Display screen heat dissipation device and vehicle-mounted display screen

Abstract

The utility model discloses a display screen heat dissipation device and a vehicle-mounted display screen, the display screen heat dissipation device comprises a heat conduction assembly and a heat dissipation assembly, and the heat conduction assembly comprises a flexible circuit board and a heat conduction piece; the heat dissipation assembly comprises a heat transfer part and a heat dissipation part which are connected with each other, a containing space for containing the heat conduction assembly and the heat transfer part is formed in the heat dissipation part, the heat transfer part is used for being connected with the LED module and arranged on the side, away from the IC chip, of the FOG, and the two ends of the flexible circuit board are used for being connected with the FOG and the heat transfer part correspondingly. Two ends of the heat conduction piece are respectively connected with the FOG and the heat transfer piece; according to the vehicle-mounted display screen, the heat generated by the IC chip is transmitted through the flexible circuit board and the heat conduction piece together, so that the temperature of the vehicle-mounted display screen is effectively reduced, and the temperature of the vehicle-mounted display screen is reduced under the condition that the heat generated by the IC chip is identical; compared with a vehicle-mounted display screen of which the heat dissipation is controlled by reducing the screen brightness in the prior art, the vehicle-mounted display screen adopting the display screen heat dissipation device for heat dissipation has higher brightness.

Description

Technical Field

[0001] The utility model relates to the technical field of vehicle-mounted display screens, in particular to a display screen heat dissipation device and a vehicle-mounted display screen. Background Art

[0002] At present, the floating display screens in vehicles are getting larger and larger, and the brightness requirements are getting higher and higher. The large screen and high brightness cause the screen's heat generation to increase dramatically. If the heat cannot be dissipated effectively, it will affect the stability and life of the product. During use, the high temperature of the display screen will affect the user experience. The existing conventional technical solution for the floating screen in the vehicle is to reduce the screen brightness to solve the heat dissipation problem. However, for usage scenarios with sufficient sunlight, the screen brightness is too low, which will cause the user to not be able to see the content displayed on the screen, seriously affecting driving safety; and the heat dissipation method has a very limited cooling effect on the IC chip located under the screen panel, which will make the temperature of the screen panel near the IC area significantly higher than the temperature of other areas, affecting the user experience.

[0003] In view of this, it is necessary to provide a new display screen heat dissipation device and a vehicle-mounted display screen to solve or at least alleviate the above-mentioned technical defects. Utility Model Content

[0004] The main purpose of the utility model is to provide a display screen heat dissipation device and a vehicle-mounted display screen, aiming to solve the technical problem of how to improve the heat dissipation capacity of the existing vehicle-mounted display screen.

[0005] In order to achieve the above object, the utility model provides a display screen heat dissipation device for dissipating heat from an IC chip assembly and an LED module, wherein the IC chip assembly comprises an IC chip and a FOG connected to each other, and the display screen heat dissipation device comprises:

[0006] A heat-conducting component, the heat-conducting component comprising a flexible circuit board and a heat-conducting member;

[0007] A heat dissipation component, wherein the heat dissipation component includes a heat transfer component and a heat dissipation component that are connected to each other, wherein a storage space for accommodating the heat conduction component and the heat transfer component is provided inside the heat dissipation component, wherein the heat transfer component is used to be connected to the LED module, wherein the heat transfer component is used to be arranged on a side of the FOG away from the IC chip, wherein one end of the flexible circuit board is used to be connected to the FOG, and the other end of the flexible circuit board is connected to the heat transfer component, wherein one end of the heat conduction component is used to be connected to the FOG, and the other end of the heat conduction component is connected to the heat transfer component.

[0008] In one embodiment, one end of the flexible circuit board is used to connect to one side of the FOG, and one end of the heat conductor is used to connect to the other side of the FOG.

[0009] In one embodiment, a side of the heat transfer member facing away from the LED module is disposed in close contact with an end of the heat conductive member away from the FOG.

