Circuit board with good heat dissipation effect

Abstract

The utility model discloses a circuit board with a good heat dissipation effect, which comprises a fixed bottom plate, a heat dissipation assembly and a circuit board main body, the heat dissipation assembly is arranged between the fixed bottom plate and the circuit board main body, and threaded rotating rods are movably arranged on the upper surface of the fixed bottom plate and close to the two ends of the fixed bottom plate. According to the circuit board with the good heat dissipation effect, the fixed bottom plate, the circuit board main body, the threaded rotating rod and the heat dissipation assembly are matched with one another, and when the circuit board is disassembled and placed, the threaded rotating rod is rotated, so that the distance between the circuit board main body and the fixed bottom plate can be continuously reduced; when the circuit board is not used, the cooling fins of the cooling assembly are folded in the folding grooves of the fixed bottom plate, so that the overall thickness of the circuit board can be reduced, when the circuit board which is not used is stored, the circuit board does not occupy a large space, and more circuit boards can be placed in the effective space.

Description

Technical Field

[0001] The utility model relates to the field of circuit boards, in particular to a circuit board with good heat dissipation effect. Background Art

[0002] The names of circuit boards include ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, circuit boards, PCB boards, aluminum substrates, high-frequency boards, thick copper boards, impedance boards, PCBs, ultra-thin circuit boards, ultra-thin circuit boards and printed (copper etching technology) circuit boards, etc. Circuit boards miniaturize and visualize circuits, and play an important role in the mass production of fixed circuits and the optimization of electrical appliance layouts. Circuit boards also have certain heat dissipation capabilities.

[0003] However, there are some shortcomings in the current circuit boards. For example, the application number is 202021647915.9, which announces "a circuit board with good heat dissipation effect". When the circuit board dissipates heat, the heat of the heat conducting plate is released through the heat dissipation fins, but the heat dissipation fins and the heat conducting plate have a certain thickness, so when placed, the overall thickness of the circuit board is larger, so that fewer circuit boards can be placed in a limited space, which is not conducive to the storage of circuit boards. Utility Model Content

[0004] The main purpose of the utility model is to provide a circuit board with good heat dissipation effect, which can effectively solve the problems in the background technology.

[0005] In order to achieve the above purpose, the technical solution adopted by the utility model is:

[0006] A circuit board with good heat dissipation effect comprises a fixed base plate, a heat dissipation component and a circuit board body. The heat dissipation component is arranged between the fixed base plate and the circuit board body. Threaded rotating rods are movably installed on the upper surface of the fixed base plate and near both ends.

[0007] Preferably, fixing holes are provided on the upper surface of the fixed base plate near the four corners, a guide rod is fixedly installed on the upper surface of the fixed base plate and on one side of the fixing hole, a stop block is fixedly installed on the upper surface of the guide rod, a folding groove is provided on the upper surface of the fixed base plate, and movable grooves are provided on the inner front and rear surfaces of the folding groove.

[0008] Preferably, sleeve holes are provided on the upper surface of the circuit board body near the four corners, and threaded holes are provided on the upper surface of the circuit board body near the middle of the two ends.

[0009] Preferably, the heat dissipation assembly includes a heat conducting plate, a support plate, a heat sink and a heat conducting film, the support plate is fixedly installed on the lower surface of the heat conducting plate and near both sides, the heat sink is movably installed between the support plates and near both sides, and the heat conducting film is fixedly installed on the upper surface of the heat sink.

[0010] Preferably, the upper end of the heat-conducting film is fixed to the heat-conducting plate, and the number of the supporting plates is several.

[0011] Preferably, sliders are fixedly mounted on both side surfaces of the lower end of the heat sink, the sliders are embedded in the movable grooves, and the length of the folding grooves is greater than the length of the heat sink.

[0012] Preferably, the guide rod passes through the sleeve hole, and the lower end of the threaded rotating rod passes through the threaded hole to be movably connected to the fixed bottom plate.

[0013] Compared with the prior art, the utility model has the following beneficial effects:

[0014] In the utility model, by setting a fixed base plate, a circuit board body, a threaded rotating rod and a heat dissipation component to cooperate with each other, when the circuit board is disassembled and placed, the threaded rotating rod is rotated. At this time, the distance between the circuit board body and the fixed base plate will be continuously reduced until the heat sink of the heat dissipation component is folded in the folding groove of the fixed base plate. In this way, the overall thickness of the circuit board can be reduced. When placing it, it will not occupy a large space, and more circuit boards can be placed in the effective space. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is an overall structural diagram of a circuit board with good heat dissipation effect according to the utility model;

[0016] Figure 2 This is a structural diagram of a fixed base plate of a circuit board with good heat dissipation effect according to the utility model;

[0017] Figure 3 This is a circuit board main body structure diagram of a circuit board with good heat dissipation effect according to the utility model;

[0018] Figure 4 This is a structural diagram of a heat dissipation component of a circuit board with good heat dissipation effect according to the utility model;

[0019] Figure 5 The utility model is a circuit board with good heat dissipation effect Figure 4 Enlarged view of point A in the middle.

[0020] In the figure: 1. fixed base plate; 101. fixed hole; 102. guide rod; 103. stop block; 104. folding groove; 105. movable groove; 2. circuit board body; 201. threaded hole; 202. sleeve hole; 3. threaded rotating rod; 4. heat dissipation component; 401. heat conducting plate; 402. support plate; 403. heat sink; 404. thermal conductive film. DETAILED DESCRIPTION

[0021] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further described below in conjunction with specific implementation methods.

