinge 5, a cleaning groove 6 is arranged on the top of the workbench 1, the cleaning groove 6 is fan-shaped, a cleaning pipe 7 is fixedly arranged inside the cleaning groove 6, and a cleaning pipe 7 is fixed on the circumferential surface of the cleaning pipe 7. A suction head 8 is fixedly connected, and the number of suction heads 8 is multiple and evenly distributed on the cleaning tube 7. A slide groove 9 is provided on the workbench 1, and a bar gear 10 is slidably provided above the slide groove 9. A lower electric rod 11 is fixedly connected to the right wall of the bar gear 10, and the lower electric rod 11 is fixedly connected to the workbench 1. A gear plate 12 is rotatably connected to the workbench 1, and the gear plate 12 is meshed with the bar gear 10. A connecting rod 13 is fixedly connected to the circumferential surface of the gear plate 12, and the connecting rod 13 is located above the bar gear 10. The end of the connecting rod 13 away from the gear plate 12 is fixedly connected to a placing table 14, and the slide groove 9. The bar gear 10, the lower electric rod 11, the gear plate 12, the connecting rod 13 and the placing table 14 are all located inside the cleaning tank 6. The working table 1 is provided with a processing table 15 and a bracket 16. The cleaning tank 6 is located in front of the processing table 15. The processing table 15 is located in front of the bracket 16. A moving block 17 is slidably provided at the bottom of the bracket 16. A screw rod 18 is rotatably provided at the bottom of the bracket 16. The screw rod 18 passes through the moving block 17 front and back and is threadedly connected to the moving block 17. The bottom of the moving block 17 is fixedly connected to an upper electric rod 19. The bottom of the upper electric rod 19 is fixedly connected to an electric suction cup 20. The electric suction cup 2 0 is located above the placement table 14 and is used to absorb the semiconductor wafers placed on the placement table 14 inside the protective cover 2. A main motor 21 is fixedly connected to the rear side wall of the protective cover 2. The output end of the main motor 21 passes through the protective cover 2 and is fixedly connected to the lead screw 18. When the main motor 21 works, the lead screw 18 rotates, thereby moving the moving block 17 forward and backward. A vacuum cleaner 22 is fixedly connected to the left side wall of the protective cover 2. The cleaning pipe 7 is connected to the vacuum cleaner 22 through a pipeline. When the vacuum cleaner 22 is started, the dust on the cleaning groove 6, the placement table 14 placed in the protective cover 2 and the semiconductor wafers therein is cleaned through the suction head 8.

[0024] Working principle: Start the lower electric rod 11, push the bar gear 10 to move on the slide 9, so that the gear plate 12 rotates, and the placement table 14 also rotates and pushes open the placement door 4, and the semiconductor wafer is placed on the placement table 14, and then start the lower electric rod 11, retract the placement table 14, and the placement door 4 is closed under the action of the self-locking hinge 5, and the vacuum cleaner 22 is started. The suction head 8 cleans the dust on the placement table 14 and the semiconductor wafer, and the main motor 21 is started to rotate the screw rod 18, and then the moving block 17 moves on the bracket 16. When the electric suction cup 20 is located above the placement table 14, the upper electric rod 19 is started, so that the electric suction cup 20 adsorbs the semiconductor wafer, and under the action of the main motor 21, it moves with the moving block 17 to the top of the processing table 15, and the upper electric rod 19 is started, the electric suction cup 20 moves down, and the semiconductor wafer is placed on the processing table 15, and then processed.

[0025] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. A semiconductor processing chamber, comprising: A workbench (1), characterized in that a protective cover (2) is fixedly connected to the top of the workbench (1), an observation window (3) is fixedly connected to the front side wall of the protective cover (2), a placement door (4) is provided on the front side wall of the workbench (1), a self-locking hinge (5) is fixedly connected to the front side wall of the placement door (4), two self-locking hinges (5) are provided and are evenly distributed on the placement door (4), the placement door (4) is rotatably connected to the workbench (1) via the self-locking hinge (5), and the workbench (1) is provided with a storage door (4) on the front side wall of the placement door (4). A cleaning groove (6) is arranged on the top of the table (1), the cleaning groove (6) is fan-shaped, a cleaning tube (7) is fixedly arranged inside the cleaning groove (6), a suction head (8) is fixedly connected to the circumferential surface of the cleaning tube (7), a slide groove (9) is arranged on the workbench (1), a bar gear (10) is slidably arranged above the slide groove (9), a lower electric rod (11) is fixedly connected to the right side wall of the bar gear (10), the lower electric rod (11) is fixedly connected to the workbench (1), and the workbench (1) is fixedly connected to the workbench (1). ) is rotatably connected to a gear plate (12), the gear plate (12) meshing with a bar gear (10), a connecting rod (13) is fixedly connected to the circumferential surface of the gear plate (12), the connecting rod (13) is located above the bar gear (10), and one end of the connecting rod (13) away from the gear plate (12) is fixedly connected to a placement table (14), and a processing table (15) and a bracket (16) are provided on the workbench (1), the processing table (15) is located in front of the bracket (16), and the bracket (16) A moving block (17) is slidably provided at the bottom of the bracket (16), a screw rod (18) is rotatably provided at the bottom of the bracket (16), the screw rod (18) penetrates the moving block (17) front and back and is threadedly connected to the moving block (17), an upper electric rod (19) is fixedly connected to the bottom of the moving block (17), an electric suction cup (20) is fixedly connected to the bottom of the upper electric rod (19), a main motor (21) is fixedly connected to the rear side wall of the protective cover (2), and a vacuum cleaner (22) is fixedly connected to the left side wall of the protective cover (2).

2. A semiconductor processing chamber according to claim 1, characterized in that: The output end of the main motor (21) passes through the protective cover (2) and is fixedly connected to the screw rod (18).

3. A semiconductor processing chamber according to claim 1, characterized in that: The slide groove (9), the bar gear (10), the lower electric rod (11), the gear plate (12), the connecting rod (13) and the placement table (14) are all located inside the cleaning groove (6).

4. A semiconductor processing chamber according to claim 1, characterized in that: The electric suction cup (20) is located above the placement table (14).

5. The semiconductor processing chamber according to claim 1, characterized in that: The suction heads (8) are provided in a plurality and are evenly distributed on the cleaning pipe (7); the cleaning pipe (7) is connected to the vacuum cleaner (22) via a pipeline.

6. The semiconductor processing chamber according to claim 1, characterized in that: The cleaning tank (6) is located in front of the processing table (15).

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