[0010] In one embodiment, at least a portion of the body of the flexible circuit board is connected to the heat conductive member, so that the flexible circuit board can be connected to the heat transfer member through the heat conductive member.

[0011] In one embodiment, the heat transfer element includes a heat transfer plate and a heat conductive layer, the heat transfer plate is used to connect to the LED module, the flexible circuit board and the heat conductive element are both connected to the heat transfer plate, one side of the heat conductive layer is connected to the heat transfer plate, and the other side of the heat conductive layer is connected to the heat dissipation element.

[0012] In one embodiment, a plurality of heat dissipation fins are disposed on a side of the heat dissipation element facing away from the accommodation space.

[0013] In one embodiment, the plurality of heat dissipation fins are arranged in a C-level surface area of ​​the display screen.

[0014] In one embodiment, the heat conducting member is made of an ethylene-carbon composite material.

[0015] In one embodiment, the flexible circuit board is a flexible copper substrate.

[0016] In addition, the utility model also provides a vehicle-mounted display screen, which includes a screen panel, the IC chip assembly, the LED module and the above-mentioned display screen heat dissipation device, the heat sink is provided with an opening connected to the accommodating space, the screen panel is connected to the heat sink, and the screen panel can cover the opening.

[0017] In the above technical solution of the utility model, a flexible circuit board and a heat conducting member are provided, so that the heat generated by the IC chip can be transferred to the flexible circuit board and the heat conducting member respectively through the FOG, and then the flexible circuit board and the heat conducting member transfer the heat to the heat transfer member, and then the heat transfer member transfers the heat to the heat sink, and the heat is removed by heat exchange between the heat sink and the external environment; since the LED module is connected to the heat transfer member, the heat generated by the LED module can be directly transferred to the heat sink through the heat transfer member, and the heat is removed by heat exchange between the heat sink and the external environment; the heat generated by the IC chip is transferred together through two parallel routes of the flexible circuit board and the heat conducting member, which effectively reduces the heat generated by the IC chip The temperature of the screen panel in the area where the IC chip is located is increased, thereby reducing the temperature difference between the area of ​​the screen panel close to the IC chip and other areas, thereby improving the user experience; and because the heat generated by the IC chip is dissipated more efficiently, the display screen heat dissipation device also effectively reduces the temperature of the vehicle-mounted display screen, so that when the heat generated by the IC chip and the LED module is the same, the vehicle-mounted display screen that uses the display screen heat dissipation device for heat dissipation can have a higher brightness than the vehicle-mounted display screen that controls heat dissipation by reducing the screen brightness in the prior art. This not only improves the user experience, but also provides a certain guarantee for the user's driving safety. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the implementation mode of the utility model or the technical solution in the prior art, the drawings required for use in the implementation mode or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some implementation modes of the utility model. For ordinary technicians in this field, other drawings can be obtained by using the structures shown in these drawings without paying any creative work.

[0019] Figure 1 The present invention is a partial structural schematic cross-sectional view of a vehicle-mounted display screen according to an embodiment of the present invention.

[0020] Description of Figure Numbers:

[0021]

[0022] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with the implementation methods and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] It should be noted that all directional indications (such as up, down, etc.) in the embodiments of the present invention are only used to explain the position of the user in a certain posture (such as the attached Figure 1 The relative position relationship, movement status, etc. between the various components under the specific posture are shown. If the specific posture changes, the directional indication will also change accordingly.

[0025] In addition, in the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" can explicitly or implicitly include at least one of the features.