[0022] like Figure 1-5 A circuit board with good heat dissipation effect is shown, comprising a fixed base plate 1, a heat dissipation component 4 and a circuit board body 2. The heat dissipation component 4 is arranged between the fixed base plate 1 and the circuit board body 2. A threaded rotating rod 3 is movably installed on the upper surface of the fixed base plate 1 and near both ends.

[0023] A fixing hole 101 is provided on the upper surface of the fixed base plate 1 and near the four corners, a guide rod 102 is fixedly installed on the upper surface of the fixed base plate 1 and located on one side of the fixing hole 101, a stop block 103 is fixedly installed on the upper surface of the guide rod 102, a folding groove 104 is provided on the upper surface of the fixed base plate 1, and a moving groove 105 is provided on the inner front and rear surfaces of the folding groove 104, and the guide rod 102 can assist the vertical lifting of the circuit board body 2; sleeve holes 202 are provided on the upper surface of the circuit board body 2 and near the four corners, and threaded holes 201 are provided on the upper surface of the circuit board body 2 and near the middle of both ends; the heat dissipation component 4 includes a heat conducting plate 401, a support plate 402, a heat sink 403 and a heat conducting film 404, and the lower surface of the heat conducting plate 401 and near Support plates 402 are fixedly installed on both sides, and heat sinks 403 are movably installed between the support plates 402 and near the two sides. A thermal conductive film 404 is fixedly installed on the upper surface of the heat sink 403, and the thermal conductive film 404 can transfer the heat inside the thermal conductive plate 401 to the heat sink 403; the upper end of the thermal conductive film 404 is fixed to the thermal conductive plate 401, and the number of support plates 402 is several; sliders are fixedly installed on the two side surfaces of the lower end of the heat sink 403, and the sliders are embedded in the movable groove 105, and the length of the folding groove 104 is greater than the length of the heat sink 403; the guide rod 102 passes through the sleeve hole 202, and the lower end of the threaded rotating rod 3 passes through the threaded hole 201 and is movably connected to the fixed bottom plate 1, and the rotating threaded rotating rod 3 can control the circuit board body 2 to rise and fall.

[0024] It should be noted that the utility model is a circuit board with good heat dissipation effect. When in use, the heat conducting plate 401 absorbs the heat generated during the use of the circuit board body 2, and transfers the heat to the heat conducting film 404, and then the heat conducting film 404 transfers the heat to the heat sink 403 for heat release. When the circuit board is disassembled and placed, the threaded rotating rod 3 is rotated. At this time, the distance between the circuit board body 2 and the fixed base plate 1 will continue to decrease until the heat sink 403 of the heat dissipation component 4 is folded in the folding groove 104 of the fixed base plate 1. In this way, the overall thickness of the circuit board can be reduced. When placing the circuit board, it will not occupy a large space, so that more circuit boards can be placed in the effective space.

[0025] The above shows and describes the basic principle and main features of the utility model and the advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.

Claims

1. A circuit board with good heat dissipation effect, characterized in that: It comprises a fixed base plate (1), a heat dissipation component (4) and a circuit board body (2); the heat dissipation component (4) is arranged between the fixed base plate (1) and the circuit board body (2); and threaded rotating rods (3) are movably mounted on the upper surface of the fixed base plate (1) and near both ends.

2. A circuit board with good heat dissipation effect according to claim 1, characterized in that: The upper surface of the fixed base plate (1) is provided with fixing holes (101) near the four corners, the upper surface of the fixed base plate (1) is provided with a guide rod (102) fixedly mounted on one side of the fixing hole (101), the upper surface of the guide rod (102) is provided with a stop block (103), the upper surface of the fixed base plate (1) is provided with a folding groove (104), and the inner front and rear surfaces of the folding groove (104) are provided with movable grooves (105).

3. A circuit board with good heat dissipation effect according to claim 2, characterized in that: Holes (202) are provided on the upper surface of the circuit board body (2) near the four corners, and threaded holes (201) are provided on the upper surface of the circuit board body (2) near the middle of both ends.

4. A circuit board with good heat dissipation effect according to claim 3, characterized in that: The heat dissipation component (4) comprises a heat conducting plate (401), a support plate (402), a heat sink (403) and a heat conducting film (404); the support plate (402) is fixedly mounted on the lower surface of the heat conducting plate (401) and close to both sides; the heat sink (403) is movably mounted between the support plates (402) and close to both sides; and the heat conducting film (404) is fixedly mounted on the upper surface of the heat sink (403).

5. A circuit board with good heat dissipation effect according to claim 4, characterized in that: The upper end of the heat-conducting film (404) is fixed to the heat-conducting plate (401), and the number of the supporting plates (402) is several.

6. A circuit board with good heat dissipation effect according to claim 5, characterized in that: Sliders are fixedly mounted on both side surfaces of the lower end of the heat sink (403), the slides are embedded in the movable grooves (105), and the length of the folding grooves (104) is greater than the length of the heat sink (403).

7. A circuit board with good heat dissipation effect according to claim 6, characterized in that: The guide rod (102) passes through the sleeve hole (202), and the lower end of the threaded rotating rod (3) passes through the threaded hole (201) and is movably connected to the fixed bottom plate (1).

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