[0026] Furthermore, the technical solutions between the various implementation modes of the present invention can be combined with each other, but this must be based on the fact that ordinary technicians in the field can implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0027] The utility model provides a display screen heat dissipation device 1. In one embodiment, Figure 1 As shown, it is used to dissipate heat for the IC chip component 21 and the LED module 22. The IC chip component 21 includes an IC chip 211 and a FOG (Full name in English: FlexOn Glass, Chinese name: Glass panel equipped with a flexible circuit board) 212 connected to each other. The display screen heat dissipation device 1 includes a heat-conducting component 11 and a heat-dissipating component 12. The heat-conducting component 11 includes a flexible circuit board 111 and a heat-conducting member 112; the heat-dissipating component 12 includes a heat-transferring member 121 and a heat-dissipating member 122 connected to each other. The heat-dissipating member 122 is provided with a receiving space 1222 for accommodating the heat-conducting component 11 and the heat-transferring member 121. The heat-transferring member 121 is used to be connected to the LED module 22. The heat-transferring member 121 is used to be arranged on a side of the FOG212 away from the IC chip 211. One end of the flexible circuit board 111 is used to connect to the FOG212, and the other end of the flexible circuit board 111 is connected to the heat-transferring member 121. One end of the heat-conducting member 112 is used to connect to the FOG212, and the other end of the heat-conducting member 112 is connected to the heat-transferring member 121.

[0028] Among them, the flexible circuit board 111 and the heat conductive member 112 are provided, so that the heat generated by the IC chip 211 can be transferred to the flexible circuit board 111 and the heat conductive member 112 respectively through the FOG 212, and then the flexible circuit board 111 and the heat conductive member 112 transfer the heat to the heat transfer member 121, and then the heat transfer member 121 transfers the heat to the heat sink 122, and the heat is removed by heat exchange with the external environment through the heat sink 122; because the LED module 22 is connected to the heat conductive member 121, the heat generated by the LED module 22 can be directly transferred to the heat sink 122 through the heat transfer member 121, and the heat is removed by heat exchange with the external environment through the heat sink 122; the heat generated by the IC chip 211 is transferred together through two parallel routes of the flexible circuit board 111 and the heat conductive member 112, which effectively reduces the screen area where the IC chip 211 is located. The temperature of the screen panel 23 is reduced, thereby reducing the temperature difference between the area of ​​the screen panel 23 near the IC chip 211 and other areas. Compared with the prior art that reduces the heat generated by the heat source of the vehicle display screen 2 by reducing the screen brightness, the reduced temperature difference is about 3°C, which improves the user experience; and because the heat generated by the IC chip 211 is more efficiently dissipated, the display screen heat dissipation device 1 also effectively reduces the temperature of the vehicle display screen 2, so that when the heat generated by the IC chip 211 and the LED module 22 is the same, the vehicle display screen 2 that uses the display screen heat dissipation device 1 for heat dissipation can have a higher brightness than the vehicle display screen 2 that controls heat dissipation by reducing the screen brightness in the prior art, which not only improves the user experience, but also provides a certain guarantee for the user's driving safety. It should be noted that the heat generated by the IC chip 211 is transferred together through two parallel routes of the flexible circuit board 111 and the heat conductive member 112, which effectively reduces the total thermal resistance from the IC chip 211 to the heat dissipation member 122 compared with the existing vehicle display screen 2. It should also be noted that the connection between the IC chip 211 and the FOG 212 can be achieved by using existing technology.

[0029] In one embodiment, one end of the flexible circuit board 111 is used to connect to one side of the FOG 212, and one end of the heat conductive member 112 is used to connect to the other side of the FOG 212. The position where the flexible circuit board 111 is connected to the FOG 212 and the position where the heat conductive member 112 is connected to the FOG 212 are respectively located on both sides of the FOG 212. Compared with the flexible circuit board 111 and the heat conductive member 112 being connected to the same side of the FOG 212, this arrangement can better transfer the heat generated by the IC chip 211 to the heat dissipation member 122. It should be noted that the flexible circuit board 111 is connected to the upper side of the FOG 212, the heat conductive member 112 is connected to the lower side of the FOG 212, and the heat conductive member 112 is arranged close to the heat transfer member 121.

[0030] In one embodiment, the side of the heat transfer member 121 facing away from the LED module 22 is arranged in a close relationship with the end of the heat conductive member 112 away from the FOG 212. The heat conductive member 112 is arranged in a close relationship with the heat transfer member 121, and the contact area is increased, thereby improving the heat exchange efficiency between the heat conductive member 112 and the heat transfer member 121, so that the heat conductive member 112 can better transfer the heat generated by the IC chip 211 to the heat transfer member 121. It should be noted that the contact area between the heat conductive member 112 and the heat transfer member 121 should be as large as possible to avoid excessively high local temperature of the heat transfer member 121, so that the heat can be more evenly distributed on the heat transfer member 121, which is helpful for heat dissipation of the IC chip 211.

[0031] In one embodiment, at least a portion of the body of the flexible circuit board 111 is connected to the heat conductive member 112, so that the flexible circuit board 111 can be connected to the heat transfer member 121 through the heat conductive member 112. Compared with directly connecting the flexible circuit board 111 to the heat dissipation member 122, the connection between the flexible circuit board 111 and the heat conductive member 112 makes it easier to install and position the flexible circuit board 111.

[0032] In one embodiment, the heat transfer element 121 includes a heat transfer plate 1211 and a heat conductive layer 1212. The heat transfer plate 1211 is used to connect with the LED module 22. The flexible circuit board 111 and the heat conductive element 112 are both connected with the heat transfer plate 1211. One side of the heat conductive layer 1212 is connected with the heat transfer plate 1211, and the other side of the heat conductive layer 1212 is connected with the heat dissipation element 122. By providing the heat conductive layer 1212, the heat transfer plate 1211 is fixed on the heat dissipation element 122, and the heat on the heat transfer plate 1211 can be effectively transferred to the heat dissipation element 122, that is, the heat is transferred from the heat transfer plate 1211 to the heat dissipation element 122 through the heat conductive layer 1212. It should be noted that the heat conductive layer 1212 is a heat conductive gel layer, and the heat transfer plate 1211 is a backlight aluminum plate, wherein the thermal conductivity of the backlight aluminum plate is 170w / mk. It should also be noted that compared with the prior art of reducing the heat generated by the heat source of the vehicle-mounted display screen 2 by lowering the screen brightness, the display screen heat dissipation device 1 can increase the brightness index by about 200 nit while ensuring the same maximum temperature rise, thereby increasing the safety of users during driving by effectively increasing the screen brightness.

[0033] In one embodiment, a plurality of heat dissipation fins 1221 are provided on one side of the heat dissipation element 122 away from the accommodation space 1222. By providing a plurality of heat dissipation fins 1221, the contact area between the heat dissipation element 122 and the external environment is effectively increased, thereby effectively improving the heat dissipation efficiency of the heat dissipation element 122. It should be noted that the heat dissipation fins 1221 are aluminum heat dissipation fins.

[0034] In one embodiment, a plurality of heat dissipation fins 1221 are used to be arranged in the C-level surface area of ​​the display screen. The display screen is a vehicle-mounted display screen 2. By arranging the heat dissipation fins 1221 in the C-level surface area of ​​the vehicle-mounted display screen 2, the heat dissipation performance of the vehicle-mounted display screen 2 is improved without affecting the aesthetics of the A-level surface of the vehicle-mounted display screen 2. Moreover, since the heat dissipation fins 1221 are arranged in the C-level surface area of ​​the vehicle-mounted display screen 2, the structural layout of the entire vehicle is not affected. It should be noted that the C-level surface area of ​​the vehicle-mounted display screen 2 is a surface that cannot be directly viewed by the user, generally referring to the area of ​​the vehicle-mounted display screen 2 that is not exposed, and the A-level surface of the vehicle-mounted display screen 2 is a surface that can be seen by the user.

[0035] In one embodiment, the heat conducting member 112 is made of an olefin-carbon composite material. By using the olefin-carbon composite material as the heat conducting member 112, the thermal conductivity of the heat conducting member 112 is about 1300w / mk, which can quickly transfer the heat generated by the IC chip 211 to the heat transfer member 121, thereby increasing the heat dissipation capacity of the display screen heat dissipation device 1.

[0036] In one embodiment, the flexible circuit board 111 is a flexible copper substrate. The flexible copper substrate is used as the flexible circuit board 111 so that the flexible circuit board 111 can quickly transfer the heat generated by the IC chip 211 to the heat transfer element 121 during the signal transmission process, thereby increasing the heat dissipation capacity of the display screen heat dissipation device 1.

[0037] In addition, the utility model also provides a vehicle-mounted display screen 2, which includes a screen panel 23, an IC chip assembly 21, an LED module 22 and the above-mentioned display screen heat dissipation device 1, the heat dissipation member 122 is provided with an opening 1223 connected to the accommodating space 1222, the screen panel 23 is connected to the heat dissipation member 122, and the screen panel 23 can cover the opening 1223. Since the vehicle-mounted display screen 2 adopts all the technical solutions of all the above-mentioned embodiments, it has at least all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be repeated here one by one.

[0038] The above are only preferred implementations of the utility model, and do not limit the patent scope of the utility model. All equivalent structural changes made based on the concept of the utility model and the contents of the description and drawings of the utility model, or direct / indirect application in other related technical fields are included in the patent protection scope of the utility model.

Claims

1. A display screen heat dissipation device, used for dissipating heat from an IC chip assembly and an LED module, wherein the IC chip assembly comprises an IC chip and a FOG connected to each other, characterized in that: include: A heat-conducting component, the heat-conducting component comprising a flexible circuit board and a heat-conducting member; A heat dissipation component, wherein the heat dissipation component includes a heat transfer component and a heat dissipation component that are connected to each other, wherein a storage space for accommodating the heat conduction component and the heat transfer component is provided inside the heat dissipation component, wherein the heat transfer component is used to be connected to the LED module, wherein the heat transfer component is used to be arranged on a side of the FOG away from the IC chip, wherein one end of the flexible circuit board is used to be connected to the FOG, and the other end of the flexible circuit board is connected to the heat transfer component, wherein one end of the heat conduction component is used to be connected to the FOG, and the other end of the heat conduction component is connected to the heat transfer component.

2. The display screen heat dissipation device according to claim 1, characterized in that: One end of the flexible circuit board is used to connect with one side of the FOG, and one end of the heat conductor is used to connect with the other side of the FOG.

3. The display screen heat dissipation device according to claim 1, characterized in that: The side of the heat transfer member facing away from the LED module is arranged in close contact with the end of the heat conductive member away from the FOG.

4. The display screen heat dissipation device according to claim 1, characterized in that: At least a portion of the body of the flexible circuit board is connected to the heat conducting member, so that the flexible circuit board can be connected to the heat transfer member through the heat conducting member.

5. The display screen heat dissipation device according to any one of claims 1 to 4, characterized in that: The heat transfer element includes a heat transfer plate and a heat conductive layer. The heat transfer plate is used to connect to the LED module. The flexible circuit board and the heat conductive element are both connected to the heat transfer plate. One side of the heat conductive layer is connected to the heat transfer plate, and the other side of the heat conductive layer is connected to the heat dissipation element.

6. The display screen heat dissipation device according to any one of claims 1 to 4, characterized in that: A plurality of heat dissipation fins are arranged on a side of the heat dissipation element away from the accommodation space.

7. The display screen heat dissipation device according to claim 6, characterized in that: The plurality of heat dissipation fins are all used to be arranged in the C-level surface area of ​​the display screen.

8. The display screen heat dissipation device according to any one of claims 1 to 4, characterized in that: The heat conducting member is made of an olefin-carbon composite material.

9. The display screen heat dissipation device according to any one of claims 1 to 4, characterized in that: The flexible circuit board is a flexible copper substrate.

10. A vehicle-mounted display screen, characterized in that: The vehicle-mounted display screen includes a screen panel, the IC chip assembly, the LED module and a display screen cooling device as described in any one of claims 1 to 9, wherein the heat sink is provided with an opening connected to the accommodating space, the screen panel is connected to the heat sink, and the screen panel can cover the opening.

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